MG Chemicals 4901 Catalog Page
Lead Free Solder Sn99
4901
99.3% tin and 0.7% copper
M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Cu (Tin/Copper) alloys
as a lead-free alternative for the standard Tin and Lead solder. These alloys conform to
the impurity requirements of J-Std-006 and RoHS. Use this solder anywhere you would
use normal solder.
Features / Benefits
z Lead free
z Complies with RoHS
z Exceeds the impurity requirements of J-Std-006
z No Clean flux
z 21 Gauge, 0.032" diameters
z Excellent wettability
z Hard non-conductive residues
Flux Percentage
M.G. Chemicals Lead Free Solder utilizes a state-of-the-art automatic wire extrusion and
wire drawing machines to manufacture consistent solder. The introduction of flux core in
the wire extrusion process involves constant monitoring of flux percentage to ensure
minimal flux voids and irregular wire. Typical flux percentage for our Lead Free Solder is
2.0-4.0%.
Flux Core
A unique flux system was specifically used for high temperature lead free alloys. It
provides the fluxing activity levels that promote fast wetting action and maximum
wetting spread. Utilizing synthetically refined resin and very effective activator that wets
and spreads like an RA type. This special activator exhibits virtually no spattering.
Activator conforms to J-STD-004, REL0. Cleaning Flux core is a no clean formulation
therefore the residues do not need to be removed for typical applications.
Specifications
Test Method Specification
Cu content 0.3-0.7 %
Sn content Balance
Flux Classification JSTD-004 REL0
Copper Mirror IPC-TM-650 2.3.32 No removal of copper film
Silver Chromate IPC-TM-650 2.3.33 Pass
Corrosion IPC-TM-650 2.6.15 Pass
2
11
11
ohms
ohms
SIR JSTD-004,Pattern Down IPC-TM-650 2.6.3.3
SIR Bellcore (Telecordia) Bellcore GR-78-CORE 13.1.3
Electromigration Bellcore GR-78-CORE 13.1.4 Pass
Post Reflow Flux Residue TGA Analysis 55%
Acid Value IPC-TM-650 2.3.13 190-210
Flux Residue Dryness IPC-TM-650 2.4.47 Pass
Spitting of Flux-Cored Solder IPC-TM-650 2.4.48 0.3%
Solder Spread IPC-TM-650 2.4.46
2.33 x 10
6.12 x 10
130 mm
Lead free/leaded solder
comparison
Melting Point 227º C (441º F) 183 º C (361.4 º F)
Upper Temperature Limit Do not to exceed 350 ºC (tip
Wire Diameter 0.032” (0.81 mm) 0.032” (0.81 mm)
Std. Wire Gauge 21 21
Tolerance, in. +/- 0.002” +/- 0.002”
Hardness, Brinell 9HB 14HB
Coefficient of Thermal Expansion Pure Sn=23.5 24.7
Tensile Strength 3190 psi 4442 psi
Density 7.31 g/cc 8.42 g/cc
Electrical Resistivity 10 - 15 µohm-cm 14.5 µohm-cm
Electrical Conductivity 13 %IACS 11.9 %IACS
Yield Strength, psi 2180 3950
Total Elongation,% 39 48
Joint Shear Strength, at 0.1mm/min
20ºC
Creep Strength, N/mm
0.1mm/min 20ºC
Creep Strength, N/mm
0.1mm/min 100 C
2
at
2
at
Lead Free Solder (Sn/Cu) Sn63/Pb37 (Leaded Solder )
temperature)
23 14
8.6 3.3
2.1 1
Do not to exceed 260 ºC (tip
temperature)
Available Sizes
Catalog Number Sizes Available Description
4901-112G 1/4 lb (113 g) Spool
4901-227G 1/2 lb (227 g) Spool
4901-454G 1 lb (454 g) Spool
4901-2LB 2 lb (907 g) Bar
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