MG Chemicals 4900 Catalog Page
Lead Free Solder Sn96 (SAC 305)
g
4900
96.3% tin, 0.7% copper and 3% silver
M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Ag/Cu
(Tin/Silver/Copper) alloys as a lead-free alternative for the standard Tin and Lead solder.
These alloys conform to the impurity requirements of J-Std-006 and RoHS. Use this
solder anywhere you would use normal solder.
If your products might enter Europe or California, you must
ensure they are RoHS compliant. Products containing lead will not
comply.
Features / Benefits
Lead free
Complies with RoHS
Exceeds the impurity requirements of J-Std-006
No Clean flux
21 Gauge, 0.032" diameters
Excellent wettability
Hard non-conductive residues
1 lb of lead free solder has 27% more length than leaded solder
Flux Percentage
M.G. Chemicals Lead Free Solder utilizes a state-of-the-art automatic wire extrusion and
wire drawing machines to manufacture consistent solder. The introduction of flux core in
the wire extrusion process involves constant monitoring of flux percentage to ensure
minimal flux voids and irregular wire. Typical flux percentage for our Lead Free Solder is
2.0-4.0%.
Flux Core
A unique flux system was specifically used for high temperature lead free alloys. It
provides the fluxing activity levels that promote fast wetting action and maximum
wetting spread. Utilizing synthetically refined resin and very effective activator that wets
and spreads like an RA type. This special activator exhibits virtually no spattering.
Activator conforms to J-STD-004, REL0.Cleaning Flux core is a no clean formulation
therefore the residues do not need to be removed for typical applications.
:
g
Specifications
Test Method Specification
Ag content 2.8-3.2%
Cu content 0.3-0.7 %
Sn content Balance
Flux Classification JSTD-004 REL0
Copper Mirror IPC-TM-650 2.3.32 No removal of copper film
Silver Chromate IPC-TM-650 2.3.33 Pass
Corrosion IP C-TM-650 2.6.15 Pass
2
11
11
ohms
ohms
SIR JSTD-004,Pattern Down IPC-TM-650 2.6.3.3
SIR Bellcore (Telecordia) Bellcore GR-78-CORE 13.1.3
Electromigration Bellcore GR-78-CORE 13.1.4 Pass
Post Reflow Flux Residue TGA Analysis 55%
Acid Value IPC-TM-650 2.3.13 190-210
Flux Residue Dryness IPC-TM-650 2.4.47 Pass
Spitting of Flux-Cored Solder IPC-TM-650 2.4.48 0.3%
Solder Spread IPC-TM-650 2.4.46
2.33 x 10
6.12 x 10
130 mm
Lead free/leaded solder
comparison
Melting Point 217-221 º C (422.6 - 429.8 º F) 183 º C (361.4 º F)
Wire Diameter 0.032” (0.81 mm) 0.032” (0.81 mm)
Std. Wire Gauge 21 21
Tolerance, in. +/- 0.002” +/- 0.002”
Hardness, Brinell 15HB 14HB
Coefficient of Thermal Expansion Pure Sn=23.5 24.7
Tensile Strength 4312 psi 4442 psi
Density 7.39 g/cc 8.42 g/cc
Electrical Resistivity 13.0 µohm-cm 14.5 µohm-cm
Electrical Conductivity 16.6 %IACS 11.9 %IACS
Yield Strength, psi 3724 3950
Total Elongation,% 27 48
Joint Shear Strength, at 0.1mm/min
20ºC
2
Creep Strength, N/mm
0.1mm/min 20ºC
Creep Strength, N/mm
0.1mm/min 100 C
Thermal Conductivity, 58.7 W/m * K 50.9 W/m * K
at
2
at
Lead Free Solder (Sn/Ag/Cu) Sn63/Pb37 (Leaded Solder)
17 14
13.0 3. 3
5 1
Available Sizes
Catalog Number Sizes Available Description
4900-35G 17 g (0.6 oz) x 25 Pocket pack (box of 25)
4900-112G 1/4 lb (113 g) Spool
4900-227G 1/2 lb (227 g) Spool
4900-454G 1 lb (454 g) Spool
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