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ADVANCED INFORMATION

MX10C805X

SINGLE-CHIP 8-BIT MICROCONTROLLER

FEATURE

•High performance CMOS ROM CPU

•Operation Voltage 5V

•Up to 40MHz operation (3.5MHz to 40MHz)

•Three 16-bit timer/counters

•256 Bytes of on-chip data RAM

•4/8/16/32/64 Kbytes on-chip Program memory

•32 Programmable I/O lines

•On-chip Watch-Dog-Timer (WDT)

•6 interrupt Sources

GENERAL DESCRIPTION

The single-chip 8-bit microcontroller is manufactured in MXIC's advanced CMOS process. This device uses the same powerful instruction set, has the same architecture, and is pin-to-pin compatible with the existing 80C51. The added features make it an even more powerful

PIN CONFIGURATIONS

44 PLCC

P1.4

P1.3

P1.2

P1.1 P1.0

N.C.

VCC

P0.0

P0.1

P0.2

P0.3

P1.5

P0.4

P1.6

P0.5

P1.7

P0.6

RST

P0.7

P3.0

N.C.

MX10C805X

N.C.

P3.1

ALE

P3.2

PSEN

P3.3

P2.7

P3.4

P2.6

P3.5

P2.5

P3.6

P3.7

XTAL2

XTAL1

VSS

N.C.

P2.0

P2.1

P2.2

P2.3

P2.4

44 PQFP

P1.4

P1.3

P1.2 P1.1

P1.0

N.C.

VCC

P0.0

P0.1

P0.2

P0.3

P1.5

P0.4

P1.6

P0.5

P1.7

P0.6

RST

P0.7

P3.0

MX10C805X

N.C.

P3.1

ALE

P3.2

PSEN

P3.3

P2.7

P3.4

P2.6

P3.5

P2.5

P3.6

P3.7

XTAL2 XTAL1

VSS

N.C.

P2.0

P2.1

P2.2

P2.3

P2.4

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•ROM Code protection

•Two priority levels

•Power saving Idle and power down modes

•64 K external program memory space

•64 K external data memory space

•Available in PLCC, PQFP, and PDIP package

•Four 8-bit I/O ports

•Full-duplex enhanced UART compatible with the standard 80C51 and the 80C52

•Extended Temperature Range (-40°C to +85°C)

microcontroller for applications that require clock output, and up/down counting capabilities such as motor control. It also has a more versatile serial channel that facilitates multi-processor communications.

40 PDIP			(T2)	P1.0	1		40	VCC
	(T2EX) P1.1				2		39	P0.0	(AD0)
				P1.2	3		38	P0.1	(AD1)
				P1.3	4		37	P0.2	(AD2)
				P1.4	5		36	P0.3	(AD3)
				P1.5	6		35	P0.4	(AD4)
				P1.6	7		34	P0.5	(AD5)
				P1.7	8	MX10C805X	33	P0.6	(AD6)
	(INT1) P3.3				13	MX10C805X	28	P2.7	(A15)
			RESET		9		32	P0.7	(AD7)
	(RXD) P3.0				10		31	EA
		(TXD)P3.1			11		30	ALE
				P3.2			29	PSEN
		(INT0)		P3.2	12		29	PSEN
								P2.6	(A14)
			(T0)	P3.4	14		27	P2.6	(A14)
			(T1)	P3.5	15		26	P2.5	(A13)
		(WR) P3.6			16		25	P2.4	(A12)
								P2.3	(A11)
			(RD) P3.7		17		24	P2.3	(A11)
			XTAL2		18		23	P2.2	(A10)
			XTAL1		19		22	P2.1	(A9)
				VSS	20		21	P2.0	(A8)

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MX10C805X

BLOCK DIAGRAM

				P0.0-P0.7	P2.0-P2.7
Vcc
Vss				PORT 0	PORT 2
				DRIVERS	DRIVERS
		RAM ADDR. REGISTER	RAM	PORT 0	PORT 2	ROM
			RAM	LATCH	LATCH	ROM
				LATCH	LATCH

							PROGRAM
			ACC		STACK	T3	ADDR.
			ACC		STACK	T3	REGISTER
					WATCHDOG		REGISTER
				POINTER		TIMER
			TMP2	TMP1			BUFFER
		B					BUFFER
		B
	REGISTER
				ALU			PC
							PC
							INCREMENTER
					T0/T1/T2
					SFRs
				PSW	TIMERS		PROGRAM
							COUNTER
PSEN		INSTRUCTION REGISTER
ALE	TIMING						DPTR
EA	AND						DPTR
EA	AND
RST	CONTROL
RST

				PORT 1		PORT 3
				LATCH		LATCH
	OSC.			PORT 1		PORT 3
	OSC.			DRIVERS		DRIVERS
				DRIVERS		DRIVERS
	XTAL1	XTAL2
				P1.0-P1.7		P3.0-P3.7
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MX10C805X

PROCESS INFORMATION

This device is manufactured on a MXIC CMOS process.

PACKAGES

MX10C805

Temperature

C=0°C to 70°C

I=-40°C to 85°C

Package

P=PDIP

Q=PLCC

F=PQFP

ROM Size

0=64K Bytes

1=4K Bytes

2=8K Bytes

4=16K Bytes

8=32K Bytes

PIN DESCRIPTIONS

VCC : Supply voltage.

VSS : Circuit ground.

Port 0 : Port 0 is an 8-bit, open drain, bidirectional I/O port. As an output port each pin can sink several LS TTL inputs. Port 0 pins that have 1's written to them float, and in that state can be used as high-impedance inputs.

Port 0 is also the multiplexed low-order address and data bus during accesses to external Program and Data Memory. In this application it uses strong internal pullups when emitting 1's, and can source and sink serveral LS TTL inputs.

Port 1 : Port 1 is an 8-bit bidirectional I/O port with internal pullups. The port 1 output buffers can drive LS TTL inputs. Port 1 pins that have 1's written to them are pulled high by the internal pullups, and in that state can be used as inputs. As inputs, Port 1 pins that are externally pulled low will source current (IIL, on the data sheet) because of the internal pullups.

In additional, Port 1 serves the functions of the following special features of the MX10C805X :

Port Pin	Alternate Function
P1.0	T2 (External Count Input to Timer/
	Counter 2), Clock-Out

P1.1	T2EX (Timer/Counter 2 Capture/Reload
	Trigger and Direction Control)

Port 2 : Port 2 is an 8-bit bidirectional I/O port with internal pullups. The port 2 output buffers can drive LS TTL inputs. Port 2 pins that have 1's written to them are pulled high by the internal pullups, and in that state can be used as inputs. As inputs, Port 2 pins that are externally pulled low will source current (IIL, on the data sheet) because of the internal pullups.

Port 2 emits the high-order address byte during fetches from external Program Memory and during accesses to external Data Memory that use 16-bit addresses (MOVX @DPTR). In this application it uses strong internal pullups when emitting 1's. During accesses to external Data Memory that use 8-bit addresses (MOVX @Ri), Port 2 emits the contents of the P2 Special Function Register.

Port 3 : Port 3 is an 8-bit bidirectional I/O port with internal pullups. The port 3 output buffers can drive LS TTL inputs. Port 3 pins that have 1's written to them are pulled high by the internal pullups, and in that state can be used as inputs. As inputs, Port 3 pins that are externally pulled low will source current (IIL, on the data sheet) because of the internal pullups.

Port 3 also serves the function of various special features of the 8051 Family, as listed below :

Port Pin Alternate Function

P3.0 RXD (serial input port)

P3.1 TXD (serial output port)

P3.2 INT0 (external interrupt 0)

P3.3 INT1 (external interrupt 1)

P3.4 T0 (Timer 0 external input)

P3.5 T1 (Timer 1 external input)

P3.6 WR (external data memory write sttobe)

P3.7 RD (external data memory read strobe)

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RST : Reset input. A high on this pin for two machine cycles while the oscillator is running resets the device. The port pins will be driven to their reset condition when a minimum VIHI voltage is applied whether the oscillator is running or not. An internal pulldown resistor permits a power-on reset with only a capacitor connected to VCC.

ALE : Address Latch Enable output pulse for latching the low byte of the address during accesses to external memory.

In normal operation ALE is emitted at a constant rate of 1/6 the oscillator frequency, and may be used for external timing or clocking purposes. Note, however, that one ALE pulse is skipped during each access to external Data Memory.

If desired, ALE operation can be disabled by setting bit 5 of SFR location 87H (PCON). With this bit set, the pin is weakly pulled high. However, the ALE disable feature will be suspended during a MOVX or MOVC instruction, idle mode, power down mode. The ALE disable feature will be terminated by reset. When the ALE disable feature is suspended or terminated, the ALE pin will no longer be pulled up weakly. Setting the ALE-disable bit has no affect if the micrcontroller is in external execution mode.

Throughout the remainder of this data sheet, ALE will refer to the signal coming out of the ALE pin, and the pin will be referred to as the ALE pin.

PSEN : Program Store Enable is the read strobe to external Program Memory.

When the MX10C805X is executing code from external Program memory, PSEN is activated twice each machine cycle, except that two PSEN activations are skipped during each access to external Data memory.

EA/VPP : Extrernal Access enable. EA must be strapped to VSS in order to enable the twiceto fetch code from external Program Memory locations 0000H to 0FFFFH. EA will be internally latched on reset.

EA should be strapped to VCC for internal program executions.

XTAL1 : Input to the inverting oscillator amplifier.

XTAL2 : Output from the inverting oscillator amplifier.

OSCILLATOR CHARACTERISTICS

XTAL1 and XTAL2 are the input and output, respectively, of a inverting amplifier which can be configured for use as an on-chip oscillator, as shown in Figure 3. Either a quartz crystal or ceramic resonator may be used.

XTAL2

XTAL1

VSS

C1, C2 = 30 pF is equal to or less than 10 pF for Crystal For Ceramic Resonators,contact resonator manufacture.

Figure 3. Oscillator Connections

To drive the device from an external clock source, XTAL1 should be driven, while XTAL2 floats, as shown in Figure 4. There are no requirememts on the duty cycle of the external clock signal, since the input to the internal clocking circuitry is through a divide-by-two flip-flop, but minimum and maximum high and low times specified on the data sheet must be observed.

An external oscillator may encounter as much as a 100 pF load at XTAL1 when it starts up. This is due to interaction between the amplifer and its feedback capacitance. Once the external signal meets the VIL and VIH specifications the capacitance will not exceed 20 pF.

N/C XTAL2

EXTERNAL

OSCILLATOR XTAL1

SIGNAL

VSS

Figure 4. External Clock Drive Configuration

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IDLE MODE

The user's software can invoke the Idle Mode. When the microcontroller is in this mode, power consumption is reduced. The Special Function Registers and the onboard RAM retain their values during Idle, but the processor stops executing instructions. Idle Mode will be exited if the chip is reset or if an enabled interrupt occurs.

ABSOLUTE MAXIMUM RATING*

Ambient Temperature Under Bias	-40°C to +85°C
Storage Temperature	-65°C to +150°C

Voltage on Any Other Pin to VSS	-0.5V to +6.5V

IOL Per I/O Pin	15mA

Power Dissipation	1.5W

(Based on PACKAGE heat transfer limitations, not device consumption)

Table 2. Status of the External Pins during Idle and Power Down

Mode	Program Memory	ALE	PSEN	PORT0	PORT1	PORT2	PORT3
Idle	Internal	1	1	Data	Data	Data	Data

Idle	External	1	1	Float	Data	Address	Data

Power Down	Internal	0	0	Data	Data	Data	Data

Power Down	External	0	0	Float	Data	Data	Data

POWER DOWN MODE

To save even more power, a Power Down mode can be invoked by software. If this mode, the oscillator is stopped and the instruction that invoked Power Down is the last instruction executed. The on-chip RAM and Special Function Registers retain their values until the Power Down mode is terminated.

On the MX10C805X either a hardware reset or an external interrupt can cause an exit from Power Down. Reset redefines all the SFRs but does not change the onchip RAM. An external interrupt allows both the SFRs and on-chip RAM to retain their values.

To properly terminate Power Down, the reset or external interrupt should not be executed before VCC is restored to its normal operating level, and must be held active long enough for the oscillator to restart and stabilize (normally less than 10 ms).

With an external interrupt, INT0 and INT1 must be enabled and configured as level-sensitive. Holding the pin low restarts the oscillator but bringing the pin back high completes the exit. Once the interrupt is serviced, the next instruction to be executed after RETI will be the one following the instruction that put the device into Power Down.

OPERATING CONDITIONS

Symbol	Description	Min	Max	Units
TA	Ambient Temperature Under Bias
	Commerical	0	+70	°C
	Industrial	-40	+85	°C

VCC		4.5	5.5	V

fOSC	Oscillator Frequency	3.5	40	MHz

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