MAXIM MAX14595 Technical data

EVALUATION KIT AVAILABLE

19-6170; Rev 0; 12/11

MAX14595

Low-Power Dual-Channel Logic-Level Translator

General Description

The MAX14595 is a dual-channel, bidirectional logiclevel translator designed specifically for low power consumption making it suitable for portable and batterypowered equipment. Externally applied voltages, VCC and VL, set the logic levels on either side of the device. A logic signal present on the VL side of the device appears as the same logic signal on the VCC side of the device, and vice-versa.

The device is optimized for the I2C bus as well as the management data input/output (MDIO) bus where often high-speed, open-drain operation is required. When TS is high, the device allows the pullup to be connected to the I/O port that has the power. This allows continuous I2C operation on the powered side without any disruption while the level translation function is off.

The part is specified over the extended -40NC to +85NC temperature range, and is available in 8-bump WLP and 8-pin TDFN packages.

Applications

Portable and Battery-Powered Electronics

Devices with I2C Communication

Devices with MDIO Communication

General Logic-Level Translation

S Meets Industry Standards

I2C Requirements for Standard, Fast, and High* Speeds MDIO Open Drain Above 4MHz*

S Allows Greater Design Flexibility

Down to 0.9V Operation on VL Side Supports Above 8MHz Push-Pull Operation

S Ultra-Low Power Consumption

7µA VCC Supply Current 3µA VL Supply Current

S Provides High Level of Integration

Pullup Resistor Enabled with One Side Power Supply when TS Is High

12kI (max) Internal Pullup Low Transmission Gate RON: 17I (max)

S Saves Space

8-Bump, 0.4mm Pitch, 0.8mm x 1.6mm WLP Package 8-Pin, 2mm x 2mm TDFN Package

*Requires external pullups.

Ordering Information appears at end of data sheet.

For related parts and recommended products to use with this part, refer to www.maxim-ic.com/MAX14595.related.

Benefits and Features

Typical Operating Circuit

+3V

SYSTEM

GND

= +3.0V

VL = +1.2V

IOVCC1

IOVCC2

1µF

SLK

0.1µF

MAX14595

GND

+1.2V

SYSTEM

CONTROLLER

GND

* PULLUPS ARE OPTIONAL FOR HIGH-SPEED, OPEN-DRAIN OPERATION.

�� Maxim Integrated Products 1

EN TS

SDA

SLK

IOVL1 SDA

IOVL2

For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

MAX14595

Low-Power Dual-Channel Logic-Level Translator

ABSOLUTE MAXIMUM RATINGS

Voltages referenced to GND.

VCC, VL, TS .............................................................-0.5V to +6V

IOVCC1, IOVCC2 ................................... -0.5V to +(VCC + 0.5V)

IOVL1, IOVL2 ............................................-0.5V to +(VL + 0.5V)

Short-Circuit Duration IOVCC1, IOVCC2,

IOVL1, IOVL2 to GND ...........................................Continuous

VCC, IOVCC_ Maximum Continuous Current at +110NC ....100mA

VL IOVL_ Maximum Continuous Current at +110NC ..........40mA

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

PACKAGE THERMAL CHARACTERISTICS (Note 1)

TDFN

Junction-to-Ambient Thermal Resistance (BJA) ........162NC/W

Junction-to-Case Thermal Resistance (BJC) ...............20NC/W

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

TS Maximum Continuous Current at +110NC .....................70mA

Continuous Power Dissipation (TA = +70NC)

TDFN (derate 6.2mW/NC above +70NC) ......................496mW

WLP (derate 11.8mW/NC above +70NC)......................944mW

Operating Temperature Range .......................... -40NC to +85NC

Storage Temperature Range ............................ -65NC to +150NC

Lead Temperature (TDFN only, soldering, 10s) .............+300NC

Soldering Temperature (reflow) ......................................+260NC

WLP

Junction-to-Ambient Thermal Resistance (BJA) ..........85NC/W

ELECTRICAL CHARACTERISTICS

= +1.65V to +5.5V, V

VCC = +3V, V

POWER SUPPLY

Power Supply Range

VCC Supply Current I

VL Supply Current I

VCC Shutdown Supply Current I

VL Shutdown Supply Current I

IOVCC_, IOVL_ Three-State Leakage Current

TS Input Leakage Current

VCC Shutdown Threshold V

VL Shutdown Threshold V

VL Above VCC Shutdown Threshold

IOVL_ Pullup Resistor R

IOVCC_ Pullup Resistor R

IOVL_ to IOVCC_ DC Resistance

= +1.2V, and TA = +25NC.) (Notes 2, 3)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

= +0.9V to min(VCC + 0.3V, +3.6V), TA = -40NC to +85NC, unless otherwise noted. Typical values are at

CC-SHDN

L-SHDN

LEAK

LEAK_TS

TH_VCC

TH_VL

TH_VL-VCCVL

VL_PU

VCC_PU

IOVL-IOVCC

IOVCC_ = VCC, IOVL_ = VL, TS = V

TS = GND TS = VCC, VL = GND, IOVCC_ = unconnected TS = GND TS = VL, VCC = GND, IOVL_ = unconnected

TA = +25NC, TS = GND

TA = +25NC

TS = VL, VCC falling TS = VCC, VL falling, V

Inferred from V

0.9 5.5

1.65 5.5

L = 0.9V

rising above VCC, VCC = +1.65V 0.4 0.73 1.1 V

measurements 3 7.6 12

OHL

measurements 3 7.6 12

OHC

measurements 6 17

OLx

0.25 0.6 0.86 V

7 15

3 6

0.4 1

0.1 1

0.8 1.35 V

�� Maxim Integrated Products 2

MAX14595

Low-Power Dual-Channel Logic-Level Translator

ELECTRICAL CHARACTERISTICS (continued)

= +1.65V to +5.5V, V

VCC = +3V, V

= +1.2V, and TA = +25NC.) (Notes 2, 3)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

LOGIC LEVELS

IOVL_ Input-Voltage High V

IOVL_ Input-Voltage Low V

IOVCC_ Input-Voltage High V

IOVCC_ Input-Voltage Low V

TS Input-Voltage High TS Input-Voltage Low

IOVL_ Output-Voltage High V

IOVL_ Output-Voltage Low V

IOVCC_ Output-Voltage High V

IOVCC_ Output-Voltage Low V

RISE/FALL TIME ACCELERATOR STAGE

Accelerator Pulse Duration VL = +0.9V, VCC = +1.65V 9 22 48 ns

IOVL_ Output Accelerator Source Impedance

IOVCC_ Output Accelerator Source Impedance

THERMAL PROTECTION

Thermal Shutdown T

Thermal Hysteresis T

= +0.9V to min(VCC + 0.3V, +3.6V), TA = -40NC to +85NC, unless otherwise noted. Typical values are at

IHL

ILL

IHC

ILC

OHL

OLL

OHC

OLC

IOVL_ rising, VL = +0.9V, VCC = +1.65V (Note 4)

IOVL_ falling, VL = +0.9V, VCC = +1.65V (Note 4)

IOVCC_ rising, VL = +0.9V, VCC = +1.65V (Note 4)

IOVCC_ falling, VL = +0.9V, VCC = +1.65V (Note 4)

TS rising, VL = +0.9V or +3.6V, VCC > V TS falling, VL = +0.9V or +3.6V, VCC > V

IOVL_ source current 20FA, V

IOVCC_

= VL to

VCC (VCC R VL)

IOVL_ sink current 5mA, V

IOVCC_ source current 20FA, V

IOVCC_ sink current 5mA, V

IOVCC_

IOVL_

P 0.05V

IOVL_

P 0.05V

= VL

VL - 0.2 V

0.15 V

VCC - 0.4 V

0.2 V

VL - 0.15 V

0.2 V

0.7 x V

0.2 V

0.7 x V

0.25 V

VL = +0.9V, IOVL_ = GND, VCC = +1.65V 26

VL = +3.3V, IOVL_ = GND, VCC = +5V 6.8

VCC = +1.65V, IOVCC_ = GND 26

VCC = +5V, IOVCC_ = GND 6.5

SHDN

HYST

+150

�� Maxim Integrated Products 3

MAX14595

Low-Power Dual-Channel Logic-Level Translator

TIMING CHARACTERISTICS

= +1.65V to +5.5V, V

TA = -40NC to +85NC, unless otherwise noted. Typical values are at VCC = +3V, V for rise time and 90% to 10% for fall time.) (Note 5)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Turn-On Time for Q1 t

IOVCC_ Rise Time t

IOVCC_ Fall Time t

IOVL_ Rise Time t

IOVL_ Fall Time t

Propagation Delay (Driving IOVL_)

Propagation Delay (Driving IOVCC_)

Channel-to-Channel Skew t

Maximum Data Rate

Note 2: All devices are 100% production tested at TA = +25NC. Limits over the operating temperature range are guaranteed by

design and not production tested.

Note 3: VL must be less than or equal to VCC during normal operation. However, VL can be greater than VCC during startup and

shutdown conditions.

Note 4: V Note 5: Guaranteed by design. Note 6: External pullup resistors are required.

IHL

, V

ILL

, V

= +0.9V to +3.6V, VCC R VL, TS = VL, C

Push-pull driving, VL = +1.2V, VCC = +3V (Figure 1)

Open-drain driving, VL = +1.2V, VCC = +3V (Figure 2)

Push-pull driving, VL = +1.2V, VCC = +3V (Figure 1)

Open-drain driving, VL = +1.2V, VCC = +3V (Figure 2)

Push-pull driving, VL = +1.2V, VCC = +3V (Figure 3)

Open-drain driving, VL = +1.2V, VCC = +3V (Figure 4)

Push-pull driving, VL = +1.2V, VCC = +3V (Figure 3)

Open-drain driving, VL = +1.2V, VCC = +3V (Figure 4)

Push-pull driving, VL = +1.2V, VCC = +3V (Figure 1)

Push-pull driving, VL = +1.2V, VCC = +3V (Figure 3)

Input rise time/fall time < 6ns 1.5 ns

Push-pull operation 8

Open-drain operation (Note 6) 4

IHC

, and V

RCC

FCC

PD_LCC

PD_CCL

SKEW

are intended to define the range where the accelerator triggers.

ILC

= 1FF, CVL = 0.1FF, C

VCC

= 0V to VL (see the Block Diagram)

= +1.2V and TA = +25NC. All timing is 10% to 90%

Rising 7.6 19

Falling 3 9

Rising 3 5

Falling 1.5 7

IOVL_

P 100pF, C

160 400

8 22

5 15

4 13

2.8 12

3.3

IOVCC_

P 100pF,

MHz

�� Maxim Integrated Products 4

+ 7 hidden pages