MAXIM MAX14591 Technical data

EVALUATION KIT AVAILABLE
19-6173; Rev 0; 12/11
MAX14591
High-Speed, Open-Drain Capable
Logic-Level Translator

General Description

The MAX14591 is a dual-channel, bidirectional logic­level translator with the level shifting necessary to allow data transfer in a multivoltage system. Externally applied voltages, VCC and VL, set the logic levels on either side of the device. A logic signal present on the VL side of the device appears as the same logic signal on the VCC side of the device, and vice-versa.
The device is optimized for the I2C bus as well as the management data input/output (MDIO) bus where often high-speed, open-drain operation is required. When TS is high, the device allows the pullup to be connected to the I/O port that has the power. This allows continuous I2C operation on the powered side without any disruption while the level translation function is off.
The part is specified over the extended -40NC to +85NC temperature range, and is available in 8-bump WLP and 8-pin TDFN packages.

Applications

Devices with I2C Communication
Devices with MDIO Communication
General Logic-Level Translation

Benefits and Features

S Meets Industry Standards
I2C Requirements for Standard, Fast, and
High* Speeds
MDIO Open Drain Above 4MHz*
S Allows Greater Design Flexibility
Down to 0.9V Operation on VL Side Supports Above 8MHz Push-Pull Operation
S Offers Low Power Consumption
23µA (typ) VCC Supply Current 0.5µA (typ) VL Supply Current
S Provides High Level of Integration
Pullup Resistor Enabled with One Side
Power Supply when TS Is High
12kI (max) Internal Pullup Low Transmission Gate RON: 17I (max)
S Saves Space
8-Bump, 0.4mm pitch, 0.8mm x 1.6mm WLP
Package
8-Pin, 2mm x 2mm TDFN Package
*Requires external pullups.
Ordering Information appears at end of data sheet.
For related parts and recommended products to use with this part, refer to www.maxim-ic.com/MAX14591.related.

Typical Operating Circuit

+3V
SYSTEM
GND
V
CC
= +3.0V
VL = +1.2V
IOVCC1
IOVCC2
1µF
V
CC
*
V
CC
*
SLK
0.1µF
MAX14591
GND
V
CC
V
+1.2V
SYSTEM
CONTROLLER
GND
* PULLUPS ARE OPTIONAL FOR HIGH-SPEED, OPEN-DRAIN OPERATION.
����������������������������������������������������������������� Maxim Integrated Products 1
EN TS
SDA
SLK
V
L
*
V
L
*
L
IOVL1 SDA
IOVL2
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
MAX14591
High-Speed, Open-Drain Capable
Logic-Level Translator

ABSOLUTE MAXIMUM RATINGS

Voltages referenced to GND.
VCC, VL, TS .............................................................-0.5V to +6V
IOVCC1, IOVCC2 ................................... -0.5V to +(VCC + 0.5V)
IOVL1, IOVL2 ............................................-0.5V to +(VL + 0.5V)
Short-Circuit Duration IOVCC1, IOVCC2,
IOVL1, IOVL2 to GND ...........................................Continuous
VCC, IOVCC_ Maximum Continuous Current at +110°C ...100mA
VL, IOVL_ Maximum Continuous Current at +110°C .........40mA
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera­tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN
Junction-to-Ambient Thermal Resistance (BJA)............ 162NC/W
Junction-to-Case Thermal Resistance (BJC).................. 20NC/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
TS Maximum Continuous Current at +110°C .....................70mA
Continuous Power Dissipation (TA = +70NC)
TDFN (derate 6.2mW/NC above +70NC) ......................496mW
WLP (derate 11.8mW/NC above +70NC)......................944mW
Operating Temperature Range .......................... -40NC to +85NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (TDFN only, soldering, 10s) .............+300NC
Soldering Temperature (reflow) ......................................+260NC
WLP
Junction-to-Ambient Thermal Resistance (BJA)............. 85NC/W

ELECTRICAL CHARACTERISTICS

(V
= +1.65V to +5.5V, V
CC
VCC = +3V, V
POWER SUPPLY
Power Supply Range
VCC Supply Current I
VL Supply Current I
VCC Shutdown Supply Current I
VL Shutdown Supply Current I
IOVCC_, IOVL_ Three-State Leakage Current
TS Input Leakage Current
VCC Shutdown Threshold V
VL Shutdown Threshold V
VL Above VCC Shutdown Threshold
IOVL_ Pullup Resistor R
IOVCC_ Pullup Resistor R
IOVL_ to IOVCC_ DC Resistance
= +1.2V, and TA = +25NC.) (Notes 2, 3)
L
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
= +0.9V to min(VCC + 0.3V, +3.6V), TA = -40NC to +85NC, unless otherwise noted. Typical values are at
L
V
L
V
CC
CC
L
CC-SHDN
L-SHDN
I
LEAK
I
LEAK_TS
TH_VCC
TH_VL
V
TH_VL-VCCVL
VL_PU
VCC_PU
R
IOVL-IOVCC
IOVCC_ = VCC, IOVL_ = VL, TS = V
IOVCC_ = VCC, IOVL_ = VL, TS = V
TS = GND TS = VCC, VL = GND, IOVCC_ = unconnected TS = GND TS = VL, VCC = GND, IOVL_ = unconnected
TA = +25NC, TS = GND
TA = +25NC
TS = VL, VCC falling, VL = 0.9V TS = VCC, VL falling
Inferred from V
Inferred from V
Inferred from V
0.9 5.5
1.65 5.5
CC
CC
0.15 0.3 0.8 V
rising above VCC, VCC = +1.65V 0.4 0.73 1.1 V
Measurements 3 7.6 12
OHL
Measurements 3 7.6 12
OHC
Measurements 6 17
OHx
23 47
0.5 6
1 2.2
1 2.2
0.1 1
0.1 1
0.1 1
1
0.8 1.35 V
V
FA
FA
FA
FA
FA
FA
kI
kI
I
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High-Speed, Open-Drain Capable
ELECTRICAL CHARACTERISTICS (continued)
(V
= +1.65V to +5.5V, V
CC
VCC = +3V, V
LOGIC LEVELS
IOVL_ Input-Voltage High V
IOVL_ Input-Voltage Low V
IOVCC_ Input-Voltage High V
IOVCC_ Input-Voltage Low V
= +1.2V, and TA = +25NC.) (Notes 2, 3)
L
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
= +0.9V to min(VCC + 0.3V, +3.6V), TA = -40NC to +85NC, unless otherwise noted. Typical values are at
L
IHL
ILL
IHC
ILC
IOVL_ rising, VL = +0.9V, VCC = +1.65V (Note 4)
IOVL_ falling, VL = +0.9V, VCC = +1.65V (Note 4)
IOVCC_ rising, VL = +0.9V, VCC = +1.65V (Note 4)
IOVCC_ falling, VL = +0.9V, VCC = +1.65V (Note 4)
MAX14591
Logic-Level Translator
VL - 0.2 V
0.15 V
VCC - 0.4 V
0.2 V
TS Input-Voltage High
TS Input-Voltage Low
IOVL_ Output-Voltage High V
IOVL_ Output-Voltage Low V
IOVCC_ Output-Voltage High V
IOVCC_ Output-Voltage Low V
RISE/FALL TIME ACCELERATOR STAGE
Accelerator Pulse Duration VL = +0.9V, VCC = +1.65V 9 22 48 ns
IOVL_ Output Accelerator Source Impedance
IOVCC_ Output Accelerator Source Impedance
THERMAL PROTECTION
Thermal Shutdown T
Thermal Hysteresis T
ESD PROTECTION
All Pins HBM ±2 kV
V
IH
V
IL
OHL
OLL
OHC
OLC
SHDN
HYST
TS rising, VL = +0.9V or +3.6V, VCC > V
TS falling, VL = +0.9V or +3.6V, VCC > V
IOVL_ source current 20FA, V VCC (VCC R VL)
IOVL_ sink current 5mA, V
IOVCC_ source current 20FA, V
IOVCC_ sink current 5mA, V
VL = +0.9V, IOVL_ = GND, VCC = +1.65V 26
VL = +3.3V, IOVL_ = GND, VCC = +5V 6.8
VCC = +1.65V, IOVCC_ = GND 26
VCC = +5V, IOVCC_ = GND 6.5
IOVCC_
IOVCC_
IOVL_
P 0.05V
IOVL_
P 0.05V
L
L
= VL to
= VL
VL - 0.15 V
0.2 V
0.7 x V
L
0.2 V
0.7 x V
CC
0.25 V
+150
10
V
V
I
I
NC
NC
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MAX14591
High-Speed, Open-Drain Capable
Logic-Level Translator

TIMING CHARACTERISTICS

(V
= +1.65V to +5.5V, V
CC
= -40NC to +85NC, unless otherwise noted. Typical values are at VCC = +3V, V for rise time and 90% to 10% for fall time.) (Note 5)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Turn-On Time for Q1 t
IOVCC_ Rise Time t
IOVCC_ Fall Time t
IOVL_ Rise Time t
IOVL_ Fall Time t
Propagation Delay (Driving IOVL_)
Propagation Delay (Driving IOVCC_)
Channel-to-Channel Skew t
Maximum Data Rate
Note 2: All devices are 100% production tested at TA = +25NC. Limits over the operating temperature range are guaranteed by
design and not production tested.
Note 3: VL must be less than or equal to VCC during normal operation. However, VL can be greater than VCC during startup and
shutdown conditions.
Note 4: V Note 5: Guaranteed by design. Note 6: External pullup resistors are required.
IHL
, V
ILL
, V
= +0.9V to +3.6V, VCC R VL, TS = VL, C
L
V
TS
Push-pull driving, VL = +1.2V, VCC = +3V (Figure 1)
Open-drain driving, VL = +1.2V, VCC = +3V (Figure 2)
Push-pull driving, VL = +1.2V, VCC = +3V (Figure 1)
Open-drain driving, VL = +1.2V, VCC = +3V (Figure 2)
Push-pull driving, VL = +1.2V, VCC = +3V (Figure 3)
Open-drain driving, VL = +1.2V, VCC = +3V (Figure 4)
Push-pull driving, VL = +1.2V, VCC = +3V (Figure 3)
Open-drain driving, VL = +1.2V, VCC = +3V (Figure 4)
Push-pull driving, VL = +1.2V, VCC = +3V (Figure 1)
Push-pull driving, VL = +1.2V, VCC = +3V (Figure 3)
Input rise time/fall time < 6ns 1.3 ns
Push-pull operation 8
Open-drain operation (Note 6) 4
IHC
, and V
ON
RCC
FCC
RL
FL
t
PD_LCC
t
PD_CCL
SKEW
are intended to define the range where the accelerator triggers.
ILC
= 1FF, CVL = 0.1FF, C
VCC
= 0V to VL (see the Block Diagram)
= +1.2V and TA = +25NC. All timing is 10% to 90%
L
Rising 3.4 7
Falling 3 8
Rising 1.9 3
Falling 1.5 7
IOVL_
P 100pF, C
80 200
3.7 10
7.9
5.1 15
6.1
2.7 8
13
2.8 12
3.3
IOVCC_
P 100pF, TA
Fs
ns
ns
ns
ns
ns
ns
MHz
����������������������������������������������������������������� Maxim Integrated Products 4
MAX14591
High-Speed, Open-Drain Capable
Logic-Level Translator
V
L
V
L
TS
R
50I
S
MAX14591
IOVL_
GND
t
RCC
90%
50%
50%
t
PD_LCC

Figure 1. Push-Pull Driving IOVL_

V
L
V
CC
V
CC
IOVCC_
90%
50%
50%
t
PD_LCC
V
V
L
V
L
TS
C
L
20pF
t
FCC
20pF
IOVL_
C
L
t
RL
50%
10%10%
t
PD_CCL
MAX14591
GND
90%
50%
50%
V
CC
V
CC
IOVCC_
t
PD_CCL
R
S
50I
t
FL
90%
50%
10%10%

Figure 3. Push-Pull Driving IOVCC_

CC
V
L
V
CC
V
1kI 1kI
L
TS
MAX14591
IOVL_
R 5I
DSON
GND
t
RCC
90%90%
10%
t
PD_LCC

Figure 2. Open-Drain Driving IOVL_

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V
CC
IOVCC_
50%
t
t
FCC
PD_LCC
50%
10%
C
L
20pF
V
1kI 1kI
L
TS
V
CC
MAX14591
20pF
IOVL_
C
L
t
RL
90%
IOVCC_
GND
50%
10%
t
PD_CCL
t
PD_CCL

Figure 4. Open-Drain Driving IOVCC_

R
t
FL
90%
DSON
5I
50%
10%
MAX14591
High-Speed, Open-Drain Capable
Logic-Level Translator

Typical Operating Characteristics

(VCC = +3V, VL = +1.5V, RL = 1MI, CL = 15pF, push-pull driving data rate = 8Mbps, TA = +25NC, unless otherwise noted.)
VL DYNAMIC SUPPLY CURRENT
SUPPLY VOLTAGE
vs. V
CC
(OPEN-DRAIN DRIVING ONE IOVL_)
200
180
160
140
120
100
80
SUPPLY CURRENT (µA)
60
L
V
40
20
0
1.65 5.50 VCC (V)
VCC DYNAMIC SUPPLY CURRENT
SUPPLY VOLTAGE
vs. V
L
(OPEN-DRAIN DRIVING ONE IOVCC_)
800
700
600
500
400
300
SUPPLY CURRENT (µA)
CC
V
200
100
0
0.9 3.6 VL (V)
VL DYNAMIC SUPPLY CURRENT
SUPPLY VOLTAGE
vs. V
CC
(PUSH-PULL DRIVING ONE IOVCC_)
200
180
160
MAX14591E toc01
140
120
100
80
SUPPLY CURRENT (µA)
60
L
V
40
20
0
4.954.403.30 3.852.752.20
1.65 5.50 VCC (V)
MAX14591E toc02
SUPPLY CURRENT (µA)
CC
V
4.954.403.30 3.852.752.20
VL DYNAMIC SUPPLY CURRENT
vs. TEMPERATURE
(OPEN-DRAIN DRIVING ONE IOVL_)
200
180
160
MAX14591E toc04
140
120
100
80
SUPPLY CURRENT (µA)
60
L
V
40
20
3.33.01.2 1.5 1.8 2.42.1 2.7
0
-40 85 TEMPERATURE (°C)
603510-15
MAX14591E toc05
SUPPLY CURRENT (µA)
L
V
VCC DYNAMIC SUPPLY CURRENT
SUPPLY VOLTAGE
vs. V
L
(PUSH-PULL DRIVING ONE IOVL_)
800
700
600
500
400
300
200
100
0
0.9 3.6 VL (V)
VL DYNAMIC SUPPLY CURRENT
vs. TEMPERATURE
(PUSH-PULL DRIVING ONE IOVCC_)
200
180
160
140
120
100
80
60
40
20
0
-40 85
TEMPERATURE (°C)
MAX14591E toc03
3.33.01.2 1.5 1.8 2.42.1 2.7
MAX14591E toc06
603510-15
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MAX14591
High-Speed, Open-Drain Capable
Logic-Level Translator
Typical Operating Characteristics (continued)
(VCC = +3V, VL = +1.5V, RL = 1MI, CL = 15pF, push-pull driving data rate = 8Mbps, TA = +25NC, unless otherwise noted.)
VL DYNAMIC SUPPLY CURRENT
vs. CAPACITIVE LOAD
(OPEN-DRAIN DRIVING ONE IOVL_)
200
180
160
140
120
100
80
SUPPLY CURRENT (µA)
60
L
V
40
20
0
0 100
CAPACITIVE LOAD (pF)
PROPAGATION DELAY
vs. CAPACITIVE LOAD
(PUSH-PULL DRIVING ONE IOVL_)
16
RS = 50I
14
12
10
8
6
PROPAGATION DELAY (ns)
4
2
0
0 100
t
PD_LCC_FALL
t
PD_LCC_RISE
CAPACITIVE LOAD (pF)
VCC DYNAMIC SUPPLY CURRENT
vs. CAPACITIVE LOAD
(PUSH-PULL DRIVING ONE IOVL_)
1.6
1.4
MAX14591E toc07
1.2
1.0
0.8
0.6
SUPPLY CURRENT (mA)
CC
0.4
V
0.2
0
80604020
0 100
CAPACITIVE LOAD (pF)
806020 40
MAX1960 toc08
RISE/FALL TIME vs. CAPACITIVE LOAD
(PUSH-PULL DRIVING ONE IOVL_)
30
RS = 50I
25
20
15
10
RISE/FALL TIME (ns)
5
0
0 100
t
FCC
t
RCC
CAPACITIVE LOAD (pF)
MAX14591E toc09
80604020
PROPAGATION DELAY
RISE/FALL TIME vs. CAPACITIVE LOAD
(PUSH-PULL DRIVING ONE IOVCC_)
16
RS = 50I
14
MAX1960 toc10
12
10
8
6
RISE/FALL TIME (ns)
4
2
0
806020 40
0 100
t
FL
CAPACITIVE LOAD (pF)
t
RL
806020 40
MAX1960 toc11
9
8
7
6
5
4
3
PROPAGATION DELAY (ns)
2
1
0
vs. CAPACITIVE LOAD
(PUSH-PULL DRIVING ONE IOVCC_)
RS = 50I
t
PD_CCL_FALL
t
PD_CCL_RISE
0 100
CAPACITIVE LOAD (pF)
806020 40
MAX1960 toc12
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MAX14591
06
High-Speed, Open-Drain Capable
Logic-Level Translator
Typical Operating Characteristics (continued)
(VCC = +3V, VL = +1.5V, RL = 1MI, CL = 15pF, push-pull driving data rate = 8Mbps, TA = +25NC, unless otherwise noted.)
RAIL-TO-RAIL DRIVING
R
6
IOVL-IOVCC
vs. V
L
(PUSH-PULL DRIVING ONE IOVL_)
MAX14591E toc14
5
4
(I)
3
IOVL-IOVCC
R
2
1
V
IOVL_
I
IOVCC_
0
(OPEN-DRAIN DRIVING ONE IOVL_)
(OPEN-DRAIN DRIVING ONE IOVL_)
VCC = 1.65V
VCC = 3.3V
= 0.05V
= 3.3mA
RAIL-TO-RAIL DRIVING
RAIL-TO-RAIL DRIVING
VL (V)
40ns/div
40ns/div
VCC = 5.5V
MAX14591E toc15
MAX14591E toc15
54321
MAX14591E toc13
IOVL_
IOVL_ 1V/div
1V/div
VL = +1.5V
VL = +1.5V V
V
= +3.3V
= +3.3V
CC
CC
C
C
= 100pF
= 100pF
L
L
RS = 50I
RS = 50I PULLUP ON
PULLUP ON IOVL_ /IOVCC_ = 1kI
IOVL_ /IOVCC_ = 1kI
IOVCC_
IOVCC_ 1V/div
1V/div
40ns/div
EXITING SHUTDOWN MODE
10µs/div
MAX14591E toc16
IOVL_ 1V/div
VL = +1.5V V
CC
C
= 15pF
L
R
= 1MI
L
R
= 50I
S
IOVCC_ 1V/div
TS 500mV/div
VL = 1.2V V
CC
IOVCC_ = 0V
= 100pF
C
L
R
PU_VL
IOVL_ 500mV/div
= +3.3V
= 3.0V
= 50I
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TOP VIEW
BUMPS ON BOTTOM
12
+
A
V
L
B
IOVCC2
V
CC
MAX14591
IOVL2
WLP
MAX14591
High-Speed, Open-Drain Capable
Logic-Level Translator

Pin Configurations

3
IOVL1
IOVCC1
TS
GND
V
CC
865
4
134
+
V
L
IOVCC2
7
MAX14591
2
IOVL2
TDFN
IOVCC1
IOVL1
GND
TS
BUMP/PIN
WLP TDFN
A1 1 V
NAME FUNCTION
Logic Supply Voltage, +0.9V to min(VCC + 0.3V, +3.6V). Bypass VL to GND with a 0.1FF
L
ceramic capacitor as close as possible to the device.
A2 2 IOVL2 Input/Output 2. Reference to VL. A3 3 IOVL1 Input/Output 1. Reference to VL.
Active-Low Three-State Input. Drive TS low to place the device in shutdown mode with
A4 4
TS
high-impedance output and internal pullup resistors disconnected. Drive TS high for normal operation.
B1 8 V
Power Supply Voltage, +1.65V to +5.5V. Bypass VCC to GND with a 1FF ceramic capacitor
CC
as close to the device as possible.
B2 7 IOVCC2 Input/Output 2. Reference to VCC. B3 6 IOVCC1 Input/Output 1. Reference to VCC. B4 5 GND Ground

Pin Description

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MAX14591
High-Speed, Open-Drain Capable
Logic-Level Translator

Block Diagram

V
L
MAX14591
ONE-SHOOT
BLOCK
EN CONTROL
BLOCK
GATE
DRIVE
IOVL_
NQ1

Detailed Description

The MAX14591 is a dual-channel, bidirectional level trans­lator. The device translates low voltage down to +0.9V on the VL side to high voltage on the VCC side and vice-ver­sa. The device is optimized for open-drain and high-speed operation, such as I2C bus and MDIO bus.
The device has low on-resistance (17I max), which is important for high-speed, open-drain operation. The device also features internal pullup resistors that are active when the corresponding power is on and TS is high.

Level Translation

For proper operation, ensure that +1.65V P VCC P +5.5V, and +0.9V P VL P VCC. When power is supplied to VL while VCC is less than VL, the device automatically disables logic-level translation function. Also, the device enters shutdown mode when TS = GND.

High-Speed Operation

The device meets the requirements of high-speed I2C and MDIO open-drain operation. The maximum data rate is at least 4MHz for open-drain operation with the total bus capacitance equal to or less than 100pF.
V
CCTS
ONE-SHOOT
BLOCK
IOVCC_

Three-State Input TS

The device features a three-state input that can put the device into high-impedance mode. When TS is low, IOVCC_ and IOVL_ are all high impedance and the inter­nal pullup resistors are disconnected. When TS is high, the internal pullup resistors are connected when the corresponding power is in regulation, and the resistors are disconnected at the side that has no power on. In many portable applications, one supply is turned off but the other side is still operating and requires the pullup resistors to be present. This feature eliminates the need for external pullup resistors. The level translation function is off until both power supplies are in range.

Thermal-Shutdown Protection

The device features thermal-shutdown protection to protect the part from overheating. The device enters thermal shutdown when the junction temperature exceeds +150NC (typ), and the device is back to normal operation again after the temperature drops by approximately 10NC (typ). When the device is in thermal shutdown, the level translator is disabled.
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MAX14591
High-Speed, Open-Drain Capable
Logic-Level Translator

Applications Information

Layout Recommendations

Use standard high-speed layout practices when laying out a board with the MAX14591. For example, to minimize line coupling, place all other signal lines not con­nected to the device at least 1x the substrate height of the PCB away from the input and output lines of the device.

Extended ESD

ESD protection structures are incorporated on all pins to protect against electrostatic discharges up to ±2kV (HBM) encountered during handling and assembly. After an ESD event, the device continues to function without latchup.
R
D
1.5kI
DISCHARGE
RESISTANCE
STORAGE CAPACITOR
DEVICE
UNDER
TEST
HIGH-
VOLTAGE
DC
SOURCE
R
C
1MI
CHARGE CURRENT-
LIMIT RESISTOR
C
100pF
S

ESD Test Conditions

ESD performance depends on a variety of conditions. Contact Maxim for a reliability report that documents test setup, test methodology, and test results.

Human Body Model

Figure 5 shows the Human Body Model. Figure 6 shows
the current waveform it generates when discharged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of interest that is then discharged into the device through a 1.5kI resistor.
PEAK-TO-PEAK RINGING
I
r
(NOT DRAWN TO SCALE)
t
DL
AMPERES
IP 100%
90%
36.8%
10%
0
0
t
RL
TIME
CURRENT WAVEFORM

Figure 6. Human Body Current WaveformFigure 5. Human Body ESD Test Model

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MAX14591
High-Speed, Open-Drain Capable
Logic-Level Translator

Ordering Information

PART TOP MARK PIN-PACKAGE
MAX14591ETA+T BNS 8 TDFN-EP* MAX14591EWA+T AAD 8 WLP
Note: All devices are specified over -40NC to +85NC operating temperature range. +Denotes a lead(Pb)-free/RoHS-compliant package. T = Tape and reel.

Chip Information

PROCESS: BiCMOS

Package Information

For the latest package outline information and land patterns (footprints), go to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
8 TDFN-EP T822CN+1
8 WLP W80A1+1
PACKAGE
CODE
OUTLINE
NO.
21-0487 90-0349
21-0555
LAND
PATTERN NO.
Refer to
Application
Note 1891
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MAX14591
High-Speed, Open-Drain Capable
Logic-Level Translator

Revision History

REVISION
NUMBER
0 12/11 Initial release
REVISION
DATE
DESCRIPTION
PAGES
CHANGED
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 13
©
2011 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.
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