_______________Detailed Description
The MAX1458 provides an analog amplification path for
the sensor signal. Calibration and temperature compensation are achieved by varying the offset and gain
of a programmable-gain amplifier (PGA) and by varying
the sensor bridge current. The PGA uses a switchedcapacitor CMOS technology, with an input-referred
coarse offset trimming range of approximately ±63mV
(9mV steps). An additional output-referred fine offset
trim is provided by the Offset DAC (approximately
2.8mV steps). The PGA provides eight gain values from
+41V/V to +230V/V. The bridge current source is programmable from 0.1mA to 2mA.
The MAX1458 uses four 12-bit DACs and one 3-bit
DAC, with calibration coefficients stored by the user in
an internal 128-bit EEPROM. This memory contains the
following information as 12-bit-wide words:
• Configuration register
• Offset calibration coefficient
• Offset temperature error compensation coefficient
• FSO (full-span output) calibration coefficient
• FSO temperature error compensation coefficient
• 24 user-defined bits for customer programming of
manufacturing data (e.g., serial number and date)
Figure 1 shows a typical pressure-sensor output and
defines the offset, full-scale, and full-span output values
as a function of voltage.
MAX1458
1%-Accurate, Digitally Trimmed
Sensor Signal Conditioner
4 _______________________________________________________________________________________
NAME FUNCTION
1 SCLK
Data Clock Input. Used only during programming/testing. Internally pulled to VSSwith a 1MΩ (typical) resistor. Data is clocked in on the rising edge of the clock. The maximum SCLK frequency is 10kHz.
2 CS
Chip-Select Input. The MAX1458 is selected when this pin is high. When low, OUT and DIO become high
impedance. Internally pulled to VDDwith a 1MΩ (typical) resistor. Leave unconnected for normal operation.
PIN
3, 11 I.C. Internally Connected. Leave unconnected.
4 TEMP
Temperature Sensor Output. An internal temperature sensor (a 100kΩ, 4600ppm/°C TC resistor) which can
provide a temperature-dependent voltage.
8 V
SS
Negative Power-Supply Input
7 WE
Dual-Function Input Pin. Used to enable EEPROM erase/write operations. Also used to set the DAC refreshrate mode. Internally pulled to V
DD
with a 1MΩ (typical) resistor. Refer to the
Chip-Select (CS) and Write-
Enable (WE)
section.
6 DIO
Data Input/Output. Used only during programming/testing. Internally pulled to VSSwith a 1MΩ (typical)
resistor. High impedance when CS is low.
5 FSOTC
Buffered FSOTC DAC Output. An internal 75kΩ resistor (R
FTC
) connects FSOTC to ISRC (see
Functional
Diagram
). Optionally, external resistors can be used in place of or in parallel with R
FTC
and R
ISRC
.
14 INP Positive Sensor Input. Input impedance >1MΩ. Rail-to-rail input range.
13 BDRIVE Sensor Excitation Current Output. This current source drives the bridge.
12 INM Negative Sensor Input. Input impedance >1MΩ. Rail-to-rail input range.
10 OUT PGA Output Voltage
9 ISRC
Current-Source Reference. An internal 75kΩ resistor (R
ISRC
) connects ISRC to VSS(see
Functional
Diagram
). Optionally, external resistors can be used in place of or in parallel with R
FTC
and R
ISRC
.
Pin Description
16 LIMIT
Voltage Limit Input. This pin sets the maximum voltage at OUT. If left unconnected, the output voltage will be
limited to 4.6V (VDD= 5V). Connect to VDDfor maximum output swing. The acceptable range is 4.5V ≤
V
LIMIT
≤ VDD.
15 V
DD
Positive Power-Supply Input. Connect a 0.1µF capacitor from VDDto V
SS.