The MAX1436B octal, 12-bit analog-to-digital converter
(ADC) features fully differential inputs, a pipelined
architecture, and digital error correction incorporating a
fully differential signal path. This ADC is optimized for
low-power and high-dynamic performance in medical
imaging instrumentation and digital communications
applications. The MAX1436B operates from a 1.8V single supply and consumes only 743mW (93mW per
channel) while delivering a 69.9dB (typ) signal-to-noise
ratio (SNR) at a 5.3MHz input frequency. In addition to
low operating power, the MAX1436B features a lowpower standby mode for idle periods.
An internal 1.24V precision bandgap reference sets the
full-scale range of the ADC. A flexible reference structure allows the use of an external reference for applications requiring increased accuracy or a different input
voltage range. The reference architecture is optimized
for low noise.
A single-ended clock controls the data-conversion
process. An internal duty-cycle equalizer compensates
for wide variations in clock duty cycle. An on-chip PLL
generates the high-speed serial low-voltage differential
signal (LVDS) clock.
The MAX1436B has self-aligned serial LVDS outputs for
data, clock, and frame-alignment signals. The output
data is presented in two’s complement or binary format.
The MAX1436B offers a maximum sample rate of
40Msps. See the
Pin-Compatible Versions
table below
for higher-speed versions. This device is available in a
small, 14mm x 14mm x 1mm, 100-pin TQFP package
with exposed pad and is specified for the extended
industrial (-40°C to +85°C) temperature range.
Applications
Ultrasound and Medical Imaging
Instrumentation
Multichannel Communications
Features
o Excellent Dynamic Performance
69.9dB SNR at 5.3MHz
96dBc SFDR at 5.3MHz
95dB Channel Isolation
o Ultra-Low Power
93mW per Channel (Normal Operation)
Fast 200μs Wake-Up Time from Standby
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
(Voltages referenced to GND)
AVDD.....................................................................-0.3V to +2.0V
CVDD.....................................................................-0.3V to +3.6V
OVDD ....................................................................-0.3V to +2.0V
IN_P, IN_N ..............................................-0.3V to (V
AV
DD
+ 0.3V)
CLK ........................................................-0.3V to (V
CV
DD
+ 0.3V)
OUT_P, OUT_N, FRAME_, CLKOUT_ ......-0.3V to (V
OV
DD
+ 0.3V)
DT, SLVS/LVDS, LVDSTEST, PLL_, T/B, STBY,
REFIO, REFADJ, CMOUT...................-0.3V to (V
, unless otherwise noted. Typical values are at TA= +25°C.) (Notes 2, 3)
Note 2: Specifications at TA≥ +25°C are guaranteed by production testing. Specifications at TA< +25°C are guaranteed by design
and characterization and not subject to production testing.
Note 3: All capacitances are between the indicated pin and GND, unless otherwise noted.
Note 4: See definition in the
Parameter Definitions
section at the end of this data sheet.
Note 5: See the
Common-Mode Output (CMOUT)
section.
Note 6: Connect REFADJ to GND directly to enable internal reference mode. Connect REFADJ to AVDD directly to disable the inter-
nal bandgap reference and enable external reference mode.
Note 7: Data valid to CLKOUT rise/fall timing is measured from 50% of data output level to 50% of clock output level.
Note 8: Guaranteed by design and characterization. Not subject to production testing.
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
POWER REQUIREMENTS
AVDD Supply Voltage RangeV
OVDD Supply Voltage RangeV
CVDD Supply Voltage RangeV
AVDD Supply CurrentI
OVDD Supply CurrentI
CVDD Supply CurrentI
Power DissipationP
TIMING CHARACTERISTICS (Note 8)
Data Valid to CLKOUT Rise/Fallt
CLKOUT Output-Width Hight
CLKOUT Output-Width Lowt
FRAME Rise to CLKOUT Riset
Sample CLK Rise to FRAME Riset
Crosstalk(Note 4)-95dB
Gain MatchingC
Phase MatchingC
AVDD
OVDD
CVDD
AVDD
OVDD
CVDD
DISSfIN
OD
CH
CL
CF
SF
GMfIN
PMfIN
1.71.81.9V
1.71.81.9V
1.71.83.6V
STBY = 0337380
fIN = 19.3MHz
at -0.5dBFS
STBY = 0, D T = 1337
STBY = 1, standb y,
no cl ock i np ut
37mA
STBY = 076100
fIN = 19.3MHz
at -0.5dBFS
CVDD is used only to bias ESD-protection
diodes on CLK input, Figure 2
STBY = 0, D T = 199
STBY = 1, standb y,
no cl ock i np ut
16µA
0mA
= 19.3MHz at -0.5dBFS743864mW
Figure 5 (Notes 7, 8)
( t
Figure 5t
Figure 5t
Figure 4 (Note 8)
Figure 4 (Note 8)
( t
( t
S AM P LE
- 0.15
S AM P LE
- 0.15
S AM P LE
+ 1.1
/24)
S AM P LE
S AM P LE
/24)
/2)
( t
S AM P LE
/24)
+ 0.15
/12ns
/12ns
( t
S AM P LE
/24)
+ 0.15
( t
S AM P LE
/2)
+ 2.6
= 5.3MHz (Note 4)±0.1dB
= 5.3MHz (Note 4)±0.25D eg r ees
mA
mA
ns
ns
ns
MAX1436B
Octal, 12-Bit, 40Msps, 1.8V ADC
with Serial LVDS Outputs
GNDGround. Connect all GND pins to the same potential.
Analog Power Input. Connect AVDD to a 1.7V to 1.9V power supply. Bypass AVDD to GND
AVDD
N.C.No Connection. Not internally connected.
OVDD
with a 0.1µF capacitor as close as possible to the device. Bypass the AVDD power plane to
the GND plane with a bulk ≥ 2.2µF capacitor. Connect all AVDD pins to the same potential.
Double-Termination Select. Drive DT high to select the internal 100Ω termination between the
differential output pairs. Drive DT low to select no output termination.
Differential Output-Signal Format-Select Input. Drive SLVS/LVDS high to select SLVS outputs.
Drive SLVS/LVDS low to select LVDS outputs.
Clock Power Input. Connect CVDD to a 1.7V to 3.6V power supply. Bypass CVDD to GND
with a 0.1µF capacitor in parallel with a ≥ 2.2µF capacitor. Install the bypass capacitors as
close as possible to the device.
O utp ut- D r i ve r P ow er Inp ut. C onnect O V D D to a 1.7V to 1.9V p ow er sup p l y. Byp ass O V D D to
G N D w i th a 0.1µF cap aci tor as cl ose as p ossi b l e to the d evi ce. Byp ass the O V D D p ow er p l ane
to the G N D p l ane w i th a b ul k ≥ 2.2µF cap aci tor . C onnect al l O V D D p i ns to the sam e p otenti al .
MAX1436B
Octal, 12-Bit, 40Msps, 1.8V ADC
with Serial LVDS Outputs
82PLL3PLL Control Input 3. See Table 1 for details.
83PLL2PLL Control Input 2. See Table 1 for details.
84PLL1PLL Control Input 1. See Table 1 for details.
85T/B
90REFN
91REFP
93REFIO
94REFADJ
95CMOUT
97IN0PChannel 0 Positive Analog Input
98IN0NChannel 0 Negative Analog Input
—EPExposed Pad. EP is internally connected to GND. Connect EP to GND.
Negative Frame-Alignment LVDS/SLVS Output. A rising edge on the differential FRAME
output aligns to a valid D0 in the output data stream.
Positive Frame-Alignment LVDS/SLVS Output. A rising edge on the differential FRAME output
aligns to a valid D0 in the output data stream.
LVDS Test Pattern Enable. Drive LVDSTEST high to enable the output test pattern (0000 1011
1101 MSB → LSB). As with the analog conversion results, the test pattern data is output LSB
first. Drive LVDSTEST low for normal operation.
Standby Input. An active-high level on STBY puts the MAX1436B into standby mode, leaving
the reference circuitry active. Drive STBY low for normal operation.
Output Format-Select Input. Drive T/B high to select binary output format. Drive T/B low to
select two’s-complement output format.
N eg ati ve Refer ence Byp ass O utp ut. C onnect a ≥ 1µF ( 10µF typ ) cap aci tor b etw een RE FP and
RE FN , and connect a ≥ 1µF ( 10µF typ ) cap aci tor b etw een RE FN and GN D . Pla c e t h e
c a p a c it o r s a s c lo s e as p o s s ib le t o t h e de v i c e on t h e sa m e si d e of t h e PC B .
Positive Reference Bypass Output. Connect a ≥ 1µF (10µF typ) capacitor between REFP and
REFN, and connect a ≥ 1µF (10µF typ) capacitor between REFP and GND. Place the
capacitors as close as possible to the device on the same side of the PC B .
Reference Input/Output. For internal reference operation (REFADJ = GND), the reference
output voltage is 1.24V. For external reference operation (REFADJ = AVDD), apply a stable
reference voltage at REFIO. Bypass to GND with ≥ 0.1µF.
Internal/External Reference-Mode-Select and Reference Adjust Input. For internal reference
mode, connect REFADJ directly to GND. For external reference mode, connect REFADJ
directly to AVDD. For reference-adjust mode, see the Full-Scale Range Adjustments Using theInternal Reference section.
Common-Mode Reference Voltage Output. CMOUT outputs the input common-mode voltage
for DC-coupled applications. Bypass CMOUT to GND with ≥ 0.1µF capacitor.
The MAX1436B ADC features fully differential inputs, a
pipelined architecture, and digital error correction for
high-speed signal conversion. The ADC pipeline architecture moves the samples taken at the inputs through
the pipeline stages every half clock cycle. The converted digital results are serialized and sent through the
LVDS/SLVS output drivers. The total clock-cycle latency
from input to output is 6.5 clock cycles.
The MAX1436B offers eight separate fully differential
channels with synchronized inputs and outputs.
Configure the outputs for binary or two’s complement with
the T/B digital input. Global power-down minimizes power
consumption.
Input Circuit
Figure 1 displays a simplified diagram of the input T/H
circuits. In track mode, switches S1, S2a, S2b, S4a, S4b,
S5a, and S5b are closed. The fully differential circuits
sample the input signals onto the two capacitors (C2a
and C2b) through switches S4a and S4b. S2a and S2b
set the common mode for the operational transconductance amplifier (OTA), and open simultaneously with S1,
sampling the input waveform. Switches S4a, S4b, S5a,
and S5b are then opened before switches S3a and S3b
connect capacitors C1a and C1b to the output of the
amplifier and switch S4c is closed. The resulting differential voltages are held on capacitors C2a and C2b. The
amplifiers charge capacitors C1a and C1b to the same
values originally held on C2a and C2b. These values are
then presented to the first-stage quantizers and isolate
Functional Diagram
CMOUT
IN0P
IN0N
IN1P
IN1N
IN7P
IN7N
CLK
CLOCK
CIRCUITRY
REFADJ REFIO REFP REFN
REFERENCE SYSTEM
ICMV*
T/H
T/H
T/H
12-BIT
PIPELINE
ADC
12-BIT
PIPELINE
ADC
12-BIT
PIPELINE
ADC
PLL
6x
STBY
POWER
CONTROL
OVDDAVDD
MAX1436B
12:1
SERIALIZER
12:1
SERIALIZER
12:1
SERIALIZER
SLVS/LVDS
DT
OUTPUT
CONTROL
LVDS/SLVS
OUTPUT
DRIVERS
LVDSTEST
T/B
OUT0P
OUT0N
OUT1P
OUT1N
OUT7P
OUT7N
FRAMEP
FRAMEN
CLKOUTP
CLKOUTN
CVDD
*ICMV = INPUT COMMON-MODE VOLTAGE (INTERNALLY GENERATED).
PLL3PLL1PLL2
GND
MAX1436B
Octal, 12-Bit, 40Msps, 1.8V ADC
with Serial LVDS Outputs
the pipelines from the fast-changing inputs. Analog
inputs, IN_P to IN_N, are driven differentially. For differential inputs, balance the input impedance of IN_P and
IN_N for optimum performance.
Reference Configurations (REFIO,
REFADJ, REFP, and REFN)
The MAX1436B provides an internal 1.24V bandgap
reference or can be driven with an external reference
voltage. The full-scale analog differential input range is
±FSR. FSR (full-scale range) is given by the following
equation:
where V
REFIO
is the voltage at REFIO, generated inter-
nally or externally. For a V
REFIO
= 1.24V, the full-scale
input range is ±700mV (1.4V
P-P
).
Internal Reference Mode
Connect REFADJ to GND to use the internal bandgap
reference directly. The internal bandgap reference generates V
REFIO
to be 1.24V with a 120ppm/°C temperature coefficient in internal reference mode. Connect an
external ≥ 0.1µF bypass capacitor from REFIO to GND
for stability. REFIO sources up to 200µA and sinks up
to 200µA for external circuits, and REFIO has a
75mV/mA load regulation. Putting the MAX1436B into
standby mode turns off all circuitry except the reference circuit, allowing the converter to power-up faster
when the ADC exits standby with a high-to-low transitional signal on STBY. The internal circuits of the
MAX1436B require 200µs to power up and settle when
the converter exits standby mode.
To compensate for gain errors or to decrease or
increase the ADC’s FSR, add an external resistor
between REFADJ and GND or REFADJ and REFIO.
This adjusts the internal reference value of the
MAX1436B by up to ±5% of its nominal value. See the
Full-Scale Range Adjustments Using the Internal
Reference
Connect ≥ 1µF (10µF typ) capacitors to GND from
REFP and REFN and a ≥ 1µF (10µF typ) capacitor
between REFP and REFN as close to the device as
possible on the same side of the PC board.
External Reference Mode
The external reference mode allows for more control
over the MAX1436B reference voltage and allows multiple converters to use a common reference. Connect
REFADJ to AVDD to disable the internal reference.
Apply a stable 1.18V to 1.30V source at REFIO. Bypass
REFIO to GND with a ≥ 0.1µF capacitor. The REFIO
input impedance is > 1MΩ.
Clock Input (CLK)
The MAX1436B accepts a CMOS-compatible clock signal with a wide 20% to 80% input clock duty cycle.
Drive CLK with an external single-ended clock signal.
Figure 2 shows the simplified clock input diagram.
Low clock jitter is required for the specified SNR performance of the MAX1436B. Analog input sampling
occurs on the rising edge of CLK, requiring this edge to
provide the lowest possible jitter. Jitter limits the maximum SNR performance of any ADC according to the
following relationship:
where fINrepresents the analog input frequency and t
J
is the total system clock jitter.
PLL Inputs (PLL1, PLL2, PLL3)
The MAX1436B features a PLL that generates an output
clock signal with 6 times the frequency of the input
clock. The output clock signal is used to clock data out
of the MAX1436B (see the
System Timing Requirements
section). Set the PLL1, PLL2, and PLL3 bits according
to the input clock range provided in Table 1.
System Timing Requirements
Figure 3 shows the relationship between the analog
inputs, input clock, frame-alignment output, serial-clock
output, and serial-data output. The differential analog
input (IN_P and IN_N) is sampled on the rising edge of
the CLK signal and the resulting data appears at the
digital outputs 6.5 clock cycles later. Figure 4 provides
a detailed, two-conversion timing diagram of the relationship between the inputs and the outputs.
Clock Output (CLKOUTP, CLKOUTN)
The MAX1436B provides a differential clock output that
consists of CLKOUTP and CLKOUTN. As shown in Figure
4, the serial output data is clocked out of the MAX1436B
on both edges of the clock output. The frequency of the
output clock is 6 times the frequency of CLK.
Frame-Alignment Output (FRAMEP, FRAMEN)
The MAX1436B provides a differential frame-alignment
signal that consists of FRAMEP and FRAMEN. As
shown in Figure 4, the rising edge of the frame-alignment signal corresponds to the first bit (D0) of the 12bit serial data stream. The frequency of the framealignment signal is identical to the frequency of the
input clock.
Serial Output Data (OUT_P, OUT_N)
The MAX1436B provides its conversion results through
individual differential outputs consisting of OUT_P and
OUT_N. The results are valid 6.5 input clock cycles
after the sample is taken. As shown in Figure 3, the output data is clocked out on both edges of the output
clock, LSB (D0) first. Figure 5 provides the detailed serial-output timing diagram.
Figure 2. Clock Input Circuitry
Table 1. PLL1, PLL2, and PLL3
Configuration Table
SNR
=×
20
log
⎛
⎜
×× ×
2
π
⎝
1
⎞
⎟
ft
⎠
INJ
AVDD
CVDD
CLK
GND
MAX1436B
DUTY-CYCLE
EQUALIZER
INPUT CLOCK RANGE
PLL1PLL2PLL3
000Unused
00132.540.0
01022.532.5
01116.322.5
10011.316.3
1018.111.3
1105.68.1
1114.05.6
(MHz)
MINMAX
MAX1436B
Octal, 12-Bit, 40Msps, 1.8V ADC
with Serial LVDS Outputs
The MAX1436B output data format is either offset binary or two’s complement, depending on the logic-input
T/B. With T/B low, the output data format is two’s complement. With T/B high, the output data format is offset
binary. The following equations, Table 2, and Figures 6
and 7 define the relationship between the digital output
and the analog input. For two’s complement (T/B = 0):
and for offset binary (T/B = 1):
where CODE
10
is the decimal equivalent of the digital
output code as shown in Table 2.
Keep the capacitive load on the MAX1436B digital outputs as low as possible.
)
(
)
Table 2. Output Code Table (V
REFIO
= 1.24V)
Figure 6. Two’s-Complement Transfer Function (T/B = 0)
Drive SLVS/LVDS low for LVDS or drive SLVS/LVDS high
for SLVS levels at the MAX1436B outputs (OUT_P,
OUT_N, CLKOUTP, CLKOUTN, FRAMEP, and FRAMEN).
For SLVS levels, enable double-termination by driving DT
high. See the
Electrical Characteristics
table for LVDS
and SLVS output voltage levels.
LVDS Test Pattern (LVDSTEST)
Drive LVDSTEST high to enable the output test pattern
on all LVDS or SLVS output channels. The output test
pattern is 0000 1011 1101. Drive LVDSTEST low for
normal operation (test pattern disabled).
Common-Mode Output (CMOUT)
CMOUT provides a common-mode reference for DCcoupled analog inputs. If the input is DC-coupled,
match the output common-mode voltage of the circuit
driving the MAX1436B to the output voltage at V
CMOUT
to within ±50mV. It is recommended that the output
common-mode voltage of the driving circuit be derived
from CMOUT.
Double-Termination (DT)
The MAX1436B offers an optional, internal 100Ω termination between the differential output pairs (OUT_P and
OUT_N, CLKOUTP and CLKOUTN, FRAMEP and FRAMEN). In addition to the termination at the end of the line, a
second termination directly at the outputs helps eliminate
unwanted reflections down the line. This feature is useful
in applications where trace lengths are long (> 5in) or with
mismatched impedance. Drive DT high to select doubletermination, or drive DT low to disconnect the internal termination resistor (single-termination). Selecting
double-termination increases the OVDD supply current
(see Figure 8).
Standby Mode
The MAX1436B offers a standby mode to efficiently use
power by transitioning to a low-power state when conversions are not required. STBY controls the standby
mode of all channels and the internal reference circuitry.
The reference does not power down in standby mode.
Drive STBY high to enable standby. In standby mode,
the output impedance of all of the LVDS/SLVS outputs is
approximately 342Ω, if DT is low. The output impedance
of the differential LVDS/SLVS outputs is 100Ω when DT
is high. See the
Electrical Characteristics
table for typical supply currents during standby. The following list
shows the state of the analog inputs and digital outputs
in standby mode:
•IN_P, IN_N analog inputs are disconnected from
the internal input amplifier
•Reference circuit remains active
•OUT_P, OUT_N, CLKOUTP, CLKOUTN, FRAMEP,
and FRAMEN have approximately 342Ω between the
output pairs when DT is low. When DT is high, the differential output pairs have 100Ω between each pair.
When operating in internal reference mode, the
MAX1436B requires 200µs to power up and settle when
the converter exits standby mode. To exit standby mode,
STBY, the applied control signal must transition from
high to low. When using an external reference, the wakeup time is dependent on the external reference drivers.
Applications Information
Full-Scale Range Adjustments
Using the Internal Reference
The MAX1436B supports a full-scale adjustment range
of 10% (±5%). To decrease the full-scale range, add a
25kΩ to 250kΩ external resistor or potentiometer (R
ADJ
)
between REFADJ and GND. To increase the fullscale range, add a 25kΩ to 250kΩ resistor between
REFADJ and REFIO. Figure 9 shows the two possible
configurations.
The following equations provide the relationship between
R
ADJ
and the change in the analog full-scale range:
for R
ADJ
connected between REFADJ and REFIO, and:
Figure 8. Double-Termination
DT
OUT_P/
CLKOUTP/
FRAMEP
100Ω100Ω
OUT_N/
MAX1436B
SWITCHES ARE CLOSED WHEN DT IS HIGH.
SWITCHES ARE OPEN WHEN DT IS LOW.
An RF transformer (Figure 10) provides an excellent
solution to convert a single-ended input source signal
to a fully differential signal. The MAX1436B input common-mode voltage is internally biased to 0.76V (typ)
with f
CLK
= 40MHz. Although a 1:1 transformer is
shown, a step-up transformer can be selected to
reduce the drive requirements. A reduced signal swing
from the input driver, such as an op amp, can also
improve the overall distortion.
Grounding, Bypassing, and Board Layout
The MAX1436B requires high-speed board layout
design techniques. Refer to the MAX1434/MAX1436/
MAX1436B/MAX1437/MAX1438 EV kit data sheet for a
board layout reference. Locate all bypass capacitors as
close to the device as possible, preferably on the same
side as the ADC, using surface-mount devices for minimum inductance. Bypass AVDD to GND with a 0.1µF
ceramic capacitor in parallel with a 0.1µF ceramic
capacitor. Bypass OVDD to GND with a 0.1µF ceramic
capacitor in parallel with a ≥ 2.2µF ceramic capacitor.
Bypass CVDD to GND with a 0.1µF ceramic capacitor
in parallel with a ≥ 2.2µF ceramic capacitor.
Multilayer boards with ample ground and power planes
produce the highest level of signal integrity. Connect
MAX1436B ground pins and the exposed pad to the
same ground plane. The MAX1436B relies on the
exposed-backside-pad connection for a low-inductance ground connection. Isolate the ground plane from
any noisy digital system ground planes.
Route high-speed digital signal traces away from the
sensitive analog traces. Keep all signal lines short and
free of 90° turns.
Ensure that the differential analog input network layout is
symmetric and that all parasitics are balanced equally.
Refer to the MAX1434/MAX1436/MAX1436B/MAX1437/
MAX1438 EV kit data sheet for an example of symmetric
input layout.
Parameter Definitions
Integral Nonlinearity (INL)
Integral nonlinearity is the deviation of the values on an
actual transfer function from a straight line. For the
MAX1436B, this straight line is between the end points
of the transfer function, once offset and gain errors
have been nullified. INL deviations are measured at
every step and the worst-case deviation is reported in
the
Electrical Characteristics
table.
Differential Nonlinearity (DNL)
Differential nonlinearity is the difference between an
actual step width and the ideal value of 1 LSB. A DNL
error specification of less than 1 LSB guarantees no
missing codes and a monotonic transfer function. For
the MAX1436B, DNL deviations are measured at every
step and the worst-case deviation is reported in the
Electrical Characteristics
table.
ADC FULL-SCALE = REFT - REFB
Figure 9. Circuit Suggestions to Adjust the ADC’s Full-Scale
Range
Figure 10. Transformer-Coupled Input Drive
REFT
REFB
REFERENCE
BUFFER
1V
CONTROL LINE TO
DISABLE REFERENCE
BUFFER
REFERENCE-
G
SCALING
AMPLIFIER
REFADJ
Ω
10
6
5
4
39pF
0.1μF
Ω
10
39pF
IN_P
MAX1436B
IN_N
REFIO
0.1μF
25kΩ
250kΩ
25kΩ
250kΩ
0.1μF
IN
N.C.
1
T1
2
3
MINICIRCUITS
ADT1-1WT
V
MAX1436B
FSRV
=
07 1
AVDDAVDD/2
⎛
125..Ω
−
⎜
R
⎝
ADJ
⎞
k
⎟
⎠
MAX1436B
Octal, 12-Bit, 40Msps, 1.8V ADC
with Serial LVDS Outputs
Offset error is a figure of merit that indicates how well
the actual transfer function matches the ideal transfer
function at a single point. For the MAX1436B, the ideal
midscale digital output transition occurs when there is
-1/2 LSBs across the analog inputs (Figures 6 and 7).
Bipolar offset error is the amount of deviation between
the measured midscale transition point and the ideal
midscale transition point.
Gain Error
Gain error is a figure of merit that indicates how well the
slope of the actual transfer function matches the slope
of the ideal transfer function. For the MAX1436B the
gain error is the difference of the measured full-scale
and zero-scale transition points minus the difference of
the ideal full-scale and zero-scale transition points.
For the bipolar devices (MAX1436B), the full-scale transition point is from 0x7FE to 0x7FF for two’s-complement output format (0xFFE to 0xFFF for offset binary)
and the zero-scale transition point is from 0x800 to
0x801 for two’s complement (0x000 to 0x001 for offset
binary).
Crosstalk
Crosstalk indicates how well each analog input is isolated
from the others. For the MAX1436B, a 5.3MHz, -0.5dBFS
analog signal is applied to one channel while a 19.3MHz,
-0.5dBFS analog signal is applied to another channel. An
FFT is taken on the channel with the 5.3MHz analog signal. From this FFT, the crosstalk is measured as the difference in the 5.3MHz and 19.3MHz amplitudes.
Aperture Delay
Aperture delay (tAD) is the time defined between the
rising edge of the sampling clock and the instant when
an actual sample is taken. See Figure 11.
Aperture Jitter
Aperture jitter (tAJ) is the sample-to-sample variation in
the aperture delay. See Figure 11.
Signal-to-Noise Ratio (SNR)
For a waveform perfectly reconstructed from digital
samples, the theoretical maximum SNR is the ratio of
the full-scale analog input (RMS value) to the RMS
quantization error (residual error). The ideal, theoretical
minimum analog-to-digital noise is caused by quantization error only and results directly from the ADC’s resolution (N bits):
SNR
dB[max]
= 6.02dBx N x 1.76
dB
In reality, there are other noise sources besides quantization noise: thermal noise, reference noise, clock jitter, etc.
For the MAX1436B, SNR is computed by taking the
ratio of the RMS signal to the RMS noise. RMS noise
includes all spectral components to the Nyquist frequency excluding the fundamental, the first six harmonics (HD2–HD7), and the DC offset.
Signal-to-Noise Plus Distortion (SINAD)
SINAD is computed by taking the ratio of the RMS signal
to the RMS noise plus distortion. RMS noise plus distortion includes all spectral components to the Nyquist frequency, excluding the fundamental and the DC offset.
Effective Number of Bits (ENOB)
ENOB specifies the dynamic performance of an ADC at
a specific input frequency and sampling rate. An ideal
ADC’s error consists of quantization noise only. ENOB for
a full-scale sinusoidal input waveform is computed from:
Total Harmonic Distortion (THD)
THD is the ratio of the RMS sum of the first six harmonics of the input signal to the fundamental itself. This is
expressed as:
Spurious-Free Dynamic Range (SFDR)
SFDR is the ratio expressed in decibels of the RMS
amplitude of the fundamental (maximum signal component) to the RMS value of the next-largest spurious
component, excluding DC offset. SFDR is specified in
decibels relative to the carrier (dBc).
Intermodulation Distortion (IMD)
IMD is the total power of the IM2 to IM5 intermodulation
products to the Nyquist frequency relative to the total
input power of the two input tones f1and f2. The individual input tone levels are at -6.5dBFS. The intermodulation products are as follows:
•3rd-order intermodulation products (IM3): 2 x f1- f2,
2 x f2- f1, 2 x f1+ f2, 2 x f2+ f
1
•4th-order intermodulation products (IM4): 3 x f1- f2,
3 x f2- f1, 3 x f1+ f2, 3 x f2+ f
1
•5th-order intermodulation products (IM5): 3 x f1- 2
x f2, 3 x f2- 2 x f1, 3 x f1+ 2 x f2, 3 x f2+ 2 x f
1
Third-Order Intermodulation (IM3)
IM3 is the total power of the 3rd-order intermodulation
product to the Nyquist frequency relative to the total
input power of the two input tones f1and f2. The individual input tone levels are at -6.5dBFS. The 3rd-order
intermodulation products are 2 x f1- f2, 2 x f2- f1, 2 x f
1
+ f2, 2 x f2+ f1.
Small-Signal Bandwidth
A small -20.5dBFS analog input signal is applied to an
ADC so that the signal’s slew rate does not limit the
ADC’s performance. The input frequency is then swept
up to the point where the amplitude of the digitized
conversion result has decreased by -3dB.
Full-Power Bandwidth
A large -0.5dBFS analog input signal is applied to an
ADC, and the input frequency is swept up to the point
where the amplitude of the digitized conversion result
has decreased by -3dB. This point is defined as fullpower input bandwidth frequency.
Gain Matching
Gain matching is a figure of merit that indicates how
well the gain of all eight ADC channels is matched to
each other. For the MAX1436B, gain matching is measured by applying the same 5.3MHz, -0.5dBFS analog
signal to all analog input channels. These analog inputs
are sampled at 40Msps and the maximum deviation in
amplitude is reported in dB as gain matching in the
Electrical Characteristics
table.
Phase Matching
Phase matching is a figure of merit that indicates how
well the phases of all eight ADC channels are matched
to each other. For the MAX1436B, phase matching is
measured by applying the same 5.3MHz, -0.5dBFS
analog signal to all analog input channels. These analog inputs are sampled at 40Msps and the maximum
deviation in phase is reported in degrees as phase
matching in the
Electrical Characteristics
table.
MAX1436B
Octal, 12-Bit, 40Msps, 1.8V ADC
with Serial LVDS Outputs
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