Safety Information ...................................................................................................................................5
Server Position ...................................................................................................................................5
System Access Warnings ..................................................................................................................6
Connecting the System ...........................................................................................................................7
Back Panel Connectors ......................................................................................................................7
Powering up the System .........................................................................................................................8
2 Server Features 9
Connector and Header Locations ..........................................................................................................10
13. Removing the Battery .....................................................................................................................20
Tables
1. NIC LEDs ........................................................................................................................................... 7
Please take note of the following criteria for creating a practical and safe workplace when setting up
your computer:
!
CAUTION
The system can be used anywhere the temperature is suitable for people. However, rooms with
humidity over 70%, and dusty or dirty areas are not appropriate. In addition, do not expose the server
to any temperatures over +30°C or under +10°C.
!
CAUTION
For proper cooling and airflow, operate the system only with the chassis covers installed.
!
CAUTION
Make sure that the cables connecting the server to peripheral devices are not tight.
!
CAUTION
Make sure that all power and connection cables are positioned so that they are not trip hazards.
!
CAUTION
When you save data to your server‘s hard disks or to a floppy disk, they are stored as magnetic
information on the media. Make sure that they are not damaged by magnetic or electromagnetic
fields.
!
CAUTION
Because the electronics in your computer can be damaged by jarring, no mechanical devices should
be placed on the same surface as the server. This is especially important for impact printers whose
vibrations could damage the hard disk.
!
CAUTION
Hazardous conditions, devices and cables: Hazardous electrical conditions may be present on
power, telephone, and communication cables. Turn off the server and disconnect the power cord,
telecommunications systems, networks, and modems attached to the server before opening it.
Otherwise, personal injury or equipment damage can result.
!
CAUTION
Electrostatic discharge (ESD) and ESD protection: ESD can damage disk drives, boards, and other
parts. We recommend that you perform all procedures in chapter 3 only at an ESD workstation. If one
is not available, provide some ESD protection by wearing an antistatic wrist strap attached to chassis
ground ‑ any unpainted metal surface ‑ on your server when handling parts.
!
ATTENTION
In order to fully separate the server from current, the power cord must be removed from the wall
outlet.
Page 6
System Access Warnings
!
CAUTION
To avoid personal injury or property damage, the following safety instructions apply whenever accessing
the inside of the product:
• Turn off all peripheral devices connected to this product.
• Turn off the system by pressing the power button to off.
• Disconnect the AC power by unplugging all AC power cords from the system or wall outlet.
• Disconnect all cables and telecommunication lines that are connected to the system.
• Retain all screws or other fasteners when removing access cover(s). Upon completion of
accessing inside the product, refasten access cover with original screws or fasteners.
• Do not access the inside of the power supply. There are no serviceable parts in the power
supply. Return to manufacturer for servicing.
• Power down the server and disconnect all power cords before adding or replacing any non hot‑
plug component.
• When replacing a hot‑plug power supply, unplug the power cord to the power supply being
replaced before removing the power supply from the server.
!
CAUTION
If the server has been running, any installed processor(s) and heat sink(s) may be hot. Unless you
are adding or removing a hot‑plug component, allow the system to cool before opening the covers.
To avoid the possibility of coming into contact with hot component(s) during a hotplug installation,
be careful when removing or installing the hot‑plug component(s).
!
CAUTION
To avoid injury do not contact moving fan blades. If your system is supplied with a guard over the
fan, do not operate the system without the fan guard in place.
67MAXDATA PLATINUM 100 I M9Setting up the System
Page 7
Connecting the System
A
B
D
F
C
E
G
H
I
J
KL
M
N
Back Panel Connectors
Figure 1. Back Panel Connectors
A. System Identification LEDH.Diagnostic LED 2
B. Status LEDI.Diagnostic LED 1
C. Diagnostic LED 7 (MSB LED)J.Diagnostic LED 0 (LSB LED)
D. Diagnostic LED 6K.Serial Port A
E.Diagnostic LED 5L.Video Port
F.Diagnostic LED 4M. NIC 1 (top, default management port),
G. Diagnostic LED 3N.NIC 2 (top), two USB ports (bottom)
two USB ports (bottom)
The NIC LEDs at the right and left of each NIC provide the following information.
Table 1. NIC LEDs
LEDLED StateDescription
LeftOffNo network connection
Solid GreenNetwork connection in place
Blinking GreenTransmit/receive activity
RightOff10 Mbps connection (if left LED is on or blinking)
Solid Green100 Mbps connection
Solid Amber1000 Mbps connection
Page 8
Powering up the System
A
B
C
D
E
At the front of the case, you can find the necessary controls like power button and the HDD LEDs.
Press the power button one time briefly in order to boot the server.
Figure 2. PLATINUM 100 I Controls
A. Front USB ports
B.Power switch
C.Power LED
D.Reset switch
E.HDD LED
8PBMAXDATA PLATINUM 100 I M9Setting up the System
Page 9
2 Server Features
This chapter briefly describes the main features of the server system. This chapter provides a list of
server system features and diagrams showing the location of important components and connections
of the server system.
Table 2 summarizes the features of the server system.
Table 2. Feature Summary
FeatureDescription
Chassis Dimensions450 mm high
195 mm wide
501 mm deep
18.0 kg max. chassis weight
Processor• Support for one Intel® Xeon® 3400 Series Processor
• LGA 1156 socket
Memory Two memory channels with support for 1066/1333 MHz ECC Unbuff-
ered DDR3 DRAM (UDIMM) or ECC Registered DDR3 DRAM (RDIMM,
Intel® Xeon® 3400 Series only).
• Up to 2 UDIMMs or 3 RDIMMs (Intel® Xeon® 3400 Series only) per
channel
• 32 GB max with x8 ECC RDIMM (2 Gbit DRAM) and 16 GB max with
x8 ECC UDIMM (1 Gbit DRAM)
Figure 4 shows the location of the configuration jumpers.
BMC
Force
Update
ME
Force
Update
BIOS
Recovery
Password
Clear
CMOS
Clear
Default
Enabled
Default
Enabled
Default
Recover
Default
Password
Clear
Default
CLEAR
CMOS
Figure 4. Configuration Jumpers
SSI Front Panel Connector
The server board provides a 24‑pin SSI front panel connector. The following figure shows the pin‑out
for this connector.
A.Power LEDD.Reset Button
B.HDD LEDE.NIC1 LED
C.Power ButtonF.NIC2 LED
Figure 5. SSI Front Panel Connector
Page 12
Hardware Requirements
To avoid integration difficulties and possible board damage, your system must meet the requirements
outlined below.
Processor
The mainboard supports one Intel® Xeon® 3400 series processor with up to 95 W Thermal Design
Power (TDP) with 2.5 GT/s.
Memory
The server board supports two memory channels with up to three DIMM sockets per channel. The
minimal memory population is one DIMM in memory slot DIMM_A1. Matching pairs of DIMMs
accross channels is recommended (e.g. DIMM_A2 ‑ DIMM_B2). Within a channel DIMM sockets
with a lower number must be populated before sockets with a higher number.
Supported Memory Modules
• 1.5 V DDR3 DIMMs, registered (RDIMMs) or unbuffered (UDIMMs)
• Mixing of RDIMMs and UDIMMs is not permitted
• The following DIMM and DRAM technologies are supported:
• RDIMMs:
‑ Single, dual and quad rank
‑ x8 DRAM with 2 Gbit technology
‑ DDR3 1333 (only single and dual rank), DDR3 1066 and DDR3 800
• UDIMMs:
‑ Single and dual rank
‑ x8 DRAM with 2 Gbit technology
‑ DDR3 1333, DDR3 1066 and DDR3 800
Optional Hardware
Remote Management Module
The Remote Management Module provides extended functions for server management.
A network card is provided specifically for remote access.
12PBMAXDATA PLATINUM 100 I M9Server Features
Page 13
3 Hardware Installations and Upgrades
REMOV E
A
B
Before You Begin
Before working with your server product, pay close attention to the “Safety Information” at the
beginning of this manual.
Tools and Supplies Needed
• Phillips (cross head) screwdriver (#1 bit and #2 bit)
• Needle nosed pliers
• Antistatic wrist strap and conductive foam pad (recommended)
Installing or Replacing a Processor
/ NOTE
Use the instructions provided below to install or replace a processor instead of using the instructions
that came with the processor.
When installing a second processor, verify that the processors are identical and of the same voltage
and speed. Do not mix processors of different types or frequencies.
CAUTIONS
Processor must be appropriate: You may damage the server board if you install a processor that
is inappropriate for your server.
ESD and handling processors: Reduce the risk of electrostatic discharge (ESD) damage to the
processor by doing the following: (1) Touch the metal chassis before touching the processor or server
board. Keep part of your body in contact with the metal chassis to dissipate the static charge while
handling the processor. (2) Avoid moving around unnecessarily.
Installing a Processor
1. Observe the safety and ESD precautions above and at the beginning of this book.
2. Turn off all peripheral devices connected to the server. Turn off the server.
3. Disconnect the AC power cord from the server.
4. Remove the server‘s cover.
5. Locate the processor socket (see Figure 3 on page 10).
6. Disconnect and remove any components necessary to access the processor socket.
7. Push down the lever on the processor socket. While pushing downward, push it away from
the socket to release it from the hook. Open the socket lever completely. See figure 6.
Figure 6. Opening the Processor Socket Lever
Page 14
8. Push the rear tab with your fingertip to bring the front end of the load plate up slightly. Open
REMOV E
REMOV E
A
B
REMOVE
A
the load plate completely. See figure 7.
Figure 7. Opening Load Plate
9. If there is a protective covering on the load plate, remove it and store it for later use.
Figure 8. Removing Protective Covering from the Load Plate
10. Take the processor out of the box and remove the protective shipping covering.
11. Align the processor with the socket in such a way that both notches match up with the
processor socket pins. Gently insert the processor into the socket.
1415MAXDATA PLATINUM 100 I M9Hardware Installations and Upgrades
Figure 9. Inserting the Processor
Page 15
12. Close the load plate (see letter “A”), close the socket lever, and ensure the load plate tab
A
B
D
C
engages under the socket lever when fully closed (see letter “B” and “C”).
Figure 10. Closing Load Plate and Socket Lever
13. Attach the heat sink (see next page).
Page 16
Installing the Heat Sink
2
3
1
4
The heat sink has Thermal Interface Material (TIM) located on the bottom of it. Use caution when
you unpack the heat sink so you do not damage the TIM.
1. Set the heat sink over the processor, lining up the four captive screws with the four posts
surrounding the processor.
2. Loosely screw in the captive screws on the heat sink corners in a diagonal manner.
Do no fully tighten one screw before tightening another.
3. Gradually and equally tighten each captive screw until each is firmly tightened.
Figure 11. Installing the Heat Sink
4.
Reinstall and reconnect any parts you removed or disconnected to reach the processor sockets.
5. Replace the server‘s cover and reconnect the AC power cord.
1617MAXDATA PLATINUM 100 I M9Hardware Installations and Upgrades
Page 17
Removing a Processor
1. Observe the safety and ESD precautions at the beginning of this book.
2. Turn off all peripheral devices connected to the server. Turn off the server.
3. Remove the AC power cord from the server.
4. Remove the server‘s cover.
5. Loosen the four captive screws on the corners of the heat sink.
6. Twist the heat sink slightly to break the seal between the heat sink and the processor.
7. Lift the heat sink from the processor. If it does not pull up easily, twist the heat sink again. Do
not force the heat sink from the processor. Doing so could damage the processor.
8. Lift the processor lever.
9. Raise the CPU load plate.
10. Remove the processor.
11. If installing a replacement processor, see “Installing the Processor”. Otherwise, install the
protective socket cover over the empty processor socket and reinstall the chassis cover.
Installing a PCI Card
Peripherals and add‑in cards are not included in your system and must be purchased separately.
The PCI slots support full‑height add‑in cards or low‑profile PCI add‑in cards. If a low profile card is
installed in the standard full‑height riser card, it must be equipped with a standard full‑height PCI
mounting bracket.
1. Observe the safety and ESD precautions at the beginning of this book.
2. Turn off all peripheral devices connected to the server. Turn off the server.
3. Remove power from your system by unplugging the AC power cord.
4. Remove the chassis cover.
5. Remove the screw that attaches the PCI bracket shield to the rear of the chassis to remove
the shield. Retain the screw.
6. Insert the PCI card into the PCI slot.
7. Use the screw removed in step 5 to secure the PCI card to the chassis.
8. Reconnect or replace any internal components you needed to disconnect or remove.
9. Replace the server’s cover. Reconnect any external components you needed to disconnect.
10. Attach the AC power cord.
Page 18
Installing and Removing Memory
The silkscreen on the board for the DIMMs displays DIMM_A3, DIMM_A2, DIMM_A1, DIMM_B3,
DIMM_B2, DIMM_B1 starting from the center of the board. DIMM A3 is the socket closest to the
processor socket. See chapter 2 – „Memory“ for a discussion of the memory requirements.
Installing DIMMs
To install DIMMs, follow these steps:
1. Observe the safety and ESD precautions at the beginning of this book.
2. Turn off all peripheral devices connected to the server. Turn off the server.
3. Disconnect the AC power cord.
4. Remove the server‘s cover.
5. Locate the DIMM sockets (see figure 3).
Figure 12. Installing DIMMs
6. Make sure the clips at either end of the DIMM socket(s) are pushed outward to the open
position.
7. Holding the DIMM by the edges, remove it from its anti‑static package.
8. Position the DIMM above the socket. Align the small notch in the bottom edge of the DIMM
with the keys in the socket (see inset in Figure 12).
9. Insert the bottom edge of the DIMM into the socket.
10. When the DIMM is inserted, push down on the top edge of the DIMM until the retaining clips
snap into place. Make sure the clips are firmly in place.
11. Reconnect or replace any internal components you needed to disconnect or remove.
12. Replace the server’s cover. Reconnect any external components you needed to disconnect.
13. Attach the AC power cord.
1819MAXDATA PLATINUM 100 I M9Hardware Installations and Upgrades
Page 19
Replacing the Backup Battery
The lithium battery on the server board powers the RTC for up to 10 years in the absence of power.
When the battery starts to weaken, it loses voltage, and the server settings stored in CMOS RAM in
the RTC (for example, the date and time) may be wrong. Contact your customer service representative
or dealer for a list of approved devices.
1. Observe the safety and ESD precautions in “Safety Information”.
2. Turn off all peripheral devices connected to the server. Turn off the server.
3. Disconnect the AC power cord from the server.
4. Remove the server‘s cover and locate the battery.
5. Lift the battery retention mechanism (see Figure 13).
6. Remove the battery from its socket.
Figure 13. Removing the Battery
7. Dispose of the battery according to local ordinance.
8. Remove the new lithium battery from its package, and, being careful to observe the correct
polarity, insert it in the battery socket.
9. Close the chassis.
10. Run Setup to restore the configuration settings to the RTC.
20PBMAXDATA PLATINUM 100 I M9Hardware Installations and Upgrades20
Page 21
4 Server Utilities
Using the BIOS Setup Utility
This section describes the BIOS Setup Utility options, which is used to change server configuration
defaults. You can run BIOS Setup with or without an operating system being present.
Starting Setup
You can enter and start BIOS Setup under several conditions:
• When you turn on the server, after POST completes the memory test
• When you have moved the CMOS jumper on the server board to the “Clear CMOS” position
(enabled)
In the two conditions listed above, during the Power On Self Test (POST), you will see this prompt:
Press <F2> to enter SETUP
In a third condition, when CMOS/NVRAM has been corrupted, you will see other prompts but not
the <F2> prompt:
Warning: CMOS checksum invalid
Warning: CMOS time and date not set
In this condition, the BIOS will load default values for CMOS and attempt to boot.
If You Cannot Access Setup
If you are not able to access BIOS Setup, you might need to clear the CMOS memory. For instructions
on clearing the CMOS, see “Clearing the CMOS”.
Setup Menus
Each BIOS Setup menu page contains a number of features. Except for those features that are
provided only to display automatically configured information, each feature is associated with a
value field that contains user‑selectable parameters. These parameters can be changed if the user
has adequate security rights. If a value cannot be changed for any reason, the feature’s value field
is inaccessible.
Page 22
2223MAXDATA PLATINUM 100 I M9Server Utilities
Table 4 describes the keyboard commands you can use in the BIOS Setup menus.
Table 4. Keyboard Commands
PressDescription
<F1>Help - Pressing F1 on any menu invokes the general Help window.
← →
↑
↓
F5/‑Change Value - The minus key or the F5 function key is used to change the value
F6/+Change Value - The plus key or the F6 function key is used to change the value
<Enter>Execute Command - The Enter key is used to activate submenus when the
<Esc>Exit - The ESC key provides a mechanism for backing out of any field. This key
The left and right arrow keys are used to move between the major menu pages.
The keys have no affect if a sub menu or pick list is displayed.
Select Item up - The up arrow is used to select the previous value in a menu
item’s option list, or a value field pick list. Pressing the Enter key activates the
selected item.
Select Item down - The down arrow is used to select the next value in a menu
item’s option list, or a value field pick list. Pressing the Enter key activates the
selected item.
of the current item to the previous value. This key scrolls through the values in
the associated pick list without displaying the full list.
of the current menu item to the next value. This key scrolls through the values
in the associated pick list without displaying the full list. On 106-key Japanese
keyboards, the plus key has a different scan code than the plus key on the other
keyboard, but it has the same effect.
selected feature is a sub menu, or to display a pick list if a selected feature has
a value field, or to select a sub-field for multi-valued features like time and date.
If a pick list is displayed, the Enter key will undo the pick list, and allow another
selection in the parent menu.
will undo the pressing of the Enter key. When the ESC key is pressed while
editing any field or selecting features of a menu, the parent menu is re-entered.
When the ESC key is pressed in any sub menu, the parent menu is re-entered.
When the ESC key is pressed in any major menu, the exit confirmation window
is displayed and the user is asked whether changes can be discarded.
<F9>Setup Defaults - Pressing F9 causes the following to appear:
Setup Confirmation
Load default configuration now?
[Yes] [No]
If “Yes” is selected and the Enter key is pressed, all Setup fields are set to their
default values. If “No” is selected and the Enter key is pressed, or if the ESC
key is pressed, the user is returned to where they were before F9 was pressed
without affecting any existing field values.
<F10>Save and Exit - Pressing F10 causes the following message to appear:
Setup Confirmation
Save Configuration changes and exit now?
[Yes] [No]
If “Yes” is selected and the Enter key is pressed, all changes are saved and
Setup is exited. If “No” is selected and the Enter key is pressed, or the ESC key
is pressed, the user is returned to where they were before F10 was pressed
without affecting any existing values.
Page 23
Clearing the CMOS
If you are not able to access the BIOS setup screens, the CMOS Clear jumper will need to be used
to reset the configuration RAM.
1. Power down the system and disconnect the AC power.
2. Open the server.
3. Move the jumper from the normal operation position, at pins 1 and 2, to the CMOS Clear
position, covering pins 2 and 3.
4. Wait 5 to 10 seconds.
5. Return the CMOS Clear jumper to the Normal location, covering pins 1 and 2.
6. Close the server chassis.
7. Reconnect the AC power and power up the system.
Page 24
2425MAXDATA PLATINUM 100 I M9Server Utilities
Configuring the System for embedded Serial ATA RAID
Configuring the BIOS
1. Make sure you are having at least two SATA hard drives.
2. Enter system BIOS Setup by pressing the <F2> key after the Power‑On‑Self‑Test (POST)
memory tests begin.
3. Go to “Advanced” ‑ “Mass Storage Controller Configuration”; Set “SATA Mode” to one of the
following modes:
• ENHANCED – Supports up to 6 SATA ports with IDE Native Mode (no RAID).
•
Intel ESRT – Intel® Embedded Server RAID Technology II supports RAID modes 0, 1, and 10.
Creating Intel® Matrix Storage Technology RAID set
/ NOTE
This RAID is supported for Windows operating systems only.
®
1. Upon re‑boot you will see the Intel
the screen. Press CTRL‑I to enter the RAID Option ROM user interface.
2. In the User Interface menu, select option #1; Create RAID Volume. Enter a volume name,
press <enter>. The RAID Volume name must be in English alphanumeric ASCII characters.
Matrix Storage Manager Option ROM status message on
3. Use the arrow keys to select the RAID level (0/1/5/10), press <enter>.
4. Select the drives to be used in the RAID array (only if there are more than two drives available),
press <enter>.
5. Select the stripe size (only for RAID 0/5), and press <enter>.
6. Enter the size of the volume (If you select less than the maximum volume size you can create
a second RAID array on the remaining portion of your volume, not recommended), and press
<enter>.
7. Finally press <Y> to confirm your selections.
8. Exit the Option ROM user interface by pressing <ESC>.
Creating LSI Technology RAID set
1. Upon re‑boot you will see the Embedded RAID Option ROM status message on the screen.
Press CTRL‑E to enter the RAID Option ROM user interface.
2. In the Management Menu, select option #1: “Configure”. Choose “Easy Configuration”.
3. Mark ready drives to be used in the RAID array using the space bar and press F10 to end
selection.
4. On the “Select Configurable Arrays” screen press <space> and <F10>.
5. Enter the properties of the new RAID: RAID Level (0/1/10), Size, Stripe Size. Accept the
settings.
6. Exit the Easy Configuration Screen using <ESC> and save the configuration.
7. Return to the Management Menu and Initialize the new RAID.
8. Exit the Option ROM user interface by pressing <ESC>.
Page 25
Loading the RAID Drivers (Windows Server 2003)
1. Begin Microsoft® Windows® Setup by booting from the Microsoft® Windows® installation CD.
2. At the beginning of Microsoft
RAID driver. When prompted, insert the floppy with the RAID driver. Install the appropiate
SATA RAID Controller driver, either “Intel(R) ICH9R SATA RAID Controller” for Intel® Matrix
Storage Technology RAID set or “Intel Embedded Server RAID Technology” for LSI technology
RAID set.
3. Finish the Microsoft
®
Windows® installation and install all necessary drivers.
4. Install the monitoring software included with your motherboard or after downloading it from
the Internet: LSI MegaRAID Storage Manager or Intel® Matrix Storage Manager depending
on the RAID technology you chose previously. This will allow for local monitoring of the RAID
configuration. Additionally errors will be entered to the local system log files.
®
Windows® Setup, press <F6> to install a third‑party SCSI or
Page 26
26PBMAXDATA PLATINUM 200 I M8
Page 27
5 Technical Reference
Power Supply Specifications
300 W Single Power Supply Input Voltage
• 100–240 V~ at 50–60 Hz; 3.5–2 A max.
300 W Single Power Supply Output Voltages
The table below lists the total wattage available for supplying power from the power subsystem for
each voltage.
Table 5. 300 W Power Supply Output Rating
VoltageMaximum Current
+3.3 V20 A
+5 V20 A
+5 V Standby2.5 A
+12 V (2 power supply rails)24 A (16 A for one power supply rail)
–12 V0.5 A
Page 28
28
Page 29
6 Regulatory and Compliance Information
Product Regulatory Compliance
Product Safety Compliance
The server complies with the following safety requirements:
• EN 60950 (European Union)
• CE – Low Voltage Directive (73/23/EEC) (European Union)
Product RoHS Compliance
Restriction of Hazardous Substances: This server system is compliant to European Directive 2002/95/
EC (RoHS).
Product EMC Compliance
The server has been tested and verified to comply with the following electromagnetic compatibility
(EMC) regulations:
• EN 55022 (Class A) – Radiated & Conducted Emissions (European Union)
• EN 55024 (Immunity) (European Union)
• CE – EMC Directive (89/336/EEC) (European Union)
Product Regulatory Compliance Markings
This product is marked with the following Product Certification Markings:
Table 6. Product Certification Markings
CE Mark
Electromagnetic Compatibility Notices
Europe (CE Declaration of Conformity)
This product has been tested in accordance too, and complies with the Low Voltage Directive (73/23/
EEC) and EMC Directive (89/336/EEC). The product has been marked with the CE Mark to illustrate
its compliance.
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