MatchX LPWAN User Manual

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MatchX Dev Kit

LoRa Development Board with Grove Sensors

User Guide

Rev 1.0

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Copyrightc 2017 MatchX GmbH

WW W.MATC HX.I O

No part of the speciﬁcations may be reproduced in any form or by any means or used to make any derivative such as translation, transformation, or adaptation without permission from MatchX GmbH All rights reserved.

First release, Nov 2017

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Contents

1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

1.1 Product overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

1.1.1 Lora . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

1.1.2 BLE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

1.2 Main Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

1.2.1 Hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

1.2.2 Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2 Hardware Architecture - SoM module . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.1 Pin-out and pin description of the SoM module . . . . . . . . . . . . . . . . . . . . . . . 7

2.1.1 Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.2 Operating frequency bands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2.2.1 EU 863-870MHz ISM Band . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2.2.2 US 902-928MHz ISM Band . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2.2.3 Australia 915-928MHz ISM Band . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3 Hardware Architecture - Evaluation Board . . . . . . . . . . . . . . . . . . . . . . 13

3.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

3.2 Hardware features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

3.3 Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

3.3.1 Connectors pin-out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3.4 Jumpers and test connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

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3.5 Hardware selectable options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

4 Sensor connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

4.1 Grove Digital . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

4.2 Grove Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

4.3 Grove UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

4.4 Grove I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

5 Quick Installation Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

5.1 Software and Hardware requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

5.2 Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

5.2.1 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

5.2.2 Bluetooth connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

5.3 Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

5.4 Registering a node on MarchX server . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

5.5 Setting DevEUI, AppEUI and DevKey . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

5.6 Region Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

6 Software Development Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

6.1 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

6.2 Prerequisites . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

6.3 Software development under Windows OS . . . . . . . . . . . . . . . . . . . . . . . . . . 31

6.3.1 Using SmartSnippet Studio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

6.4 Software development under Linux . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

7 Product speciﬁcation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

7.1 Software environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

7.2 Hardware environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

7.2.1 RF performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

7.2.2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

7.2.3 Antenna characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

7.3 Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

7.4 Certiﬁcation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

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1. Introduction

1.1 Product overview

The LPWAN Dev Kit by MatchX is a high performance, ready to use development platform allowing you to kick-start your IoT project. Together with a MatchX Core module the Dev Kit is an incredibly ﬂexible solution that can be deployed in a various number of applications which require long distance communication and long battery life. The unique combination of both LoRa and Bluetooth Low Energy makes non-contact ﬁrmware updates easy, especially when the device is mounted in a unaccessible place.

This guide covers both the US and EU version of the Dev Kit. The main differences between

these two versions are listed in Table 1.1.number

Parameter US EU Operating Frequency Band 902-928MHz 863-870MHz Maximum Output Power +17dBm +14dBm Lora BW 500k/125kHz 125kHz SF 7-10 7-12 Certiﬁcation IEC 60950-1 EN 300200

FCC PART 15.247 EN 301489

1.1.1 Lora

The MatchX Module uses LoRa communication to send messages over long distances (up to 20km in open spaces). This unique modulation scheme guarantees robust wireless communication even in difﬁcult from RF point of view environments such as high-rise city landscapes or within the inside of buildings. The module can output up to 17dBm of power and is fully LoraWAN compatible. It’s uniquely designed to work with the MatchX Box gateway and can also be used with a LoraWAN

Table 1.1: Comparison of different regions

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compatible Gateway of your choice.

1.1.2 BLE

The module offers a novel ﬁrmware solution upgrade by augmenting LoRa, together with Bluetooth Low Energy (BLE). As LoRa protocol is not suitable for transmitting large amounts of data, MatchX has combated this with BLE, offering a quick, robust and remote way of updating your software. It is a perfect method in cases where a sensor may be mounted in an unaccessible place like in a basement, sealed container box or behind a wall. Moreover BLE together with provided mobile app enables you to conﬁgure your module and read its status and additional data.

1.2 Main Features

LPWAN Dev Kits long range, long battery life, ﬂexible sensor conﬁguration and wireless ﬁrmware update are the key features that are offered by the Core module.

1.2.1 Hardware

• integrated MatchX Core System on Module

• +18.5dBm output power in 868MHz/915MHz

• -146dBm sensitivity of LoraWAN packets

• integrated Semtech SX1276 LoRa and Bluetooth Low Energy

• 0 Hz up to 96 MHz 32-bit ARM Cortex-M0 Dialog DA14680 microcontroller

• GPS receiver with 22 tracking / 66 acquisition- channels

• optional NB-IOT, Tri-Band LTE-FDD and Dual-Band GPRS/EDGE module

• integrated Li-ION battery charger

• 16 bit I/O expander

• GROVE sensor connector

• RGB indicator LED and User Button

• temperature sensor with 0.125◦C resolution and 1◦C accuracy

• unique ID EEPROM memory

• ultra low power design

1.2.2 Software

• Runs LoRa and Bluetooth stack simultaneously

• Low power consumption modes

• Easy to use software package

• Eclipse-based IDE

• Firmware upgrade over the air

• Mobile application

Currently there is no Class B support in server yet, but the hardware and ﬁrmware are fully

prepared for Class B speciﬁcation, it is expected to support Class B in future ﬁrmware upgrade.

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2. Hardware Architecture - SoM module

2.1 Pin-out and pin description of the SoM module

The pin-out of the MatchX Core SoM module can be seen on Figure 2.1 and the description of the pins in Table 2.1. On top of the module there are two UF.L RF connectors, the one on the left is the LoRa antenna connector, a suitable 868MHz in EU and 915MHz in US, 50 Ohm antenna is expected to be connected on these port. The other connector is for connecting the 2.4GHz, 50 Ohm BLE antenna. Both antennas come together with the evaluation board.

Figure 2.1: Pin-out of the SoM module.

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Pin number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22

Name Description

V3P3_LDO 3.3V output of the internal LDO GND Ground VDD_RFS Supply voltage of the radio front-end LED1 Open drain output type, LED driver LED2 Open drain output type, LED driver LED3 Open drain output type, LED driver RESET Reset signal, active high P1_6 General Purpose I/O P1_6 / NTC resistor for battery temperature sensing P1_4 General Purpose I/O P1_4 / ADC1 / battery temperature sensing P4_2 General Purpose I/O P4_2 P4_3 General Purpose I/O P4_3 P2_3 General Purpose I/O P2_3 P1_3 General Purpose I/O P1_3 / ADC2 P0_7 General Purpose I/O P0_7 / ADC3 SWD_DIO Serial Wire Debug interface I/O signal / GPIO P0_6 / ADC4 SWD_CLK Serial Wire Debug interface clock signal / GPIO P2_4 / ADC7 P3_3 General Purpose I/O P3_3 P3_4 General Purpose I/O P3_4 P3_2 General Purpose I/O P3_2 VBATT Battery voltage input GND Ground VBUS 5V supply, charging voltage

Table 2.1: USB-C connector pins description.

The module can be powered in two ways:

1. By connecting the VBATT to a battery voltage (2.7V to 4.2V).

2. By supplying +5V on the VBUS pin. If both power sources are present, the battery will be charged form +5V power supply. The charging current and charging characteristics for different battery types is software conﬁgurable. The module provides used to supply external devices, but the maximum current drawn can’t be grater than 100mA. By default

VDD_RFS

with +17dBm power. This has to be taken in consideration when planning the power budget of

V3P3_LDO

power source for low power converter.

LDO, when battery voltage. By default all GPIO are referenced to

1.8V as the GPIO level, each GPIO can be conﬁgured individually) so care must be taken to ensure

V3P3_LDO

VDD_RFS

is around 35mA during transmission with +14dBm power output and around 90mA

. When even higher RF transmission power is required it is advisable to use different

The source of

VBUS

voltage, it is a output of internal LDO of the DA14680 MCU, and it can be

is connected to

VDD_RFS

V3P3_LDOisVBUS

is not present, and

V3P3_LDO

. On the Evaluation Board it can be done by using 3.3V output of the

when present or

VBATT

with an external 0R resistor. The current draw of

VBATT

drops below 3.3V the

V3P3_LDO

otherwise. As it is a output of a

V3P3_LDO

(it is also possible to conﬁgure

will follow the

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2.1 Pin-out and pin description of the SoM module 9

that no voltage higher than external devices, that connect to SoM module, from a boost converter.

V3P3_LDO

Figure 2.2: Block diagram of the Core module.

is presented to any GPIO. This may happen when powering

2.1.1 Dimensions

Figure 2.3: Dimension of the SoM module.

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2.2 Operating frequency bands

2.2.1 EU 863-870MHz ISM Band

In the European region the EN300220-2 V3.1.1 (2017-02) regulation deﬁnes the allowed frequency allocation and spectrum access. Every device working in this band must comply with these rules as shown in the Table 2.3. EU regulations restrict the maximum radiated power as well as the duty cycle of the transmission in different frequency bands.To comply with the duty cycle requirement the transmitting device must wait after every transmitted packet. The time device has to wait depends on the time on air of transmitted packet and this in turn depends on the length of the packet and spreading factor SF. This relation and required wait time can be seed in Table 2.2 According to LoRaWAN speciﬁcation every device has to implement at least 3 channels as follows:

• 868.10 MHz

• 868.30 MHz

• 868.50 MHz

The SoM is preconﬁgured to work with the MatchX Box gateway and additionally to the 3 mandatory

channels 5 additional channels are deﬁned. The list of all preconﬁgured channels can be found in

Table 2.4.

Spreading Factor Bit rate Range (depends Time on air (ms) 0.1% duty cycle 1% duty cycle

(125kHz Lora) (bps) on conditions) (10 bytes payload) waiting time waiting time

SF7 5470 2 km 56 ms 1 min 6s SF8 3125 4 km 100 ms 1 min 40s 10s

SF9 1760 6 km 200 ms 3 min 20s 20s SF10 980 8 km 370 ms 6 min 10s 37s SF11 440 14 km 740 ms 12 min 20s 1 min 14s SF12 290 20 km 1400 ms 23 min 20s 2min 20s

Table 2.2: Modules operating frequencies.

2.2.2 US 902-928MHz ISM Band

These frequencies band can be used in USA, Canada and all other countries that adopt the entire

FCC-Part15 regulations in 902-928 ISM band. For these region MatchX uses predeﬁned frequencies listed in Table 2.5. The FCC regulation puts restriction on the maximum dwell time of 400ms in uplink, thats why the maximum allowed spreading factor is SF10.

2.2.3 Australia 915-928MHz ISM Band

These frequencies band can be used in Australia region. For these region MatchX uses predeﬁned

frequencies listed in Table 2.6. All channels use 125kHz bandwidth and maximum of +20dBm output power can be reached.

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2.2 Operating frequency bands 11

Class 1 sub-

Operational Frequency band

863,000 MHz to

865,000 MHz

865,000 MHz to

868,000 MHz

868,000 MHz to

868,600 MHz

868,700 MHz to

869,200 MHz

869,400 MHz to

869,650 MHz

869,400 MHz to

869,650 MHz

869,700 MHz to

870,000 MHz

869,700 MHz to

870,000 MHz

Channel access and

Maximum e.r.p

25 mW e.r.p.

25 mW e.r.p. Power density:

-4,5 dBm/100 kHz

25 mW e.r.p.

500 mW e.r.p.

5 mW e.r.p. No requirement 56a 31

25 mW e.r.p.

occupation rules (e.g. Duty cycle or LBT + AFA)

≤

0,1% duty cycle or polite spectrum access

≤

1 % duty cycle or polite spectrum access

≤

1% duty cycle or polite spectrum access

≤

0,1% duty cycle or polite spectrum access

≤

0,1% duty cycle or polite spectrum access

≤

10 % duty cycle or polite spectrum access

≤

1% duty cycle or polite spectrum access

Band number from EC Decision 2013/752/EU [i.3]

46a 66

47 67

48 28

50 29

54a 130

54b 30

56c 69

class number according Commission Decision 2000/299/EU [i.7]

Table 2.3: EU wide harmonized national radio interfaces.

Frequency Bandwidth Maximum e.r.p Channel access

864.7 MHz 125 kHz 14 dBm ≤0,1% duty cycle

864.9 MHz 125 kHz 14 dBm ≤0,1% duty cycle

865.1 MHz 125 kHz -4.5 dBm ≤1% duty cycle

865.3 MHz 125 kHz -4.5 dBm ≤1% duty cycle

868.1 MHz 125 kHz 14 dBm ≤1% duty cycle

868.3 MHz 125 kHz 14 dBm ≤1% duty cycle

868.5 MHz 125 kHz 14 dBm ≤1% duty cycle

868.8 MHz 125 kHz 14 dBm ≤0,1% duty cycle

Table 2.4: Core Module operating frequencies in EU 863-870MHz ISM Band.

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Channel number Frequency Channel number Frequency

1 903.90 MHz 5 904.70 MHz 2 904.10 MHz 6 904.90 MHz 3 904.30 MHz 7 905.10 MHz 4 904.50 MHz 8 905.30 MHz

Table 2.5: Modules operating frequencies (uplink) in US 902-928MHz ISM Band.

Channel number Frequency Channel number Frequency

1 915.20 MHz 5 916.00 MHz 2 915.40 MHz 6 916.20 MHz 3 915.60 MHz 7 916.40 MHz 4 915.80 MHz 8 916.60 MHz

Table 2.6: Modules operating frequencies (uplink) in Australia 915-928MHz ISM Band.

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3. Hardware Architecture - Evaluation Board

3.1 Block Diagram

The development board comprises of two main subsystems:

1. MatchX SoM with LoRa and Bluetooth radios

2. SIMCom SIM7000E NB-IOT module with 3G/4G and GPS

Figure 3.1: Block diagram of the Dev Kit.

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MatchX SoM is the core of the Dev Kit. It is responsible for controlling the SIMCom module, accessing the sensors, I/O expender, RGB LED etc. It also controls different power rails enabling low power modes.

The Dev Kit can be powered by USB-C +5V and/or Lithium-ion battery connected to X401 connector.The presence of +5V is signaled by a red LED next to USB-C. When both +5V and battery are present the MatchX SoM will start to charge the battery. The battery type, charging current, and charging curve are software conﬁgurable.

MatchX SoM provides capable to deliver up to 100mA of current. As it is used to power the LoRa RF front-ent by default, it can be used to power just very low power peripherals. If more current is needed, a onboard SMPS

TPS62740 should be used. It outputs a 3.3V up to 300mA current. Its output should be connected to

the V3P3 power rail with the J402 jumper in position 1-2.

The SIMCom module is optional and is not included in a standard package but all peripheral components are already soldered. The main communication interface between MatchX SoM and SIMCom module is UART together with two control lines (SIM_NRST and SIM_PWR_KEY). Please refer to SIMCom SIM7000E datasheet to ﬁnd more information about the modules operation.

The SIM7000E is powered from +5V provided by USB-C connector which is converted to 3.3V by a

LDO. Its enable pin can be controlled by a SoM or can be always set high by a jumper.

The Dev Kit offers two ways to receive GPS signal. One is by using aforementioned SIM7000E module. A cheaper and less power demanding alternative is using SIM28ML.

V3P3_LDO

output, which is a low current output of internal LDO

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3.2 Hardware features 15

3.2 Hardware features

Figure 3.2: Hardware features of the Dev Kit.

Components marked on the Figure 3.2 are:

Optional SIMCOM SIM7000E NB-IOT module with 3G/4G and GPS

MatchX SoM module with LoRa and Bluetooth SIM28ML GPS receiver

3.3V low power converter for sensors supply

PCA6416A I2C I/O expander

3.3V LDO for powering the optional SIM7000E module

RGB LED controlled by the MatchX SoM

User button, connected to P3_2 of the SoM module Reset button for MatchX SoM PCT2075GV I2C temperature sensor

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I2C Serial EEPROM 24AA025UIDT-I/OT LED indicating presence of USB +5V

NET indication LED of the SIM7000E LED indicating presence of SIM card

3.3 Connectors

Figure 3.3: Connectors on the Dev Kit.

Connectors marked on the Figure 3.3 are:

J102 MatchX SoM modules I/Os J201 SIM7000E I/Os and signals

J103 PCA6416A I/Os

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3.3 Connectors 17

J100 RGB LED control signals

J301 Grove sensors I2C connector J101 MatchX SoM SWD programming and debugging connector

J300 I2C connector X401 S2B-PH-SM4-TB Lithium battery connector

USB-C connector, +5V supply and programming

SIM card socket for SIM7000E

3.3.1 Connectors pin-out

Figure 3.4: Pin-out of the Dev Kit.

The J102 connector, shown on Figure 3.5 routs out all GPIOs available on the MatchX SoM module. Some of these GPIOs are used by default to control functions of the Dev Kit.

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18 Chapter 3. Hardware Architecture - Evaluation Board

Pin Name Function Description

1 P2_3 UART_SIM_RX UART interface to SIMCom module, connected with J109 jumper 2 P1_3 UART_SIM_TX UART interface to SIMCom module, connected with J105 jumper 3 P4_3 I2C_SCL Main I2C bus, connected with J104 jumper 4 P4_2 I2C_SDA Main I2C bus, connected with J108 jumper 5 P1_4 - Not used 6 P1_6 - Not used 7 P0_7 - Not used 8 P3_3 - Not used

9 P3_4 PS_EN controls enable pin of TPS62740 10 P3_2 USR_BUTTON User button connection 11 V3P3 3.3V 3.3V power, the source selectable by J402 jumper 12 GND GND Ground

Table 3.1: Functions assignment of the MatchX SoM GPIOs

Figure 3.5: Pin-out of J102 connector.

Figure 3.6: Pin-out of J301 connector.

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3.3 Connectors 19

The J103 connector, shown on Figure 3.7, exposes all pins available on the PCA6416A I2C I/O expander. It offers 16 I/Os organized in two ports P0 and P1. Each pin can be conﬁgured individually as a input or output, and its state can be read and set by the I2C commands. Additionally there is a interrupt line EXP_INT that is being driven by the PCA6416A when input IO changes it state.

Figure 3.7: Pin-out of J103 connector.

The J201 connector, depicted on Figure 3.8, exposes all unused pins of the SIMCom SIM7000E module. For more information about the signals functions please refer to the modules datasheet.

Figure 3.8: Pin-out of J201 connector.

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20 Chapter 3. Hardware Architecture - Evaluation Board

3.4 Jumpers and test connectors

Figure 3.9: Jumpers and test connectors on the Dev Kit.

Components marked on the Figure 3.9 are:

J402 - selection of the source of V3P3 used to power RGB LED and sensors. A jumper in position 1-2 selects the 3V3 from low power converter (located left), jumper in position 2-3 selects the V3P3_LDO output from integrated LDO of the SoM module

J111, J112 - connect the P1_3 and P0_7 to Grove D1 and D2 lines J104, J108 - connect the P4_2 and P4_3 to I2C_SDA and I2C_SCL J105, J109 - connect P1_2 and P2_3 of MatchX SoM to UART_SIM_TX and UART_SIM_RX of the SIM7000E module J107 - connects the enable line of the 3.3V LDO that powers SIM7000E ether to EXT_P0_2 (I/O expander) in position 1-2 or to 5V (always on) in position 2-3.

J110 - connects SIM_NRST of the SIM7000E to EXT_P0_1 of the I/O expander

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3.5 Hardware selectable options 21

J106 - cconnects SIM_PWR_KEY of the SIM7000E to EXT_P0_0 of the I/O expander

J404 - test connector of the battery voltage

J401 - connects USB +5V to the input of the LDO, it is bypassed by a 0R resistor by default

J403 - connects power to the input of the low power 3.3V converter, the source of the power is USB +5V or battery if the +5V is not present.

J400 - test connector of the VCC_SIM (by default it is a 3.3V output of the LDO)

3.5 Hardware selectable options

Figure 3.10: Hardware options of the Dev Kit.

Components marked on the Figure 3.10 are:

0R jumper connects P3_2 of SoM module to the User Button

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22 Chapter 3. Hardware Architecture - Evaluation Board

0R jumper connects P3_4 of SoM module to PS_EN, a enable signal of the low power 3.3V converter 0R jumper selectin the source of VDD_RFS (the radio frontend power). The 0R connected on the left side connects the VDD_RFS to low power 3.3V converter, jumper soldered on the right side connects VDD_RFS to the V3P3_LDO (the output of internal LDO of the SoM)

2.2M Ohm resistor connected in the upper position pulls the enable line of the low power 3.3V converter low, in the lower position pulls this line up

test point connected to the interrupt line of the temperature sensor (PTC_OS)

test point connected to the power good pin of low power 3.3V converter

test point connected to the CNTRL pin of low power 3.3V converter, pulling it high enables the

internal LDO test point connected to the LOAD pin of low power 3.3V converter, it is a output of internal LDO test point connected to the SIM_MDM_LOG pin of the SIM7000E module

test point connected to the SIM_BOOT_CFG pin of the SIM7000E module

0R jumpers connect P2_3 and P3_3 GPS_UART_RXD and GPS_UART_TXD, they need to be removed when SIM7000 is to be used

Page 23

4. Sensor connection

The Dev Kit is speciﬁcally designed to work with all different sorts of sensors, which can be attached

to its GROVE connector or to 2.54mm pin headers. This makes it a very ﬂexible solution that can be adjusted to speciﬁc applications and individual needs.

4.1 Grove Digital

The Grove digital modules use two signal lines called D0 and D1 . There are, for example, switch

Modules, the Fan Module, and the LED Module that controlled by digital GPIOs D0 and D1.

The following table shows the pin out of the Grove digital connector:

Pin Name Function

1 D0 Primary Digital I/0 2 D1 Secondary Digital I/0 3 VCC Power for Grove module 4 GND Ground for Grove module

Table 4.1: Pin-out of the Grove digital connector

4.2 Grove Analog

The Grove Analog modules use two signal lines called A0 and A1 . There are, for example,

Potentiometer, Voltage Divider, and the Air Quality Module that controlled by analog pins A0 and

A1.

The following table 4.2 shows the pin out of the Grove Analog connector:

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24 Chapter 4. Sensor connection

Pin Name Function

1 A0 Primary analog I/0 2 A1 Secondary analog I/0 3 VCC Power for Grove module 4 GND Ground for Grove module

Table 4.2: Pin-out of the Grove analog connector

4.3 Grove UART

The Grove UART modules use two signal lines RX and TX. There are, for example, RFID module

that controlled by UART pins TX and RX.

The following table 4.3 shows the pin out of the Grove UART connector:

Pin Name Function

1 RX Serial receive 2 TX Serial transmit 3 VCC Power for Grove module 4 GND Ground for Grove module

Table 4.3: Pin-out of the Grove UART connector

4.4 Grove I2C

The Grove I2C modules use two signal lines SDA and SCL. There are, for example, motion detect

module and environment module that controlled by I2C pins SDA and SCL.

The following table 4.4 shows the pin out of the Grove I2C connector:

Pin Name Function

1 SCL I2C Clock 2 SDA I2C data 3 VCC Power for Grove module 4 GND Ground for Grove module

Table 4.4: Pin-out of the Grove UART connector

Page 25

5. Quick Installation Guide

The Core module incorporated in the Dev Kit is by default conﬁgured to connect with MatchX

LoraWAN cloud server if the network coverage is present. Nonetheless some settings can be changed and some set up may be required in order to use the Dev Kit in a custom application. This installation guide will introduce how to set up the LoRa parameters and establish LoraWAN network connection.

5.1 Software and Hardware requirements

To conﬁgure the board, users will need to have the following:

• Dev Kit with USB-C power cable or Li-ion battery

• MatchX server account

• LoraWAN coverage by e.g. MatchX Box gateway

• USB-to-UART converter

• PC computer with Windows or Linux OS

5.2 Connections

5.2.1 Power

The Dev Kit is equipped with battery connector. As long as the battery is charged there is no other

connection required for the Dev Kit to work. Charging: If the LED is signaling that the battery needs to be charged or the state of charge readouts from the mobile app or through LoRa are indicating low battery it can be charged two ways:

By connecting the Dev Kit to a USB charger. A standard USB charger with 5V output and minimum 500mA of current can be used and standard, reversible USB-C cable. The integrated charging controller will take care of proper charging of the battery. This process can take up to 12h. By using a dedicated lithium battery charger . Using this method may result in a faster charging process due to higher charging current. Please refer to the battery datasheet for details about the charging characteristics.

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26 Chapter 5. Quick Installation Guide

Important!

MatchX strongly recommends to charge the battery within speciﬁed temperature range of 0 to

+45◦C. Charging outside of these reommended conditions may lead to either reduced battery

life or permanent damage.

5.2.2 Bluetooth connection

The Core module implements Bluetooth Low Energy (Bluetooth 4.2 speciﬁcation) with SUOTA (Software Update Over The Air) feature. The only hardware requirement is a connection of 2,4GHz,

50 Ohm antenna to BLE antenna port.

5.3 Setup

Every Dev Kit and Core module comes with preprogrammed unique MAC address, AppEUI and LoraWAN DevKey (also referred as AppKey by different sources). The DevKey is used to ensure a secure communication and data encryption between the module and application server. AppEUI is used to communicate with the application that registered on the Lora server. Care must be taken

with storing the DevKey in a safe place and ensuring it is not compromised.

The products will come with a QR code sticker, which gives the Serial Number of the device. By typing in the S/N at the registration of the MatchX LPWAN Cloud, the preprogrammed APP EUI, MAC address and DevKey will be associated automatically.

5.4 Registering a node on MarchX server

Registering a node on MatchX server is a straight forward process. The user needs to know nodes DevKey, DevEUI and AppEUI. For more information about these keys refer to section 5.5.

Go to matchx.io and under ’Cloud’ ﬁnd an appropriate server according to region the node should be deployed. In this example we are using https://eux.matchx.io for Europa region. Register an account using valid email address. Go to your dashboard and click on ’Application’ tab and than press ’Create application’ button (see Figure 5.1).

Figure 5.1: Creating new Application.

Fill out the ’Application name’ and ’Application description’ ﬁelds and click ’Submit’. Click on

your newly created application and under ’Nodes’ tab click on the ’Create node’ button.

Fill out information about DevKey, DevEUI and AppEUI. Device EUI should be in 64bit format

(with fffe in the middle) like on Figure 5.2. Click on ’Submit’ button. The node is now created, you

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5.5 Setting DevEUI, AppEUI and DevKey 27

Figure 5.2: Creating new node.

can click on ’View’ under ’Frame Logs’ to see all messages belonging to the node like it is shown on Figure 5.3.

Figure 5.3: Nodes messages.

5.5 Setting DevEUI, AppEUI and DevKey

To ensure the highest level of security in LoRaWAN network and Over the Air Activation (OTTA) 3

different keys have to be programmed into every end node.

• DevEUI

the end-device, also used by Bluetooth. It is converted to IEEE EUI64 by inserting 0xFFFE in

the bytes 4 and 5. e.g. 78af58fffe040000

• AppEUI

the application provider (i.e., owner) of the end-device

- 6 bytes global end-device ID in IEEE EUI48 address space that uniquely identiﬁes

- 8 bytes global application ID in IEEE EUI64 address space that uniquely identiﬁes

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28 Chapter 5. Quick Installation Guide

• DevKey - 16 bytes unique AES-128 key

These keys are programmed by MatchX and stored in a special region of the nonvolatile memory of the Dialog microcontroller. They will be preserved during ﬂashing of the new ﬁrmware, however they will be lost by performing full ﬂash erase. The default values are deﬁned in In Dev Kit Firmware the values of these keys are printed on UART console on power up, see Figure

5.4. On default DKF conﬁgures pins 5 and 6 on the J102 connector to be UART TX and RX respectively, a UART-to-USB converter needs to be connected to these pins to see the messages.

lora\param.c

Figure 5.4: Displaying the keys on UART console.

The values of DevEUI, AppEUI and DevKey can also be changed from UART console by using param command. The syntax is as follow:

param x value

where x = 0 for DevEUI, 1 for AppEUI and 2 for DevKey, value is a hexadecimal value to be

set.

When value ﬁeld is not speciﬁed the command will output current value of the parameter

(except DevKey, which will not be shown).

DevKey is a AES-128 encryption key used for secure communication. It should be kept secret and only known to the sensor owner, this is why it is recommended to not display it on the UART in a ﬁnal version of the ﬁrmware by removing recommended to change its value before registering the node on the server.

#define DEBUG

line in

param.c

5.6 Region Selection

Dev Kit Firmware implements different regional settings according to regulations applicable to these regions. By default the board determines which settings to choose by reading the jumpers conﬁguration on connector J103 during startup. Jumpers placement is shown on Figure 5.5 and conﬁguration settings in Table 5.1.

The jumper conﬁguration is read only if the settings are not programmed to internal memory of the module. It is possible to program these settings using UART similarly to programming the DevEUI in paragraph 5.5. In this case the jumper values are ignored and J103 pins can be used as regular GPIOs. The syntax is as follow:

ﬁle. It is also

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5.6 Region Selection 29

param x value

where x = 5 for changing the region, value is a region number in hexadecimal (see Table 5.1).

If value parameter is set to FF ﬁrmware will unset regional parameter and the board will return to reading jumpers settings.

Figure 5.5: Jumpers placement for region selection (EU region selected).

Region Jumper Position

number 3 2 1 0

00 0 0 0 0 EU Europe region 01 0 0 0 1 AS1 Asia AS923MHz ISM Band 02 0 0 1 0 KR Korea region 08 0 1 0 0 US USA region, 8 channels 09 0 1 0 1 AU Australia region, 8 channels 18 1 1 0 0 US(full) USA region, full 64 channels 19 1 1 0 1 AU(full) Australia region, full 64 channels

Table 5.1: Region selection settings.

Region Description

Page 30

6. Software Development Guide

The purpose of this chapter is to help user to quickly install all necessary software components and

establish hardware connections needed to start software development using MarchX Core SoM and Development Kit. MatchX is providing the Dev Kit Firmware (DKF) to be a starting point for further software development according to individual needs.

6.1 References

SoM module is based on Dialog DA14680 microcontroller so it is advisable to get familiar with the following documents available on Dialog Semiconductors website:

• DA14680-01 DS, Datasheet, Dialog Semiconductor

• UM-B-057-SmartSnippets Studio user guide, User manual, Dialog Semiconductor

• UM-B-047 DA1468x Getting Started, User manual, Dialog Semiconductor

• UM-B-044 DA1468x Software Platform Reference, User manual, Dialog Semiconductor

• UM-B-056 DA1468x Software Developer’s Guide, Dialog Semiconductor

6.2 Prerequisites

• MatchX Development Kit

• USB-C cable and 5V charger

• UART-USB converter

• JLink programmer

• Dialog’s Semiconductor SmartSnippets DA1468x SDK

• SmartSnippets Studio package

• MatchX Dev Kit Firmware

• Operating System (Windows or Linux)

Page 31

6.3 Software development under Windows OS 31

6.3 Software development under Windows OS

The easiest way to install and conﬁgure all required tools is to install Dialogs SmartSnippets Studio

package (it can be downloaded from the company website after registration). Experienced users can try to install all cross-compilation tools and conﬁgure they favorite SDE manually, but using Dialogs software the whole process is straight forward. Please follow UM-B-057 User Manual from Dialog for details about the installation.

After successful installation of SmartSnippets Studio and J-Link programmer, you should have gcc cross-compilation tools installed and proper PATH entry should exist, to check it you can open command line window and type to what is shown on Figure 6.1. In these example we are using gcc version 4.9.3 20150529.

arm-none-eabi-gcc -v

The result should be similar

Figure 6.1: Checking ARM tools installation.

Download the Dialog’s Semiconductor SmartSnippets DA1468x SDK (in the example the SDK

version 1.0.8.1050.1 has been used) and MatchX Dev Kit Frmware. Both SDK and Dev Kit Firmware

should be put in one folder (for example SmartSnippet workspace folder). DKF folder contains a make ﬁle which can be executed by navigating to the ﬁrmware folder and typing command line window. This command will compile the ﬁrmware. If everything has been setup correctly the compilation process should return no errors and a binary ﬁle should be generated as a result, see Fugure 6.2.

After the software has been successfully compiled it can be programmed through J-Link programmer using a script provided by Dialog Semi. In command line window navigate to the DKF folder. The programming script initial_flash.bat should be located in SDK folder:

DA1468x_SDK_BTLE_v_1.0.8.1050.1\utilities\scripts\suota\v11\

It takes two parameter - path to the .bin ﬁle with ﬁrmware and path to the J-Link tools. The syntax is as follows:

{Path}\initial_flash.bat "{Path to firmware}" "{Path to J-Link}"

The example of the command can be seen on Figure 6.3. Before executing it the Dev Kit board has

to be powered on and J-Link programmer has to be connected to SWD port on J101. Only GND, SWDCK and SWDIO are necessary to program the board. After successful programming process the screen should look similar as on Figure 6.4. On default DKF conﬁgures pins 5 and 6 on the

J102 connector to be UART TX and RX respectively. By connecting a UART-to-USB converter to

make

in the

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32 Chapter 6. Software Development Guide

Figure 6.2: Compilation process of DKF.

these pins the ﬁrmware will output the console messages. The output information sent after reset and UART conﬁguration can be seen on Figure 6.5.

Figure 6.3: Example of programming command.

Figure 6.4: Programming completed successfully.

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6.3 Software development under Windows OS 33

Figure 6.5: Console output of the Dev Kit after reset.

6.3.1 Using SmartSnippet Studio

As MatchX DKF is a makeﬁle based project it is possible to port it quite easily to different IDE and

use different operating systems. SmartSnippet Studio is a Dialog Semiconductors IDE based on Eclipse. It offers makeﬁle project import capabilities.

In order to import the project, open the SmartSnippet IDE. The folder structure should be the same as in previous section, both SDK and DKF should be in SmartSnippet workspace folder. Go to File->Import and choose ’Existing Code as Makeﬁle Project’ like on Figure 6.6.

press

Click

Finish

Figure 6.6: Import makeﬁle project window.

. On the next window navigate to the DKF folder. Choose

. The software should be correctly imported and you should be able to compile it by

’Cross ARM GCC’

and

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34 Chapter 6. Software Development Guide

going to Project->Build All or pressing the build icon.

To program the just compiled ﬁrmware into DK you need to import "scripts" project to your workspace. To do that go to

Figure 6.7.

File->Import

Figure 6.7: Import existing project window.

and choose

’Existing Projects into Workspace’

like on

Click

. On the next window navigate to the script folder that should be located in

<sdk_root>\utilities\scripts. See Figure 6.8 and Figure 6.9

Figure 6.8: Importing eXisting project browse window.

Now all the scripts should be available, but in order to use them they must be slightly modiﬁed to point to a correct .bin ﬁle. Click on ’External Tools Conﬁguration’ as shown on Figure 6.10.

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6.3 Software development under Windows OS 35

Figure 6.9: Browse window.

Figure 6.10: Scripts.

It is best to copy the

’Duplicate’

to compiled ﬁrmware. The variables values can be modiﬁed by clicking compiled .bin ﬁle is stored in obj folder in the project directory.

then renaming it. The

’suota_initial_ﬂash_jtag_win’

’Argument’

section has to be modiﬁed to contain correct path

script by right clicking on it and pressing

’Variables’

button. The

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36 Chapter 6. Software Development Guide

Figure 6.11: Scripts editing.

6.4 Software development under Linux

Software developing under Linux operating system is straight forward. The easiest way to setup the environment is to install the the SmartSnippet Studio from Dialog and following the installation guide in DA1468x SDK (in the example the SDK version 1.0.8.1050.1 has been used) and MatchX Dev Kit Frmware. Both SDK and Dev Kit Firmware should be put in one folder (for example SmartSnippet

workspace folder). Open the terminal and navigate to DKF folder. The project contains make ﬁle

that takes over the compilation process. The ﬁrmware will be compiled by invoking Programming the DK board is done by invoking make command with firstflash parameter.

UM-B-057

User guide from Dialog. Download the Dialog’s Semiconductor SmartSnippets

make

command.

Figure 6.12: Programming Dev Kit board under Linux OS.

Page 37

7. Product speciﬁcation

The LPWAN Dev Kit is designed for enhanced LPWAN performance and manageability. In this

chapter we brieﬂy introduce the speciﬁcations for both hardware and software.

7.1 Software environment

To facilitate an easy network deployment, we have included many software features, which include

but are not limited to:

• Open source SDK and software support

• Over The Air software update

• Mobile App for Android

• Free cloud service for managing and visualizing sensors data

7.2 Hardware environment

The MatchX Dec Kit is mainly designed for developers and designers for evaluation purposes. It

helps to kickstart your project by providing test and evaluation hardware for proof of concept and enables programmers to develop software before custom hardware is ready. Using the exchangeable sensors provides incredibe ﬂexibility so the Dev Kit can be used for many different applications.

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38 Chapter 7. Product speciﬁcation

Item Description MCU DA14680, 0 Hz up to 96 MHz 32-bit ARM Cortex-M0 Memory 8Mb Flash, 64kB OTP, 128kB ROM, 144kB SRAM Interfaces I2C, I2S, PCM, SPI, UART, USB, GPIOs Wireless Bluetooth 4.1 and LoRa Battery 2.0mm pitch connector Size 32 x 148 x 32mm (including Hat)

7.2.1 RF performance

There are two RF systems in the module, which include Lora, and Bluetooth. In this section we

brieﬂy introduce the performance of these systems. For Lora, both the "transmission" and "receive" performance are listed in Table 7.2 and "Bluetooth" can be found in Table 7.3.

Table 7.1: Key hardware speciﬁcations

Item Value TX Max +18.5dBm RX down to -148dBm

For Bluetooth is listed in Table 7.3.

7.2.2 Electrical characteristics

Symbol Description Min Max Unit V V I

V V I

BUS

BATT

SNR

GPIO

BUS

Battery voltage 2.7 4.2 V Voltage output on the USB-C A8 and B8 pins V Current output of 3V3_SNR 0 300mA mA Voltage on any GPIO pin on USB-C 0 V USB charging voltage 4.2 5.75 V USB charging current supply 300 mA Operating Temperature -40 +85

Table 7.2: Lora RF performance

Item Value Output Power 0dBm Sensitivity -94dBm

Table 7.3: Bluetooth performance.

BATT

3.3 V

SNR

◦

Table 7.4: Operating Range.

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7.2 Hardware environment 39

Symbol Description Min Max Unit I

IDLE

SEN D

SLE E P

Current consumption, MCU awake, no RF activity 10 mA Current consumption,sending LoRa packet 75 mA Current consumption in sleep mode <10 µA

Table 7.5: Current consumption of the core module.

7.2.3 Antenna characteristics

The SoM module is equipped with two U.FL connectors: 2.4GHz for Bluetooth and one for 868MHz (915MHz in US version) LoRa antenna. The parameters of the recommended antennas can be found

in Table 7.6.

Parameter 2.4GHz antenna 868MHz (EU version) 915MHz (US version) Center Frequency 2.44GHz 868MHz 915MHz Bandwidth 101MHz 40MHz 40MHz Gain 4.3dBi 2.33dBi 2.3dBi

Table 7.6: Parameters of recommended antennas.

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40 Chapter 7. Product speciﬁcation

7.3 Dimensions

Figure 7.1: Dimension of the Dev Kit (top view), all dimensions in mm.

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7.4 Certiﬁcation 41

7.4 Certiﬁcation

CE and FCC certiﬁcation pending.