Mag Layers MSCDRI-64 User Manual

SCOPE
This specification applies to the Pb Free high current type SMD inductors for
(1) SHAPES AND DIMENSIONS
A: 5.90± 0.3
B: 6.20± 0.3
C: 5.00 Max.
D: 1.50± 0.2
E: 4.60 Typ.
F: 6.60± 0.3
(2) ELECTRICAL SPECIFICATIONS
(3) CHARACTERISTICS
MSCDRI-64-SERIES
PRODUCT INDENTIFICATION MSCDRI - 64 - 100 M
mm mm mm mm mm mm
SEE TABLE 1
TEST INSTRUMENTS L : HP 4284A PRECISION LCR METER (or equivalent) RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
(3)-1 Ambient temperature ............ 60 Max.
(3)-2 Operate temperature range ...... 40℃~+125
(Including self temp. rise)
(3)-3 Storage temperature range ...... 40℃~+125
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TABLE 1
MAGLAYERS
PT/NO. MSCDRI-64-3R3 MSCDRI-64-4R7
MSCDRI-64-100 MSCDRI-64-120 MSCDRI-64-150 MSCDRI-64-180 MSCDRI-64-220 MSCDRI-64-270 MSCDRI-64-330 MSCDRI-64-390 MSCDRI-64-470 MSCDRI-64-560 MSCDRI-64-680 MSCDRI-64-820 MSCDRI-64-101 MSCDRI-64-121 MSCDRI-64-151 MSCDRI-64-181 MSCDRI-64-221 MSCDRI-64-271 MSCDRI-64-331 MSCDRI-64-391 MSCDRI-64-471 MSCDRI-64-561 MSCDRI-64-681 MSCDRI-64-821 MSCDRI-64-102
Inductance Percent Test Resistance Rated DC Current
L(μH) Tolerance Frequency RDC(Ω) Max.
3.3 N 100kHz/0.25V 27m 3R3
4.7 M,N 100kHz/0.25V 30m 4R7 10 M,N 100kHz/0.25V 0.12 100 12 M,N 100kHz/0.25V 0.13 120
15 M,N 100kHz/0.25V 0.18 150 18 M,N 100kHz/0.25V 0.24 180 22 M,N 100kHz/0.25V 0.27 220 27 M,N 100kHz/0.25V 0.30 270 33 M,N 100kHz/0.25V 0.33 330 39 M,N 100kHz/0.25V 0.37 390 47 M,N 100kHz/0.25V 0.52 470 56 M,N 100kHz/0.25V 0.56 560 68 M,N 100kHz/0.25V 0.63 680
82 M,N 100kHz/0.25V 0.71 820 100 K,M 100kHz/0.25V 1.03 101 120 K,M 100kHz/0.25V 1.15 121 150 K,M 100kHz/0.25V 1.68 151 180 K,M 100kHz/0.25V 1.87 181 220 K,M 100kHz/0.25V 2.08 221 270 K,M 100kHz/0.25V 2.37 271 330 K,M 100kHz/0.25V 2.67 331 390 K,M 100kHz/0.25V 2.94 391 470 K,M 100kHz/0.25V 3.93 471 560 K,M 100kHz/0.25V 5.43 561 680 K,M 100kHz/0.25V 7.32 681 820 K,M 100kHz/0.25V 8.24 821
1000 K,M 100kHz/0.25V 9.26 102
IDC(A)
3.00
2.20
1.35
1.20
1.10
1.00
0.91
0.82
0.75
0.69
0.62
0.58
0.52
0.47
0.43
0.39
0.35
0.32
0.29
0.26
0.23
0.22
0.20
0.18
0.17
0.15
0.14
Marking
※ □ specify the inductance tolerance,K(±10%),M(±20%),N(±30%)IDC : Based on inductance change (L/Lo drop 30% max) @ ambient temp. 25 and
Based on temperature rise (T 40 TYP.)
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(4) RELIABILITY TEST METHOD
MECHANICAL
TEST ITEM SPECIFICATION TEST DETAILS
Substrate bending
L/Lo±5%
There shall be direction is made approximately 3mm.(keep time 30 seconds) no mechanical PCB dimension shall the page 7/9 damage or elec- F(Pressurization) trical damege.
The sample shall be soldered onto the printed circuit board in figure 1 and a load applied unitil the figure in the arrow
PRESSURE ROD
figure-1
Vibration
Solderability
L/Lo±5%
There shall be and a frequency of from 10 to 55Hz/1 minute repeated should no mechanical be applied to the 3 directions (X,Y,Z) for 2 hours each. damage. (A total of 6 hours)
New solder Flux (rosin, isopropyl alcohol{JIS-K-1522}) shall be coated More than 90% over the whole of the sample before hard, the sample shall
The sample shall be soldered onto the printed circuit board and when a vibration having an amplitude of 1.52mm
then be preheated for about 2 minutes in a temperature of 130150 and after it has been immersed to a depth 0.5mm below for 3±0.2 seconds fully in molten solder M705 with a temperature of 245±5. More than 90% of the electrode sections shall be couered with new solder smoothly when the sample is taken out of the solder bath.
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