Mag Layers MSCDRB-0403 User Manual

Page 1
SCOPE
:
(1) SHAPES AND DIMENSIONS
(2) ELECTRICAL SPECIFICATIONS
(3) CHARACTERISTICS
This specification applies to the Pb Free high current type SMD inductors for MSCDRB-0403-SERIES
PRODUCT INDENTIFICATION MSCDRB - 0403 - 100 M
① ② ③ ④
① Product Code ② Dimensions Code ③ Inductance Code ④ Tolerance Code
A: 6.60 Max. mm B: 4.45 Max. mm C: 2.92 Max. mm D: 1.02 Typ. mm E: 1.27 Typ. mm F: 4.32 Typ. mm
SEE TABLE 1
TEST INSTRUMENTS L : HP 4284A PRECISION LCR METER (or equivalent) RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
(3)-1 Ambient temperature ……......... +60℃ Max.
(3)-2 Operate temperature range ...... -40℃~+125℃
(Including self temp. rise)
(3)-3 Storage temperature range ...... -40℃~+125℃
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TABLE 1
MAGLAYERS
PT/NO. MSCDRB-0403-1R0□ MSCDRB-0403-1R5□ MSCDRB-0403-2R2□ MSCDRB-0403-3R3□ MSCDRB-0403-4R7□ MSCDRB-0403-6R8□
MSCDRB-0403-100□ MSCDRB-0403-150□ MSCDRB-0403-220□ MSCDRB-0403-330□ MSCDRB-0403-470□ MSCDRB-0403-101□ MSCDRB-0403-151□ MSCDRB-0403-221□ MSCDRB-0403-331□ MSCDRB-0403-471□ MSCDRB-0403-561□
Inductance Percent Test Resistance Rated DC Current
L(μH) Tolerance Frequency RDC(Ω)Max.
1.0 N 100kHz/0.25V 40m 1R0
1.5 N 100kHz/0.25V 45m 1R5
2.2 N 100kHz/0.25V 50m 2R2
3.3 M,N 100kHz/0.25V 55m 3R3
4.7 M,N 100kHz/0.25V 63m 4R7
6.8 M,N 100kHz/0.25V 65m 6R8 10 M,N 100kHz/0.25V 75m 100 15 M,N 100kHz/0.25V 90m 150 22 M,N 100kHz/0.25V 0.11 220 33 M,N 100kHz/0.25V 0.19 330 47 M,N 100kHz/0.25V 0.23 470
100 M,N 100kHz/0.25V 0.48 101 150 M,N 100kHz/0.25V 0.70 151 220 M,N 100kHz/0.25V 0.80 221 330 M,N 100kHz/0.25V 0.90 331 470 M,N 100kHz/0.25V 2.40 471 560 M,N 100kHz/0.25V 2.80 561
IDC(A)
1.00
0.90
0.70
0.60
0.40
0.18
0.15
0.14
0.135
0.13
0.12
0.11
0.10
0.09
0.08
0.07
0.06
Marking
※ □ specify the inductance tolerance,M(±20%),N(±30%) ※IDC : Based on inductance change (△L/Lo: drop 30% Typ.) @ambient temperature 25℃ and
Based on temperature rise (△T: 40℃ TYP.)
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(4) RELIABILITY TEST METHOD
MECHANICAL
TEST ITEM SPECIFICATION TEST DETAILS
Substrate bending
△L/Lo≦±5%
There shall be direction is made approximately 3mm.(keep time 30 seconds) no mechanical PCB dimension shall the page 7/9 damage or elec- F(Pressurization) trical damege.
The sample shall be soldered onto the printed circuit board in figure 1 and a load applied unitil the figure in the arrow
PRESSURE ROD
figure-1
Vibration
Solderability
△L/Lo≦ ±5%
There shall be and a frequency of from 10 to 55Hz/1 minute repeated should no mechanical be applied to the 3 directions (X,Y,Z) for 2 hours each. damage. (A total of 6 hours)
New solder Flux (rosin, isopropyl alcohol{JIS-K-1522}) shall be coated More than 90% over the whole of the sample before hard, the sample shall
The sample shall be soldered onto the printed circuit board and when a vibration having an amplitude of 1.52mm
then be preheated for about 2 minutes in a temperature of 130~150℃ and after it has been immersed to a depth 0.5mm below for 3±0.2 seconds fully in molten solder M705 with a temperature of 245±5℃. More than 90% of the electrode sections shall be couered with new solder smoothly when the sample is taken out of the solder bath.
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MECHANICAL
Sodering temperature (℃)
(230
℃)
2 min
TEST ITEM SPECIFICATION Resistance to There shall be Temperature profile of reflow soldering Soldering heat no damage or (reflow soldering) problems.
300 250
soldering (Peak temperature 260±3℃ 10 sec
200
150
100
50
Pre-heating
150 ~ 180℃
The specimen shall be passed through the reflow oven with the condition shown in the above profile for 1 time. The specimen shall be stored at standard atmospheric conditions for 1 hour, after which the measurement shall be made.
ELECTRICAL
TEST ITEM SPECIFICATION TEST DETAILS Temperature characteristics
△L/L20℃≦±10% 0~2000 ppm/℃ an ambient temperature of -20 to +85 ℃,and the value
The test shall be performed after the sample has stabilized in
calculated based on the value applicable in a normal temperature and narmal humidity shall be △L/L20℃≦±10%.
30 sec Min
+0
10 sec.
Slow cooling (Stored at room temperature)
2 min. or more
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ENVIROMENT CHARACTERISTICS
TEST ITEM SPECIFICATION High temperature storage
△L/Lo≦ ±5%
There shall be Upon completion of the measurement shall be made after the no mechanical sample has been left in a normal temperature and normal damage. humidity for 1 hour.
The sample shall be left for 96±4 hours in an atmospere with a temperature of 85±2℃ and a normal humidity.
Low temperature storage
Change of temperature in the table 2 below and then it shall be subjected to standard
△L/Lo≦ ±5%
There shall be Upon completion of the test, the measurement shall be made no mechanical after the sample has been left in a normal temperature and damage. normal humidity for 1 hour. △L/Lo≦ ±5%
There shall be atmospheric conditions for 1 hour, after which measurement no other dama- shall be made. ge of problems
The sample shall be left for 96±4 hours in an atmosphere with a temperature of -25±3℃.
The sample shall be subject to 5 continuos cycles, such as shown
table 2
Temperature Duration
1
2
3
4
-25±3℃
(Themostat No.1)
Standard
atmospheric
85±2℃
(Themostat No.2)
Standard
atmospheric
30 min.
No.1→No.2
30 min.
No.2→No.1
Moisture storage
Test conditions:
The sample shall be reflow soldered onto the printed circuit board in every test.
△L/Lo≦ ±5%
There shall be Upon completion of the test, the measurement shall be made no mechanical after the sample has been left in a normal temperature and damage. normal humidity more than 1 hour.
MAG.LAYERS
The sample shall be left for 96±4 hours in a temperature of 40±2℃ and a humidity(RH) of 90~ 95%.
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(5) LAND DIMENSION (Ref.)
PCB: GLASS EPOXY t=1.6mm
(5)-1 LAND PATTERN DIMENSIONS
(STANDARD PATTERN)
unit:mm
(5)-2 SUBSTRATE BENDING TEST BENDING TEST BOARD
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(6) PACKAGING
(6)-1 CARRIER TAPE DIMENSIONS (mm)
(6)-2 TAPING DIMENSIONS (mm)
Unreeling Direction
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(6)-3 REEL DIMENSIONS (mm)
Tape width
(6)-4 QUANTITY
2500pcs/Reel The products are packaged so that no damage will be sustained.
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