Mag Layers MSCDRI-2D11LD User Manual

SCOPE
(1) SHAPES AND DIMENSIONS
(2) ELECTRICAL SPECIFICATIONS
SEE TABLE 1
(3) CHARACTERISTICS
This specification applies to the Pb Free high current type SMD inductors for MSCDRI-2D11LD-SERIES
PRODUCT INDENTIFICATION MSCDRI-2D11LD-3R3 N
A: 3.00±0.2 mm B: 3.00±0.2 mm C: 1.20 Max. mm D: 4.50 Max. mm E: 2.10 Typ. mm F: 1.00 Typ. mm
TEST INSTRUMENTS L : HP 4284A PRECISION LCR METER (or equivalent) RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
(3)-1 Ambient temperature ……......... 60 Max.
(3)-2 Operate temperature range ...... 40℃~+125
(Including self temp. rise)
(3)-3 Storage temperature range ...... 40℃~+125
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TABLE 1
MAGLAYERS
PT/NO.
Inductance Percent Test Resistance Rated DC Current
L(μH) Tolerance Frequency RDC(Ω) Max.IDC1(A) IDC2(A)
Marking
MSCDRI-2D11LD-1R5 MSCDRI-2D11LD-2R2 MSCDRI-2D11LD-3R3 MSCDRI-2D11LD-4R7 MSCDRI-2D11LD-6R8
MSCDRI-2D11LD-100 MSCDRI-2D11LD-150 MSCDRI-2D11LD-220 MSCDRI-2D11LD-330
※ □ specify the inductance tolerance,M(±20%),N(±30%) ※ IDC1: Based on inductance change (△L/Lo: ≦-35%) @ ambient temp. 25℃
IDC2 Based on temperature rise (T 40 TYP.) Rated DC Current The less value which is IDC1 or IDC2.
1.5 N 100kHz/0.25V 68m 0.90 1.48 1R5
2.2 N 100kHz/0.25V 98m 0.78 1.27 2R2
3.3 N 100kHz/0.25V 0.123 0.60 1.02 3R3
4.7 N 100kHz/0.25V 0.170 0.50 0.88 4R7
6.8 N 100kHz/0.25V 0.260 0.44 0.80 6R8 10 M,N 100kHz/0.25V 0.400 0.35 0.65 100 15 M,N 100kHz/0.25V 0.520 0.31 0.60 150 22 M,N 100kHz/0.25V 0.670 0.27 0.55 220 33 M,N 100kHz/0.25V 1.00 0.22 0.40 330
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(4) RELIABILITY TEST METHOD
MECHANICAL
TEST ITEM SPECIFICATION TEST DETAILS
Substrate bending
L/Lo±5%
There shall be direction is made approximately 3mm.(keep time 30 seconds) no mechanical PCB dimension shall the page 7/9 damage or elec- F(Pressurization) trical damege.
The sample shall be soldered onto the printed circuit board in figure 1 and a load applied unitil the figure in the arrow
PRESSURE ROD
figure-1
Vibration
Solderability
L/Lo±5%
There shall be and a frequency of from 10 to 55Hz/1 minute repeated should no mechanical be applied to the 3 directions (X,Y,Z) for 2 hours each. damage. (A total of 6 hours)
New solder Flux (rosin, isopropyl alcohol{JIS-K-1522}) shall be coated More than 90% over the whole of the sample before hard, the sample shall
The sample shall be soldered onto the printed circuit board and when a vibration having an amplitude of 1.52mm
then be preheated for about 2 minutes in a temperature of 130150 and after it has been immersed to a depth 0.5mm below for 3±0.2 seconds fully in molten solder M705 with a temperature of 245±5. More than 90% of the electrode sections shall be couered with new solder smoothly when the sample is taken out of the solder bath.
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MECHANICAL
Sodering temperature ()
(230
)
2 min
TEST ITEM SPECIFICATION Resistance to There shall be Temperature profile of reflow soldering Soldering heat no damage or (reflow soldering) problems.
300 250
soldering (Peak temperature 260±3 10 sec
200
150
100
50
Pre-heating
150 ~ 180
30 sec Min
+0
10 sec.
Slow cooling (Stored at room temperature)
2 min. or more
The specimen shall be passed through the reflow oven with the condition shown in the above profile for 1 time. The specimen shall be stored at standard atmospheric conditions for 1 hour, after which the measurement shall be made.
ELECTRICAL
TEST ITEM SPECIFICATION TEST DETAILS Insulation There shall be DC 100V voltage shall be applied across this sample of top resistance no other surface and the terminal.
damage or
problems. Dielectric There shall be AC 100V voltage shall be applied for 1 minute acrosset the top withstand no other surface and the terminal of this sample voltage damage or
problems. Temperature characteristics
L/L20℃≦±10%
02000 ppm/ an ambient temperature of -20 to +85,and the value
The insulation resistance shall be more than 1 × 108 Ω.
The test shall be performed after the sample has stabilized in
calculated based on the value applicable in a normal temperature and narmal humidity shall be L/L20℃≦±10%.
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ENVIROMENT CHARACTERISTICS
TEST ITEM SPECIFICATION High temperature storage
L/Lo±5%
There shall be Upon completion of the measurement shall be made after the no mechanical sample has been left in a normal temperature and normal damage. humidity for 1 hour.
The sample shall be left for 96±4 hours in an atmospere with a temperature of 85±2 and a normal humidity.
Low temperature storage
Change of temperature in the table 2 below and then it shall be subjected to standard
L/Lo±5%
There shall be Upon completion of the test, the measurement shall be made no mechanical after the sample has been left in a normal temperature and damage. normal humidity for 1 hour. L/Lo±5%
There shall be atmospheric conditions for 1 hour, after which measurement no other dama- shall be made. ge of problems
The sample shall be left for 96±4 hours in an atmosphere with a temperature of -25±3.
The sample shall be subject to 5 continuos cycles, such as shown
table 2
Temperature Duration
1
2
3
4
25±3
(Themostat No.1)
Standard 5 sec. or less
atmospheric
85±2
(Themostat No.2)
Standard 5 sec. or less
atmospheric
30 min.
No.1No.2
30 min.
No.2No.1
Moisuture storage
Test conditions
The sample shall be reflow soldered onto the printed circuit board in every test.
L/Lo±5%
There shall be Upon completion of the test, the measurement shall be made no mechanical after the sample has been left in a normal temperature and damage. normal humidity more than 1 hour.
MAG.LAYERS
The sample shall be left for 96±4 hours in a temperature of 40±2 and a humidity(RH) of 9095%.
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(5) LAND DIMENSION (Ref.)
PCB: GLASS EPOXY t1.6mm
(5)-1 LAND PATTERN DIMENSIONS
(STANDARD PATTERN)
unitmm
(5)-2 SUBSTRATE BENDING TEST BENDING TEST BOARD
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(6) PACKAGING
(6)-1 CARRIER TAPE DIMENSIONS (mm)
(6)-2 TAPING DIMENSIONS (mm)
Unreeling Direction
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(6)-3 REEL DIMENSIONS (mm)
(6)-4 QUANTITY
1000pcs/Reel The products are packaged so that no damage will be sustained.
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