Mag Layers MSCDRI-127 User Manual

SCOPE
This specification applies to the Pb Free high current type SMD inductors for
(1) SHAPES AND DIMENSIONS
(2) ELECTRICAL SPECIFICATIONS
(3) CHARACTERISTICS
MSCDRI-127-SERIES
PRODUCT INDENTIFICATION MSCDRI - 127 - 100 M
A: 12.0±0.5 mm B: 12.0±0.5 mm C: 8.0 Max. mm
SEE TABLE 1
TEST INSTRUMENTS L : HP 4284A PRECISION LCR METER (or equivalent) RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
(3)-1 Ambient temperature ……......... 60 Max.
(3)-2 Operate temperature range ...... 40℃~+125
(Including self temp. rise)
(3)-3 Storage temperature range ...... 40℃~+125
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TABLE 1
MAGLAYERS
PT/NO. MSCDRI-127-1R0 MSCDRI-127-1R2 MSCDRI-127-2R2 MSCDRI-127-2R4 MSCDRI-127-2R5 MSCDRI-127-3R5 MSCDRI-127-4R7 MSCDRI-127-6R1 MSCDRI-127-6R4 MSCDRI-127-6R8 MSCDRI-127-7R6
MSCDRI-127-100 MSCDRI-127-120 MSCDRI-127-150 MSCDRI-127-180 MSCDRI-127-220 MSCDRI-127-270 MSCDRI-127-330 MSCDRI-127-390 MSCDRI-127-470 MSCDRI-127-560 MSCDRI-127-680 MSCDRI-127-750 MSCDRI-127-820 MSCDRI-127-101 MSCDRI-127-121 MSCDRI-127-151 MSCDRI-127-181 MSCDRI-127-221 MSCDRI-127-271 MSCDRI-127-331 MSCDRI-127-391 MSCDRI-127-471 MSCDRI-127-561 MSCDRI-127-681 MSCDRI-127-821 MSCDRI-127-102 MSCDRI-127-152
Inductance Percent Test Resistance Rated DC Current
L(μH) Tolerance Frequency RDC(Ω)Max.
1.0 N 100kHz/0.25V 7.0m 1R0
1.2 N 100kHz/0.25V 7.0m 1R2
2.2 M,N 100kHz/0.25V 11.5m 2R2
2.4 M,N 100kHz/0.25V 11.5m 2R4
2.5 M,N 100kHz/0.25V 11.5m 2R5
3.5 M,N 100kHz/0.25V 13.5m 3R5
4.7 M,N 100kHz/0.25V 15.8m 4R7
6.1 M,N 100kHz/0.25V 17.6m 6R1
6.4 M,N 100kHz/0.25V 19.0m 6R4
6.8 M,N 100kHz/0.25V 19.0m 6R8
7.6 M,N 100kHz/0.25V 20.0m 7R6 10 M,N 100kHz/0.25V 21.6m 100 12 M,N 100kHz/0.25V 24.3m 120 15 M,N 100kHz/0.25V 27.0m 150 18 M,N 100kHz/0.25V 39.2m 180 22 M,N 100kHz/0.25V 43.2m 220 27 M,N 100kHz/0.25V 45.9m 270 33 M,N 100kHz/0.25V 64.8m 330 39 M,N 100kHz/0.25V 72.9m 390 47 M,N 100kHz/0.25V 0.10 470 56 M,N 100kHz/0.25V 0.11 560 68 M,N 100kHz/0.25V 0.14 680 75 M,N 100kHz/0.25V 0.15 750 82 M,N 100kHz/0.25V 0.16 820
100 K,M 100kHz/0.25V 0.22 101 120 K,M 100kHz/0.25V 0.25 121 150 K,M 100kHz/0.25V 0.28 151 180 K,M 100kHz/0.25V 0.35 181 220 K,M 100kHz/0.25V 0.39 221 270 K,M 100kHz/0.25V 0.56 271 330 K,M 100kHz/0.25V 0.64 331 390 K,M 100kHz/0.25V 0.70 391 470 K,M 100kHz/0.25V 0.98 471 560 K,M 100kHz/0.25V 1.07 561 680 K,M 100kHz/0.25V 1.46 681
820 K,M 100kHz/0.25V 1.64 821 1000 K,M 100kHz/0.25V 1.82 102 1500 K,M 10kHz/0.25V 2.48 152
IDC(A)
9.80
9.80
8.00
8.00
8.00
7.50
6.80
6.60
6.30
6.30
5.90
5.40
4.90
4.50
3.90
3.60
3.40
3.00
2.75
2.50
2.35
2.10
2.00
1.95
1.70
1.60
1.42
1.30
1.16
1.06
0.95
0.88
0.79
0.73
0.67
0.60
0.55
0.45
Marking
※ □ specify the inductance tolerance,K(±10%),M(±20%),N(±30%) ※IDC : Based on inductance change (△ L/Lo: ≦ drop 10%) and @ambient temperature 25℃
Based on temperature rise (T 40 TYP.)
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(4) RELIABILITY TEST METHOD
MECHANICAL
TEST ITEM SPECIFICATION TEST DETAILS
Substrate bending
L/Lo±5%
There shall be direction is made approximately 3mm.(keep time 30 seconds) no mechanical PCB dimension shall the page 7/9 damage or elec- F(Pressurization) trical damege.
The sample shall be soldered onto the printed circuit board in figure 1 and a load applied unitil the figure in the arrow
PRESSURE ROD
figure-1
Vibration
Solderability
L/Lo±5%
There shall be and a frequency of from 10 to 55Hz/1 minute repeated should no mechanical be applied to the 3 directions (X,Y,Z) for 2 hours each. damage. (A total of 6 hours)
New solder Flux (rosin, isopropyl alcohol{JIS-K-1522}) shall be coated More than 90% over the whole of the sample before hard, the sample shall
The sample shall be soldered onto the printed circuit board and when a vibration having an amplitude of 1.52mm
then be preheated for about 2 minutes in a temperature of 130150 and after it has been immersed to a depth 0.5mm below for 3±0.2 seconds fully in molten solder M705 with a temperature of 245±5. More than 90% of the electrode sections shall be couered with new solder smoothly when the sample is taken out of the solder bath.
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MECHANICAL
Sodering temperature ()
(230
)
2 min
TEST ITEM SPECIFICATION Resistance to There shall be Temperature profile of reflow soldering Soldering heat no damage or (reflow soldering) problems.
300 250
soldering (Peak temperature 260±3 10 sec
200
150
100
50
Pre-heating
150 ~ 180
30 sec Min
+0
10 sec.
Slow cooling (Stored at room temperature)
2 min. or more
The specimen shall be passed through the reflow oven with the condition shown in the above profile for 1 time. The specimen shall be stored at standard atmospheric conditions for 1 hour, after which the measurement shall be made.
ELECTRICAL
TEST ITEM SPECIFICATION TEST DETAILS Insulation There shall be DC 100V voltage shall be applied across this sample of top resistance no other surface and the terminal.
damage or
problems. Dielectric There shall be AC 100V voltage shall be applied for 1 minute acrosset the top withstand no other surface and the terminal of this sample voltage damage or
problems. Temperature characteristics
L/L20℃≦±10%
02000 ppm/ an ambient temperature of -20 to +85,and the value
The insulation resistance shall be more than 1 × 108 Ω.
The test shall be performed after the sample has stabilized in
calculated based on the value applicable in a normal temperature and narmal humidity shall be L/L20℃≦±10%.
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ENVIROMENT CHARACTERISTICS
TEST ITEM SPECIFICATION High temperature storage
L/Lo±5%
There shall be Upon completion of the measurement shall be made after the no mechanical sample has been left in a normal temperature and normal damage. humidity for 1 hour.
The sample shall be left for 96±4 hours in an atmospere with a temperature of 85±2 and a normal humidity.
Low temperature storage
Change of temperature in the table 2 below and then it shall be subjected to standard
L/Lo±5%
There shall be Upon completion of the test, the measurement shall be made no mechanical after the sample has been left in a normal temperature and damage. normal humidity for 1 hour. L/Lo±5%
There shall be atmospheric conditions for 1 hour, after which measurement no other dama- shall be made. ge of problems
The sample shall be left for 96±4 hours in an atmosphere with a temperature of -25±3.
The sample shall be subject to 5 continuos cycles, such as shown
table 2
Temperature Duration
1
2
3
4
25±3
(Themostat No.1)
Standard
atmospheric
85±2
(Themostat No.2)
Standard
atmospheric
30 min.
No.1No.2
30 min.
No.2No.1
Moisture storage
Test conditions
The sample shall be reflow soldered onto the printed circuit board in every test.
MAG.LAYERS
L/Lo±5%
There shall be Upon completion of the test, the measurement shall be made no mechanical after the sample has been left in a normal temperature and damage. normal humidity more than 1 hour.
The sample shall be left for 96±4 hours in a temperature of 40±2 and a humidity(RH) of 9095%.
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(5) LAND DIMENSION (Ref.)
PCB: GLASS EPOXY t1.6mm
7.0
12.6
2.8
(5)-1 LAND PATTERN DIMENSIONS
(STANDARD PATTERN) Unit:mm
5.4
(5)-2 SUBSTRATE BENDING TEST BENDING TEST BOARD
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(6) PACKAGING
(6)-1 CARRIER TAPE DIMENSIONS (mm)
(6)-2 TAPING DIMENSIONS (mm)
Unreeling Direction
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(6)-3 REEL DIMENSIONS (mm)
(6)-4 QUANTITY
500pcs/Reel The products are packaged so that no damage will be sustained.
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