Mag Layers MSCDRI-125 User Manual

SCOPE
This specification applies to the Pb Free high current type SMD inductors for
(1) SHAPES AND DIMENSIONS
(2) ELECTRICAL SPECIFICATIONS
(3) CHARACTERISTICS
MSCDRI-125-SERIES
PRODUCT INDENTIFICATION MSCDRI-125- 220 M
A: 12.0±0.5 mm B: 12.0±0.5 mm C: 6.00 Max. mm
SEE TABLE 1
TEST INSTRUMENTS L : HP 4284A PRECISION LCR METER (or equivalent) RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
(3)-1 Ambient temperature ……......... 60 Max.
(3)-2 Operate temperature range ...... 40℃~+125
(Including self temp. rise)
(3)-3 Storage temperature range ...... 40℃~+125
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TABLE 1
MAGLAYERS
PT/NO. MSCDRI-125-2R4 MSCDRI-125-2R7 6.5
MSCDRI-125-3R9 MSCDRI-125-4R7 MSCDRI-125-6R8 MSCDRI-125-8R2
MSCDRI-125-100 MSCDRI-125-120 MSCDRI-125-150 MSCDRI-125-180 MSCDRI-125-220 MSCDRI-125-270 MSCDRI-125-330 MSCDRI-125-390 MSCDRI-125-470 MSCDRI-125-560 MSCDRI-125-680 MSCDRI-125-820 MSCDRI-125-101 MSCDRI-125-121 MSCDRI-125-151 MSCDRI-125-181 MSCDRI-125-221
MSCDRI-125-331 0.68 MSCDRI-125-391 0.65 MSCDRI-125-471 0.58 MSCDRI-125-561 MSCDRI-125-681 MSCDRI-125-821 0.43 MSCDRI-125-102 0.40
Inductance Percent Test Resistance Rated DC Current
L(μH) Tolerance Frequency RDC(Ω)Max.
2.4 N 100kHz/0.25V 15m 2R4
2.7 N 100kHz/0.25V 15m 2R7
3.3 M,N 100kHz/0.25V 17m 3R3
3.9 N 100kHz/0.25V 18m 3R9
4.7 M,N 100kHz/0.25V 20m 4R7
6.8 N 100kHz/0.25V 23m 6R8
8.2 M,N 100kHz/0.25V 24m 8R2 10 M,N 100kHz/0.25V 25m 100 12 M,N 100kHz/0.25V 27m 120 15 M,N 100kHz/0.25V 30m 150 18 M,N 100kHz/0.25V 34m 180 22 M,N 100kHz/0.25V 36m 220 27 M,N 100kHz/0.25V 51m 270 33 M,N 100kHz/0.25V 57m 330 39 M,N 100kHz/0.25V 68m 390 47 M,N 100kHz/0.25V 56 M,N 100kHz/0.25V 68 M,N 100kHz/0.25V 82 M,N 100kHz/0.25V
100 K,M 100kHz/0.25V 120 K,M 100kHz/0.25V 150 K,M 100kHz/0.25V 180 K,M 100kHz/0.25V 220 K,M 100kHz/0.25V 270 K,M 100kHz/0.25V 330 K,M 100kHz/0.25V 390 K,M 100kHz/0.25V 470 K,M 100kHz/0.25V 560 K,M 100kHz/0.25V 680 K,M 100kHz/0.25V 820 K,M 100kHz/0.25V
1000 K,M 100kHz/0.25V
75m
0.11
0.12
0.14
0.16
0.17
0.23
0.29
0.40
0.46
0.51
0.69
0.77
0.86
1.20
1.34
1.53
IDC(A)
6.5
6.0MSCDRI-125-3R3
5.7
5.0
4.3
4.2
4.0
3.5
3.3
3.0
2.8
2.3
2.1
2.0
1.8
1.7
1.5
1.4
1.3
1.1
1.0
0.9
0.8
0.75MSCDRI-125-271
0.54
0.48
Marking
470 560 680 820 101 121 151 181 221 271 331 391 471 561 681 821 102
※ □ specify the inductance tolerance,K(±10%),M(±20%),N(±30%)IDC : Based on inductance change (L/Lodrop 10% Max.)@ ambient temp. 25 and
Based on temperature rise (T 40 TYP.)
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(4) RELIABILITY TEST METHOD
MECHANICAL
TEST ITEM SPECIFICATION TEST DETAILS
Substrate bending
L/Lo±5%
There shall be direction is made approximately 3mm.(keep time 30 seconds) no mechanical PCB dimension shall the page 7/9 damage or elec- F(Pressurization) trical damege.
The sample shall be soldered onto the printed circuit board in figure 1 and a load applied unitil the figure in the arrow
PRESSURE ROD
figure-1
Vibration
Solderability
L/Lo±5%
There shall be and a frequency of from 10 to 55Hz/1 minute repeated should no mechanical be applied to the 3 directions (X,Y,Z) for 2 hours each. damage. (A total of 6 hours)
New solder Flux (rosin, isopropyl alcohol{JIS-K-1522}) shall be coated More than 90% over the whole of the sample before hard, the sample shall
The sample shall be soldered onto the printed circuit board and when a vibration having an amplitude of 1.52mm
then be preheated for about 2 minutes in a temperature of 130150 and after it has been immersed to a depth 0.5mm below for 3±0.2 seconds fully in molten solder M705 with a temperature of 245±5. More than 90% of the electrode sections shall be couered with new solder smoothly when the sample is taken out of the solder bath.
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MECHANICAL
Sodering temperature ()
(230
)
2 min
TEST ITEM SPECIFICATION Resistance to There shall be Temperature profile of reflow soldering Soldering heat no damage or (reflow soldering) problems.
300 250
soldering (Peak temperature 260±3 10 sec
200
150
100
50
Pre-heating
150 ~ 180
30 sec Min
+0
10 sec.
Slow cooling (Stored at room temperature)
2 min. or more
The specimen shall be passed through the reflow oven with the condition shown in the above profile for 1 time. The specimen shall be stored at standard atmospheric conditions for 1 hour, after which the measurement shall be made.
ELECTRICAL
TEST ITEM SPECIFICATION TEST DETAILS Insulation There shall be DC 100V voltage shall be applied across this sample of top resistance no other surface and the terminal.
damage or
problems. Dielectric There shall be AC 100V voltage shall be applied for 1 minute acrosset the top withstand no other surface and the terminal of this sample voltage damage or
problems. Temperature characteristics
L/L20℃≦±10%
02000 ppm/ an ambient temperature of -20 to +85,and the value
The insulation resistance shall be more than 1 × 108 Ω.
The test shall be performed after the sample has stabilized in
calculated based on the value applicable in a normal temperature and narmal humidity shall be L/L20℃≦±10%.
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ENVIROMENT CHARACTERISTICS
TEST ITEM SPECIFICATION High temperature storage
L/Lo±5%
There shall be Upon completion of the measurement shall be made after the no mechanical sample has been left in a normal temperature and normal damage. humidity for 1 hour.
The sample shall be left for 96±4 hours in an atmospere with a temperature of 85±2 and a normal humidity.
Low temperature storage
Change of temperature in the table 2 below and then it shall be subjected to standard
L/Lo±5%
There shall be Upon completion of the test, the measurement shall be made no mechanical after the sample has been left in a normal temperature and damage. normal humidity for 1 hour. L/Lo±5%
There shall be atmospheric conditions for 1 hour, after which measurement no other dama- shall be made. ge of problems
The sample shall be left for 96±4 hours in an atmosphere with a temperature of -25±3.
The sample shall be subject to 5 continuos cycles, such as shown
table 2
Temperature Duration
1
1
2
2
3
3
4
4
25±3
(Themostat No.1)
Standard
atmospheric
85±2
(Themostat No.2)
Standard
atmospheric
30 min.
30 min.
No.1No.2
30 min.
30 min.
No.2No.1
Moisuture storage
Test conditions
The sample shall be reflow soldered onto the printed circuit board in every test.
MAG.LAYERS
L/Lo±5%
There shall be Upon completion of the test, the measurement shall be made no mechanical after the sample has been left in a normal temperature and damage. normal humidity more than 1 hour.
The sample shall be left for 96±4 hours in a temperature of 40±2 and a humidity(RH) of 9095%.
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(5) LAND DIMENSION (Ref.)
7.0
12.6
2.8
PCB: GLASS EPOXY t1.6mm
(5)-1 LAND PATTERN DIMENSIONS
(STANDARD PATTERN) Unit:mm
5.4
(5)-2 SUBSTRATE BENDING TEST BENDING TEST BOARD
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(6) PACKAGING
(6)-1 CARRIER TAPE DIMENSIONS (mm)
(6)-2 TAPING DIMENSIONS (mm)
Unreeling Direction
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(6)-3 REEL DIMENSIONS (mm)
(6)-4 QUANTITY
500pcs/Reel The products are packaged so that no damage will be sustained.
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