SCOPE
：
(1) SHAPES AND DIMENSIONS
(2) ELECTRICAL SPECIFICATIONS
(3) CHARACTERISTICS
This specification applies to the Pb Free high current type SMD inductors for
MSCDB-2206H-SERIES
PRODUCT INDENTIFICATION
MSCDB - 2206H - 4R7 M
① ② ③ ④
① Product Code
② Dimensions Code
③ Inductance Code
④ Tolerance Code
A: 22.3Max. mm
B: 16.2Max. mm
C: 7.40Max. mm
D: 14.5Typ. mm
SEE TABLE 1
TEST INSTRUMENTS
L : HP 4284A PRECISION LCR METER (or equivalent)
RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
(3)-1 Ambient temperature ……......... ＋60℃ Max.
(3)-2 Operate temperature range ...... －40℃～＋125℃
(Including self temp. rise)
(3)-3 Storage temperature range ...... －40℃～＋125℃
MAG.LAYERS
MSCDB-2206H-SERIES Page 1/8
TABLE 1
MAGLAYERS
PT/NO.
MSCDB-2206H-R80□
MSCDB-2206H-1R2□
MSCDB-2206H-1R8□
MSCDB-2206H-2R7□
MSCDB-2206H-3R3□
MSCDB-2206H-4R7□
MSCDB-2206H-5R6□
MSCDB-2206H-6R8□
MSCDB-2206H-8R2□
MSCDB-2206H-100□
MSCDB-2206H-120□
MSCDB-2206H-150□
MSCDB-2206H-180□
MSCDB-2206H-220□
MSCDB-2206H-270□
MSCDB-2206H-330□
MSCDB-2206H-390□
MSCDB-2206H-470□
MSCDB-2206H-560□
MSCDB-2206H-680□
MSCDB-2206H-820□
MSCDB-2206H-101□
MSCDB-2206H-121□
MSCDB-2206H-151□
MSCDB-2206H-181□
MSCDB-2206H-221□
MSCDB-2206H-271□
MSCDB-2206H-331□
MSCDB-2206H-391□
MSCDB-2206H-471□
MSCDB-2206H-561□
MSCDB-2206H-681□
MSCDB-2206H-821□
MSCDB-2206H-102□
Inductance Percent Test Resistance Rated DC Current
L(μH) Tolerance Frequency RDC(Ω)Max. IDC1(A) IDC2(A)
0.8 M,N 100kHz/0.25V 2.76m 35.0 16.0 R80
1.2 M,N 100kHz/0.25V 4.20m 30.0 15.0 1R2
1.8 M,N 100kHz/0.25V 5.40m 25.0 13.0 1R8
2.7 M,N 100kHz/0.25V 8.40m 20.0 10.0 2R7
3.3 M,N 100kHz/0.25V 9.36m 17.0 9.0 3R3
4.7 M,N 100kHz/0.25V 10.6m 15.0 8.5 4R7
5.6 M,N 100kHz/0.25V 14.9m 14.0 7.8 5R6
6.8 M,N 100kHz/0.25V 17.0m 12.0 7.5 6R8
8.2 M,N 100kHz/0.25V 18.6m 11.0 7.0 8R2
10 M,N 100kHz/0.25V 20.6m 10.0 6.5 100
12 L,M 100kHz/0.25V 28.3m 9.5 5.5 120
15 L,M 100kHz/0.25V 33.6m 9.0 5.0 150
18 L,M 100kHz/0.25V 39.6m 8.0 4.6 180
22 L,M 100kHz/0.25V 47.3m 6.5 4.0 220
27 L,M 100kHz/0.25V 52.2m 6.0 3.8 270
33 L,M 100kHz/0.25V 70.1m 5.5 3.4 330
39 K,M 100kHz/0.25V 78.0m 5.2 3.2 390
47 K,M 100kHz/0.25V 0.109 5.0 2.8 470
56 K,M 100kHz/0.25V 0.116 4.5 2.6 560
68 K,M 100kHz/0.25V 0.134 4.0 2.4 680
82 K,M 100kHz/0.25V 0.173 3.5 2.2 820
100 K,M 100kHz/0.25V 0.202 3.0 2.0 101
120 K,M 100kHz/0.25V 0.230 3.0 1.6 121
150 K,M 100kHz/0.25V 0.250 2.6 1.5 151
180 K,M 100kHz/0.25V 0.300 2.5 1.3 181
220 K,M 100kHz/0.25V 0.380 2.4 1.2 221
270 K,M 100kHz/0.25V 0.470 2.2 1.1 271
330 K,M 100kHz/0.25V 0.560 1.9 1.0 331
390 K,M 100kHz/0.25V 0.680 1.7 0.9 391
470 K,M 100kHz/0.25V 0.850 1.4 0.82 471
560 K,M 100kHz/0.25V 1.00 1.3 0.78 561
680 K,M 100kHz/0.25V 1.10 1.2 0.72 681
820 K,M 100kHz/0.25V 1.40 1.1 0.64 821
1000 K,M 100kHz/0.25V 1.80 1.0 0.56 102
Marking
※ □ specify the inductance tolerance,K(±10%),L(±15%),M(±20%),N(±30%)
※ IDC1： Based on inductance change (△L/Lo： ≦ drop 10% Typ.)@ ambient temp. 25℃
IDC2： Based on temperature rise (△T： 40℃ Typ.)
Rated DC Current： The less value which is IDC1 or IDC2.
MAG.LAYERS
MSCDB-2206H-SERIES Page-2/8
(4) RELIABILITY TEST METHOD
MECHANICAL
TEST ITEM SPECIFICATION TEST DETAILS
Substrate bending
△L/Lo≦±5%
There shall be direction is made approximately 3mm.(keep time 30 seconds)
no mechanical PCB dimension shall the page 7/9
damage or elec- F(Pressurization)
trical damege.
The sample shall be soldered onto the printed circuit board
in figure 1 and a load applied unitil the figure in the arrow
PRESSURE ROD
figure-1
Vibration
Solderability
△L/Lo≦ ±5%
There shall be and a frequency of from 10 to 55Hz/1 minute repeated should
no mechanical be applied to the 3 directions (X,Y,Z) for 2 hours each.
damage. (A total of 6 hours)
New solder Flux (rosin, isopropyl alcohol{JIS-K-1522}) shall be coated
More than 90% over the whole of the sample before hard, the sample shall
The sample shall be soldered onto the printed circuit board
and when a vibration having an amplitude of 1.52mm
then be preheated for about 2 minutes in a temperature of
130～150℃ and after it has been immersed to a depth 0.5mm
below for 3±0.2 seconds fully in molten solder M705 with
a temperature of 245±5℃.
More than 90% of the electrode sections shall be couered
with new solder smoothly when the sample is taken out of
the solder bath.
MAG.LAYERS
MSCDB-2206H-SERIES
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MECHANICAL
Sodering temperature (℃)
(230
℃)
TEST ITEM SPECIFICATION
Resistance to There shall be Temperature profile of reflow soldering
Soldering heat no damage or
(reflow soldering) problems.
300
250
soldering
(Peak temperature 260±3℃ 10 sec
200
150
100
50
Pre-heating
150 ~ 180℃
2 min
30 sec Min
+0
10
sec.
Slow cooling
(Stored at room
temperature)
2 min. or more
The specimen shall be passed through the reflow oven with the
condition shown in the above profile for 1 time.
The specimen shall be stored at standard atmospheric conditions
for 1 hour, after which the measurement shall be made.
ELECTRICAL
TEST ITEM SPECIFICATION TEST DETAILS
Dielectric There shall be AC 100V voltage shall be applied for 1 minute acrosset the top
withstand no other surface and the terminal of this sample
voltage damage or
problems.
Temperature
characteristics
△L/L20℃≦±10%
0～2000 ppm/℃ an ambient temperature of -20 to +85℃,and the value
The test shall be performed after the sample has stabilized in
calculated based on the value applicable in a normal
temperature and narmal humidity shall be △L/L20℃≦±10%.
MAG.LAYERS
MSCDB-2206H-SERIES
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ENVIROMENT CHARACTERISTICS
TEST ITEM SPECIFICATION
High temperature
storage
△L/Lo≦ ±5%
There shall be Upon completion of the measurement shall be made after the
no mechanical sample has been left in a normal temperature and normal
damage. humidity for 1 hour.
The sample shall be left for 96±4 hours in an atmospere with
a temperature of 85±2℃ and a normal humidity.
Low temperature
storage
Change of
temperature in the table 2 below and then it shall be subjected to standard
△L/Lo≦ ±5%
There shall be Upon completion of the test, the measurement shall be made
no mechanical after the sample has been left in a normal temperature and
damage. normal humidity for 1 hour.
△L/Lo≦ ±5%
There shall be atmospheric conditions for 1 hour, after which measurement
no other dama- shall be made.
ge of problems
The sample shall be left for 96±4 hours in an atmosphere with
a temperature of -25±3℃.
The sample shall be subject to 5 continuos cycles, such as shown
table 2
Temperature Duration
1
2
3
4
－25±3℃
(Themostat No.1)
Standard
atmospheric
85±2℃
(Themostat No.2)
Standard
atmospheric
30 min.
No.1→No.2
30 min.
No.2→No.1
Moisture storage
Test conditions：
The sample shall be reflow soldered onto the printed circuit board in every test.
MAG.LAYERS
△L/Lo≦ ±5%
There shall be Upon completion of the test, the measurement shall be made
no mechanical after the sample has been left in a normal temperature and
damage. normal humidity more than 1 hour.
The sample shall be left for 96±4 hours in a temperature of
40±2℃ and a humidity(RH) of 90～ 95%.
MSCDB-2206H-SERIES
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(5) LAND DIMENSION (Ref.)
PCB: GLASS EPOXY t＝1.6mm
(5)-1 LAND PATTERN DIMENSIONS
(STANDARD PATTERN)
unit：mm
(5)-2 SUBSTRATE BENDING TEST BENDING TEST BOARD
MAG.LAYERS
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(6) PACKAGING
(6)-1 CARRIER TAPE DIMENSIONS (mm)
(6)-2 TAPING DIMENSIONS (mm)
Unreeling
Direction
MAG.LAYERS
MSCDB-2206H-SERIES
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(6)-3 REEL DIMENSIONS (mm)
Tape width
(6)-4 QUANTITY
300pcs/Reel
The products are packaged so that no damage will be sustained.
:44
MAG.LAYERS
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