:
(1) SHAPES AND DIMENSIONS
(2) ELECTRICAL SPECIFICATIONS
This specification applies to the Pb Free high current type SMD inductors for
MSCDB-1807H-SERIES
PRODUCT INDENTIFICATION
MSCDB-1807 H-680 M
① ② ③ ④ ⑤
① Product Code
② Dimensions Code
③ High Current
④ Inductance Code
A: 19.40 Max. mm
B: 13.30 Max. mm
C: 6.80 Max. mm
D: 12.2 Typ. mm
SEE TABLE 1
TEST INSTRUMENTS
L : HP 4284A PRECISION LCR METER (or equivalent)
RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
(3)-1 Ambient temperature ……......... +60℃ Max.
(3)-2 Operate temperature range ...... -40℃~+125℃
(Including self temp. rise)
(3)-3 Storage temperature range ...... -40℃~+125℃
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MAGLAYERS
PT/NO.
MSCDB-1807H-4R7□
MSCDB-1807H-6R8□
MSCDB-1807H-680□
※ □ specify the inductance tolerance,M(±20%),N(±30%)
※ IDC1: Based on inductance change (△L/Lo: drop 10%Max. )
IDC2: Based on temperature rise (△T: 40℃ TYP.)
Rated DC Current: The less value which is IDC1 or IDC2.
Inductance Percent Test Resistance Rated DC Current
L(μH) Tolerance Frequency RDC(Ω)Max. IDC1(A) IDC2(A)
4.7 N 100kHz,0.25V 12m 6.5 7.0 4R7
6.8 N 100kHz,0.25V 19m 5.8 5.5 6R8
68 M,N 100kHz,0.25V 0.156 1.6 2.0 680
Marking
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(4) RELIABILITY TEST METHOD
MECHANICAL
TEST ITEM SPECIFICATION TEST DETAILS
Substrate bending
△L/Lo≦±5%
There shall be direction is made approximately 3mm.(keep time 30 seconds)
no mechanical PCB dimension shall the page 7/9
damage or elec- F(Pressurization)
trical damege.
The sample shall be soldered onto the printed circuit board
in figure 1 and a load applied unitil the figure in the arrow
PRESSURE ROD
figure-1
Vibration
Solderability
△L/Lo≦ ±5%
There shall be and a frequency of from 10 to 55Hz/1 minute repeated should
no mechanical be applied to the 3 directions (X,Y,Z) for 2 hours each.
damage. (A total of 6 hours)
New solder Flux (rosin, isopropyl alcohol{JIS-K-1522}) shall be coated
More than 90% over the whole of the sample before hard, the sample shall
The sample shall be soldered onto the printed circuit board
and when a vibration having an amplitude of 1.52mm
then be preheated for about 2 minutes in a temperature of
130~150℃ and after it has been immersed to a depth 0.5mm
below for 3±0.2 seconds fully in molten solder M705 with
a temperature of 245±2℃.
More than 90% of the electrode sections shall be couered
with new solder smoothly when the sample is taken out of
the solder bath.
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