:
(1) SHAPES AND DIMENSIONS
(2) ELECTRICAL SPECIFICATIONS
This specification applies to the Pb Free high current type SMD inductors for
MSCDB-1303-SERIES
Warn:It is here not to use synchronous rectification curcuit!
PRODUCT INDENTIFICATION
MSCDB - 1303 - 100 M
① ② ③ ④
① Product Code
② Dimensions Code
③ Inductance Code
④ Tolerance Code
SEE TABLE 1
TEST INSTRUMENTS
L : HP 4284A PRECISION LCR METER (or equivalent)
RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
(3)-1 Ambient temperature ……......... +60℃ Max.
(3)-2 Operate temperature range ...... -40℃~+125℃
(Including self temp. rise)
(3)-3 Storage temperature range ...... -40℃~+125℃
A: 13.5 Max. mm
B: 9.50 Max. mm
C: 3.20 Max. mm
D: 2.54 Typ. mm
E: 2.54 Typ. mm
F: 7.62 Typ. mm
MAG.LAYERS
MSCDB-1303-SERIES Page 1/8
MAGLAYERS
PT/NO.
MSCDB-1303-2R2□
Inductance Percent Test Resistance Rated DC Current
L(μH) Tolerance Frequency RDC(Ω)Max. IDC1(A) IDC2(A)
2.2 M,N 100kHz/0.25V 30m 3.8 4.4 2R2
Marking
MSCDB-1303-4R7□
MSCDB-1303-6R8□
MSCDB-1303-100□
MSCDB-1303-150□
MSCDB-1303-220□
MSCDB-1303-330□
MSCDB-1303-470□
MSCDB-1303-680□
MSCDB-1303-101□
MSCDB-1303-151□
MSCDB-1303-221□
MSCDB-1303-331□
MSCDB-1303-471□
MSCDB-1303-681□
MSCDB-1303-102□
4.7 N 100kHz/0.25V 60m 2.7 3.2 4R7
6.8 M,N 100kHz/0.25V 75m 2.6 3.0 6R8
10 M,N 100kHz/0.25V 90m 2.4 2.3 100
15 M,N 100kHz/0.25V 0.12 2.0 1.9 150
22 M,N 100kHz/0.25V 0.19 1.6 1.5 220
33 M,N 100kHz/0.25V 0.25 1.4 1.2 330
47 M,N 100kHz/0.25V 0.32 1.0 1.0 470
68 M,N 100kHz/0.25V 0.55 0.9 0.9 680
100 K,M 100kHz/0.25V 0.70 0.7 0.73 101
150 K,M 100kHz/0.25V 1.00 0.6 0.62 151
220 K,M 100kHz/0.25V 1.60 0.5 0.51 221
330 K,M 100kHz/0.25V 2.20 0.4 0.40 331
470 K,M 100kHz/0.25V 3.30 0.3 0.33 471
680 K,M 100kHz/0.25V 4.40 0.2 0.28 681
1000 K,M 100kHz/0.25V 7.00 0.1 0.23 102
※ □ specify the inductance tolerance,K(±10%),M(±20%),N(±30%)
※ IDC1: Based on inductance change (△L/Lo: ≦drop 10%)@ambient temperature 25℃
IDC2: Based on temperature rise (△T: 40℃ TYP.)
Rated DC Current: The less value which is IDC1 or IDC2.
MAG.LAYERS
MSCDB-1303-SERIES
Page 2/8
(4) RELIABILITY TEST METHOD
MECHANICAL
TEST ITEM SPECIFICATION TEST DETAILS
Substrate bending
△L/Lo≦±5%
There shall be direction is made approximately 3mm.(keep time 30 seconds)
no mechanical PCB dimension shall the page 7/9
damage or elec- F(Pressurization)
trical damege.
The sample shall be soldered onto the printed circuit board
in figure 1 and a load applied unitil the figure in the arrow
PRESSURE ROD
figure-1
Vibration
Solderability
△L/Lo≦ ±5%
There shall be and a frequency of from 10 to 55Hz/1 minute repeated should
no mechanical be applied to the 3 directions (X,Y,Z) for 2 hours each.
damage. (A total of 6 hours)
New solder Flux (rosin, isopropyl alcohol{JIS-K-1522}) shall be coated
More than 90% over the whole of the sample before hard, the sample shall
The sample shall be soldered onto the printed circuit board
and when a vibration having an amplitude of 1.52mm
then be preheated for about 2 minutes in a temperature of
130~150℃ and after it has been immersed to a depth 0.5mm
below for 3±0.2 seconds fully in molten solder M705 with
a temperature of 245±5℃.
More than 90% of the electrode sections shall be couered
with new solder smoothly when the sample is taken out of
the solder bath.
MAG.LAYERS
MSCDB-1303-SERIES
Page-3/8