Mag Layers MSCD-54 User Manual

SCOPE
This specification applies to the Pb Free high current type SMD inductors for
(1) SHAPES AND DIMENSIONS
(2) ELECTRICAL SPECIFICATIONS
(3) CHARACTERISTICS
MSCD-54-SERIES
PRODUCT INDENTIFICATION MSCD- 54 - 1R0 M
Product Code Dimensions Code Inductance Code Tolerance Code
A: 5.8 ± 0.3 mm B: 5.2 ± 0.3 mm C: 4.5 ± 0.3 mm D: 2.0 Typ. mm
SEE TABLE 1
TEST INSTRUMENTS L : HP 4284A PRECISION LCR METER (or equivalent) RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
(3)-1 Ambient temperature ……......... 60 Max.
(3)-2 Operate temperature range ...... 40℃~+125
(Including self temp. rise)
(3)-3 Storage temperature range ...... 40℃~+125
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TABLE 1
φ0.3
8.5Ts
φ0.4
9.5Ts
φ0.4
11.5Ts
φ0.26
24.5Ts
MAGLAYERS
PT/NO. MSCD-54-R47 MSCD-54-R56 MSCD-54-1R0 MSCD-54-1R4 MSCD-54-1R8 MSCD-54-2R2 MSCD-54-2R7 MSCD-54-3R3 MSCD-54-3R9 MSCD-54-4R7 MSCD-54-5R0 MSCD-54-5R6 MSCD-54-6R8 MSCD-54-8R2
MSCD-54-100 MSCD-54-120 MSCD-54-150 MSCD-54-180 MSCD-54-220 MSCD-54-270 MSCD-54-330 MSCD-54-390 MSCD-54-470 MSCD-54-560 MSCD-54-680 MSCD-54-820 MSCD-54-101 MSCD-54-121 MSCD-54-151 MSCD-54-181 MSCD-54-221 MSCD-54-271 MSCD-54-331 MSCD-54-391 MSCD-54-471 MSCD-54-561 MSCD-54-102 MSCD-54-152 MSCD-54-222
Inductance Percent Test Resistance
L(μH) Tolerance Frequency RDC(Ω)Max.
0.47 N 100kHz/0.25V 16 m R47
0.56 N 100kHz/0.25V 16 m R56
1.0 M,N 100kHz/0.25V 28 m 1R0
1.4 M,N 100kHz/0.25V 29 m 1R4
1.8 M,N 100kHz/0.25V 30 m 1R8
2.2 M,N 100kHz/0.25V 42 m 2R2
2.7 M,N 100kHz/0.25V 44 m 2R7
3.3 M,N 100kHz/0.25V 45 m 3R3
3.9 M,N 100kHz/0.25V 47 m 3R9
4.7 M,N 100kHz/0.25V 48 m 4R7
5.0 M,N 100kHz/0.25V 49 m 5R0
5.6 M,N 100kHz/0.25V 50 m 5R6
6.8 M,N 100kHz/0.25V 60 m 6R8
8.2 M,N 100kHz/0.25V 90 m 8R2 10 M,N 100kHz/0.25V 0.10 100 12 M,N 100kHz/0.25V 0.12 120 15 L,M,N 100kHz/0.25V 0.14 150 18 M,N 100kHz/0.25V 0.15 180 22 K,M,N 100kHz/0.25V 0.18 220 27 M,N 100kHz/0.25V 0.20 270 33 K,L,M 100kHz/0.25V 0.23 330 39 L,M 100kHz/0.25V 0.32 390 47 L,M 100kHz/0.25V 0.37 470 56 K,M 100kHz/0.25V 0.42 560 68 K,M 100kHz/0.25V 0.46 680 82 K,M 100kHz/0.25V 0.60 820
100 K,M 100kHz/0.25V 0.70 101 120 K,M 100kHz/0.25V 0.93 121 150 K,M 100kHz/0.25V 1.10 151 180 K,M 100kHz/0.25V 1.38 181 220 K,M 100kHz/0.25V 1.57 221 270 K,M 100kHz/0.25V 1.85 271 330 K,M 100kHz/0.25V 2.00 331 390 K,M 100kHz/0.25V 2.60 391 470 K,M 100kHz/0.25V 3.00 471
560 K,M 100kHz/0.25V 3.50 561 1000 K,M 100kHz/0.25V 6.20 102 1500 K,M 100kHz/0.25V 8.40 152 2200 K,M 100kHz/0.25V 12.90 222
Rated DC Current
IDC(A)
4.50
4.50
3.00
2.80
2.60
2.30
2.10
2.00
1.95
1.90
1.85
1.80
1.60
1.50
1.44
1.40
1.30
1.23
1.11
0.97
0.88
0.80
0.72
0.68
0.61
0.58
0.52
0.48
0.40
0.38
0.35
0.28
0.26
0.24
0.12
0.11 80m 70m 50m
Marking
Wire
Tuns(Ref.)
1. Specify the inductance tolerance, K(±10%), L(±15%), M(±20%), N(±30%) 2. IDC Based on inductance change (L/Lodrop 10% Max.) @ ambient temp. 25 and
Based on temperature rise (T 40 TYP.)
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(4) RELIABILITY TEST METHOD
MECHANICAL
TEST ITEM SPECIFICATION TEST DETAILS
Substrate bending
L/Lo±5%
There shall be direction is made approximately 3mm.(keep time 30 seconds) no mechanical PCB dimension shall the page 7/9 damage or elec- F(Pressurization) trical damege.
The sample shall be soldered onto the printed circuit board in figure 1 and a load applied unitil the figure in the arrow
PRESSURE ROD
figure-1
Vibration
Solderability
L/Lo±5%
There shall be and a frequency of from 10 to 55Hz/1 minute repeated should no mechanical be applied to the 3 directions (X,Y,Z) for 2 hours each. damage. (A total of 6 hours)
New solder Flux (rosin, isopropyl alcohol{JIS-K-1522}) shall be coated More than 90% over the whole of the sample before hard, the sample shall
The sample shall be soldered onto the printed circuit board and when a vibration having an amplitude of 1.52mm
then be preheated for about 2 minutes in a temperature of 130150 and after it has been immersed to a depth 0.5mm below for 3±0.2 seconds fully in molten solder M705 with a temperature of 245±5. More than 90% of the electrode sections shall be couered with new solder smoothly when the sample is taken out of the solder bath.
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MECHANICAL
Sodering temperature ()
(230
)
TEST ITEM SPECIFICATION Resistance to There shall be Temperature profile of reflow soldering Soldering heat no damage or (reflow soldering) problems.
300 250
soldering (Peak temperature 260±3 10 sec
200
150
100
50
Pre-heating
150 ~ 180
2 min
30 sec Min
+0
10 sec.
Slow cooling (Stored at room temperature)
2 min. or more
The specimen shall be passed through the reflow oven with the condition shown in the above profile for 1 time. The specimen shall be stored at standard atmospheric conditions for 1 hour, after which the measurement shall be made.
ELECTRICAL
TEST ITEM SPECIFICATION TEST DETAILS Insulation There shall be DC 100V voltage shall be applied across this sample of top resistance no other surface and the terminal.
damage or
problems. Dielectric There shall be AC 100V voltage shall be applied for 1 minute acrosset the top withstand no other surface and the terminal of this sample voltage damage or
problems. Temperature characteristics
L/L20℃≦±10%
02000 ppm/ an ambient temperature of -25 to +85,and the value
The insulation resistance shall be more than 1 × 108 Ω.
The test shall be performed after the sample has stabilized in
calculated based on the value applicable in a normal temperature and narmal humidity shall be L/L20℃≦±10%.
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ENVIROMENT CHARACTERISTICS
TEST ITEM SPECIFICATION High temperature storage
L/Lo±5%
There shall be Upon completion of the measurement shall be made after the no mechanical sample has been left in a normal temperature and normal damage. humidity for 1 hour.
The sample shall be left for 96±4 hours in an atmospere with a temperature of 85±2 and a normal humidity.
Low temperature storage
Change of temperature in the table 2 below and then it shall be subjected to standard
L/Lo±5%
There shall be Upon completion of the test, the measurement shall be made no mechanical after the sample has been left in a normal temperature and damage. normal humidity for 1 hour. L/Lo±5%
There shall be atmospheric conditions for 1 hour, after which measurement no other dama- shall be made. ge of problems
The sample shall be left for 96±4 hours in an atmosphere with a temperature of -25±3.
The sample shall be subject to 5 continuos cycles, such as shown
table 2
Temperature Duration
1
2
3
4
25±3
(Themostat No.1)
Standard
atmospheric
85±2
(Themostat No.2)
Standard
atmospheric
30 min.
No.1No.2
30 min.
No.2No.1
Moisture storage
Test conditions
The sample shall be reflow soldered onto the printed circuit board in every test.
MAG.LAYERS
L/Lo±5%
There shall be Upon completion of the test, the measurement shall be made no mechanical after the sample has been left in a normal temperature and damage. normal humidity more than 1 hour.
The sample shall be left for 96±4 hours in a temperature of 40±2 and a humidity(RH) of 9095%.
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(5) LAND DIMENSION (Ref.)
PCB: GLASS EPOXY t1.6mm
(5)-1 LAND PATTERN DIMENSIONS
(STANDARD PATTERN) Unit : mm
5.50
Land
Part of silk screen
6.00
2.15
1.70
R1.0
(5)-2 SUBSTRATE BENDING TEST BENDING TEST BOARD
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(6) PACKAGING
(6)-1 CARRIER TAPE DIMENSIONS (mm)
16
(6)-2 TAPING DIMENSIONS (mm)
Unreeling Direction
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(6)-3 REEL DIMENSIONS (mm)
Tape width
(6)-4 QUANTITY
1000 pcs/Reel The products are packaged so that no damage will be sustained.
:16
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