Mag Layers MSCD-52 User Manual

SCOPE
This specification applies to the Pb Free high current type SMD inductors
(1) SHAPES AND DIMENSIONS
(2) ELECTRICAL SPECIFICATIONS
(3) CHARACTERISTICS
for MSCD-52-SERIES
PRODUCT INDENTIFICATION MSCD - 52 - 820 K
Product Code Dimensions Code Inductance Code Tolerance Code
A: 5.8 ± 0.3 mm B: 5.2 ± 0.3 mm C: 2.5 ± 0.3 mm D: 2.0 Typ. mm
SEE TABLE 1
TEST INSTRUMENTS L : HP 4284A PRECISION LCR METER (or equivalent) RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
(3)-1 Ambient temperature ……......... 60 Max.
(3)-2 Operate temperature range ...... 40℃~+125
(Including self temp. rise)
(3)-3 Storage temperature range ...... 40℃~+125
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TABLE 1
MAGLAYERS
PT/NO. MSCD-52-R25 MSCD-52-R82 MSCD-52-1R0 MSCD-52-1R4 MSCD-52-1R8 MSCD-52-2R2 MSCD-52-2R7 MSCD-52-3R3 MSCD-52-3R9 MSCD-52-4R7 MSCD-52-5R6 MSCD-52-6R8 MSCD-52-8R2
MSCD-52-100 MSCD-52-120 MSCD-52-150 MSCD-52-180 MSCD-52-220 MSCD-52-270 MSCD-52-330 MSCD-52-390 MSCD-52-470 MSCD-52-560 MSCD-52-680 MSCD-52-820 MSCD-52-101 MSCD-52-121 MSCD-52-151 MSCD-52-181 MSCD-52-221 MSCD-52-271 MSCD-52-331 MSCD-52-391 MSCD-52-471 MSCD-52-561 MSCD-52-681 MSCD-52-821 MSCD-52-102
Inductance Percent Test Resistance Rated DC Current
L(μH) Tolerance Frequency RDC(Ω)Max. IDC1(A) IDC2(A)
0.25 N 100kHz/0.25V 5.3m 7.50 7.50 R25
0.82 M 100kHz/0.25V 12m 5.50 5.50 R82
1.0 M 100kHz/0.25V 30m 4.50 4.50 1R0
1.4 M.N 100kHz/0.25V 40m 4.00 4.00 1R4
1.8 M.N 100kHz/0.25V 50m 3.30 3.30 1R8
2.2 M 100kHz/0.25V 60m 2.94 3.20 2R2
2.7 M.N 100kHz/0.25V 70m 2.50 2.50 2R7
3.3 M 100kHz/0.25V 80m 2.35 2.70 3R3
3.9 M.N 100kHz/0.25V 90m 2.20 2.20 3R9
4.7 M 100kHz/0.25V 0.14 2.00 2.60 4R7
5.6 M.N 100kHz/0.25V 0.15 1.80 1.80 5R6
6.8 M 100kHz/0.25V 0.16 1.70 2.50 6R8
8.2 M.N 100kHz/0.25V 0.17 1.40 1.40 8R2 100 M.N 100kHz/0.25V 0.18 1.20 1.20 100 120 M.N 100kHz/0.25V 0.20 1.18 1.18 120 150 M.N 100kHz/0.25V 0.22 1.15 1.15 150 180 M.N 100kHz/0.25V 0.25 1.10 1.10 180 220 M.N 100kHz/0.25V 0.35 1.00 1.00 220 270 M.N 100kHz/0.25V 0.45 0.86 0.86 270
33 K,M 100kHz/0.25V 0.50 0.79 1.05 330 39 K,M 100kHz/0.25V 0.69 0.75 1.00 390 47 K,M 100kHz/0.25V 0.72 0.73 0.88 470 56 K,M 100kHz/0.25V 0.84 0.55 0.78 560 68 K,M.N 100kHz/0.25V 0.90 0.52 0.52 680
82 K,M 100kHz/0.25V 0.95 0.50 0.70 820 100 K,M 100kHz/0.25V 1.30 0.40 0.40 101 120 K,M 100kHz/0.25V 1.38 0.36 0.36 121 150 K,M 100kHz/0.25V 1.81 0.30 0.30 151 181 K,M 100kHz/0.25V 1.95 0.26 0.26 181 220 K,M 100kHz/0.25V 2.10 0.25 0.25 221 270 K,M 100kHz/0.25V 2.42 0.21 0.21 271 330 K,M 100kHz/0.25V 3.82 0.18 0.18 331 390 K,M 100kHz/0.25V 4.68 0.16 0.16 391 470 K,M 100kHz/0.25V 5.10 0.15 0.15 471 560 K,M 100kHz/0.25V 6.00 0.14 0.14 561 680 K,M 100kHz/0.25V 7.60 0.13 0.13 681 820 K,M 100kHz/0.25V 9.12 0.07 0.07 821
1000 K,M 100kHz/0.25V 9.87 0.05 0.05 102
Marking
※ □ Specify the inductance tolerance, K(±10%),M(±20%),N(±30%) IDC1 Based on inductance change (L/Lodrop 10% Max.) @ ambient temp. 25
IDC2 Based on temperature rise (T 40 TYP.) Rated DC Current The less value which is IDC1 or IDC2.
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(4) RELIABILITY TEST METHOD
MECHANICAL
TEST ITEM SPECIFICATION TEST DETAILS
Substrate bending
L/Lo±5%
There shall be direction is made approximately 3mm.(keep time 30 seconds) no mechanical PCB dimension shall the page 7/9 damage or elec- F(Pressurization) trical damege.
The sample shall be soldered onto the printed circuit board in figure 1 and a load applied unitil the figure in the arrow
PRESSURE ROD
figure-1
Vibration
Solderability
L/Lo±5%
There shall be and a frequency of from 10 to 55Hz/1 minute repeated should no mechanical be applied to the 3 directions (X,Y,Z) for 2 hours each. damage. (A total of 6 hours)
New solder Flux (rosin, isopropyl alcohol{JIS-K-1522}) shall be coated More than 90% over the whole of the sample before hard, the sample shall
The sample shall be soldered onto the printed circuit board and when a vibration having an amplitude of 1.52mm
then be preheated for about 2 minutes in a temperature of 130150 and after it has been immersed to a depth 0.5mm below for 3±0.2 seconds fully in molten solder M705 with a temperature of 245±5. More than 90% of the electrode sections shall be couered with new solder smoothly when the sample is taken out of the solder bath.
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