Mag Layers MSCD-32 User Manual

SCOPE
This specification applies to the Pb Free high current type SMD inductors for
(1) SHAPES AND DIMENSIONS
(2) ELECTRICAL SPECIFICATIONS
(3) CHARACTERISTICS
MSCD-32-SERIES
PRODUCT INDENTIFICATION MSCD - 32 - 100 K
Product Code Dimensions Code Inductance Code Tolerance Code
A: 3.3 ± 0.3 mm B: 3.0 ± 0.3 mm C: 2.1 ± 0.3 mm D: 1.0 Typ. mm
SEE TABLE 1
TEST INSTRUMENTS L : HP 4284A PRECISION LCR METER (or equivalent) RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
(3)-1 Ambient temperature ……......... 60 Max.
(3)-2 Operate temperature range ...... 40℃~+125
(Including self temp. rise)
(3)-3 Storage temperature range ...... 40℃~+125
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TABLE 1
MAGLAYERS
PT/NO. MSCD-32-R47 MSCD-32-1R0 MSCD-32-1R4 MSCD-32-1R5 1.86 MSCD-32-1R8 MSCD-32-2R2 MSCD-32-2R7 MSCD-32-3R3 MSCD-32-3R9 MSCD-32-4R7 MSCD-32-5R6 MSCD-32-6R8 MSCD-32-8R2
MSCD-32-100 MSCD-32-120 MSCD-32-150 MSCD-32-180 MSCD-32-220 MSCD-32-270 MSCD-32-330 MSCD-32-390 MSCD-32-470 MSCD-32-560 MSCD-32-680 MSCD-32-820 MSCD-32-101 MSCD-32-121 MSCD-32-151 MSCD-32-181 MSCD-32-221 MSCD-32-331 MSCD-32-391 MSCD-32-471 MSCD-32-561 MSCD-32-681 MSCD-32-821 MSCD-32-102
Inductance Percent Test Resistance Rated DC Current
L(μH) Tolerance Frequency RDC(Ω)Max. IDC(A)
0.47 N 100kHz/0.25V 17.7m R47
1.0 M,N 100kHz/0.25V
1.4 M,N 100kHz/0.25V
1.5 M,N 100kHz/0.25V 90m 1R5
1.8 M,N 100kHz/0.25V
2.2 K,M,N 100kHz/0.25V
2.7 M,N 100kHz/0.25V
3.3 M,N 100kHz/0.25V
3.9 M,N 100kHz/0.25V
4.7 M,N 100kHz/0.25V
5.6 M,N 100kHz/0.25V
6.8 M,N 100kHz/0.25V
8.2 M,N 100kHz/0.25V 10 M 100kHz/0.25V 12 M 100kHz/0.25V 15 M 100kHz/0.25V 18 M 100kHz/0.25V 22 M 100kHz/0.25V 27 M 100kHz/0.25V 0.65 270 33 M 100kHz/0.25V 0.80 330 39 M 100kHz/0.25V 47 M 100kHz/0.25V 56 M 100kHz/0.25V 68 M 100kHz/0.25V 82 M 100kHz/0.25V
100 K,M 100kHz/0.25V 120 K,M 100kHz/0.25V 150 K,M 100kHz/0.25V 180 K,M 100kHz/0.25V 220 K,M 100kHz/0.25V 330 K,M 100kHz/0.25V 390 K,M 100kHz/0.25V 470 K,M 100kHz/0.25V 560 K,M 100kHz/0.25V 680 K,M 100kHz/0.25V 820 K,M 100kHz/0.25V
1000 K,M 100kHz/0.25V
70m 90m
0.11
0.13
0.14
0.17
0.19
0.21
0.22
0.25
0.28
0.32
0.35
0.40
0.48
0.58
0.90
1.19
1.27
1.73
1.99
2.52
2.90
3.36
4.03
5.64
9.24
10.14
11.48
19.49
22.00
23.98
28.80
3.00
2.08
1.86
1.80
1.39
1.32
1.25
1.20
1.03
0.91
0.85
0.82
0.74
0.64
0.60
0.54
0.50
0.43
0.37
0.36
0.33
0.30
0.29
0.25
0.20
0.19
0.17
0.17
0.14
0.12
0.09
0.08
0.08
0.07
0.06
0.05
Marking
1R0 1R4
1R8 2R2 2R7 3R3 3R9 4R7 5R6 6R8 8R2
100 120 150 180 220
390 470 560 680 820 101 121 151 181 221 331 391 471 561 681 821 102
※ □ specify the inductance tolerance,K(±10%),M(±20%),N(±30%) IDC : Based on inductance change (L/Lodrop 10% Max.) @ ambient temperature 25 and
Based on temperature rise (T 40 TYP.)
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(4) RELIABILITY TEST METHOD
MECHANICAL
TEST ITEM SPECIFICATION TEST DETAILS
Substrate bending
L/Lo±5%
There shall be direction is made approximately 3mm.(keep time 30 seconds) no mechanical PCB dimension shall the page 7/9 damage or elec- F(Pressurization) trical damege.
The sample shall be soldered onto the printed circuit board in figure 1 and a load applied unitil the figure in the arrow
PRESSURE ROD
figure-1
Vibration
Solderability
L/Lo±5%
There shall be and a frequency of from 10 to 55Hz/1 minute repeated should no mechanical be applied to the 3 directions (X,Y,Z) for 2 hours each. damage. (A total of 6 hours)
New solder Flux (rosin, isopropyl alcohol{JIS-K-1522}) shall be coated More than 90% over the whole of the sample before hard, the sample shall
The sample shall be soldered onto the printed circuit board and when a vibration having an amplitude of 1.52mm
then be preheated for about 2 minutes in a temperature of 130150 and after it has been immersed to a depth 0.5mm below for 3±0.2 seconds fully in molten solder M705 with a temperature of 245±5. More than 90% of the electrode sections shall be couered with new solder smoothly when the sample is taken out of the solder bath.
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MSCD-32-SERIES
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MECHANICAL
Sodering temperature ()
(230
)
TEST ITEM SPECIFICATION Resistance to There shall be Temperature profile of reflow soldering Soldering heat no damage or (reflow soldering) problems.
300 250
soldering (Peak temperature 260±3 10 sec
200
150
100
50
Pre-heating
150 ~ 180
2 min
30 sec Min
+0
10 sec.
Slow cooling (Stored at room temperature)
2 min. or more
The specimen shall be passed through the reflow oven with the condition shown in the above profile for 1 time. The specimen shall be stored at standard atmospheric conditions for 1 hour, after which the measurement shall be made.
ELECTRICAL
TEST ITEM SPECIFICATION TEST DETAILS Insulation There shall be DC 100V voltage shall be applied across this sample of top resistance no other surface and the terminal.
damage or
problems. Dielectric There shall be AC 100V voltage shall be applied for 1 minute acrosset the top withstand no other surface and the terminal of this sample voltage damage or
problems. Temperature characteristics
L/L20℃≦±10%
02000 ppm/ an ambient temperature of -20 to +85,and the value
The insulation resistance shall be more than 1 × 108 Ω.
The test shall be performed after the sample has stabilized in
calculated based on the value applicable in a normal temperature and narmal humidity shall be L/L20℃≦±10%.
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ENVIROMENT CHARACTERISTICS
TEST ITEM SPECIFICATION High temperature storage
L/Lo±5%
There shall be Upon completion of the measurement shall be made after the no mechanical sample has been left in a normal temperature and normal damage. humidity for 1 hour.
The sample shall be left for 96±4 hours in an atmospere with a temperature of 85±2 and a normal humidity.
Low temperature storage
Change of temperature subjected to standard atmospheric conditions for 1 hour,
Moisuture storage
Test conditions
The sample shall be reflow soldered onto the printed circuit board in every test.
L/Lo±5%
There shall be Upon completion of the test, the measurement shall be made no mechanical after the sample has been left in a normal temperature and damage. normal humidity for 1 hour. L/Lo±5%
There shall be after which measurement shall be made. no other dama­ge of problems
L/Lo±5%
There shall be Upon completion of the test, the measurement shall be made no mechanical after the sample has been left in a normal temperature and damage. normal humidity more than 1 hour.
The sample shall be left for 96±4 hours in an atmosphere with a temperature of -25±3.
The sample shall be subject to 5 continuos cycles, then it shall be
The sample shall be left for 96±4 hours in a temperature of 40±2 and a humidity(RH) of 9095%.
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(5) LAND DIMENSION (Ref.)
PCB: GLASS EPOXY t1.6mm
(5)-1 LAND PATTERN DIMENSIONS
(STANDARD PATTERN) Unit : mm
3.5
Land
Part of silk screen
3.6
1.2
1.2
R1.0
(5)-2 SUBSTRATE BENDING TEST BENDING TEST BOARD
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(6) PACKAGING
(6)-1 CARRIER TAPE DIMENSIONS (mm)
12
(6)-2 TAPING DIMENSIONS (mm)
Unreeling Direction
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(6)-3 REEL DIMENSIONS (mm)
Tape width
(6)-4 QUANTITY
1000 pcs/Reel The products are packaged so that no damage will be sustained.
:12
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