Mag Layers MNR-6012 User Manual

SCOPE
(1) SHAPES AND DIMENSIONS
(2) ELECTRICAL SPECIFICATIONS
(3) CHARACTERISTICS
This specification applies to the Pb Free high current type SMD inductors for MNR-6012-SERIES
PRODUCT INDENTIFICATION MNR - 6012 - 5R3 M
A: 6.0±0.2 mm B: 6.0±0.2 mm C: 1.20Max. mm D: 3.10Typ. mm E: 1.45Typ. mm
SEE TABLE 1
TEST INSTRUMENTS L : HP 4284A PRECISION LCR METER (or equivalent) SRF : HP 4291B IMPEDANCE ANALYZER (or equivalent) RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
(3)-1 Ambient temperature ……......... 60 Max.
(3)-2 Operate temperature range ...... 40℃~+125
(Including self temp. rise)
(3)-3 Storage temperature range ...... 40℃~+125
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TABLE 1
MAGLAYERS
PT/NO. MNR-6012-3R3 MNR-6012-5R3 MNR-6012-6R8 MNR-6012-8R2
MNR-6012-100
※ □ specify the inductance tolerance,M(±20%),N(±30%) IDC1 Based on inductance change (L/Lodrop 30% Max.) @ ambient temp. 25
IDC2 Based on temperature rise (T 40 Typ.) Rated DC Current The less value whith is IDC1 or IDC2.
Inductance Percent L Test SRF(MHz) Resistance
L(μH) Tolerance Frequency Min. RDC(Ω)±20% IDC1(A) IDC2(A)
3.3 M,N 100KHz/0.25V 42 90m 1.80 1.50 3R3
5.3 M,N 100KHz/0.25V 34 0.110 1.50 1.40 5R3
6.8 M,N 100KHz/0.25V 30 0.165 1.30 1.18 6R8
8.2 M,N 100KHz/0.25V 25 0.185 1.10 1.10 8R2 10 M,N 100KHz/0.25V 22 0.235 1.00 1.00 100
Rated DC Current
Marking
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(4) RELIABILITY TEST METHOD
MECHANICAL
TEST ITEM SPECIFICATION TEST DETAILS
Substrate bending
L/Lo±5%
There shall be direction is made approximately 3mm.(keep time 30 seconds) no mechanical PCB dimension shall the page 7/9 damage or elec- F(Pressurization) trical damege.
The sample shall be soldered onto the printed circuit board in figure 1 and a load applied unitil the figure in the arrow
PRESSURE ROD
figure-1
Vibration
Solderability
L/Lo±5%
There shall be and a frequency of from 10 to 55Hz/1 minute repeated should no mechanical be applied to the 3 directions (X,Y,Z) for 2 hours each. damage. (A total of 6 hours)
New solder Flux (rosin, isopropyl alcohol{JIS-K-1522}) shall be coated More than 90% over the whole of the sample before hard, the sample shall
The sample shall be soldered onto the printed circuit board and when a vibration having an amplitude of 1.52mm
then be preheated for about 2 minutes in a temperature of 130150 and after it has been immersed to a depth 0.5mm below for 3±0.2 seconds fully in molten solder M705 with a temperature of 245±5. More than 90% of the electrode sections shall be couered with new solder smoothly when the sample is taken out of the solder bath.
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