Mag Layers MND-04BZNSERIES-XC User Manual

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PDA, notebook, desktop, and server applications
Low profile, high current power supplies

Battery powered devices
DC/DC converters in distributed power systems

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DC/DC converters for field programmable gate array

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RoHS compliant
Super low resistance, ultra high current rating
High performance (I sat) realized by metal dust core

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MND - 04BZN 1R0 M - XC

① Product Code
② Dimensions : 4.3 x 4.3 x 2.0 mm
③ Inductance : 1R0 = 1.0μH

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① ② ③ ④ ⑤

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④ Tolerance : M = ±20%
⑤ Series Type : XC Type

NOTE：Please refer to the “Product Dimension” for detail dimensions.

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1R0

MAG.LAYERS

MND-04BZNSERIES-XC

NOTE

PRODUCT NO. A B C D

：Dimensions in mm

MND-04BZN2R2M-XC

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PART NUMBER

MND-04BZNR40M-XC 0.40 7.55

MND-04BZNR60M-XC 0.60 9.5 10.45

MND-04BZN1R0M-XC 1.0 13.25 14.6

MND-04BZN1R5M-XC 1.5 21.45 23.6

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4.0 ± 0.3 4.0 ± 0.3 2.0 Max 3.4 ± 0.2

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INDUCTANCE

Lo(μH)±20%

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Typ. Max

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dc

(mΩ)

8.3 14 12.5

HEAT RATING

CURRENT(Idc)

DC AMPS

11.7 10.4

9.6 8.7

7.5 7.1

1

SATURATION

CURRENT(Isat)

DC AMPS2

MND-04BZN2R2M-XC 2.2 35.2 38.7

TEST FREQUENCY: 100KHz, 0.25V
TESTING INSTRUMENT L :Agilent4284A,WK4235,CH3302/G LCR METER

CH1320,CH1320S BIAS CURRENT SOURCE

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NOTES:

1. DC current (Idc) that will cause an approximate △T of 40℃

2. DC current (I

3. All test data is referenced to 25℃ ambient

4. Operating Temperature Range -55℃ to +125℃

5. The part temperature (ambient + temp rise) should not exceed 125℃

under the worst operating conditions. Circuit design, component placement,
PWB trace size and thickness, airflow and other cooling provisions all affect

the part temperature. Part temperature should be verified in the end application.

sat

) that will cause Lo to drop approximately 30%

:CH11025,GOM802 MICRO OHMMETER

dc

5.5 5.6

MAG.LAYERS

MND-04BZNSERIES-XC