Mag Layers MMD-12FD-SERIES-V1 User Manual

A
P
P
L
I
C
A
T
I
N
A
P
P
L
I
C
A
A
P
P
L
PDA, notebook, desktop, and server applications Low profile, high current power supplies
Battery powered devices DC/DC converters in distributed power systems DC/DC converters for field programmable gate array
F
E
A
F
P
P
T
E
A
F
P
T
E
A
T
Super low resistance, ultra high current rating Low profile for machine placement High performance (I sat) realized by metal dust core
R
D
R
D
R
D
MMD - 12FD - R47 M - V1
I
U
U
U
C
U
U
U
R
R
R
A
C
C
C
E
E
E
T
T
T
T
T
S
S
S
I
N
I
N
I
D
E
N
T
I
F
I
C
A
T
I
N
I
D
E
N
T
I
F
I
C
A
I
D
E
N
T
I
F
T
I
C
A
T
I
N
I
N
Product Code Dimensions : 13.7 X 12.9 X 6.4 mm ③ Inductance : R47 = 0.47μH Tolerance : M = ±20% ⑤ Series Type : V1 Type
NOTEPlease refer to the “Product Dimension” for detail dimensions.
P
R
D
U
C
T
D
I
M
E
N
S
I
N
P
R
D
U
C
T
D
I
M
E
N
P
R
D
U
C
T
D
I
M
A
B
E
N
S
S
D
C
I
N
I
N
E
MAG.LAYERS
MMD-12FD-SERIES-V1-B6
NOTE
PRODUCT NO. A B C D E
Dimensions in mm
MMD-12FD-SERIES-V1
13.2 ± 0.5
12.9 Max 6.4 Max 3.2 ± 0.5 2.3 ± 0.3
E
L
E
C
T
R
I
C
A
L
R
E
U
I
R
E
M
E
N
T
E
L
E
C
T
R
I
C
A
L
R
E
U
I
R
E
M
E
M
E
E
E
MMD-12FD-R22M-V1 0.22 0.63 0.7 53 112 MMD-12FD-R33M-V1 0.33 0.83 0.9 46 65 MMD-12FD-R47M-V1 0.47 1.0 1.2 41 63 MMD-12FD-R56M-V1 0.56 1.2 1.4 37 62 MMD-12FD-R68M-V1 0.68 1.4 1.6 35 60 MMD-12FD-R82M-V1 0.82 1.6 1.9 33 50 MMD-12FD-1R0M-V1 1.0 1.7 2.0 32 49
L
E
C
T
R
I
C
PART NUMBER
A
L
R
E
INDUCTANCE
Lo(µH)±20%
U
I
@0A
R
S
N
T
S
N
T
S
R
dc
(m)
Typ. Max
HEAT RATING
CURRENT(Idc)
DC AMPS
1
SATURATION
CURRENT(Isat)
DC AMPS2
MMD-12FD-1R5M-V1 1.5 2.5 3.0 27 45 MMD-12FD-1R8M-V1 1.8 2.8 3.2 24 41 MMD-12FD-2R2M-V1 2.2 3.5 4.2 22 40 MMD-12FD-3R3M-V1 3.3 5.7 6.8 18 35 MMD-12FD-4R7M-V1 4.7 9.3 11.2 13.5 30
TEST FREQUENCY:100KHz,0.25V TESTING INSTRUMENT L :Agilent4284A,WK4235,CH3302/G LCR METER
CH1320,CH1320S BIAS CURRENT SOURCE R
NOTES:
1.DC current (Idc) that will cause an approximate T of 40
2.DC current (I
3.All test data is referenced to 25 ambient
4.Operating Temperature Range -55 to +125
5.The part temperature (ambient + temp rise) should not exceed 125
sat
) that will cause Lo to drop approximately 20%
:CH11025,GOM802 MICRO OHMMETER
dc
under worst case operating conditions. Circuit design, component placement, PWB trace size and thickness, airflow and other cooling provisions all affect
the part temperature. Part temperature should be verified in the end application.
MAG.LAYERS
MMD-12FD-SERIES-V1-B6
Loading...
+ 4 hidden pages