Loctite 3609 Technical Data Sheet

Technical Data Sheet

3609™

March-2009

PRODUCT DESCRIPTION

3609™ provides the following product characteristics:

Technology Epoxy
Chemical Type Epoxy
Appearance (uncured) Dark, red viscous gel

LMS

Components One component - requires no mixing

Cure Heat cure
Application Surface mount adhesive

Key Substrates SMD components to PCB
Other Application Areas Small parts bonding
Dispense Method Syringe
Dispense Speed Medium 15,000 -25,000 dots/h
Wet Strength High

3609™ is designed for the bonding of surface mounted devices
to printed circuit boards prior to wave soldering. Particularly
suited for applications where medium to high dispense speeds,
high dot profile, high wet strength and good electrical
characteristics are required. 3609™ has been used
successfully in lead free processes with water and alcohol
based fluxes under conditions outlined in the Environmental
Resistance section.

TYPICAL PROPERTIES OF UNCURED MATERIAL

Specific Gravity @ 25 °C 1.2
Particle Size, µm <150
Flash Point - See MSDS
Yield Point, 25 °C, Pa

Cone & Plate Rheometer:

Haake PK 100, M10/PK 1 2° Cone

Casson Viscosity @ 25 °C, Pa∙s

Cone & Plate Rheometer:

Haake PK 100, M10/PK 1 2° Cone

250 to 700

0.16 to 2.0

LMS

VISCOSITY VS. TEMPERATURE

The following graph shows a typical temperature-viscosity
curve as measured using a Haake rotoviscometer PK100,
M10/PK1 2° Cone system at a shear rate of 2 s

-1

which is
representative of the shear rate in the dispense nozzle.
Increased cabin or nozzle temperature in the 30°C to 35°C
range may aid dispense performance at higher dispense
speeds.

400

300

200

Viscosity, Pa∙s

100

TYPICAL CURING PERFORMANCE

Recommended conditions for curing are exposure to heat
above 100 °C (typically 90-120 seconds @ 150 °C). Rate of
cure and final strength will depend on the residence time at the
cure temperature.

Cure Speed vs. Time, Temperature

The following graph shows the rate of torque strength
developed with time at different temperatures. These times are
defined from the moment the adhesive reaches cure
temperature. In practice, total oven time may be longer to allow
for heat up period. Strength is measured on 1206 capacitors @
22 °C, tested according to IPC SM817, TM-650 Method 2.4.42.

100

75

50

25

% of Full Strength

0

150°C

0 1 2 3 4 5 6 7 8 9 10

125°C

100°C

Time at Temperature, minutes

TYPICAL PROPERTIES OF CURED MATERIAL

Cured for 30 minutes @ 150 °C

Physical Properties:

Coefficient of Thermal Expansion,
ISO 11359-2, K

Coefficient of Thermal Conductivity, ISO 8302,
W/(m·K)

Glass Transition Temperature, ASTM D 4065, °C 73
Specific Heat, kJ/(kg·K) 0.3
Density, BS 5350-B1 @ 25 °C, g/cm³ 1.4

Electrical Properties:

Surface Resistivity, IEC 60093, Ω 2×10
Volume Resistivity, IEC 60093, Ω·cm 2×10
Surface Insulation Resistance, Ω:

SN 59651:

Initial 0.1×10
Aged for 4 days @ 40 °C, 93 % RH 10×10

Aged for 21 days @ 40 °C, 93 % RH 1×10
Electrolytic Corrosion, DIN 53489 AN-1.2
Dielectric Constant / Dissipation Factor, IEC 60250:

1-kHz 3.7 / 0.009
10-kHz 3.3 / 0.03
1,000-kHz 3.2 / 0.03
10,000-kHz 3.1 / 0.03

-1

145×10

0.4

15

15

9

-6

9

9

0

20 25 30 35

Temperature, °C

TDS 3609™, March-2009

TYPICAL PERFORMANCE OF CURED MATERIAL

Adhesive Properties

Cured for 10 minutes @ 110 °C

Push-off Strength:

C-1206 on bare FR4 board N ≥20

(lb) (≥4.5)

Cured for 5 minutes @ 125 °C

Pull-off Strength, Siemens norm SN59651:

C-1206 on bare FR4 board N 40 to 80

(lb) (9 to 18)

Torque Strength, IPC SM817 , TM-650 Method 2.4.42:

C-1206 on bare FR4 board N·mm 30 to 70

(in.oz) (4 to 10)

Cured for 30 minutes @ 150 °C

Lap Shear Strength, ISO 4587:

Steel (grit blasted) N/mm² ≥10

(psi) (≥1,450)

LMS

LMS

Bond strength achieved in practice will vary considerably
depending on the SMD component type, adhesive dot size
and the type, grade and degree of cure of the solder
mask/resist.

TYPICAL ENVIRONMENTAL RESISTANCE

Cured for 30 minutes @ 150 °C

Lap Shear Strength, ISO 4587:

Mild steel (grit blasted)

Hot Strength

Tested at temperature

100

75

50

25

% Initial Strength at 22 °C

0

0 25 50 75 100 125 150 175

Temperature, °C

Chemical/Solvent Resistance

Aged under conditions indicated and tested @ 22 °C.

% of initial strength

Environment °C 100 h 500 h 1000 h

Air 22 100 100 95

Air 150 85 70 70

Heat/humidity 98% RH 40 110 110 100

Resistance to Hot Solder Dip

Cured for 90 seconds @ 150 °C

Hot Solder Dip, IPC SM817, TM-650 Method 2.4.42.1, Pass/Fail:

R-1206 on bare FR4 board:

Supported 60 seconds above solder
bath @ 260°C and dipped for 10
seconds

Pass

Resistance to Process Conditions

Cured for 90 seconds @ 150 °C

Torque Strength, IPC SM817 , TM-650 Method 2.4.42, % of initial
strength retained:

C-1206 on bare FR4 board:

Aged 30 seconds preheat to 100°C
and 3 seconds @ 260°C with flux and
wave solder

100

Resistance to Lead Free Solder

3609™ can be used in lead free wave solder with both water
based and alcohol based fluxes

Lead Free Solder Test Conditions

Flux Types Multicore MF200 (alcohol based) and

Wave Condition 100°C pre-heat with dual wave at 260°C
Components C1608 bonded with twin dot 0.8mm

Result No component loss in the wave

Multicore MF300 (water based)

SOD 80 bonded with single dot 1.1mm

GENERAL INFORMATION
For safe handling information on this product, consult the

Material Safety Data Sheet (MSDS).

Directions for use:

1. 3609™ is supplied de-aerated in a range of ready-to-use
syringes which fit straight into a variety of air
pressure/time dispensing systems commonly available.

2. After storage in a refrigerator the adhesive must be
allowed to equilibrate to room temperature before use,
typically 2 to 4 hours.

3. Avoid cross contamination with other adhesive residues
by ensuring dispense nozzels, adapters etc. are
thoroughly cleaned.

4. Do not leave dirty nozzles on dispensing equipment while
not in use or soaking in solvents for long periods of time.

5. The quantity of adhesive dispensed will depend on the
dispense pressure, time, nozzle size and temperature.

6. These parameters will vary depending on the type of
dispensing system used and should be optimised
accordingly.

7. Dispensing temperature should ideally be controlled at a
value between 30 °C to 35 °C for optimum results,
however higher dispense temperatures are possible.

8. 3609™ can also be dispensed using positive
displacement pump systems.

9. The product is not recommended for dispensing by pin
transfer.

10.

Uncured adhesive can be cleaned from the board with
isopropanol, MEK or ester blends such as LOCTITE®
7360™.

Loctite Material Specification

LMS

LMS dated February-04, 2004. Test reports for each batch are
available for the indicated properties. LMS test reports include
selected QC test parameters considered appropriate to
specifications for customer use. Additionally, comprehensive
controls are in place to assure product quality and
consistency. Special customer specification requirements may
be coordinated through Henkel Quality.

Henkel Americas
+949.789.2500

For the most direct access to local sales and technical support visit: www.henkel.com/electronics

Henkel Europe

+44.1442.278.000

Henkel Asia Pacific

+86.21.2891.8000