Littelfuse SP050xBA User Manual

TVS Diode Arrays (SPA

8

76

5

4

321

RoHS

GREEN

®

Diodes)

General Purpose ESD Protection - SP05 Series

SP05 Series - 30pF 30kV unidirectional TVS Array

Description

This surface mount family of arrays suppresses ESD and
other transient overvoltage events. Used to meet the
International Electrotechnical Compatibility (IEC transient
immunity standards IEC 61000-4-2 for Electrostatic
Discharge Requirements), these devices can help protect
sensitive digital or analog input circuits on data, signal, or
control lines with voltage levels up to 5VDC.

The monolithic silicon arrays are comprised of specially
designed structures for transient voltage suppression (TVS).
The size and shape of these structures have be tailored
for transient protection. The low capacitance and clamp

Pinout

SP0502BAHTG
SP0502BAJTG

1

2

SP0505BAHTG
SP0505BAJTG

SP0503BAHTG

SP0504BAHTG
SP0504BAJTG

1

1

3

2

4

2

3

3

5

4

SP0506BAATG

1

6

voltage are ideal for high speed signal line protection.

Features

• An Array of 2, 3, 4, 5 or 6 TVS Avalanche Diodes in a ultra
small SC70, SOT-23, SOT-143 or MSOP packages

• ESD Capability Standards

- IEC 61000-4-2, Direct Discharge ........ 30kV (Level 4)

- IEC 61000-4-2, Air Discharge .............. 30kV (Level 4)

- MIL STD 883 3015.7 ..........................................30kV

• Input Protection for Applications Up to 5VDC

• Fast Response Time ..................................................<1ns

• Low Input Capacitance ...................................30pF Typical

• Operating Temperature Range..................... -40ºC to 85ºC

Pb

2

3

Life Support Note:

Not Intended for Use in Life Support or Life Saving Applications

The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.

© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/24/13

5

4

Applications

• Mobile phone handsets

• Personal Digital
Assistants (PDA)

• Portable handheld
equipment (Laptop,
Palmtop computers)

Additional Information

Datasheet

• Computer port, keyboard
(USB1.1)

• Digital still cameras

• Digital video cameras

• MP3 players

Resources

Samples

TVS Diode Arrays (SPA

General Purpose ESD Protection - SP05 Series

Absolute Maximum Ratings

Parameter Rating Units

Storage Temperature Range –40 to 125 ºC
Package Power Dissipation

SC70
SOT23-3, SOT23-5, SOT23-6, SOT143
MSOP

0.2

0.225

0.5

®

Diodes)

W
W
W

Electrical Characteristics T

= +25ºC, Unless Otherwise Specified

A

Parameter Test Conditions Min Ty p Max Units

Reverse Standoff Voltage I

≤ 1μA - - 5.5 V

R

Reverse Standoff Leakage Current V = 5.0V 1 100 nA

Signal Clamp Voltage

Positive I = 1mA 7. 0 7. 8 8.5 V

Negative I = 10mA -1.2 -0.8 -0.4 V

Clamp Voltage during ESD

MIL-STD-883 Method 3015 (HBM) test

+ 8kV 12 V

- 8kV -8 V

ESD Test Level (1)

IEC-61000-4-2, Contact discharge 30 kV

MIL-STD-883 Method 3015 (HBM) 30 kV

Capacitance 2.5V @ 1MHz 30 pF

Turn on/off Time <1 ns

Temperature Range

Operating -40 85 ºC

Storage -65 150 ºC

Diode Dynamic Resistance

Forward Conduction 1. 0 Ω

Reverse Conduction 1. 4 Ω

Note:
(1) ESD voltage applied between channel pins and ground, one pin at a time; all other channel pins are open; all ground pins are grounded.

Typical Diode Capacitance vs. Reverse Voltage

60

40

20

Diode Capacitance (pF)

0

0

1

2

Diode Reverse Voltage (V)

3

4

5

Specifications are subject to change without notice.

© 2013 Littelfuse, Inc.

Revised: 04/24/13

TVS Diode Arrays (SPA

t

R

R

o

C

e

T

T

e

3.40 (.134")

3.60 (.140")

0.80 (.032")

1.00 (.040")

2.20

(.087")

REF

1.90

(.075")

1.70

(.067")

1.00 (.040")

1.20 (.048")

0.80 (.032")

1.00 (.040")

BSC

MAX

1.40 (.055")

®

Diodes)

General Purpose ESD Protection - SP05 Series

Soldering Parameters

Reflow Condition Pb – Free assembly

- Temperature Min (T

Pre Heat

- Temperature Max (T

- Time (min to max) (t

Average ramp up rate (Liquidus) Temp
(T

) to peak

L

to TL - Ramp-up Rate 5°C/second max

T

S(max)

Reflow

- Temperature (T

- Temperature (t

Peak Temperature (T

L

) 60 – 150 seconds

L

) 260

P

Time within 5°C of actual peak
Temperature (t

)

p

) 150°C

s(min)

) 200°C

s(max)

) 60 – 180 secs

s

5°C/second max

) (Liquidus) 217°C

+0/-5

20 – 40 seconds

°C

Ramp-down Rate 5°C/second max

Time 25°C to peak Temperature (TP) 8 minutes Max.

Do not exceed 260°C

Package Dimensions — SOT143

SP0503BAHTG - SOT143-4

4

503B

1

e1

b2

c

3

Recommended Pad Layout

E

E1

0.80 (.032")

2

D

A1

b

L

L1

A

3.40 (.134")

3.60 (.140")

1.00 (.040")

2.20

(.087")

REF

1.00 (.040")

1.20 (.048")

1.90

(.075")

1.70

(.067")

BSC

1.40 (.055")

0.80 (.032")

1.00 (.040")

MAX

t

T

P

Ramp-up

t

amp-up

PreheatPrehea

S

T

L

T

S(max)

Temperature

T

S(min)

25

time to peak temperature

P

t

L

Critical Zone
T

Ramp-down

amp-d

Time

Package SOT143-4

Pins 4

JEDEC TO-253

Millimeters Inches

Min Max Min Max

A 0.8 1.22 0.03 0.048

A1 0.05 0.15 0.002 0.006

b 0.30 0.50 0.012 0.020

b2 0.76 0.89 0.030 0.035

c 0.08 0.20 0.003 0.008
D 2.80 3.04 0.110 0.120
E 2.10 2.64 0.082 0.104

E1 1.20 1.40 0.047 0.055

e 1.92 BSC 0.076 BSC

e1 0.20 BSC 0.008 BSC

L 0.4 0.6 0.016 0.024

L1 0.550 REF 0.022 REF

ritical Zon

L to TP

to

© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/24/13