The Littelfuse SM7 Series is a plastic-encapsulated
surface-mount metal oxide varistor (MOV) transient
voltage surge suppressor that is designed to be
operated continuously across AC power lines.
The series comprises a Nylon molded package with
tin plated lead frame for soldering to board. The
surface mount SM7 Series is based on radial 7mm
internal varistor element with similar characteristics
to the Littelfuse LA / ZA series of varistor.
Features
• Electrical equivalent
to leaded types
LA/ZA series
• AC Voltage Rating
115 to 510VAC rms
• Good solderability
• Available in tape
and reel
• Application of AC
power meters
• No De-Rating up
to 85°C ambient
SM7 Series
Absolute Maximum Ratings
• For ratings of individual members of a series, see Device Ratings and Specifications chart
Continuous
Steady State Applied Voltage:
AC Voltage Range (V
DC Voltage Range (V
)115 to 510V
M(AC)RMS
)153 to 675V
M(DC)
Transients:
Peak Pulse Current (ITM)
For 8/20μs Current Wave (See Figure 2)1200A
Single Pulse Energy Range
For 10/1000μs Current Wave (W
Operating Ambient Temperature Range (T
Storage Temperature Range (T
Temperature Coefficient (a
Hi-Pot Encapsulation (COATING Isolation Voltage Capability)
(Dielectric must withstand indicated DC voltage for one minute per MIL-STD 202, Method 301)
COATING Insulation Resistance1000MΩ
STG
V
) of Clamping Voltage (VC) at Specified Test Current<0.01%/OC
)-40 to +85
A
)-55 to +125
) 10 to 40J
TM
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only
rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is
not implied.
The principal techniques used for the soldering of
components in surface mount technology are IR Re-flow
and Wave soldering. Typical profiles are shown on the right.
The terminals of SM7 series devices are tin plated copper,
and the recommended solder is 62/36/2 (Sn/Pb/Ag), 60/40
(Sn/Pb) or 63/37 (Sn/Pb). Littelfuse also recommends an
RMA solder flux.
Wave soldering is the most strenuous of the processes.
To avoid the possibility of generating stresses due to
thermal shock, a preheat stage in the soldering process
is recommended, and the peak temperature of the solder
process should be rigidly controlled.
When using a reflow process, care should be taken to
ensure that the SM7 chip is not subjected to a thermal
gradient steeper than 4 degrees per second; the ideal
gradient being 2 degrees per second. During the soldering
process, preheating to within 100 degrees of the solder's
peak temperature is essential to minimize thermal shock.
Once the soldering process has been completed, it is
still necessary to ensure that any further thermal shocks
are avoided. One possible cause of thermal shock is hot
printed circuit boards being removed from the solder
process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually
to less than 50ºC before cleaning.
Reflow Solder Profile
250
200
150
100
TEMPERATURE °C
50
0
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
PREHEAT DWELL
PREHEAT ZONE
Wave Solder Profile
300
250
200
150
100
TEMPERATURE °C
50
FIRST PREHEAT
MAXIMUM TEMPERATURE
230°C
SECONDS
ABOVE 183°C
RAMP RATE
<2°C/s
MAXIMUM WAVE 260°C
SECOND PREHEAT
40-80
Lead–free (Pb-free) Soldering Recommendations
The terminals of SM7 series devices are tin plated copper,
and the recommended Lead-free solder is 96.5/3.0/0.5
(SnAgCu) with an RMA flux, though there is a wide
selection of pastes and fluxes available that should be
compatible.
The reflow profile must be constrained by the maximums
in the Lead–free Reflow Profile. For Lead–free Wave
soldering, the Wave Solder Profile still applies.
Note: the Lead–free paste, flux and profile were used for
evaluation purposes by Littelfuse, based upon industry
standards and practices. There are multiple choices of all
three available, it is advised that the customer explores the
optimum combination for their process as processes vary
considerably from site to site.
SM7 Series Varistor
Lead–free Re-flow Solder Profile
78
Revised: May 8, 2013
0
0.0 0.51.01.52.02.53.03.54.0 4.5
300
250
200
150
100
TEMPERATURE °C
MAXIMUM TEMPERATURE 250˚C,
TIME WITHIN 5˚C OF PEAK
20 SECONDS MAXIMUM
PREHEAT ZONE
50
0
0 1.0 2.0 3.0 4.0 5.0 6.0 7.0
Please refer to www.littelfuse.com/series/sm7.html for current information.
TIME (MINUTES)
RAMP RATE
<3˚C/s
TIME (MINUTES)
Specifications are subject to change without notice.