Littelfuse SL1002A User Manual

Page 1
Gas Discharge Tube (GDT) Products
SL1002A Series
SL1002A Series
Agency Approvals
AGENCY AGENCY FILE NUMBER
®
2 Electrode GDT Graphical Symbol
E128662
Description
The Broadband Optimized™ SL1002A series has been especially developed for use in broadband equipment. Special design features provide high levels of protection against fast rising transients in the 100V/s to 1kV/s range usually caused by lightning disturbances. These devices have ultra low capacitance (typically 1.2pF or less) and present insignificant signal losses up to 1.5GHz. These devices are extremely robust and are able to divert a 5000A pulse without destruction. For AC Power Cross of long duration, overcurrent protection is recommended.
Features
• RoHS compliant/Lead­free
• Ultra low insertion loss
• Surface mountable
• 5kA surge capability tested with 8/20S– Pulse as defined by IEC 61000-4-5
• Excellent response to fast rising transients
• 10/700 6kV capability, as per ITU-T Rec. K.21, enhanced test level
• 2000 A 2/10s surge rating
• Meet FCC part 68 10/160s waveform, 200A test and 10/560s waveform 100A test
• Halogen-free
• Can be used to meet Telcordia GR1089 without series resistance
®
©2009 Littelfuse, Inc. Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information. Customer should verify actual device performance in their specific applications.
Applications
• Broadband equipment
• ADSL equipment
• XDSL equipment
35
Revised: November 10, 2009
Revised: November 10, 2009
• Satellite and CATV equipment
• General telecom equipment
Page 2
Gas Discharge Tube (GDT) Products
Electrical Characteristics
Device Specifications (at 25°C) Life Ratings
DC Breakdown
Part Number
in Volts
(@100V/s)
MIN TYP MAX MAX MIN MAX TYP TYP @ 2/10 μs @ 10/350 μs
SL1002A075 60 75 90
SL1002A090 72 90 108
SL1002A230 184 230 276
SL1002A250 200 250 300
SL1002A260 210 260 310
SL1002A350 280 350 420 800 900
SL1002A470 376 470 564 900 1000
SL1002A600 480 600 720 1100 1200
SL1002A600SP 570 600 780 1200 1300
Notes:
1. At delivery AQL 0.65 level II, DIN ISO 2859
2. In ionized mode
3. In ionized mode, tested according to ITU-T Rec. K.12
4. Comparable to the silicon measurement Switching Voltage (Vs)
5. Reference REA PE-80, 0.2A. Tested to ITU-T Rec. K.12 and REA PE-80 < 150 msecs.
6. 300 Applications [150(+) & 150(-)]
7. 10x[5x (+) & 5x (-)] Applications
1,2
Impulse
Breakdown
3,4
in Volts
(@100V/µs)
400 650
600 700
Impulse
Breakdown
3,4
in Volts
(@1kV/µs)
Insulation
Resistance
9
10
(at 50V)
9
10
(at 100V)
9
10
(at 500V)
Capaci-
tance
(@1MHz
0V Bias)
1.2 pF ~15 V
SL1002A Series
Arc
Voltage
(on state
voltage)
@1Amp Min
Surge
Life
(@100A
10/1000µs)
300
shots
Nominal
Discharge
10 shots7
6
Impulse
Current
(8/20µs)
(@ 5kA)
Nominal
AC
Discharge
Current
(10x1s
@50-60Hz)
5 A
DC
Holdover
Voltage
50 V
135 V
Max Impulse Discharge
5
Current
(1 Application)
2 kA 1.5 kA
Product Characteristics
Materials
Product Marking
Construction = Ceramic Insulator Device Finish = Dull Tin-plated 17.5 +/-12.5
microns
Littelfuse 'LF' Mark, voltage and date code
Voltage vs. Time Characteristics
Max dynamic
breakover voltage
(V)
Voltage
Hold-over voltage
On-State voltage
0 200 400 600 80 0 1000 1200
Time
(ns)
Glow to Arc Transition Current
Glow Voltage
Storage and Operational Temperature
< 0.5 Amps
~60 - 140 Volts
-40 to +90°C
36
Revised: November 10, 2009
Specifications are subject to change without notice.
Customer should verify actual device performance in their specific applications.
Please refer to www.littelfuse.com for current information.
©2009 Littelfuse, Inc.
Page 3
Insertion Loss Characteristics
Gas Discharge Tube (GDT) Products
SL1002A Series
Typical Insertion Loss Characteristics (90V)
2
0
-2
-4
-6
-8
S21 [dB]
-10
-12
-14
-16
-18
1.E+07 1.E+08 1.E+09 1.E+10 1.E+11
Frequency [Hz]
Device Dimensions
'C' Type Core Devices
Dimensions are in millimeters [and inches] Dimensions are in millimeters [and inches]
TOP VIEW PROFILE VIEW SEMI–PROFILE VIEW
Ø6.0 ± 0.15
[0.236 ± 0.0059]
15
Ø6.0 ± 0.
0.50
4.1 ± 0.2 [0.161 ± 0.0079]
3.6 ± 0.2 [0.142 ± 0.0079]
Typical Insertion Loss Characteristics (600V)
2
0
-2
-4
-6
S21 [dB]
-8
-10
-12
-14
-16
1.E+07 1.E+08 1.E+09 1.E+10 1.E+11
Frequency [Hz]
'SM' Type Surface Mount Devices
TOP VIEW PROFILE VIEW SEMI–PROFILE VIEW
6.2 ± 0.15
7.5 ± 0.2
3.9 Ref
[0.154 Ref]
5
Ø6.2 ± 0.1
0.50
SOLDER PAD LAYOUT
1.30 [0.051]
3.6 ± 0.2 [0.142 ± 0.0079]
4.1 ± 0.2 [0.161 ± 0.0079]
©2009 Littelfuse, Inc. Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information. Customer should verify actual device performance in their specific applications.
37
Revised: November 10, 2009
5.00 [0.197]
3.50 [0.138]
Page 4
Gas Discharge Tube (GDT) Products
SL1002A Series
Soldering Parameters - Reflow Soldering (Surface Mount Devices)
Reflow Condition Pb-free assembly
- Temperature Min (T
Pre Heat
- Temperature Max (T
- Time (Min to Max) (ts) 60 – 180 seconds
Average Ramp-up Rate (Liquidus Temp (TL) to peak)
T
to TL - Ramp-up Rate 5°C/second max.
S(max)
Reflow
- Temperature (TL) (Liquidus) 217°C
- Temperature (tL) 60 – 150 seconds
Peak Temperature (TP) 260
Time within 5°C of Actual Peak Temperature (tp)
Ramp-down Rate 6°C/second max.
Time 25°C to Peak Temperature (TP) 8 minutes max.
Do not exceed 260°C
) 150°C
s(min)
) 200°C
s(max)
3°C/second max.
+0/-5
°C
10 – 30 seconds
T
Temperature
S(max)
T
S(min)
T
P
T
L
25
time to peak temperature
Preheat
t
S
(t 25ºC to peak)
Ramp-up
t
P
Critical Zone
T
to T
L
P
t
L
Ramp-down
Time
Soldering Parameters - Wave Soldering (Thru-Hole Devices)
300
280
260
240
220
200
180
160
140
120
100
80
60
40
20
0
Temperature (°C) - Measured on bottom side of board
0
102030405060708090
Time (Seconds)
Preheat Time
100
110
120
130
140
150
160
170
180
190
200
210
220
230
Dwell Time
Cooling Time
Soldering Parameters - Hand Soldering
Solder Iron Temperature: 350° C +/- 5°C Heating Time: 5 seconds max.
Recommended Process Parameters:
Wave Parameter Lead-Free Recommendation
Preheat:
(Depends on Flux Activation Temperature)
Temperature Minimum:
Temperature Maximum:
Preheat Time: 60-180 seconds
Solder Pot Temperature:
Solder Dwell Time: 2-5 seconds
240
(Typical Industry Recommendation)
100
° C
150
° C
280
° C Maximum
38
Revised: November 10, 2009
Specifications are subject to change without notice.
Customer should verify actual device performance in their specific applications.
Please refer to www.littelfuse.com for current information.
©2009 Littelfuse, Inc.
Page 5
Gas Discharge Tube (GDT) Products
SL1002A Series
Packaging
‘C’ Type Core Items: Package bulk pack in polybag, 1000 pcs/bag
'SM' Type Surface Mount Items: Packaged tape and reel carrier, 1000 pcs/reel (specifications below)
Dimensions are in millimeters [and inches]Dimensions are in millimeters [and inches]
+0.10
1.50 0
+0.004
[0.059]
0
2 ± 0.1
4 ± 0.1
[0.157 ± 0.004]
8 ± 0.1 [0.315 ± 0.004]
1.50
[0.059]
[0.079 ± 0.004]
10x4=40 ± 0.2
[10x0.157=1.575 ± 0.008]
Part Numbering System and Ordering Information
16 ± 0.3
7.5 ± 0.1 [0.295 ± 0.004]
1.75 ± 0.1
[0.069 ± 0.004]
6.5 ± 0.1
[0.256 ± 0.004]
[0.016]
[0.630 ± 0.012]
R0.30 max.
[0.012]
0.40
3 °
6.5 ± 0.1 [0.256 ± 0.004]
17.7
[0.697]
275.0
[10.83]
76.0
[2.99]
100.0
[3.94]
25.0
[0.98]
Direction of Feed
SL1002 A XXX XX
Surge Capability
Voltage
Pin Configuration
C = Core (Packed in polybag, 1000pcs/bag) SM = Surface Mount (Packed in carrier and tape, 1000pcs/reel)
©2009 Littelfuse, Inc. Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information. Customer should verify actual device performance in their specific applications.
39
Revised: November 10, 2009
Loading...