TVS Diode Arrays (SPA
RoHS
GREEN
1
2
®
Diodes)
General Purpose ESD Protection - SD05 Series
SD05 Series 450W Discrete unidirectional TVS Diode
Description
The SD05 TVS diode is designed to replace multilayer
varistors (MLVs) in electronic equipment for low speed and
DC applications. It will protect any sensitive equipment
from damage due to electrostatic discharge (ESD) and
other transient events.
The SD05 can safely absorb repetitive ESD strikes
at ±30kV (contact discharge, IEC 61000-4-2) without
performance degradation and safely dissipate 30A of
8/20μs induced surge current (IEC61000-4-5) with very low
clamping voltages.
Pinout and Functional Block Diagram
Features
• ESD, IEC61000-4-2,
±30kV contact, ±30kV air
• EFT, IEC61000-4-4, 40A
(5/50ns)
• Lightning, IEC61000-4-5,
30A (t
=8/20μs)
P
Pb
• Low clamping voltage
• Low leakage current
• Small SOD323 package
fits 0805 footprints
Applications
• Switches / Buttons
• Test Equipment /
Instrumentation
• Point-of-Sale Terminals
Additional Information
Datasheet
• Medical Equipment
• Notebooks / Desktops /
Servers
• Computer Peripherals
Resources
Samples
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/24/13
TVS Diode Arrays (SPA
Bias Voltage (V)
Capacitance (pF)
0.0
50.0
100.0
150.0
200.0
250.0
300.0
0.0 0.5 1.01.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
®
Diodes)
General Purpose ESD Protection - SD05 Series
Absolute Maximum Ratings
Symbol Parameter Value Units
I
PP
P
pk
T
OP
T
STOR
Notes:
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Thermal Information
Storage Temperature Range –55 to 150 °C
Maximum Junction Temperature 150 °C
Maximum Lead Temperature (Soldering 20-40s) 260 °C
Peak Current (tp=8/20μs) 30 A
Peak Pulse Power (tp=8/20μs)
450
W
Operating Temperature –40 to 125 °C
Storage Temperature –55 to 150 °C
Parameter Rating Units
Electrical Characteristics (T
OP
=25ºC)
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Voltage Drop V
Reverse Standoff Voltage V
Leakage Current I
Clamp Voltage
1
Dynamic Resistance R
ESD Withstand Voltage
Diode Capacitance
Note:
1
Parameter is guaranteed by design and/or device characterization.
1
1
V
RWM
LEAK
V
DYN
ESD
C
R
C
IEC61000-4-2 (Contact Discharge) ±30 kV
IEC61000-4-2 (Air Discharge) ±30 kV
D
Capacitance vs. Reverse Bias
IR=1mA 6 V
IR≤1μA 5.0 V
VR=5V 1. 0 μA
IPP=1A, tp=8/20µs, Fwd 8.0 V
I
=2A, tp=8/20µs, Fwd 8.5 V
PP
I
=10A, tP=8/20μs, Fwd 11. 8 V
PP
I
=24A, tP=8/20μs, Fwd 16.8 V
PP
(VC2 - VC1) / (I
- I
) 0.5 Ω
PP2
PP1
Reverse Bias=0V, f=1MHz 350 pF
Non-Repetitive Peak Pulse Power vs. Pulse Time
10
(kW)
pk
1
0.1
Peak Pulse Power - P
0.01
0.11 10 100 1000
Pulse Duration - tp (µs)
Specifications are subject to change without notice.
© 2013 Littelfuse, Inc.
Revised: 04/24/13
TVS Diode Arrays (SPA
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
0.0 5.0 10.0 15.0 20.0 25.0 30.0
Time (μs)
Percent of I
PP
t
R
o
C
e
T
L
T
P
®
Diodes)
General Purpose ESD Protection - SD05 Series
Power Derating Curve
110
100
90
80
PP
70
60
50
40
30
20
% of Rated Power I
10
0
0255075100 125150
o
Ambient Temperature - T
(
C)
A
Soldering Parameters
Reflow Condition Pb – Free assembly
- Temperature Min (T
Pre Heat
- Temperature Max (T
- Time (min to max) (ts) 60 – 180 secs
Average ramp up rate (Liquidus) Temp
(T
) to peak
L
to TL - Ramp-up Rate 3°C/second max
T
S(max)
Reflow
- Temperature (TL) (Liquidus) 217°C
- Temperature (tL) 60 – 150 seconds
Peak Temperature (TP) 260
Time within 5°C of actual peak
Temperature (t
)
p
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (T
Do not exceed 260°C
) 150°C
s(min)
) 200°C
s(max)
3°C/second max
+0/-5
°C
20 – 40 seconds
) 8 minutes Max.
P
Pulse Waveform
T
P
T
L
T
S(max)
Temperature
T
S(min)
25
time to peak temperature
t
S
PreheatPrehea
Ramp-upRamp-up
t
P
t
L
Critical Zone
ritical Zon
T
L to TP
to
Ramp-down
amp-d
Time
Product Characteristics
Lead Plating
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Substitute Material Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/24/13
Matte Tin
TVS Diode Arrays (SPA
4.00
2.00
ø1.50
B-B
®
Diodes)
General Purpose ESD Protection - SD05 Series
Part Marking System
g
Package Dimensions -SOD323
E
b
E1
L
0.2
L1
L
c
A1
A2
Part Numbering System
–
SD05
01
T
G
F
G= Green
TVS Diode Arrays
®
(SPA
Diodes)
Series
Number of
Channels
T= Tape & Reel
Package
F: SOD323
Ordering Information
Part Number Package Marking Min. Order Qty.
SD05-01FTG SOD323 g 3000
SOD323
Symbol
A 1. 0 0 0.039
A1 0.00 0.10 0.000 0.004
D
A2 0.80 0.90 0.031 0.035
b 0.25 0.35 0 .010 0.014
A
c 0.08 0.15 0.003 0.006
D 1.20 1.40 0.047 0.055
E 1.60 1.80 0.063 0.071
E1 2.50 2.70 0.098 0.106
L 0.475 REF 0.019 REF
L1 0.25 0.40 0.010 0.016
Ø 0º 8º 0º 8º
Millimeters Inches
Min Max Min Max
Embossed Carrier Tape & Reel Specification — SOD323
1.75
2.90
1.25
B
B
Cover Tape
3.50
8.00
4.00
1.46
A-A
A
A
0.254
R78.0
R25.6
R25.6
12.3
3000
2500
2000
1500
1000
500
R6.5
54.4
12.3
9.5
Specifications are subject to change without notice.
ø178
© 2013 Littelfuse, Inc.
Revised: 04/24/13
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