Littelfuse SACB User Manual

Transient Voltage Suppression Diodes

Surface Mount – 500W > SACB series

SACB Series

Uni-directional

Agency Approvals

AGENCY AGENCY FILE NUMBER

E230531

Maximum Ratings and Thermal Characteristics (T

=25°C unless otherwise noted)

A

Parameter Symbol Value Unit

Peak Pulse Power Dissipation at ta=25°C by 10/1000μs Waveform (g.1)( Note 1) Power Dissipation on Innite Heat Sink at TL=50ºC Peak Pulse Power Dissipation at Ta=25ºC by 10/1000μs Waveform (Fig. 3) (Note 1)

Operating Junction and Storage Temperature Range Typical Thermal Resistance Junction

to Lead

Typical Thermal Resistance Junction to Ambient

Note:

1. Non-repetitive current pulse , per Fig. 3 and derated above T

P

PPM

P

M(AV)

I

PPM

, T

T

J

R

uJL

R

uJA

500 W

3.0 W

See

Table 1

-55 to 150 °C

STG

30 °C/W

120 °C/W

= 25°C per Fig. 2.

A

Amps

RoHS

Description

SACB series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events.

Features

• For surface mounted

applications in order to optimize board space

• Low prole package

• Built-in strain relief

• Typical failure mode is short from over-specied

voltage or current

• Whisker test is conducted

based on JEDEC JESD201A per its table 4a and 4c

• IEC-61000-4-2 ESD

15kV(Air), 8kV (Contact)

• ESD protection of data

lines in accordance with IEC 61000-4-2 (IEC801-2)

• EFT protection of data

lines in accordance with IEC 61000-4-4 (IEC801-4)

•

VBR @TJ= VBR@25°C × (1+αT

x (TJ - 25))

(αT: Temperature Coefcient)

• Glass passivated chip

• 500W peak pulse power

capability at 10/1000μs

waveform, repetition rate (duty cycles):0.01%

• Fast response time:

typically less than 1.0ps from 0V to BV min

• Excellent clamping

capability

• Low incremental surge

resistance

• High temperature

soldering guaranteed:

260°C/40 seconds at

terminals

• Plastic package has underwriters laboratory ammability 94V-O

• Meet MSL level1, per

J-STD-020, LF maximum peak of 260°C

• Matte tin lead–free plated

• Halogen free and RoHS

compliant

junction

Applications

TVS devices are ideal for the protection of I/O Interfaces, V

bus and other vulnerable circuits used in Telecom,

CC

Computer, Industrial and Consumer electronic applications.

Additional Information

Datasheet

Resources

Speciﬁcations are subject to change without notice.

Samples

Revised: 01/20/14

Transient Voltage Suppression Diodes

0.1µ

1.0µ

10µs

100µs

1.0ms

10ms

Non-repetitive Pulse

Current Waveforms

Square

P

td=7tp

td

P

Half Sine

Impulse

td

P

Exponential

Decay

SACB: Revised Figure 1 - Peak Pulse Power Rating Curve

Surface Mount – 500W > SACB series

Electrical Characteristics (T

Stand-Off

Part

Number

Marking

Code

Voltage

(Note1) V

(V)

=25°C unless otherwise noted)

A

BR

Maximum

Reverse Leakage

at V

(V)

Minimum

Breakdown

Voltage at

R

=1.0MA

I

T

V

A)

R IR

Maximum

Clamping

Voltage at

I

=5.0A

PP

V

C

(V)

Maximum

Peak

Pulse

Current

per (Fig.3)

(A)

I

PP

Maximum

Junction

Capacitance

at

0 Volts (pF)

Working

Inverse

Blocking

Voltage

V

(V)

WIB

Inverse Blocking Leakage

Current at

@ I

V

WIB

IB

(mA)

Peak Inverse

Blocking

Voltage V

(V)

PIB

Recognition

SACB5.0 SKE 5.0 7.60 300 10.0 44.0 45 75 1.0 100 X SACB6.0 SKG 6.0 7.90 300 11.2 41.0 45 75 1.0 100 X SACB7.0 SKM 7.0 8.33 300 12.6 38.0 45 75 1.0 100 X SACB8.0 SKR 8.0 8.89 100 13.4 36.0 45 75 1.0 100 X SACB8.5 SKT 8.5 9.44 50 14.0 34.0 45 75 1.0 100 X

SACB10 SKX 10.0 11.10 5 16.3 29.0 45 75 1.0 100 X SACB12 SLE 12.0 13.30 5 19.0 25.0 45 75 1.0 100 X SACB15 SLM 15.0 16.70 5 23.6 20.0 45 75 1.0 100 X SACB18 SLT 18.0 20.00 5 28.8 15.0 45 75 1.0 100 X SACB22 SLX 22.0 24.40 5 35.4 14.0 45 75 1.0 100 X SACB26 SME 26.0 28.90 5 42.3 11.1 45 75 1.0 100 X SACB30 SMK 30.0 33.30 5 48.6 10.0 45 75 1.0 100 X SACB36 SMP 36.0 40.00 5 60.0 8.6 45 75 1.0 100 X SACB45 SMV 45.0 50.00 5 77.0 6.8 45 150 1.0 200 X SACB50 SMZ 50.0 55.50 5 88.0 5.8 45 150 1.0 200 X

Ratings and Characteristic Curves (T

=25°C unless otherwise noted

= 25°C unless otherwise noted)

A

Figure 1 - Peak Pulse Power Rating Curve Figure 2 - Pulse Derating Curve

100

30

10

- Peak Pulse Power (kW)

".5"

PK

1

PPM

I

PK

0.1 s

s

Waveform shown in Fig. 3

T

=25°C

A

td - Pulse Width (sec.)

100

Average Power

75

50

Peak Power

(Single Pulse)

25

Percentage of Rated Power (%)

0

0255075100 125 150

TL - Lead Temperature (ºC)

UL

Figure 3 - Pulse Waveform

150

RSM

100

50

- Peak Pulse Current, % I

PPM

I

0

tr=10µsec

Peak Value I

PPM

t

d

0

1.0 2.0 3.0 4.0

Half Value

I

PPM

I

PPM

( )

2

10/1000µsec. Waveform as deﬁned by R.E.A

t-Time (ms)

TJ=25°C Pulse Width(td) is deﬁned as the point where the peak current decays to 50% of I

PPM

Figure 4 - AC Line Protection Application

Low Capacitance

Application Note: Device must be used with two units in parallel, opposite in polarity as shown in circuit for AC signal line protection.

Soldering Parameters

Transient Voltage Suppression Diodes

Surface Mount – 500W > SACB series

Reﬂow Condition Lead–free assembly

Pre Heat

- Temperature Min (T

- Temperature Max (T

) 150°C

s(min)

) 200°C

s(max)

- Time (min to max) (ts) 60 – 180 secs

Average ramp up rate (Liquidus Temp (T

) to peak

L

to TL - Ramp-up Rate 3°C/second max

T

S(max)

Reﬂow

- Temperature (TL) (Liquidus) 217°C

- Time (min to max) (ts) 60 – 150 seconds

Peak Temperature (TP) 260

Time within 5°C of actual peak Temperature (t

)

p

3°C/second max

+0/-5

°C

20 – 40 seconds

Ramp-down Rate 6°C/second max

Time 25°C to peak Temperature (T

) 8 minutes Max.

P

Do not exceed 280°C

Physical Speciﬁcations

Weight 0.003oz., 0.093g

Case

JEDEC DO-214AA molded plastic body

over glass passivated junction.

t

T

P

Ramp-up Critical Zone

T

L

T

s(max)

T

s(min)

Temperature (T)

25˚C

t

s

Preheat

t 25˚C to Peak

Time (t)

p

Flow/Wave Soldering (Solder Dipping)

Peak Temperature : 265OC

Dipping Time : 10 seconds

Soldering : 1 time

Environmental Speciﬁcations

High Temp. Storage JESD22-A103

HTRB JESD22-A108

T

to

L

t

L

P

Ramp-down

Polarity

Terminal

Dimensions

A

D

E

Color band denotes cathode except Bidirectional

Matte Tin-plated leads. Solderable per JESD22-B102.

DO-214AA (SMB J-Bend)

Cathode Band

B

F

G

Temperature Cycling JESD22-A104

MSL JEDEC-J-STD-020, Level 1

H3TRB JESD22-A101

RSH JESD22-B106

Dimensions

Inches Millimeters

Min Max Min Max

A 0.077 0.086 1.950 2.200

B 0.160 0.180 4.060 4.570

C

C 0.130 0.155 3.300 3.940

D 0.084 0.096 2.130 2.440

E 0.030 0.060 0.760 1.520

F - 0.008 - 0.203

H

G 0.205 0.220 5.210 5.590

H 0.006 0.012 0.152 0.305

Speciﬁcations are subject to change without notice.

Revised: 01/20/14

Transient Voltage Suppression Diodes

(for uni-directional products only)

0.47

(12.0)

0.315 (8.0)

0.157 (4.0)

0.49

(12.5)

0.80 (20.2)

Arbor Hole Dia.

13.0 (330)

Dimensions are in inches (and millimeters).

Direction of Feed

0.059 DIA

(1.5)

Cover tape

Surface Mount – 500W > SACB series

Part Numbering System

SACB

Series Type

XX

Stand Off Voltage

Part Marking System

F

XX

YMXXX

Packaging

Part number

SACBXX DO-214AA 3000 Tape & Reel - 12mm tape/13” reel EIA STD RS-481

Component

Package

Quantity

Schematic

Packaging

Option

Packaging Speciﬁcation

Cathode Band

Littelfuse Logo

Marking Code

Trace Code Marking

Y:Year Code M: Month Code XXX: Lot Code

Tape and Reel Speciﬁcation

Transient

Voltage

Suppressor

Diode

Cathode

Littelfuse SACB User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual