Lite-On HSDL-3220 User Manual

HSDL-3220

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TRANSMITTER

HSDL-3220

CX1

CX2

CX4

SD (5)

RXD (4)

V

CC

V

CC

(6)

IOV

CC

(7)

GND (8)

V

led

R1

CX3

TXD (3)

LED C (2)

LED A (1)

RECEIVER

SHIELD

IrDA® Data Compliant Low Power 4.0 Mbit/s
Infrared Transceiver

Data Sheet

Description

The HSDL-3220 is a new generation low profile high
speed infrared transceiver module that provides inter­face between logic and IR signals for through-air, serial,
half-duplex IR data-link. The module is fully compliant
to IrDA Physical Layer specification version 1.4 low
power from 9.6kbit/s to 4.0 Mbit/s (FIR) and is IEC825­Class 1 Eye Safe.

The HSDL-3220 can be shutdown completely to achieve
very low power consumption. In the shutdown mode,
the PIN diode will be inactive and thus producing very
little photocurrent even under very bright ambient
light. It is also designed to interface to input/output
logic circuits as low as 1.8V. These features are ideal for
mobile devices that require low power consumption.

Features

•

Fully compliant to IrDA 1.4 physical layer low power
specication from 9.6 kbit/s to 4.0 Mbit/s (FIR)

• Miniature package
– Height: 2.5 mm
– Width: 8.0 mm
– Depth: 3.0 mm

• Typical link distance > 50 cm

•

Guaranteed temperature performance, -25o to 70oC

•

Critical parameters are guaranteed over temperature
and supply voltage

• Low power consumption
–

Low shutdown current

– Complete shutdown of TXD, RXD and PIN diode

• Excellent EMI performance

• Vcc supply 2.7 to 3.6 Volts

• Interfacing with I/O logic circuits as low as 1.8 V

• Lead-free package

• LED stuck-high protection

• Designed to accommodate light loss with cosmetic

windows

• IEC 825-class 1 eye safe

Applications

• Mobile telecom
– Mobile phones
– Smart phones
– Pagers

• Data communication
– Pocket PC handheld products

Figure 1. Functional block diagram of HSDL-3220.

Figure 2. Rear view diagram with pinout.

– Personal digital assistants
– Portable printers

• Digital imaging
– Digital cameras
– Photo-imaging printers

• Electronic wallet

• Small industrial & medical instrumentation

– General data collection devices
– Patient & pharmaceutical data collection devices

Application Support Information

The Application Engineering Group is available to as­sist you with the application design associated with the
HSDL-3220 infrared transceiver module. You can con-

Marking Information

The unit is marked with ‘yyww’ on the shield:

yy = year

ww = work week
tact them through your local sales representatives for
additional details.

Order Information

Part Number Packaging Type Package Quantity

HSDL-3220-021 Tape and Reel Front View 2500

I/O Pins Conguration Table

Pin Symbol Description I/O Type Notes

1 LED A LED Anode I 1

2 LED C LED Cathode 2

3 TXD Transmit Data. Active High. I 3

4 RXD Receive Data. Active Low. O 4

5 SD Shutdown. Active High. I 5

6 Vcc Supply Voltage 6

7 IOVcc Input/Output ASIC Vcc 7

8 GND Ground 8

- Shield EMI Shield 9

Recommended Application Circuit Components

Component Recommended Value Notes

R1 5.6Ω ± 5%, 0.25 watt for 2.7 ≤Vled< 3.3V
10Ω ± 5%, 0.25 watt for 3.3 ≤Vled<4.2V
15Ω ± 5%, 0.25 watt for 4.2 ≤Vled< 5.5V

CX1, CX4 0.47 µF ± 20%, X7R Ceramic 10

CX2, CX3 6.8 µF ± 20%, Tantalum 11

Notes:

1. Tied through external series resistor, R1, to regulated Vled from 2.7 to 5.5V. Please refer to table above for recommended series resistor value.

2. Internally connected to LED driver. Leave this pin unconnected.

3. This pin is used to transmit serial data when SD pin is low. If this pin is held high for longer than 50 µs, the LED is turned o. Do NOT oat this

pin.

4. This pin is capable of driving a standard CMOS or TTL load. No external pull-up or pull-down resistor is required. The pin is in tri-state when

the transceiver is in shutdown mode. The receiver output echoes transmitted signal.

5. The transceiver is in shutdown mode if this pin is high for more than 400 µs. On falling edge of this signal, the state of the TXD pin sampled

and used to set receiver low bandwidth (TXD=low) or high bandwidth (TXD=high) mode. Refer to the section ”Bandwidth selection timing”
for programming information. Do NOT oat this pin.

6. Regulated, 2.7 to 3.6 Volts.

7. Connect to ASIC logic controller Vcc voltage or supply voltage. The voltage at this pin must be equal to or less than supply voltage.

8. Connect to system ground.

9. Connect to system ground via a low inductance trace. For best performance, do not connect directly to the transceiver pin GND.

10. CX1 must be placed within 0.7 cm of the HSDL-3220 to obtain optimum noise immunity.

11. In environments with noisy power supplies, including CX2, as shown in Figure 1, can enhance supply ripple rejection performance.

2

Bandwidth Selection Timing

V

IH

50%

t

S

t

H

V

IL

50%50%TXD

SD/MODE

V

IL

V

IH

50%

t

S

t

H

V

IL

50%50%TXD

SD/MODE

V

IH

V

IL

The transceiver is in default SIR/ MIR mode when pow­ered on. User needs to apply the following program­ming sequence to both the SD and TXD inputs to en­able the transceiver to operate at FIR mode.

Figure 3. Bandwidth selection timing at SIR/MIR mode. Figure 4. Bandwidth selection timing at FIR mode.

Setting the transceiver to SIR/MIR Mode (9.6 kbit/s to

1.152 Mbit/s)

1. Set SD/Mode input to logic HIGH

2. TXD input should remain at logic LOW

3. After waiting for tS ≥ 25 ns, set SD/Mode to logic LOW,

the HIGH to LOW negative edge transition will deter­mine the receiver bandwidth

4. Ensure that TXD input remains low for tH ≥ 100 ns, the

receiver is now in SIR/MIR mode

5. SD input pulse width for mode selection should be >

50 ns.

Setting the transceiver to FIR (4.0 Mbit/s) Mode

1. Set SD/Mode input to logic HIGH

2. After SD/Mode input remains HIGH at > 25 ns, set TXD
input to logic HIGH, wait tS ≥ 25 ns (from 50% of TXD
rising edge till 50% of SD falling edge)

3. Then set SD/Mode to logic LOW, the HIGH to LOW
negative edge transition will determine the receiver
bandwidth

4. After waiting for tH ≥ 100 ns, set the TXD input to logic
LOW

5. SD input pulse width mode selection should be >
50 ns.

Transceiver I/O Truth Table

Inputs Outputs

TXD Light Input to Receiver SD LED RXD Note

High Don’t Care Low On Not Valid

Low High Low O Low 12,13

Low Low Low O High

Don’t Care Don’t Care High O High

Notes:

12. In-band IrDA signals and data rates ≤ 4.0 Mbit/s

13. RXD logic low is a pulsed response. The condition is maintained for a duration dependent on pattern and

strength of the incident intensity.

CAUTIONS: The BiCMOS inherent to the design of this component increases the component’s susceptibility to
damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken in handling and
assembly of this component to prevent damage and/or degradation which may be induced by ESD.

3

Absolute Maximum Ratings

For implementations where case to ambient thermal resistance is ≤50°C/W.

Parameter Symbol Min. Max. Units Conditions

Storage Temperature T

-40 +100 °C

S

Operating Temperature TA -25 +70 °C

LED Anode Voltage V

0 6.5 V

LEDA

Supply Voltage VCC 0 6.5 V

Input Voltage: TXD, SD/Mode VI 0 6.5 V

Output Voltage: RXD VO 0 6.5 V

DC LED Transmit Current I

Average Transmit Current I

(DC) 50 mA

LED

(PK) 200 mA ≤ 90µs pulse width

LED

≤25% duty cycle

Recommended Operating Conditions

Parameter Symbol Min. Typ. Max. Units Conditions

Supply Voltage VCC 2.7 3.6 V

Input/Output Voltage IOVcc 1.8 Vcc V

Logic Input Voltage Logic High VIH IOVcc – 0.5 IOVcc V
for TXD, SD/Mode

Logic High E

Receiver Input Irradiance 0.020 mW/cm2 1.152 Mbit/s < in-band signals
≤ 4.0 Mbit/s

≤ 4.0 Mbit/s

Logic Low EIL 0.3 µW/cm2 For in-band signals

LED (Logic High) Current I
Pulse Amplitude

Receiver Data Rate 0.0096 4.0 Mbit/s

Note :

14. An in-band optical signal is a pulse/sequence where the peak wavelength, λp, is dened as 850 ≤ λp ≤ 900 nm, and the pulse characteristics
are compliant with the IrDA Serial Infrared Physical Layer Link Specication v1.4.

Logic Low VIL 0 0.4 V

IH, min

0.0081 mW/cm

2

≤ 1.152 Mbit/s

E

500 mW/cm

IH, max

150 mA

LEDA

2

9.6kbit/s ≤ in-band signals

[14]

[14]

9.6 kbit/s ≤ in-band signals

[14]

[14]

4

Electrical and Optical Specications

Specications (Min. and Max. values) hold over the recommended operating conditions unless otherwise noted.
Unspecied test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25°C, Vcc set to

3.0V and IOVcc set to 1.8V unless otherwise noted.

Parameter Symbol Min. Typ. Max. Units Conditions

Receiver

Viewing Angle 2θ 30 °

Peak Sensitivity Wavelength λp 880 nm

TXD

2

≥ VIH,

RXD Output Voltage Logic High VOH IOVCC – 0.2 IOVCC V I

Logic Low VOL 0 0.4 V I

RXD Pulse Width (SIR)

RXD Pulse Width (MIR)

RXD Pulse Width (FIR)

[15]

tPW (SIR) 1 4.0 µs θ ≤ 15°, CL = 9 pF

[16]

tPW(MIR) 100 500 ns θ ≤ 15°, CL = 9 pF

[16]

tPW(FIR) 80 175 ns θ ≤ 15°, CL = 9 pF

= -200 µA, EI ≤ 0.3 µW/cm

OH

= 200 µA, EI ≥ 8.1 µW/cm2

OL

RXD Rise and Fall Times tr, tf 60 ns CL = 9 pF

Receiver Latency Time

Receiver Wake Up Time

[17]

[18]

tW 50 100 µs

tL 25 50 µs

Transmitter

Radiant Intensity IEH 10 45 mW/sr I
V

= 150 mA, θ ≤ 15°, V

LEDA

≤ VIL, Ta=25°C

SD

Viewing Angle 2θ 30 60 °

Peak Wavelength λp 875 nm

Spectral Line Half Width ∆λ 35 nm

TXD Input Current High IH 10 µA V

Low IL 10 µA 0 ≤ V

LED ON Current I

150 mA V

LEDA

≥ VIH

TXD

≤ VIL

TXD

≥ VIH, R1=5.6ohm, Vled=3.0V

TXD

TXD Pulse Width (SIR) tPW (SIR) 1.5 1.6 1.8 µs tPW (TXD) = 1.6 µs at 115.2 kbit/s

TXD Pulse Width (MIR) tPW(MIR) 148 217 260 ns tPW (TXD) = 217 ns at 1.152 Mbit/s

TXD Pulse Width (FIR) tPW(FIR) 115 125 135 ns tPW(TXD)=125 ns at 4.0 Mbit/s

Maximum Optical PW

t

50 100 µs

PW(max.)

[19]

TXD Rise and fall Time (Optical) tr, tf 600 ns tPW(TXD) = 1.4 µs at 115.2 kbit/s

40 ns tPW (TXD) = 125 ns at 4.0 Mbit/s

LED Anode On-State Voltage V

1.6 2.1 V I

ON(LEDA)

=150 mA, V

LEDA

TXD≥VIH

Transceiver

Supply Current Shutdown I

Idle I

Notes:

15. For in-band signals from 9.6 kbit/s to 115.2 kbit/s, where 9 µW/cm2 ≤ EI ≤ 500 mW/cm2.

16. For in-band signals from 0.576 Mbit/s to 4.0 Mbit/s, where 22.5 µW/cm2 ≤ EI ≤ 500 mW/cm2.

17. Latency time is dened as the time from the last TxD light output pulse until the receiver has recovered full sensitivity.

18. Receiver wake up time is measured from Vcc power on or SD pin high to low transition to a valid RXD output.

19. The maximum optical PW is the maximum time the LED remains on when the TXD is constantly high. This is to prevent long turn on time of

the LED for eye safety protection.

0.1 1 µA VSD ≥ V

CC1

1.8 3.0 mA VSD ≤ VIL, V

CC2

Ta= 25°C

IH,

≤ VIL, EI=0

TXD

5

Figure 5. RxD output waveform.

t

f

V

OH

90%

50%

10%

V

OL

t

pw

t

r

t

f

LED OFF

90%

50%

10%

LED ON

t

pw

t

r

t

pw (MAX.)

TXD

LED

RX
LIGHT

t

RW

RXD

SD

Figure 9. Radiant Intensity vs I

LEDA

.

I

LEDA

(A)

RADIANT INTENSITY (mW/sr)

0.10 0.200.15 0.30 0.350.25

120

100

80

60

40

20

0

Figure 10. V

LEDA

vs I

LEDA

.

I

LEDA

(A)

V

LEDA

(V)

0.10 0.200.15 0.30 0.350.25

2.4

2.2

2.0

1.8

1.6

1.4

Figure 6. LED optical waveform.

Figure 7. TxD “Stuck On” protection waveform.

6

Figure 8. Receiver wakeup time waveform.