LINEAR TECHNOLOGY LTC3423, LTC3424 Technical data

FEATURES
LTC3423/LTC3424
Low Output Voltage,
3MHz Micropower Synchronous
Boost Converters
U
DESCRIPTIO
1.5V to 5.5V Adjustable Output Voltage
Synchronous Rectification: Up to 95% Efficiency
1A Switch Current (LTC3423) or 2A Switch Current (LTC3424)
Fixed Frequency Operation Up to 3MHz
Wide Input Range: 0.5V to 5.5V (Operating)
Very Low Quiescent Current: 38µA (Burst Mode
®
Operation)
No External Schottky Diode Required
Synchronizable Switching Frequency
Burst Mode Enable Control
OPTI-LOOP® Compensation
Very Low Shutdown Current: <1µA
Small 10-Pin MSOP Package
U
APPLICATIO S
Pagers
Handheld Instruments
Cordless Phones
Wireless Handsets
GPS Receivers
Battery Backup
, LTC and LT are registered trademarks of Linear Technology Corporation.
Burst Mode and OPTI-LOOP are registered trademarks of Linear Technology Corporation.
The LTC®3423 and LTC3424 are high efficiency, fixed frequency, step-up DC/DC converters that can regulate output voltages as low as 1.5V from a single cell. An applied voltage of at least 2.7V to the VDD pin is required to power the internal control circuitry.
The devices include a 0.16 N-channel MOSFET switch and a 0.21 P-channel synchronous rectifier. The LTC3423 is intended for applications requiring less than 0.75W of output power and the LTC3424 for 1.5W or less. Switching frequencies up to 3MHz are programmed with an external timing resistor and the oscillator can be synchronized to an external clock.
Quiescent current is only 38µA in Burst Mode operation, maximizing battery life in portable applications. Burst Mode operation is user controlled and can be enabled by driving the MODE/SYNC pin high. If the MODE/SYNC pin has either a clock or is driven low then the operation is at constant fixed frequency.
Other features include a 1µA shutdown, thermal shutdown and current limit. The LTC3423 and LTC3424 are available in the 10-lead MSOP package. For applications requiring an output voltage greater than 2.6V, the LTC3401 and LTC3402 are recommended without the need of a separate voltage for the VDD pin.
TYPICAL APPLICATIO
1-Cell to 1.8V at 600mA Step-Up Converter
V
2.2µF
DD
C1
VDD = 2.7V TO 5.5V
= 0.9V TO 1.5V
V
IN
+
1 CELL
C2
10µF
0 = FIXED FREQ
1 = Burst Mode OPERATION
L1
2.2µH
LTC3424
6
V
10
SHDN
3
V
2
MODE/SYNC
1
R
R
t
30.1k
SW
DD
V
OUT
IN
t
FB
V
C
GND
C1: TAIYO YUDEN JMK212BJ225MG C2: TAIYO YUDEN JMK212BJ106MM C3: TAIYO YUDEN JMK325BJ226MM L1: SUMIDA CD43-2R2M
4
7
8
9
5
U
C4 470pF
RC 82k
C5
4.7pF
R1 110k
R2 249k
V
OUT
1.8V 600mA
C3 44µF (2× 22µF)
3423/24 TA01
100
90
OPERATION
80 70 60 50 40
EFFICIENCY (%)
30 20 10
0
0.1 10 100 10001
Efficiency
VIN = 1.5V
Burst Mode
VDD = 3.3V
= 1.8V
V
OUT
WITH MBRM120T3 SCHOTTKY
OUTPUT CURRENT (mA)
VIN = 1.2V
VIN = 0.9V
3223/24 TA02
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LTC3423/LTC3424
PACKAGE/ORDER I FOR ATIO
UU
W
WWWU
ABSOLUTE AXI U RATI GS
(Note 1)
VIN, V
SW Voltage ................................................. –0.5V to 6V
VC, Rt Voltages ......................... –0.5V to (V
SHDN, FB, MODE Voltages ......................... –0.5V to 6V
Operating Temperature Range (Note 2) .. –40°C to 85°C
Storage Temperature Range ................. –65°C to 125°C
Lead Temperature (Soldering, 10 sec)..................300°C
, VDD Voltages.............................. –0.5V to 6V
OUT
OUT
+ 0.3V)
ORDER PART
TOP VIEW
10
1
R
t
MODE
2
V
3
IN
SW
4
GND
5
MS PACKAGE
10-LEAD PLASTIC MSOP
T
= 125°C
JMAX
= 130°C/W 1 LAYER BOARD
θ
JA
= 100°C/W 4 LAYER BOARD
θ
JA
Consult LTC Marketing for parts specified with wider operating temperature ranges.
SHDN
9
V
C
FB
8
V
7
OUT
V
6
DD
NUMBER
LTC3423EMS LTC3424EMS
MS PART MARKING
LTQM
LTQN
ELECTRICAL CHARACTERISTICS
The denotes specifications that apply over the full operating temperature range, otherwise specifications are at TA = 25°C. VIN = 1.2V, VDD = 3.3V, V
PARAMETER CONDITIONS MIN TYP MAX UNITS
VDD Input Voltage Range 2.7 5.5 V VIN Operating Voltage Range (Note 4) 0.5 5.5 V Output Voltage Adjust Range 1.5 5.5 V Feedback Voltage 1.22 1.25 1.28 V Feedback Input Current VFB = 1.25V 1 50 nA Quiescent Current—Burst Mode Operation VC = 0V, MODE/SYNC = 3.3V (Note 3) 38 65 µA Quiescent Current—SHDN SHDN = 0V, Not Including Switch Leakage 0.1 1 µA Quiescent Current—Active VC = 0V, MODE/SYNC = 0V, Rt = 300k (Note 3) 440 800 µA NMOS Switch Leakage 0.1 5 µA PMOS Switch Leakage 0.1 10 µA NMOS Switch On Resistance 0.16 PMOS Switch On Resistance 0.21 NMOS Current Limit LTC3423 1 1.6 A
Maximum Duty Cycle Rt = 15k 80 85 % Minimum Duty Cycle 0% Frequency Accuracy Rt = 15k 1.6 2 2.4 MHz MODE/SYNC Input High 1.4 V MODE/SYNC Input Low 0.4 V MODE/SYNC Input Current V Error Amp Transconductance I = –5µA to 5µA, VC = V
= 1.8V, unless otherwise noted.
OUT
LTC3424
MODE/SYNC
2 2.8 A
= 5.5V 0.01 1 µA
FB
85 µmhos
2
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LTC3423/LTC3424
ELECTRICAL CHARACTERISTICS
The denotes specifications that apply over the full operating temperature range, otherwise specifications are at TA = 25°C. VIN = 1.2V, V
PARAMETER CONDITIONS MIN TYP MAX UNITS
SHDN Input High V SHDN Input Low 0.4 V SHDN Input Current V
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired.
Note 2: The LTC3423/LTC3424 are guaranteed to meet performance specifications from 0°C to 70°C. Specifications over the –40°C to 85°C operating temperature range are assured by design, characterization and correlation with statistical process controls.
= 3.3V unless otherwise noted.
OUT
= VIN = V
SHDN
= 5.5V 0.01 1 µA
SHDN
OUT
Note 3: Current is measured into V bootstrapped to the V
pin. The outputs are not switching.
DD
1V
since the supply current is
DD
Note 4: Once the output is started, the IC is not dependant upon the V supply.
IN
UW
TYPICAL PERFOR A CE CHARACTERISTICS
Transient Response
Switching Waveform on SW Pin
150mA to 450mA
SW
0.5V/DIV
V
OUT
100mV/DIV
AC COUPLED
SW
1V/DIV
0V
I
= 500mA 100ns/DIV 3423/24 G01
LOAD
V
1.8V
OUT
Burst Mode Operation at 500µA Load
= 1.2V 1ms/DIV 3423/24 G03
V
IN
V
= 1.8V
OUT
= 44µF
C
OUT
MODE/SYNC PIN = HIGH
V
OUT
100mV/DIV
AC COUPLED
450mA
I
OUT
150mA
V
OUT
100mV/DIV
AC COUPLED
SW
1V/DIV
C
= 44µF 200µs/DIV 3423/24 G02
OUT
L = 2.2µH
= 1MHz
f
OSC
Burst Mode Operation at 10mA Load
V
= 1.2V 500µs/DIV 3423/24 G04
IN
V
= 1.8V
OUT
= 44µF
C
OUT
MODE/SYNC PIN = HIGH
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LTC3423/LTC3424
UW
TYPICAL PERFOR A CE CHARACTERISTICS
Converter Efficiency 1.2V to 1.8V
100
90
Burst Mode
80
OPERATION
70 60 50 40
EFFICIENCY (%)
30 20 10
0
0.1 10 100 1000
300MHz
1MHz
WITH MBRM120T3 SCHOTTKY
1 OUTPUT CURRENT (mA)
EA FB Voltage
1.28
1.27
1.26
1.25
VOLTAGE (V)
1.24
1.23
3MHz
3223/24 G05
LTC3424 Current Limit
3.4
3.2
3.0
2.8
2.6
CURRENT (A)
2.4
2.2
2.0 –15 25 105
–55
TEMPERATURE (°C)
Oscillator Frequency Accuracy
2.10 = 15k
R
T
2.05
2.00
FREQUENCY (MHz)
1.95
LTC3423 Current Limit
1.80
1.75
1.70
1.65
1.60
1.55
CURRENT (A)
1.50
1.45
RESISTANCE ()
1.40
0.30
0.25
0.20
0.15
0.10
–15 25 105
–55
TEMPERATURE (°C)
NMOS R
DS(ON)
V
= 1.8V
OUT
= 3.3V
V
DD
65
125
3423/24 G07
65
125
3423/24 G06
1.22 –55
–15 25 105
TEMPERATURE (°C)
0.40
0.35
0.30
0.25
RESISTANCE ()
0.20
0.15
65
3423/24 G08
PMOS R
–55
DS(ON)
V
= 1.8V
OUT
= 3.3V
V
DD
–15 25 105
TEMPERATURE (°C)
125
1.90 –15 25 105
–55
TEMPERATURE (°C)
65
125
3423/24 G09
0.05 –15 25 105
–55
TEMPERATURE (°C)
65
125
3423/24 G10
Efficiency Loss Without Schottky vs Frequency
14
T
= 25°C
A
12
10
8
6
4
EFFICIENCY LOSS (%)
2
65
125
3423/24 G11
0
0.2
0.6 1.0 FREQUENCY (MHz)
1.8 2.6 3.0
1.4 2.2
3423/24 G12
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TYPICAL PERFOR A CE CHARACTERISTICS
LTC3423/LTC3424
Shutdown Threshold
1.10
1.05
1.00
0.95
0.90
0.85
0.80
VOLTAGE (V)
0.75
0.70
0.65
0.60
U
–15 25 105
–55
TEMPERATURE (°C)
UU
65
125
3423/24 G13
PI FU CTIO S
Rt (Pin 1): Timing Resistor to Program the Oscillator Frequency.
10
f
OSC
MODE/SYNC (Pin 2): Burst Mode Select and Oscillator Synchronization.
MODE/SYNC = High. Enable Burst Mode operation. The inductor peak inductor current will be 400mA and return to zero current on each cycle. During Burst Mode operation the operation is variable frequency, providing a significant efficiency improvement at light loads. It is recommended the Burst Mode operation only be en­tered once the part has started up.
MODE/SYNC = Low. Disable Burst Mode operation and maintain low noise, constant frequency operation.
MODE/SYNC = External CLK. Synchronization of the internal oscillator and Burst Mode operation disable. A clock pulse width of 100ns to 2µs is required to synchronize.
VIN (Pin 3): Voltage Sense for Internal Circuitry.
310
=
Hz
R
t
Burst Mode Operation Current
44
42
40
38
36
CURRENT (µA)
34
32
30
–15 25 105
–55
TEMPERATURE (°C)
65
125
3423/24 G14
SW (Pin 4): Switch Pin. Connect inductor and optional Schottky diode here. Minimize trace length to keep EMI down.
GND (Pin 5): Signal and Power Ground for the IC. VDD (Pin 6): Power Source for the IC. Typically derived
from a higher voltage power converter. Requires an input of 2.7V to 5.5V. A 2.2µF ceramic bypass capacitor is recommended as close to the pins as possible.
V
(Pin 7): Output of the Synchronous Rectifier.
OUT
FB (Pin 8): Feedback Pin. Connect resistor divider tap
here. The output voltage can be adjusted from 1.5V to
5.5V. The feedback reference voltage is typically 1.25V. VC (Pin 9): Error Amp Output. A frequency compensation
network is connected to this pin to compensate the loop. See the section “Compensating the Feedback Loop” for guidelines.
SHDN (Pin 10): Shutdown. Grounding this pin shuts down the IC. Tie to >1V to enable (VDD or digital gate output). During shutdown the output voltage will hold up to V
IN
minus a diode drop due to the body diode of the PMOS synchronous switch. If the application requires a com­plete disconnect during shutdown then refer to section “Output Disconnect”.
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LTC3423/LTC3424
W
BLOCK DIAGRA
+
1V TO V
+ 0.3
OUT
OPTIONAL
V
2.7V TO 5.5V
V
IN
3
SHDN SHUTDOWN
10
GND
5
DD
V
6
DD
ANTICROSS CONDITION
CURRENT
LIMIT
PWM
LOGIC
SLEEP
SW
4
N
+
1.6A TYP (LTC3423)
2.8A TYP (LTC3424)
CURRENT
COMP
+
+
I
SENSE
AMP
+–
Σ
10mV
P
V
OUT
7
V
OUT
1.5V TO 5.5V
+
+
I
ZERO
AMP
+
1.25V
ERROR
AMP
FB
8
V
9
R1
C
Burst Mode
CONTROL
R
t
1
OSC
SYNC
SLOPE COMP
MODE/SYNC
2
3423/24 BD
R2
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APPLICATIO S I FOR ATIO
LTC3423/LTC3424
DETAILED DESCRIPTION
The LTC3423/LTC3424 provides high efficiency, low noise power for applications such as portable instrumentation and are ideal for applications that require an output voltage between 1.5V and 2.6V from a single cell. These products are an addition to the LTC3401 and LTC3402 family of synchronous boost converters, with the differences being the omission of the power good function (PGOOD) and the addition of a VDD input to provide internal power. The IC will not start up until the applied voltage on the VDD pin is above 2.7V.
The current mode architecture with adaptive slope compensation provides ease of loop compensation with excellent transient load response. The low R gate charge synchronous switches provides the pulse width modulation control at high efficiency.
Low Noise Fixed Frequency Operation Oscillator. The frequency of operation is set through a
resistor from the Rt pin to ground where f = 3 • 1010/Rt. An internally trimmed timing capacitor resides inside the IC. The oscillator can be synchronized with an external clock inserted on the MODE/SYNC pin. When synchronizing the oscillator, the free running frequency must be set to approximately 30% lower than the desired synchronized frequency. Keeping the sync pulse width below 2µs will ensure that Burst Mode operation is disabled.
DS(ON)
, low
Zero Current Amp. The zero current amplifier monitors the inductor current to the output and shuts off the synchro­nous rectifier once the current is below 50mA, preventing negative inductor current.
Burst Mode Operation
Burst Mode operation is when the IC delivers energy to the output until it is regulated and then goes into a sleep mode where the outputs are off and the IC is consuming only 38µA. In this mode, the output ripple has a variable frequency component with load current and the steady state ripple will be typically below 3%.
During the period where the device is delivering energy to the output, the peak current will be equal to 400mA and the inductor current will terminate at zero current for each cycle. In this mode the maximum output current is given by:
V
I
OUT MAXBURST
()
Burst Mode operation is user controlled by driving the MODE/SYNC pin high to enable and low to disable. It is recommended that Burst Mode operation be entered after the part has started up.
COMPONENT SELECTION
Inductor Selection
IN
Amps
•≈6
V
OUT
Current Sensing. Lossless current sensing converts the peak current signal to a voltage to sum in with the internal slope compensation. This summed signal is compared to the error amplifier output to provide a peak current control command for the PWM. The slope compensation in the IC is adaptive to the input and output voltage. Therefore, the converter provides the proper amount of slope compensa­tion to ensure stability and not an excess causing a loss of phase margin in the converter.
Error Amp. The error amplifier is a transconductance amplifier with gm = 85µmhos. A simple compensation network is placed from the VC pin to ground.
Current Limit. The current limit amplifier will shut the NMOS switch off once the current exceeds its threshold. The current amplifier delay to output is typically 50ns.
The high frequency operation of the LTC3423/LTC3424 allows the use of small surface mount inductors. The minimum inductance value is proportional to the operat­ing frequency and is limited by the following constraints:
VV V
k
L
where
H and L
>
f
k = 3 for LTC3423, 2 for LTC3424 f = Operating Frequency (Hz) Ripple = Allowable Inductor Current Ripple (A) V V
= Minimum Input Voltage (V)
IN(MIN) OUT(MAX)
= Maximum Output Voltage (V)
IN MIN OUT MAX IN MIN
•–
() ( ) ()
()
f Ripple V
••
OUT MAX
()
H
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LTC3423/LTC3424
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APPLICATIO S I FOR ATIO
The inductor current ripple is typically set to 20% to 40% of the maximum inductor current.
For high efficiency, choose an inductor with a high fre­quency core material, such as ferrite, to reduce core losses. The inductor should have low ESR (equivalent series resistance) to reduce the I2R losses and must be able to handle the peak inductor current at full load without saturating. Molded chokes or chip inductors usually do not have enough core to support the peak inductor cur­rents in the 1A to 2A region. To minimize radiated noise, use a toroid, pot core or shielded bobbin inductor. See Table 1 for a list of component suppliers.
Table 1. Inductor Vendor Information
SUPPLIER PHONE FAX WEBSITE
Coilcraft (847) 639-6400 (847) 639-1469 www.coilcraft.com Coiltronics (516) 241-7876 (516) 241-9339 www.coiltronics.com Murata (814) 237-1431 (814) 238-0490 www.murata.com
(800) 831-9172
Sumida
USA: (847) 956-0666 (847) 956-0702 www.japanlink.com
Japan: 81-3-3607-5111 81-3-3607-5144 sumida
where
IL = Average Inductor Current IP = Peak Inductor Current
The ESR is usually the most dominant factor for ripple in most power converters. The ripple due to capacitor ESR is simply given by:
VR
CESR
= IP • R
ESR
Volts
where
R
= Capacitor Series Resistance
ESR
Low ESR capacitors should be used to minimize output voltage ripple. For surface mount applications, AVX TPS series tantalum capacitors and Sanyo POSCAP or Taiyo­Yuden ceramic capacitors are recommended. For through­hole applications Sanyo OS-CON capacitors offer low ESR in a small package size. See Table 2 for a list of component suppliers.
In some layouts it may be required to place a 1µF low ESR capacitor as close to the V
and GND pins as possible.
OUT
SHDN
R
t
MODE V SW GND
V
OUT
Figure 1. Recommended Component Placement. Traces Carrying High Current Are Direct. Trace Area FB and VC Pins Are Kept Low. Lead Length to Battery Should be Kept Short
V
C
FB
IN
V
OUT
V
DD
VDD IN
2.7V TO 5.5V
3423/24 F01
Output Capacitor Selection
The output voltage ripple has several components. The bulk value of the capacitor is set to reduce the ripple due to charge into the capacitor each cycle. The max ripple due to charge is given by:
IVV V
•( –)
VR
BULK
L IN OUT IN
=
CVVf
•••
OUT OUT OUT
Volts
Table 2. Capacitor Vendor Information
SUPPLIER PHONE FAX WEBSITE
AVX (803) 448-9411 (803) 448-1943 www.avxcorp.com Sanyo (619) 661-6322 (619) 661-1055 www.sanyovideo.com Taiyo Yuden (408) 573-4150 (408) 573-4159 www.t-yuden.com
Input Capacitor Selection
The input filter capacitor reduces peak currents drawn from the input source and reduces input switching noise. In most applications a 3.3µF is sufficient.
Output Diode
The Schottky diode across the synchronous PMOS switch is not required, but provides a lower drop during the break­before-make time (typically 20ns) of the NMOS to PMOS transition. The addition of the Schottky diode will improve peak efficiency (see graph “Efficiency Loss Without Schottky vs Frequency”). Use of a Schottky diode such as a MBRM120T3, 1N5817 or equivalent. Since slow recov­ery times will compromise efficiency, do not use ordinary rectifier diodes.
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APPLICATIO S I FOR ATIO
LTC3423/LTC3424
Operating Frequency Selection
There are several considerations in selecting the operat­ing frequency of the converter. The first is determining the sensitive frequency bands that cannot tolerate any spec­tral noise. For example, in products incorporating RF communications, the 455kHz IF frequency is sensitive to any noise, therefore switching above 600kHz is desired. Some communications have sensitivity to 1.1MHz. In this case, converter frequencies up to 3MHz may be em­ployed.
The second consideration is the physical size of the converter. As the operating frequency goes up, the induc­tor and filter caps go down in value and size. The trade off is in efficiency since the switching losses due to gate charge are going up proportional with frequency.
Another operating frequency consideration is whether the application can allow “pulse skipping.” In this mode, the minimum on time of the converter cannot support the duty cycle, so the converter ripple will go up and there will be a low frequency component of the output ripple. In many applications where physical size is the main criterion then running the converter in this mode is acceptable. In applications where it is preferred not to enter this mode, then the maximum operating frequency is given by:
130mA/100mV, and the LTC3424 is typically 170mA/ 100mV, so the amount of signal injected is proportional to the anticipated change of inductor current with load. The outer voltage loop performs the remainder of the correc­tion, but because of the load feed forward signal, the range over which it must slew is greatly reduced. This results in an improved transient response. A logic level feed forward signal, VFF, is coupled through components C5 and R6. The amount of feed forward signal is attenuated with resistor R6 and is given by the following relationship:
R
6
where I
V
IN
V
DD
IN
VRV
515
•• •.
FF IN
VI
OUT
•–∆
OUT OUT
= load current change.
LTC3423/LTC3424
6
V
DD
10
SHDN
3
V
IN
2
MODE/SYNC
1
R
t
V
GND
SW
OUT
R
5
V
OUT
4
7
8
FB
9
V
C
5
C3
VV
f
MAX NOSKIP
where t
ON(MIN)
= minimum on time = 140ns
OUT IN
=
Vt
OUT ON MIN_()
Hz
Reducing Output Capacitance with a Load Feed Forward Signal
In many applications the output filter capacitance can be reduced for the desired transient response by having the device commanding the change in load current, (i.e. system microcontroller), inform the power converter of the changes as they occur. Specifically, a “load feed forward” signal coupled into the VC pin gives the inner current loop a head start in providing the change in output current. The transconductance of the LTC3423 converter at the VC pin with respect to the inductor current is typically
R5
C5
LOAD FEED
FORWARD
SIGNAL
V
FF
Figure 2
3.3nF
R6
3423/24 F02
Closing the Feedback Loop
The LTC3423/LTC3424 uses current mode control with internal adaptive slope compensation. Current mode con­trol eliminates the 2nd order filter due to the inductor and output capacitor exhibited in voltage mode controllers, and simplifies it to a single-pole filter response. The product of the modulator control to output DC gain plus the error amp open-loop gain equals the DC gain of the system.
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LTC3423/LTC3424
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APPLICATIO S I FOR ATIO
GDC = G
G
CONTROL
CONTROLOUTPUT
2•
=
I
OUT
• G
V
IN
, GEA 2000
EA
The output filter pole is given by:
I
f
FILTERPOLE
where C
=
is the output filter capacitor.
OUT
OUT
VC
π••
OUT OUT
Hz
The output filter zero is given by:
f
FILTERZERO
where R
=
2• • π
is the capacitor equivalent series resistance.
ESR
1
RC
ESR OUT
Hz
A troublesome feature of the boost regulator topology is the right half plane zero (RHP) and is given by:
2
VR
=
2••••π
IN O
LV
Hz
2
O
f
RHPZ
At heavy loads this gain increase with phase lag can occur at a relatively low frequency. The loop gain is typically rolled off before the RHP zero frequency.
The typical error amp compensation is shown in Figure 3. The equations for the loop dynamics are as follows:
f
POLE
1
22010
•• • •
1
π
6
Hz
C
C
1
whichisextremelyclosetoDC
f
ZERO
f
POLE
=
1
2
2
1
RC
•• •
π
ZC
1
RC
•• •
π
2
ZC
Hz
1
Hz
2
Refer to Application Note AN76 for more closed loop examples.
V
OUT
R1
R2
C
C2
3423/24 F03
ERROR
AMP
+
1.25V
FB
8
V
C
9
Figure 3
C
C1
R
Z
TYPICAL APPLICATIO
1 = Burst Mode OPERATION
10
U
Typical Application with Output Disconnect
VIN = 0.9V TO 1.5V
LTC3423/LTC3424
3
V
IN
10
SHDN
2
MODE/SYNC
6
V
DD
V
DD
1
R
t
* SET RB TO FORCE BETA OF 100; RB =
0 = FIXED FREQ
V
GND
SW
OUT
ZETEX
FMMT717
4
7
8
FB
9
V
C
5
– V
INMIN
I
OUTMAX
– 0.7V) • 100
(V
OUT
RB*
3423/24 TA03
V
C5 1µF
OUT
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TYPICAL APPLICATIO
V
DD
IN
C1
2.2µF
U
Single Cell to 1.8V at 300mA, 1.8mm High
VDD = 2.7V TO 5.5V
= 0.9V TO 1.5V
V
IN
+
1 CELL
C2
4.7µF
6
V
10
SHDN
3
V
2
MODE/SYNC
1
R
R
t
30.1k
DD
IN
t
f
OSC
L1
4.7µH
LTC3423
= 1MHz
V
GND
SW
OUT
4
7
8
FB
9
V
C
5
LTC3423/LTC3424
D1
C4 470pF
C5
R 82k
4.7pF
C
R1 110k
R2 249k
V
OUT
1.8V 300mA
C3 22µF
PACKAGE DESCRIPTIO
5.23
(.206)
MIN
3.05 ± 0.38
(.0120 ± .0015)
TYP
RECOMMENDED SOLDER PAD LAYOUT
GAUGE PLANE
0.18
(.007)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0 = FIXED FREQ
1 = Burst Mode OPERATION
U
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661)
0.889
(.035 ± .005)
3.2 – 3.45
(.126 – .136)
(.0197)
DETAIL “A”
0.254 (.010)
° – 6° TYP
0
DETAIL “A”
MS Package
± 0.127
0.50
BSC
0.53 ± 0.01
(.021 ± .006)
C1: TAIYO YUDEN JMK212BJ225MG C2: TAIYO YUDEN JMK212BJ475MM C3: TAIYO YUDEN JMK325BJ226MM D1: ON SEMICONDUCTOR MBRM120T3 L1: SUMIDA CDRH3D16-4R7M
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
4.88 ± 0.10
(.192 ± .004)
12
1.10
(.043)
MAX
SEATING
PLANE
0.17 – 0.27
(.007 – .011)
0.50
(.0197)
TYP
3423/24 TA04
0.497 ± 0.076
7
6
45
(.0196 ± .003)
REF
3.00 ± 0.102
(.118 ± .004)
NOTE 4
0.86
(.034)
REF
0.13 ± 0.05
(.005 ± .002)
MSOP (MS) 1001
34234f
8910
3
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen­tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
11
LTC3423/LTC3424
TYPICAL APPLICATIO
U
Triple Output Converter
V
DD
IN
2.2µF
C1
VDD = 2.7V TO 5.5V
= 0.9V TO 1.5V
V
IN
+
1 CELL
C2
10µF
0 = FIXED FREQ
1 = Burst Mode OPERATION
6
V
DD
10
SHDN
3
V
IN
2
MODE/SYNC
1
R
t
R
t
30.1k
D2 D3
0.1µF 0.1µF 0.1µF
L1
2.2µH
LTC3423
= 1MHz
f
OSC
4
SW
7
V
OUT
8
FB
9
V
C
5
GND
C1: TAIYO YUDEN JMK212BJ225MG C2: TAIYO YUDEN JMK212BJ106MM C3: TAIYO YUDEN JMK325BJ226MM D1: ON SEMICONDUCTOR MBRM120T3 D2 TO D7: ZETEX FMND7000 DUAL DIODE L1: SUMIDA CD43-2R2M
D1
RC 82k
D4 D5
C4 470pF
C5
4.7pF
R1 110k
R2 249k
4.7µF
0.1µF
V
OUT
1.8V 700mA
C3 44µF (2× 22µF)
3423/24 TA05
3.6V 2mA
D6
4.7µF
D7
–1.1V 1mA
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ThinSOT is a trademark of Linear Technology Corporation.
Linear Technology Corporation
12
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
www.linear.com
TM
VIN As Low As 1.1V, 3V at 30mA from Single Cell
5V
OUT
LT/TP 0302 2K • PRINTED IN USA
LINEAR TECHNOLOGY CORP ORATION 2001
34234f
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