Datasheet LTC3252 Datasheet (LINEAR TECHNOLOGY)

Page 1
查询LTC3252供应商
FEATURES
LTC3252
Dual, Low Noise,
Inductorless Step-Down
DC/DC Converter
U
DESCRIPTIO
■
2.7V to 5.5V Input Voltage Range
■
No Inductors
■
Typical Efficiency 50% Higher than LDOs
■
Spread Spectrum Operation
■
Low Input and Output Noise
■
Shutdown Disconnects Load from V
■
Dual Adjustable Independent Outputs
IN
(Range: 0.9V to 1.6V)
■
Output Current: 250mA Each Output
■
Low Operating Current: IIN = 60µA Typ (35µA with One Output Enabled)
■
Low Shutdown Current: IIN = 0.01µA Typ
■
Soft-Start Limits Inrush Current at Turn On
■
Short Circuit and Over Temperature Protected
■
Available in 4mm × 3mm 12-Pin DFN Package
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APPLICATIO S
■
Handheld Electronic Devices
■
Cellular Phones
■
Low Voltage Logic Supplies
■
DSP Power Supplies
■
3.3V to 1.5V Conversion
The LTC®3252 is a switched capacitor step-down DC/DC converter that produces two adjustable regulated outputs from a single 2.7V to 5.5V input. The part uses switched capacitor fractional conversion to achieve a typical effi­ciency increase of 50% over that of a linear regulator. No inductors are required.
A unique constant frequency, spread spectrum architec­ture provides a very low noise regulated output as well as low noise at the input. The part also has Burst Mode
®
operation to provide high efficiency at low output currents, as well as ultralow current shutdown.
Low operating currents (60µA with both outputs enabled, 35µA with one output enabled) and low external parts count make the LTC3252 ideally suited for space-con­strained battery-powered applications. The part is short­circuit and overtemperature protected and is available in a tiny 4mm × 3mm 12-pin DFN package.
, LTC and LT are registered trademarks of Linear Technology Corporation.
Burst Mode is a registered trademark of Linear Technology Corporation.
TYPICAL APPLICATIO
1.5V and 1.2V Output Voltages with Shutdown
2
1µF
1µF
EN1
11
EN2
3
V
IN
4
+
C1
6
–
C1
10
+
C2
8
–
C2
7
GND
1-CELL
Li-ION
OR 3-CELL
NiMH
OFF ON OFF ON
4.7µF
U
LTC3252
OUT1
FB1
OUT2
FB2
1.5V/1.2V Efficiency vs Input Voltage
5
470k
1
510k
9
261k
12
510k
V I
OUT
4.7µF
V I
OUT
4.7µF
= 1.5V
OUT
≤ 250mA
= 1.2V
OUT
≤ 250mA
3252 TA01
100
90 80 70 60
LTC3252-1.2V 50 40
EFFICIENCY (%)
30 20 10
0
3.1 3.5 3.9 4.3 4.7 5.1 5.5
2.7
I
(1.5V) = 100mA
OUT
(1.2V) = 100mA
I
OUT
LTC3252-1.5V
LDO-1.5V
LDO-1.2V
VIN (V)
3252 TA01a
3252f
1
Page 2
LTC3252
FB2 EN2 C2
+
OUT2 C2
–
GND
FB1
EN1
V
IN
C1
+
OUT1
C1
–
TOP VIEW
DE PACKAGE
12-LEAD (4mm × 3mm) PLASTIC DFN
12 11 10
9 8 7
1 2 3 4 5 6
WW
W
ABSOLUTE AXI U RATI GS
U
PACKAGE/ORDER I FOR ATIO
(Notes 1, 6)
VIN to GND................................................–0.3V to 6.0V
EN1, EN2, FB1, FB2 to GND .......... –0.3V to (VIN + 0.3V)
I
, I
OUT1
(Note 3)........................................... 400mA
OUT2
Operating Ambient Temperature Range
(Note 2) .................................................. – 40°C to 85°C
Storage Temperature Range ................. –65°C to 125°C
Lead Temperature (Soldering, 10 sec).................. 300°C
T
JMAX
Consult LTC Marketing for parts specified with wider operating temperature ranges.
ELECTRICAL CHARACTERISTICS
temperature range, otherwise specifications are at TA = 25°C. VIN = 3.6V, V
4.7µF (all capacitors ceramic) unless otherwise noted.
The ● denotes the specifications which apply over the full operating
EXPOSED PAD IS GROUND
(MUST BE SOLDERED TO PCB)
= 125°C, θJA = 40°C/W, θJC = 4.3°C/W
OUT1
= V
= 1.5V, C1 = C2 = 1µF, Cin = C
OUT2
UUW
ORDER PART
NUMBER
LTC3252EDE
DE PART
MARKING
3252
OUT1
= C
OUT2
=
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
V
IN
Min Operating Voltage (Note 4) ● 2.7 V Max Operating Voltage ● 5.5 V
I
VIN
Operating Current, I Both Outputs Enabled 2.7V ≤ V
Operating Current, I One Output Enabled V
Shutdown Current VM0 = 0V, VM1 = 0V, 2.7V ≤ VIN ≤ 5.5V ● 0.01 1 µA
V
FB1
I
OUT1
I
OUT2
I
FB
V
RIPPLE
, V
Feedback Voltage I
FB2
Output Current V Output Current V FB1, FB2 Input Current V Output Ripple (OUT1 or OUT2) I Spread Spectrum Frequency Range f
V
IH
V
IL
I
IH
I
IL
t
ON
OUT1, OUT2 Load Regulation (Referred to FB pin) 0.08 mV/mA
R
OL
2
EN1, EN2 Input High Voltage 2.7V ≤ VIN ≤ 5.5V ● 1.2 0.8 V EN1, EN2 Input Low Voltage 2.7V ≤ VIN ≤ 5.5V ● 0.8 0.4 V EN1, EN2 Input High Current EN1 = VIN, EN2 = V EN1, EN2 Input Low Current EN1 = 0V, EN2 = 0V ● –1 1 µA Turn On Time R
Line Regulation 0 ≤ I Open Loop Output Impedance, VIN = 3.0V, I
(OUT1 or OUT2)
= 0mA, V
OUT
= 0mA, V
OUT
= 0, 2.7V ≤ V
EN2
= 0mA, 2.7V ≤ V
OUT
= V
EN1
= V
EN2
= V
FB1
FB2
= 250mA 10 mV
OUT
Switching Frequency ● 0.8 1.0 MHz
MIN
Switching Frequency ● 1.6 2.0 MHz
f
MAX
= 3Ω 0.8 ms
OUT
OUT1
IN
IN
IN
EN1
≤ 5.5V
EN1
= VIN, V
= 0, V
IN
= VIN, ● 60 100 µA
EN2
= VIN or V
EN2
= VIN, ● 35 60 µA
EN1
≤ 5.5V
≤ 5.5V ● 0.78 0.8 0.82 V
IN
● 250 mA
● 250 mA
= 0.85V ● –50 50 nA
IN
≤ 250mA or 0 ≤ I
= 200mA, VFB = 0.74V (Note 5) ● 1 1.4 Ω
OUT
≤ 250mA 0.2 %/V
OUT2
● –1 1 µA
P-P
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ELECTRICAL CHARACTERISTICS
LTC3252
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired.
Note 2: The LTC3252EDE is guaranteed to meet specified performance from 0°C to 70°C. Specifications over the –40°C and 85°C operating temperature range are assured by design characterization and correlation with statistical process control.
Note 3: Based on long-term current density limitations.
Note 4: Minimum operating voltage required for regulation is:
> 2 • (V
V
IN
Note 5: Output not in regulation; R Note 6: This IC includes overtemperature protection that is intended to
protect the device during momentary overload conditions. Junction temperature will exceed 125°C when overtemperature protection is active. Continuous operation above the specified maximum operating junction temperature may impair device reliability.
UW
TYPICAL PERFOR A CE CHARACTERISTICS
No Load Supply Current vs Supply Voltage (One Output Enabled)
60
50
40
30
(µA)
IN
I
20
10
0
2.7
85°C
–45°C
3.7 4.2 4.7
3.2
25°C
VIN (V)
5.2
3252 G01
No Load Supply Current vs Supply Voltage (Both Outputs Enabled)
100
90 80 70 60
(µA)
50
CC
I
40 30 20 10
0
2.7
85°C
–40°C
3.7 4.2 4.7
3.2
25°C
VIN (V)
OUT(MIN)
5.2
3252 G02
+ ROL • I
0.82
0.81
0.80
(V)
0.79
FB
V
0.78
0.77
0.76
)
OUT
= (VIN/2 – V
OL
OUT
)/I
OUT
.
FB Voltage vs Load Current
VIN = 3.6V
25°C
–40°C
85°C
50 100 150 200 250
0
I
(mA)
OUT
3252 G03
EN1/EN2 Input Threshold Voltage vs Supply Voltage
1.2
1.1
25°C
VIN (V)
(V)
SHDN
V
1.0
0.9
0.8
0.7
0.6
0.5
0.4
2.7
–40°C
85°C
3.7 4.2 4.7
3.2
5.2
3252 G04
1.5V Output Voltage vs Supply Voltage
1.60 TA = 25°C
1.58
1.56
1.54
I
(V)
OUT
V
1.52
1.50
1.48
1.46
1.44
1.42
1.40
3
= 0mA
OUT
I
= 250mA
OUT
3.5 4 4.5 5 5.5 VIN (V)
I
OUT
= 50mA
3252 G05
1.5V Output Efficiency vs Output Current
100
= 25°C
T
A
80
60
I
OUT
VIN = 3.1V V V V V
(mA)
= 3.3V
IN
= 3.6V
IN
= 4V
IN
= 5V
IN
40
EFFICIENCY (%)
20
0
0.1
1 10 100 1000
3252 G06
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LTC3252
UW
TYPICAL PERFOR A CE CHARACTERISTICS
Oscillator Max/Min Frequency vs Supply Voltage
2.0
1.9
1.8
1.7
1.6
1.5
1.4
1.3
1.2
FREQUENCY (MHz)
1.1
1.0
0.9
0.8
2.7
–40°C MAX
3.2
–40°C MIN
25°C MAX
85°C MAX
25°C MIN
85°C MIN
3.7 4.2 4.7 VIN (V)
Output Current Transient Response
250mA
I
OUT
20mA
V
OUT
20mV/DIV
AC
5.2
3252 G07
1.2V Output Voltage vs Supply Voltage 1.2V Efficiency vs Load Current
100
TA = 25°C
80
60
40
EFFICIENCY (%)
20
0
0.1
VIN = 2.8V V V V
1 10 100 1000
I
(mA)
OUT
(V)
OUT
V
1.30
1.28
1.26
1.24
1.22
1.20
1.18
1.16
1.14
1.12
1.10
2.7
TA = 25°C
3.2
I
= 0mA
OUT
I
= 50mA
OUT
I
= 250mA
OUT
3.7 4.2 4.7 VIN (V)
5.2
3252 G08
Line Transient Response
4.5V
V
IN
3.5V
V
OUT
10mV/DIV
AC
= 3.1V
IN
= 3.5V
IN
= 4.5V
IN
3252 G09
VIN = 3.6V V
= 1.5V
OUT
3252 G11
UUU
PI FU CTIO S
FB1 (Pin 1): Feedback Input Pin 1. An output divider should be connected from OUT1 to FB1 to program the output voltage.
EN1 (Pin 2): Input Enable Pin 1. When EN1 is high, OUT1 is enabled. When EN1 is low OUT1 is shut down.
VIN (Pin 3): Input Supply Voltage. Operating VIN may be between 2.7V and 5.5V. Bypass VIN with a ≥ 4.7µF (1µF min) low ESR ceramic capacitor to GND (CIN).
V I
OUT
OUT
= 1.5V
= 150mA
3252 G12
C1+ (Pin 4): Flying Capacitor 1 Positive Terminal (C1). OUT1 (Pin 5): Regulated Output Voltage 1. OUT1 is
disconnected from VIN when in shutdown. Bypass OUT1 with a low ESR ceramic capacitor to GND (CO1). See Output Capacitor Selection section for size requirements.
C1– (Pin 6): Flying Capacitor 1 Negative Terminal (C1). GND (Pin 7): Ground. Connect to a ground plane for best
performance.
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Page 5
UUU
PI FU CTIO S
LTC3252
C2– (Pin 8): Flying Capacitor 2 Negative Terminal (C2). OUT2 (Pin 9): Regulated Output Voltage 2. OUT2 is
disconnected from VIN when in shutdown. Bypass OUT2 with a low ESR ceramic capacitor to GND (CO2). See Output Capacitor Selection section for size requirements.
C2+ (Pin 10): Flying Capacitor 2 Positive Terminal (C2).
WW
SI PLIFIED
BLOCK DIGRAM
OVERTEMPERATURE
3V
IN
EN1
2
SWITCH
CONTROL
EN2 (Pin 11): Input Enable Pin 2. When EN2 is high, OUT2 is enabled. When EN2 is low OUT2 is shut down.
FB2 (Pin 12): Feedback Input Pin 2. An output divider should be connected from OUT2 to FB2 to program the output voltage.
EN2
11
SPREAD SPECTRUM
OSCILLATOR
CHARGE
PUMP 1
+
4
C1
BURST
DETECT
CIRCUIT
5
OUT1
–
6
C1
–
+
CHARGE
PUMP 2
–
1 FB1
C2
10
9
OUT2
8
C2
12 FB2
+
–
+
7
GND
3252 SBD
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LTC3252
OPERATIO
U
(Refer to Simplified Block Diagram)
The LTC3252 has two switched capacitor charge pumps to step down VIN to two regulated output voltages. The two charge pumps operate 180° out of phase to reduce input ripple. Regulation is achieved by sensing each output voltage through an external resistor divider and modulat­ing the charge pump output current based on the error signal. A 2-phase nonoverlapping clock activates the two charge pumps running them out of phase from each other. On the first phase of the clock current is transferred from VIN, through the external flying capacitor 1, to OUT1 via the switches of charge pump 1. Not only is current being delivered to OUT1 on the first phase, but the flying capaci­tor is also being charged up. On the second phase of the clock, flying capacitor 1 is connected from OUT1 to ground, transferring the charge stored during the first phase of the clock to OUT1 via the switches of charge pump 1. Charge pump 2 operates in the same manner to supply current to OUT2, but with the phases of the clock reversed relative to charge pump 1. Using this method of switching, only half of the output current for each output is delivered from VIN, thus achieving a 50% increase in efficiency over a conventional LDO. A spread spectrum oscillator, which utilizes random switching frequencies between 1MHz and 1.6MHz, sets the rate of charging and discharging of the flying capacitors. This architecture achieves extremely low output noise. Input noise is signifi­cantly reduced compared to conventional charge pumps. The outputs also have a low current burst mode to improve efficiency even at light loads.
In shutdown mode all circuitry is turned off and the LTC3252 draws only leakage current from the VIN supply. Furthermore, OUT1 and OUT2 are disconnected from VIN. The EN1 and EN2 pins are CMOS inputs with threshold voltages of approximately 0.8V to allow regulator control with low voltage logic levels. The LTC3252 is in shutdown when a logic low is applied to both enable pins. Since the mode pins are high impedance CMOS inputs, they should never be allowed to float. Always drive the enable pins with valid logic levels.
Short-Circuit/Thermal Protection
The LTC3252 has built-in short-circuit current limiting as well as over temperature protection. During short-circuit conditions, internal circuitry automatically limits each output to approximately 500mA of current. If fault condi­tions (such as shorted outputs) cause excessive self heating on chip such that the junction temperature ex­ceeds approximately 160°C, the thermal shutdown cir­cuitry will disable the charge pumps. The IC resumes operation once the junction temperature drops back to approximately 155°C. The LTC3252 will cycle in and out of thermal shutdown without latchup or damage until the overstress condition is removed. Long term overstress (I
or I
OUT1
avoided as it can degrade the performance or shorten the life of the part.
Soft-Start
To prevent excessive current flow at VIN during start-up, the LTC3252 has built-in soft-start circuitry on each out­put. When an output is enabled, the soft-start circuitry increases the amount of current available from the output linearly over a period of approximately 500µs. The soft- start circuitry is disabled shortly after the output achieves regulation.
Spread Spectrum Operation
Switching regulators can be particularly troublesome where electromagnetic interference (EMI) is concerned. Switch­ing regulators operate on a cycle-by-cycle basis to transfer power to an output. In most cases, the frequency of operation is either fixed or is a constant based on the output load. This method of conversion creates large components of noise at the frequency of operation (funda­mental) and multiples of the operating frequency (har­monics).
> 400mA, and/or TJ > 125°C) should be
OUT2
6
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OPERATIO
LTC3252
U
(Refer to Simplified Block Diagram)
Unlike conventional buck converters, the LTC3252’s inter­nal oscillator is designed to produce a clock pulse whose period is random on a cycle-by-cycle basis but fixed between 1MHz and 1.6MHz. This has the benefit of spread­ing the switching noise over a range of frequencies, thus significantly reducing the peak noise. Figures 1 and 2 show how the spread spectrum feature of the LTC3252 significantly reduces the peak harmonic noise and virtu­ally elliminates harmonics compared to a conventional buck converter.
Spread spectrum operation is always enabled but is most effective when the LTC3252’s outputs are out of Burst Mode operation and the oscillator is running continuously (see the Low Current Burst Mode Operation section).
Low Current Burst Mode Operation
To improve efficiency at low output currents, a Burst Mode operation function is included in the LTC3252. An output current sense is used to detect when the required output current of both outputs drop below an internally set
threshold (30mA typ). When this occurs, the part shuts down the internal oscillator and goes into a low current operating state. The LTC3252 will remain in the low current operating state until either output has dropped enough to require another burst of current. The LTC3252 resumes continuous operation when the load on one or both outputs exceeds the internally set threshold. Unlike traditional charge pumps where the burst current is highly dependant on many factors (i.e., supply, switch strength, capacitor selection, etc.), the LTC3252’s burst current is set by the burst threshold and hysteresis. This means that the output ripple voltage in Burst Mode operation is relatively consistent and is typically about 12mV with a
4.7µF output capacitor on a 1.5V output. The ripple voltage amplitude is a direct function of the output capacitor size. Burst Mode operation ripple voltage does increase slightly at lower output voltages due to the increase in loop gain. Users can counteract output voltage ripple increase through the use of a slightly larger output capacitor. See Recom­mended Output Capacitance guidelines of Figure 3.
Figure 1. Conventional Buck Input Noise Figure 2. LTC3252 Input Noise
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LTC3252
OPERATIO
U
(Refer to Simplified Block Diagram)
Output Capacitor Selection
The style and value of capacitors used with the LTC3252 determine several important parameters such as regulator control loop stability, output ripple and charge pump strength.
The switching nature of the LTC3252 minimizes output noise significantly but not completely. What small ripple that exists at an output is controlled by the value of output capacitor directly. Increasing the size of the output capaci­tor will proportionately reduce the output ripple. The ESR (equivalent series resistance) of the output capacitor plays the dominant role in output noise. When the LTC3252 switches between clock phases there is a period where all switches are turned off. This “blanking period” shows up as a spike at the output and is a direct function of the output current times the ESR value. To reduce output noise and ripple, it is suggested that a low ESR (<0.08Ω) ceramic capacitor be used for the output capacitor. Tantalum and aluminum capacitors are not recommended because of their high ESR.
Both the style and value of the output capacitors can significantly affect the stability of the LTC3252. As shown in the Simplified Block Diagram, the LTC3252 uses a control loop to adjust the strength of each charge pump to match the current required at the output. The error signal of each loop is stored directly on each output capacitor. Thus the output capacitors also serve to form the domi­nant pole in each control loop. Figure 3 is a graph of the recommended output capacitance, and minimum capaci-
8
tance required for good transient response (see the Ce­ramic Capacitor Selection Guidelines section).
Likewise excessive ESR on the output capacitor will tend to degrade the loop stability of the LTC3252. The closed loop output impedance of the LTC3252 is approximately:
V
R
=Ω00808.•
O
For example, with the output programmed to 1.5V, the R
OUT
.
V
O
is 0.15Ω, which produces a 38mV output change for a 250mA load current step. For stability and good load transient response it is important for the output capacitor to have 0.1Ω or less of ESR. Ceramic capacitors typically have exceptional ESR and combined with a tight board layout should yield excellent stability and load transient performance.
Further output noise reduction can be achieved by filtering the LTC3252 outputs through a very small series inductor as shown in Figure 4. A 10nH inductor will reject the fast output transients caused by the blanking period, thereby presenting a nearly constant output voltage. For economy the 10nH inductor can be fabricated on the PC board with about 1cm (0.4") of PC board trace.
OUT
LTC3252
GND
Figure 4. 10nH Inductor Used for Additional Output Noise Reduction
10nH
4.7µF 0.47µF
V
3252 F04
OUT
8
7
6
(µF)
5
OUT
C
4
3
2
1 1.1 1.2 1.3 1.4 1.5 1.6
0.9
Figure 3. Output Capacitance vs Output Voltage
RECOMMENDED CAPACITANCE
MINIMUM CAPACITANCE
V
(V)
OUT
3252 F03
VIN Capacitor Selection
The low noise, dual phase architecture used by the LTC3252 makes input noise filtering much less demanding than conventional charge pump regulators. The LTC3252 input current will transition between I
OUT1
/2 and I
OUT2
/2 for each half cycle of the oscillator. The blanking period described in the V
section also effects the input. For
OUT
this reason it is recommended that a low ESR 4.7µF (1µF min) or greater ceramic capacitor be used for CIN (see the Ceramic Capacitor Selection Guidelines section). Alumi­num and tantalum capacitors can be used but are not recommended because of their high ESR.
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OPERATIO
LTC3252
U
(Refer to Simplified Block Diagram)
Further input noise reduction can be achieved by filtering the input through a very small series inductor as shown in Figure 5. A 10nH inductor will reject the fast input tran­sients caused by the blanking period, thereby presenting a nearly constant load to the input supply. For economy the 10nH inductor can be fabricated on the PC board with about 1cm (0.4") of PC board trace.
10nH
V
IN
SUPPLY
4.7µF
Figure 5. 10nH Inductor Used for Additional Input Noise Reduction
V
IN
GND
LTC3252
3252 F05
Flying Capacitor Selection
Warning: A polarized capacitor such as tantalum or alumi­num should never be used for the flying capacitors since their voltages can reverse upon start-up of the LTC3252. Ceramic capacitors should always be used for the flying capacitors.
The flying capacitors control the strength of the charge pump. In order to achieve the rated output current it is necessary for the flying capacitor to have at least 0.4µF of capacitance over operating temperature with a 2V bias (see the Ceramic Capacitor Selection Guidelines). If 100mA or less of current is required from an output then its asso­ciated flying capacitor minimum can be reduced to 0.15µF.
discussing the specified capacitance value. For example, over rated voltage and temperature conditions, a 4.7µF, 10V, Y5V ceramic capacitor in a 0805 case may not provide any more capacitance than a 1µF, 10V, X7R available in the same 0805 case. In fact, over bias and temperature range, the 1µF, 10V, X7R will provide more capacitance than the 4.7µF, 10V, Y5V. The capacitor manufacturer’s data sheet should be consulted to deter­mine what value of capacitor is needed to ensure mini­mum capacitance values are met over operating temperature and bias voltage.
Below is a list of ceramic capacitor manufacturers and how to contact them:
AVX www.avxcorp.com
Kemet www.kemet.com
Murata www.murata.com
Taiyo Yuden www.t-yuden.com
Vishay www.vishay.com
Layout Considerations
Due to the high switching frequency and transient currents produced by the LTC3252 careful board layout is neces­sary for optimal performance. A true ground plane and short connections to all capacitors will improve perfor­mance and ensure proper regulation under all conditions. Figure 7 shows the suggested layout configuration. Note the exposed paddle of the package is ground (GND) and must be soldered to the PCB ground.
Ceramic Capacitor Selection Guidelines
Capacitors of different materials lose their capacitance with higher temperature and voltage at different rates. For example, a ceramic capacitor made of X7R material will retain most of its capacitance from – 40°C to 85°C whereas a Z5U or Y5V style capacitor will lose considerable capacitance over that range (60% to 80% loss typical). Z5U and Y5V capacitors may also have a very strong voltage coefficient causing them to lose an additional 60% or more of their capacitance when the rated voltage is applied. Therefore, when comparing different capaci­tors it is often more appropriate to compare the amount of achievable capacitance for a given case size rather than
The flying capacitor pins C1+, C1–, C2+ and C2– will have very high edge rate wave forms. The large dv/dt on these pins can couple energy capacitively to adjacent printed circuit board runs. Magnetic fields can also be generated if the flying capacitors are not close to the LTC3252 (i.e., the loop area is large). To decouple capacitive energy transfer, a Faraday shield may be used. This is a grounded PC trace between the sensitive node and the LTC3252 pins. For a high quality AC ground, it should be returned to a solid ground plane that extends all the way to the LTC3252. Keep the FB traces away from or shielded from the flying capacitor traces or degraded performance could result.
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LTC3252
OPERATIO
U
(Refer to Simplified Block Diagram)
Thermal Management
To reduce the maximum junction temperature, a good thermal connection to the PC board is recommended. Soldering the exposed paddle of the IC to the PCB and maintaining a solid ground plane under the device on one or more layers of the PC board, the thermal resistance of the package can be as small as 40°C/W. By applying the suggested thermal management techniques the IC junc­tion temperature should never exceed 125°C even under worst case operating conditions.
Power Efficiency
The power efficiency (η) of the LTC3252 is approximately 50% higher than a conventional linear regulator. This occurs because the input current for a 2-to-1 step-down charge pump is approximately half the output current. For an ideal 2-to-1 step-down charge pump the power effi­ciency is given by:
P
OUT
η≡ = =
P
IN
VI
•
OUT OUT
1
VI
•
IN OUT
2
V
2
OUT
V
IN
The switching losses and quiescent current of the LTC3252 are designed to minimize efficiency loss over the entire output current range, causing only a couple % error from the theoretical efficiency. For example with VIN = 3.6V,
R
R
B
LTC3252
RB' RA'
EN2
C2
EN1
V
A
1
IN
C
IN
C1
I
= 150mA and OUT1 regulating at 1.5V the measured
OUT1
efficiency is 80.6% which is in close agreement with the theoretical 83.3% calculation.
Programming the LTC3252 Output Voltages (FB1 and FB2 Pin)
Each output of the LTC3252 is programmed to an arbitrary voltage via an external resistive divider. Figure 7 shows the required voltage divider connection. The voltage divider ratio is given by the expression:
R
OUT
A
=−
R
B
081.
V
The user may want to consider load regulation when setting the desired output voltage. The closed loop output impedance of the LTC3252 is approximately:
R
=Ω00808.•
O
OUT
.
V
For a 1.5V output, RO is 0.15Ω, which produces a 38mV output change for a 250mA load current step. Thus, the user may want to target an unloaded output voltage slightly higher than desired to compensate for the output load conditions. The output may be programmed for regulation voltages of 0.9V to 1.6V.
Since the LTC3252 employs a 2-to-1 charge pump archi­tecture, it is not possible to achieve output voltages greater than half the available input voltage. The minimum VIN supply required for regulation can be determined by the following equation:
VIN (MIN) ≤ 2 • (V
(MIN) + I
OUT
OUT
• ROL)
10
C
O1
(CONNECT DIRECTLY TO GROUND PLANE)
GND
C
O2
Figure 6. Suggested Layout for the LTC3252
OUT1
OUT1
R
A
OUT2OUT1
3252 F06
=– 1
R
0.8V
B
C
O1
OUT1
R
A
FB1
R
B
GND
LTC3252
OUT2
FB2
GND
RA'
RB'
C
O2
OUT2
'
OUT2
R
A
=– 1
'
R
0.8V
B
3252 F07
Figure 7. Programming the LTC3252
3252f
Page 11
TYPICAL APPLICATIO
OUT1
1.2V
250mA
4.7µF
Li-ION
4.7µF
PACKAGE DESCRIPTIO
U
Li-Ion to 1.5V/1.2V Outputs
261k
OFF ON
1µF
510k
V
IN
EN1 OUT1
C1 C1 FB1
LTC3252
+
–
EN2
OUT2
C2
C2
FB2
GND
U
DE/UE Package
12-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1695)
LTC3252
113
OFF ON
92 105
+
84
–
126 71
1µF
470k
510k
4.7µF
3252 TA02
OUT2
1.5V 250mA
3.40 ±0.05
0.58 ±0.05
1.70 ±0.05 (2 SIDES)2.24 ±0.05
PACKAGE OUTLINE
0.25 ± 0.05
3.30 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
4.00 ±0.10
(2 SIDES)
PIN 1
TOP MARK
0.200 REF
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION (WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
0.50 BSC
3.00 ±0.10
(2 SIDES)
0.75 ±0.05
R = 0.20
TYP
1.70 ± 0.10
(2 SIDES)
0.00 – 0.05
R = 0.115
TYP
0.25 ± 0.05
3.30 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
0.50 BSC
127
16
0.38 ± 0.10
PIN 1 NOTCH
(UE12/DE12) DFN 0802
3252f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen­tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
11
Page 12
LTC3252
TYPICAL APPLICATIO S
U
3-Cell NiMH with Digitally Selectable 1.2V/1.5V Output
V
IN
EN1EN1 OUT1
LTC3252
+
3-CELL
NiMH
1µF
4.7µF
412k 100k
C1 C1 FB1
–
3.3V
Fixed 3.3VIN to 1.5V
OFF ON
4.7µF
1µF
V
IN
EN1 OUT1
C1 C1 FB1
LTC3252
+
–
OUT
EN2
OUT2
C2
C2 FB2
GND
at 300mA
113 92 105
+
84
–
126 71
1µF
470k
510k
10µF
3252 TA03
OUT
1.5V 300mA
RELATED PARTS
PART NUMBER DESCRIPTION COMMENTS
LTC1514 50mA, 650kHz, Step-Up/Down Charge Pump VIN = 2.7V to 10V, V
with Low Battery Comparator I
SHDN
= 10µA, S8
LTC1515 50mA, 650kHz, Step-Up/Down Charge Pump VIN = 2.7V to 10V, V
with Power-On Reset I
LT1776 500mA (I
Step-Down DC/DC Converter I
), 200kHz, High Efficiency 90% Efficiency, VIN = 7.4V to 40V, V
OUT
= <1µA, S8
SHDN
= 3.2mA, I
Q
SHDN
LTC1911-1.5 250mA, 1.5MHz, High Efficiency 75% Efficiency, VIN = 2.7V to 5.5V, V
Step-Down Charge Pump I
= 180µA, I
Q
SHDN
LTC1911-1.8 250mA, 1.5MHz, High Efficiency 75% Efficiency, VIN = 2.7V to 5.5V, V
Step-Down Charge Pump I
= 180µA, I
Q
SHDN
LTC3250-1.5 250mA, 1.5MHz, High Efficiency 85% Efficiency, VIN = 3.1V to 5.5V, V
Step-Down Charge Pump I
= 35µA, I
Q
SHDN
LTC3251 500mA, Spread Spectrum, High Efficiency Up to 85% Efficiency, VIN = 2.7V to 5.5V, V
Step-Down Charge Pump I
LTC3404 600mA (I
Step-Down DC/DC Converter I
LTC3405/LTC3405A 300mA (I
Step-Down DC/DC Converter I
LTC3406/LTC3406B 600mA (I
Step-Down DC/DC Converter I
LTC3411 1.25A (I
DC/DC Converter I
LTC3412 2.5A (I
OUT
DC/DC Converter I
LTC3440 600mA (I
Buck-Boost DC/DC Converter I
), 1.4MHz, Synchronous 95% Efficiency, VIN = 2.7V to 6V, V
OUT
), 1.5MHz, Synchronous 95% Efficiency, VIN = 2.7V to 6V, V
OUT
), 1.5MHz, Synchronous 95% Efficiency, VIN = 2.5V to 5.5V, V
OUT
), 4MHz, Synchronous Step-Down 95% Efficiency, VIN = 2.5V to 5.5V, V
OUT
), 4MHz, Synchronous Step-Down 95% Efficiency, VIN = 2.5V to 5.5V, V
), 2MHz, Synchronous 95% Efficiency, VIN = 2.5V to 5.5V, V
OUT
= 8µA, I
Q
= 10µA, I
Q
= 20µA, I
Q
= 20µA, I
Q
= 60µA, I
Q
= 60µA, I
Q
= <25µA, I
Q
SHDN
SHDN
SHDN
SHDN
SHDN
SHDN
SHDN
= 3V or 5V, Regulated Output, IQ = 60µA,
OUT
= 3.3V or 5V, Regulated Output, IQ = 60µA,
OUT
Min = 1.24V,
OUT
= 30µA, N8, S8
= 1.5V, Regulated Output,
OUT
= 10µA, MS8
= 1.8V, Regulated Output,
OUT
= 10µA, MS8
= 1.5V, Regulated Output,
OUT
= <1µA, ThinSOT
= <1µA, MS10
Min = 0.8V,
OUT
= <1µA, MS8
Min = 0.8V,
OUT
= <1µA, ThinSOT
Min = 0.6V,
OUT
= <1µA, ThinSOT
Min = 0.8V,
OUT
= <1µA, MS10
Min = 0.8V,
OUT
= <1µA, TSSOP-16E
Min = 2.5V,
OUT
= 1µA, MS10
113
EN2 EN2
92
OUT2
105
+
C2
84
–
C2
126
FB2
71
GND
= 0.9V to 1.6V,
OUT
1µF
I
OUT
261k
250mA
4.7µF
EN1 EN2 OUT
OFF OFF 0V OFF ON 1.2V ON OFF 1.5V ON ON 1.5V
3252 TA04
12
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear.com
3252f
LT/TP 0503 1K • PRINTED IN USA
LINEAR TECHNOLOGY CORPORATION 2003
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