The LTC®3421 is a high efficiency, current mode, fixed
frequency, step-up DC/DC converter with true output disconnect and inrush current limiting. The device includes a
0.10Ω N-channel MOSFET switch and a 0.14Ω P-channel
synchronous rectifier. This product has the ability to simply program the output voltage, switching frequency, current limit, soft-start, Burst Mode threshold and loop
compensation with external passive components.
Quiescent current is only 12µA during Burst Mode opera-
tion, maximizing battery life in portable applications. The
oscillator frequency can be programmed up to 3MHz and
can be synchronized to an external clock applied to the
SYNC pin. An open-drain uncommitted low-battery comparator is included. The part maintains operation in
applications with a secondary cell powering the output
voltage during shutdown.
Other features include: 1µA shutdown, antiringing control,
thermal limit and reference output.
The LTC3421 is available in a small 4mm × 4mm QFN
package.
, LTC and LT are registered trademarks of Linear Technology Corporation.
Burst Mode is a registered trademark of Linear Technology Corporation.
TYPICAL APPLICATIO
V
IN
1.8V TO 3V
*LOCATE COMPONENTS CLOSE TO PINS
C1: TAIYO YUDEN JMK212BJ106MM
LBO LeakageV
SS Current SourceVSS = 1V1.22.45µA
BURST Threshold VoltageFalling Edge0.870.971.07V
OUT
V
OUT
V
IN
PGOOD
= 0V, I
The ● denotes the specifications which apply over the full operating
= 3.3V, RT = 28k, unless otherwise noted.
OUT
= 0V (Initial Start-Up)1.00V
> 2.4V0.65V
= 1mA12.050mV
SINK
= 20mA0.250.5V
SINK
= 5.5V0.011µA
Note 1: Absolute Maximum Ratings are those values beyond which the life
of a device may be impaired.
Note 2: The LTC3421E is guaranteed to meet performance specifications
from 0°C to 70°C. Specifications over the 40°C to 85°C operating
temperature range are assured by design, characterization and correlation
with statistical process controls.
Note 3: Current is measured into the V
bootstrapped to the output. The current will reflect to the input supply by
(V
) • Efficiency. The outputs are not switching.
OUT/VIN
pin since the supply current is
OUTS
Note 4: Once V
supply.
Note 5: This IC includes overtemperature protection that is intended to
protect the device during momentary overload conditions. Junction
temperature will exceed 125°C when overtemperature protection is active.
Continuous operation above the specified maximum operating junction
temperature may impair device reliability.
is greater than 2.4V, the IC is not dependent on the V
OUT
IN
3421f
3
LTC3421
OUTPUT CURRENT (mA)
0
START VOLTAGE (V)
1.00
1.05
1.10
200
3421 G09
0.95
0.90
0.80
50
100
150
0.85
1.20
1.15
UW
TYPICAL PERFOR A CE CHARACTERISTICS
(TA = 25°C, unless otherwise specified)
Single Cell to 3.3V Efficiency
100
Burst Mode OPERATION
90
80
70
60
50
40
EFFICIENCY (%)
30
20
V
= 3.3V
10
OUT
= 1MHz
f
OSC
0
0.1101001000
1
OUTPUT CURRENT (mA)
VIN = 1.2V
Burst Mode OperationLoad Transient ResponseInrush Current Control
FB (Pin 1): Feedback Pin. Connect resistor divider tap
here. The output voltage can be adjusted from 2.4V to
5.25V. The feedback reference voltage is typically 1.220V.
SHDN (Pin 2): Shutdown Pin. Less than 0.25V on this pin
shuts down the IC. The IC is enabled when the SHDN
voltage is greater than 1V. Once V
hysteresis is applied to the pin (–500nA out of the pin)
allowing it to operate at a logic high while the battery can
drop to 0.5V.
V
(Pin 3): Buffered 1.22V Reference Output. This pin
REF
can source up to 100µA and sink up to 8µA. This pin must
be decoupled with a 0.1µF capacitor for stability.
is above 2.2V,
OUT
ENB (Pin 4): Reference Output (V
Comparator Enable. When ENB = Low, the V
) and Low-Battery
REF
output and
REF
low-battery comparator are disabled, which lowers the
quiescent current by 5µA. When ENB = High, the V
REF
output and the low-battery comparator are enabled. During shutdown, if the ENB = High and the output voltage is
pulled up to greater than 2.5V from a secondary source
such as a coin cell through a Schottky diode, the V
REF
output and low-battery comparator becomes powered
from the output voltage and enabled.
3421f
5
LTC3421
UUU
PI FUCTIOS
RT (Pin 5): Connect a resistor to ground to program the
oscillator frequency according to the formula:
OSC
28 100,
=
R
T
is in kHz and RT is in kΩ.
OSC
f
where f
SS (Pin 6): Soft-Start Pin. Connect a capacitor from this
pin to ground to set the soft-start time according to the
formula:
t(ms) = CSS(µF) • 320
The nominal soft-start charging current is 2.5µA. The
active range of SS is from 0.8V to 1.6V.
SYNC (Pin 7): Oscillator Synchronization Pin. A clock
pulse width of 100ns to 2µs is required to synchronize the
internal oscillator. If not used SYNC should be grounded.
I
(Pin 8): Current Limit Adjust Pin. Connect a resistor
LIM
from this pin to ground to set the peak current limit threshold for the N-channel MOSFET according to the formula
(note that this is the peak current in the inductor):
GND (Pin 10): Signal Ground Pin. Connect to ground plane
near the RT resistor, error amp compensation components and feedback divider.
PGND (Pins 11 to 13): Source Terminal of Power Internal
N-Channel MOSFET.
SW (Pins 14 to 16): Switch Pin for Inductor Connection.
For applications where V
SW to V
or to a snubber circuit is required to maintain
OUT
> 4.3V, a Schottky diode from
OUT
absolute maximum rating for SW. (see Application Circuits for 5V).
V
(Pins 17, 19 and 20): The output of the synchronous
OUT
rectifier and bootstrapped power source for the IC. A
ceramic bypass capacitor is required to be very close to
the V
V
OUTS
and PGND pins of the IC.
OUT
(Pin 18): V
Sense Pin. Connect V
OUT
OUTS
directly to
an output filter capacitor. The top of the feedback divider
network should also be tied to this point.
VIN (Pin 21): Input Supply Pin. Connect this pin to the
input supply and decouple with at least a 4.7µF ceramic
capacitor.
LIM
150
=
R
I
where I is in amps and R is in kΩ.
BURST (Pin 9): Burst Mode Threshold Adjust Pin. A
resistor/capacitor combination from this pin to ground
programs the average load current at which automatic
Burst Mode operation is entered, according to the formula:
R
BURST
where R
C
BURST
where C
BURST
BURST(MIN)
2
=
I
BURST
is in kΩ and I
CV
•
OUTOUT
≥
,10 000
and C
BURST
are in µF.
OUT
is in amps.
For manual control of Burst Mode operation, ground the
BURST pin to force Burst Mode operation or connect it to
V
to force fixed frequency PWM mode. Note that the
OUT
BURST pin must not be pulled higher than V
OUT
.
LBO (Pin 22): Open-Drain Output. This pin pulls low when
the LBI input is below 0.6V. The open-drain output can
sink up to 20mA. During Burst Mode operation LBO is only
active during the time the IC wakes up to service the
output.
LBI (Pin 23): Low-Battery Comparator Input. Typical
threshold voltage is 0.6V with 30mV hysteresis. This
function is enabled when the ENB pin is high. The lowbattery comparator will operate off VIN or V
, whichever
OUT
is greater.
VC (Pin 24): Error Amp Output. A frequency compensation
network is connected from this pin to ground to compensate the loop. See the section Compensating the Feedback
Loop for guidelines.
Exposed Pad (Pin 25): Ground. This pin must be soldered
to the PCB and is typically connected through the power
GND plane.
3421f
6
BLOCK DIAGRA
W
+
LTC3421
1V TO 4.5V
21
V
IN
ANTIRING
VINV
ANTICROSS
CONDUCTION
CURRENT
LIMIT
SHDN
ENB
V
REF
SHUTDOWN
1.22V REF
2%
THERMAL
REG/SHDN
PWM
LOGIC
2
V
4
OUT
3
14
15
16
SW
SW
DD
NMOS
SW
I
SENSE
AMP
PMOS
V
IN
WELL
SWITCH
+
–
I
ZERO
AMP
V
18
OUTS
V
OUT
17
V
OUT
19
V
OUT
20
R1
V
OUT
2.40V TO 5.25V
+
I
LIM
BURST
8
SS
6
FB
1
V
C
24
9
R
C1
C
SS
R2
C
P
R
Z
SLEEP
OFF
–
–
CURRENT
COMP
+
++
Σ
Burst Mode
CONTROL
1%
ERROR
AMP
I
LIMIT
150k/R
+
–
=
C1
1.22V
I/3000
+
SYNC
R1
R2
0.97V/1.05V
–
LBO
22
13
3421 BD
3421f
EXPOSED
PAD
25
–
+
–3%
BURST
COMP
+
3%
–
PGND
PGND12PGND
11
R
T
SYNC
LBI
0.6V/
OSC
V
–
+
INVOUT
ENB
SLOPE COMP
GND
10
5
7
IN
23
0.63V
UV
OV
7
LTC3421
OPERATIO
U
LOW VOLTAGE START-UP
The LTC3421 includes an independent start-up oscillator
designed to start-up at input voltages of 0.85V typical. The
frequency and peak current limit during start-up are internally controlled. The device can start-up under some load
(see graph of Start-Up Current vs Input Voltage). Softstart and inrush current limiting are provided during startup as well as normal mode. The same soft-start capacitor
is used for each operating mode.
When either VIN or V
normal operating mode. Once the output voltage exceeds
the input by 0.3V, the IC powers itself from V
of VIN. At this point the internal circuitry has no dependency on the VIN input voltage, eliminating the requirement for a large input capacitor. The input voltage can drop
as low as 0.5V without affecting circuit operation. The
limiting factor for the application becomes the availability
of the power source to supply sufficient energy to the
output at the low voltages and the maximum duty cycle,
which is clamped at 91% typical.
exceeds 2.25V, the IC enters
OUT
instead
OUT
Oscillator
The frequency of operation is set through a resistor from
the RT pin to ground. An internally trimmed timing capacitor resides inside the IC. The oscillator can be synchronized with an external clock applied to the SYNC pin. When
synchronizing the oscillator, the free running frequency
must be set to an approximately 30% lower frequency
than the desired synchronized frequency.
Current Sensing
Lossless current sensing converts the peak current signal
to a voltage to sum in with the internal slope compensation. This summed signal is compared to the error amplifier output to provide a peak current control command for
the PWM. The slope compensation in the IC is adaptive to
the input voltage and output voltage. Therefore, the converter provides the proper amount of slope compensation
to ensure stability, but not an excess to cause a loss of
phase margin in the converter.
Error Amplifier
LOW NOISE FIXED FREQUENCY OPERATION
Shutdown
The part is shut down by pulling SHDN below 0.3V, and
activated by pulling the pin initially above 1V and maintaining a high state down to 0.5V. Note that the SHDN pin can
be driven above VIN or V
than the absolute maximum rating.
Soft-Start
The soft-start time is programmed with an external capacitor to ground on the SS pin. An internal current source
charges it with a nominal 2.5µA. The voltage on the SS pin
(in conjunction with the external resistor on the I
is used to control the peak current limit until the voltage on
the capacitor exceeds 1.6V, at which point the external
resistor sets the peak current. In the event of a commanded shutdown or a thermal shutdown, the capacitor is
discharged automatically. Note that Burst Mode operation
is inhibited during the soft-start time.
as long as it is limited to less
OUT
LIM
pin)
The error amplifier is a transconductance amplifier, with
its positive input internally connected to the 1.22V reference and its negative input connected to FB. A simple
compensation network is placed from COMP to ground.
Internal clamps limit the minimum and maximum error
amplifier output voltage for improved large-signal transient response. During sleep (in Burst Mode operation),
the compensation pin is high impedance; however, clamps
limit the voltage on the external compensation network,
preventing the compensation capacitor from discharging
to zero during the sleep time.
Current Limit
The programmable current limit circuit sets the maximum
peak current. This clamp level is programmed with a
resistor from I
current limit is automatically set to a nominal value of 0.6A
peak for optimal efficiency.
LIM
150
=
I
to ground. In Burst Mode operation, the
LIM
R
t(ms) = CSS(µF) • 320
8
where I is in amps and R is in kΩ.
3421f
OPERATIO
LTC3421
U
Zero Current Amplifier
The zero current amplifier monitors the inductor current to
the output and shuts off the synchronous rectifier once the
current is below 50mA typical, preventing negative inductor current.
Antiringing Control
The antiringing control places a resistor across the
inductor to damp the ringing on the SW pin in discontinuous conduction mode. The LCSW ringing (L = inductor,
CSW = capacitance on SW pin) is low energy, but can
cause EMI radiation.
V
REF
The internal 1.22V reference is buffered and brought out
to REFOUT. It is active when the ENB pin is pulled high
(above 1.4V). For stability, a minimum of a 0.1µF capacitor
must be placed on the pin. The output can source up to
100µA and sink up to 8µA. For the lowest possible quies-
cent current in Burst Mode operation, the reference output
should be disabled by grounding the ENB pin.
increasing the output capacitance. Another method of
reducing Burst Mode ripple is to place a small feedforward capacitor across the upper resistor in the V
feedback divider network.
During Burst Mode operation, the VC pin is disconnected
from the error amplifier in an effort to hold the voltage on
the external compensation network where it was before
entering Burst Mode operation. To minimize the effects of
leakage current and stray resistance, voltage clamps limit
the min and max voltage on VC during Burst Mode operation. This minimizes the transient experienced when a
heavy load is suddenly applied to the converter after being
in Burst Mode operation for an extended period of time.
For automatic operation, an RC network should be connected from BURST to ground. The value of the resistor
will control the average load current (I
Burst Mode operation will be entered and exited (there is
hysteresis to prevent oscillation between modes). The
equation given for the capacitor on BURST is for the
minimum value to prevent ripple on BURST from causing
the part to oscillate in and out of Burst Mode operation at
the current where the mode transition occurs.
BURST
) at which
OUT
Burst Mode OPERATION
Burst Mode operation can be automatic or user controlled.
In automatic operation, the IC will automatically enter
Burst Mode operation at light load and return to fixed
frequency PWM mode for heavier loads. The user can
program the average load current at which the mode
transition occurs using a single resistor.
The oscillator is shut down in this mode, since the on time
is determined by the time it takes the inductor current to
reach a fixed peak current and the off time is determined
by the time it takes for the inductor current to return to
zero.
In Burst Mode operation, the IC delivers energy to the
output until it is regulated and then goes into a sleep mode
where the outputs are off and the IC is consuming only
12µA of quiescent current. In this mode, the output ripple
has a variable frequency component with load current and
will be typically 2% peak-peak. This maximizes efficiency
at very light loads by minimizing switching and quiescent
losses. Burst Mode ripple can be reduced slightly by
R
BURST
where R
where C
In the event that a sudden load transient causes FB to
deviate by more than 4% from the regulation value, an
internal pull-up is applied to BURST, forcing the part
quickly out of Burst Mode operation. For optimum transient response when going between Burst Mode operation
and PWM mode, the mode should be controlled manually
by the host. This way PWM mode can be commanded
before the load step occurs, minimizing output voltage
droop. For manual control of Burst Mode operation, the
RC network can be eliminated. To force fixed frequency
PWM mode, BURST should be connected to V
force Burst Mode operation, BURST should be grounded.
C
BURST
BURST
BURST(MIN)
2
=
I
BURST
is in kΩ and I
CV
•
OUTOUT
≥
,10 000
and C
BURST
are in µF.
OUT
is in amps.
OUT
. To
3421f
9
LTC3421
OPERATIO
U
Simplified Diagram of Automatic Burst Mode Control Circuit
V
CC
1mAI
–
V
REF
–4%
FB
1
+
–
REF
+
V
±1%
UV
ERROR AMP/
SLEEP COMP
24
SSDONE
V
C
R
COMP
C
COMP
TO
MODULATOR
CLAMP
0.5V TO 1V
9
0.9V/
1.1V
BURST
R
B
/3000
OUT
SSDONE
–
+
C
B
SLEEP
MODE
1 = Burst Mode
OPERATION
0 = PWM MODE
3421 TA03
The circuit connected to BURST should be able to sink or
source up to 2mA. Note that Burst Mode operaton is
inhibited during start-up and soft-start.
Note that if VIN is above V
– 0.3V, the part will exit Burst
OUT
Mode operation and the synchronous rectifier will be
disabled.
Note that if the load applied during forced Burst Mode
operation exceeds the current that can be supplied, the
output voltage will start to droop and the part will automatically come out of Burst Mode operation and enter fixed
frequency mode, raising V
. The maximum current that
OUT
can be supplied in Burst Mode operation is given by:
10
I
O MAX
()
=
2
055
VV
+
1
•
–
()
OUTIN
V
IN
in amps
.
OUTPUT DISCONNECT AND INRUSH LIMITING
The LTC3421 is designed to allow true output disconnect
by eliminating body diode conduction of the internal
P-channel MOSFET rectifier. This allows V
to go to zero
OUT
volts during shutdown without drawing any current from
the input source. It also allows for inrush current limiting
at turn-on, minimizing surge currents seen by the input
supply. Note that to obtain the advantages of output
3421f
OPERATIO
LTC3421
U
disconnect, there must not be any external Schottky
diodes connected between the SW pins and V
OUT
.
Note: Board layout is extremely critical to minimize voltage overshoot on the SW pins due to stray inductance.
Keep the output filter capacitors as close as possible to the
WUUU
APPLICATIO S I FOR ATIO
COMPONENT SELECTION
V
242322212019
LBI LBO VINV
V
C
FB
1
2
SHDN
3
V
REF
4
ENB
R
5
T
SS
6
I
LIM
SYNC
BURST GND PGND PGND
789101112
OUTVOUT
V
OUTS
V
PGND
OUT
SW
SW
SW
V
OUT
18
17
16
15
14
13
3421 F01
Figure 1. Recommended Component Placement. Traces Carrying
High Current are Direct (PGND, SW, V
). Trace Area at FB and
OUT
VC are Kept Low. Lead Length to Battery Should be Kept Short.
VIN and V
Ceramic Capacitors Should be as Close to the IC
OUT
Pins as Possible
Inductor Selection
The high frequency operation of the LTC3421 allows the
use of small surface mount inductors. The minimum
inductance value is proportional to the operating frequency and is limited by the following constraints:
3
L
and L
>>
VVV
IN MINOUT MAXIN MIN
f
•–
()
()( ) ()
••
f Ripple V
OUT MAX
()
IN
GND
MULTIPLE VIAS
TO GROUND
PLANE
V
pins and use very low ESR/ESL ceramic capacitors,
OUT
tied to a good ground plane. In V
a Schottky diode is required from the switch nodes to V
> 4.3V applications,
OUT
OUT
to limit the peak switch voltage to less than 6V unless
some form of external snubbing is employed. (See 5V
Applications section.)
where
f = Operating Frequency in MHz
Ripple = Allowable Inductor Current Ripple (Amps
Peak-Peak)
V
V
= Minimum Input Voltage
IN(MIN)
OUT(MAX)
= Maximum Output Voltage
The inductor current ripple is typically set to 20% to 40%
of the maximum inductor current.
For high efficiency, choose an inductor with high frequency core material, such as ferrite, to reduce core loses.
The inductor should have low ESR (equivalent series
resistance) to reduce the I2R losses and must be able to
handle the peak inductor current without saturating. Molded
chokes or chip inductors usually do not have enough core
to support peak inductor currents in the 1A to 4A region.
To minimize radiated noise, use a toroidal or shielded
inductor. See Table 1 for suggested inductor suppliers and
Table 2 for a list of capacitor suppliers.
The output voltage ripple has two components to it. The
bulk value of the capacitor is set to reduce the ripple due
to charge into the capacitor each cycle. The maximum
ripple due to charge is given by:
IV
•
V
RBULK
=
PIN
CVf
••
OUTOUT
where IP = peak inductor current.
The ESR (equivalent series resistance) is usually the most
dominant factor for ripple in most power converters. The
ripple due to capacitor ESR is simply given by:
V
where C
RCESR
ESR
= IP • C
ESR
= capacitor series resistance.
Low ESR capacitors should be used to minimize output
voltage ripple. For surface mount applications, AVX TPS
series tantalum capacitors, Sanyo POSCAP or Taiyo Yuden
ceramic capacitors are recommended. For through-hole
applications, Sanyo OS-CON capacitors offer low ESR in a
small package size.
In some layouts it may be necessary to place a 1µF low ESR
ceramic capacitor as close to the V
and GND pins as
OUT
possible.
Input Capacitor Selection
The input filter capacitor reduces peak currents drawn
from the input source and reduces input switching noise.
Since the IC can operate at voltages below 0.5V once the
output is regulated, the demand on the input capacitor is
much less. In most applications 1µF per amp of peak input
current is recommended. Taiyo Yuden offers very low ESR
ceramic capacitors, for example the 1µF in a 0603 case
(JMK107BJ105MA).
There are several considerations in selecting the operating
frequency of the converter. The first is, which are the sensitive frequency bands that cannot tolerate any spectral
noise? The second consideration is the physical size of the
converter. As the operating frequency goes up, the inductor and filter capacitors go down in value and size. The trade
off is in efficiency since the switching losses due to gate
charge are going up proportional with frequency.
Another operating frequency consideration is whether the
application can allow “pulse skipping.” In this mode, the
minimum on time of the converter cannot support the duty
cycle, so the converter ripple will go up and there will be
a low frequency component of the output ripple. In many
applications where physical size is the main criterion,
running the converter in this mode is acceptable. In applications where it is preferred not to enter this mode, the
maximum operating frequency is given by:
f
MAX NOSKIP
where t
ON(MIN)
=
•
Vt
OUTON MIN_()
Hz
= minimum on time = 120ns.
–
VV
OUTIN
Thermal Considerations
To deliver the power that the LTC3421 is capable of, it is
imperative that a good thermal path be provided to
dissipate the heat generated within the package. This can
be accomplished by taking advantage of the large thermal
pad on the underside of the IC. It is recommended that multiple vias in the printed circuit board be used to conduct
heat away from the IC and into a copper plane with as much
area as possible. In the event that the junction temperature gets too high, the peak current limit will automatically
be decreased. If the junction temperature continues to rise,
the part will go into thermal shutdown, and all switching
will stop until the temperature drops.
VIN > V
Operation
OUT
The LTC3421 will maintain voltage regulation when the
input voltage is above the output voltage. This is achieved
by terminating the switching on the synchronous PMOS
and applying VIN statically on the gate. This will ensure the
3421f
12
WUUU
f
V
IL
RHPZ
IN
OUT
=
π
2
2• ••
APPLICATIO S I FOR ATIO
LTC3421
volts • seconds of the inductor will reverse during the time
current is flowing to the output. Since this mode will
dissipate more power in the IC, the maximum output
current is limited in order to maintain an acceptable
junction temperature.
–
125
T
I
OUT MAX
()
=
•.–
401 5
VV
()
()
INOUT
A
+
where TA = ambient temperature.
For example at VIN = 4.5V and V
= 3.3V, the maximum
OUT
output current is 370mA.
Short Circuit
The LTC3421 output disconnect feature allows output short
circuit while maintaining a maximum set current limit. The
IC has incorporated internal features such as current limit
and thermal shutdown for protection from an excessive
overload or short circuit. In applications that require a prolonged short circuit, it is recommended to limit the power
dissipation in the IC to maintain an acceptable junction
temperature. The circuit in Figure 2 will limit the maximum
current during a prolonged short by reducing the current
limit value in a short circuit by disconnecting R2 with the
N-channel MOSFET switch. R3 and C1 provide a soft-start
function after a short circuit. Resistor R1 lowers the current limit value as VIN rises, maintaining a relatively constant power. The current limit equation for the circuit in
Figure 2 is given by:
Closing the Feedback Loop
The LTC3421 uses current mode control with internal
adaptive slope compensation. Current mode control eliminates the 2nd order filter due to the inductor and output
capacitor exhibited in voltage mode controllers, and simplifies it to a single pole filter response. The product of the
modulator control to output DC gain and the error amp
open-loop gain gives the DC gain of the system:
V
GG
=
G
DCEA
G
CONTROL
CONTROL_OUTPUT
V
•,2
I
OUT
IN
=≈
••
G
EA
2000
V
REF
OUT
The output filter pole is given by:
I
f
FILTER POLE
where C
=
_
is the output filter capacitor.
OUT
OUT
••
π
VC
OUTOUT
The output filter zero is given by:
f
FILTER ZERO
where R
_
ESR
=
•• •
2
is the capacitor equivalent series resistance.
1
RC
π
ESROUT
A troublesome feature of the boost regulator topology is
the right-half plane zero (RHP) and is given by:
I
LIMIT
where I
0606
=
R
is in Amps; R
LIMIT
Figure 2. Current Limit Foldback Circuit for
Extended Short Conditions
.
LIM
I
LIM
8
R
LIM
100k
V
–
VN2222
IN
TO V
–.
R
1
IN
R1
1M
R2
50k
250
•
and R1 are in kΩ.
LIM
R3
10k
C1
0.1µF
3421 F02
TO V
OUT
At heavy loads this gain increase with phase lag can occur
at a relatively low frequency. The loop gain is typically
rolled off before the RHP zero frequency.
The typical error amp compensation is shown in Figure 3.
The equations for the loop dynamics are as follows:
f
POLE
f
ZERO
f
POLE
≈
1
2206
≈
1
2
≈
2
2
1
π
•••
eC
1
π
•• •
RC
ZC
1
π
•• •
RC
ZC
which is extremely close to DC
C
1
1
2
3421f
13
LTC3421
WUUU
APPLICATIO S I FOR ATIO
U
TYPICAL APPLICATIO
5V Applications
ERROR
AMP
+
–
1.22V
FB
1
V
C
24
Figure 3
V
OUT
R1
R2
C
R
Z
C
C1
C2
3421 F03
When the output voltage is programmed above 4.3V it is
necessary to add a Schottky diode either from SW to
V
, or to a snubber network in order to maintain an
OUT
acceptable peak voltage on SW. The Schottky to the
V
2.7V TO
4.2V
Li-Ion
IN
C1*
10µF
+
*LOCATE COMPONENTS CLOSE TO PINS
C1: TAIYO YUDEN JMK212BJ106MM
C5: TAIYO YUDEN JMK325BJ226MM
output will provide a peak efficiency improvement but will
negate the output disconnect feature. If output disconnect
is required, the Schottky to an active snubber network is
suggested as shown in Figure 4.
M1
R5
1.13M
R6
365k
C6*
1µF
C5*
22µF
×2
3421 F04
100
V
OUT
5V
1A
90
80
70
60
50
40
EFFICIENCY (%)
30
20
10
0
Li-Ion to 5V Efficiency
Burst Mode
OPERATION
V
= 5V
OUT
= 1MHz
f
OSC
0.1101001000
1
OUTPUT CURRENT (mA)
VIN = 4.2V
= 3.6V
V
IN
= 2.7V
V
IN
3421 G03
14
Figure 4. Lithium-Ion to 5V at 1A Application with an Active Snubber Circuit
3421f
PACKAGE DESCRIPTIO
LTC3421
U
UF Package
24-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1697)
0.70 ±0.05
4.50 ± 0.05
3.10 ± 0.05
2.45 ± 0.05
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
4.00 ± 0.10
(4 SIDES)
PIN 1
TOP MARK
(NOTE 5)
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)—TO BE APPROVED
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
6. DRAWING NOT TO SCALE
0.25 ±0.05
0.50 BSC
PACKAGE OUTLINE
0.75 ± 0.05
2.45 ± 0.10
(4-SIDES)
0.200 REF
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
0.23 TYP
(4 SIDES)
24
23
0.38 ± 0.10
1
2
(UF24) QFN 0603
0.25 ± 0.05
0.50 BSC
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3421f
15
LTC3421
TYPICAL APPLICATIO
U
Single Cell to 3.3V at 500mA with Secondary Cell Backup During Shutdown. LOWBAT and V
L1
R2
28k
V
IN
LTC3421
GND
4.7µH
SW SW
SW
V
OUTS
V
V
V
BURST
PGND PGNDPGND
OUT
OUT
OUT
FB
V
1312111056
0.1µF
18
17
19
20
1
24
C
9
C3
470pF
R3
40k
V
IN
1V TO 1.5V
1 CELL
PRIMARY CELL
C1*
4.7µF
301k
+
604k
*LOCATE COMPONENTS CLOSE TO PINS
C1: TAIYO YUDEN JMK212BJ106MM