LINEAR TECHNOLOGY LTC3421 Technical data

FEATURES
Synchronous Rectification: Up to 96% Efficiency
True Output Disconnect
Inrush Current Limiting
Very Low Quiescent Current: 12µA
Up to 1.5A Continuous Output Current
Fixed Frequency Operation Up to 3MHz
0.5V to 4.5V Input Range
2.4V to 5.25V Adjustable Output Voltage
Guaranteed 1V Start-Up
Programmable Current Limit
Programmable Soft-Start
Synchronizable Oscillator
Manual or Automatic Burst Mode® Operation
Low-Battery Comparator
<1µA Shutdown Current
1.22V Reference Output Voltage
Small (4mm × 4mm) Thermally Enhanced QFN Package
U
APPLICATIO S
Handheld Computers
Cordless Phones
GPS Receivers
Battery Backup Supplies
LTC3421
3A, 3MHz Micropower
Synchronous Boost Converter
with Output Disconnect
U
DESCRIPTIO
The LTC®3421 is a high efficiency, current mode, fixed frequency, step-up DC/DC converter with true output dis­connect and inrush current limiting. The device includes a
0.10 N-channel MOSFET switch and a 0.14 P-channel synchronous rectifier. This product has the ability to sim­ply program the output voltage, switching frequency, cur­rent limit, soft-start, Burst Mode threshold and loop compensation with external passive components.
Quiescent current is only 12µA during Burst Mode opera- tion, maximizing battery life in portable applications. The oscillator frequency can be programmed up to 3MHz and can be synchronized to an external clock applied to the SYNC pin. An open-drain uncommitted low-battery com­parator is included. The part maintains operation in applications with a secondary cell powering the output voltage during shutdown.
Other features include: 1µA shutdown, antiringing control, thermal limit and reference output.
The LTC3421 is available in a small 4mm × 4mm QFN package.
Burst Mode is a registered trademark of Linear Technology Corporation.
TYPICAL APPLICATIO
V
IN
1.8V TO 3V
*LOCATE COMPONENTS CLOSE TO PINS C1: TAIYO YUDEN JMK212BJ106MM
2 CELLS
C1*
4.7µF
45.3k
0.1µF
221141516
V
SHDN
REF
LIM
SS R
IN
GND
T
28k
4
ENB
3
V
23
LBI
22
LBO
7
SYNC
8
I
U
L1
4.7µH
SW SW
SW
18
V
OUTS
17
V
OUT
19
V
OUT
20
LTC3421
PGND PGNDPGND
C5: TAIYO YUDEN JMK325BJ226MM L1: TDK RLF7030T-4R7M3R4
V
OUT
BURST
FB V
C
1312111056
0.1µF
1 24 9
470pF
20k
100k
340k
200k
C5* 22µF
3421 TA01
V
3.3V
1.2A
OUT
2-Cell to 3.3V Efficiency
100
Burst Mode OPERATION
90 80 70 60 50 40
EFFICIENCY (%)
30 20
V
10
f
0
0.1 10 100 1000
= 3.3V
OUT
= 1MHz
OSC
1 OUTPUT CURRENT (mA)
VIN = 3V
VIN = 2.4V
VIN = 2V
3421 G02
3421f
1
LTC3421
WW
W
U
ABSOLUTE AXI U RATI GS
(Note 1)
VIN, V BURST, SHDN, SS, ENB, SW,
LBO, LBI, SYNC Voltages .......................... –0.3V to 6V
Operating Temperature Range
(Notes 2, 5)............................................. –40°C to 85°C
Storage Temperature Range ................. –65°C to 125°C
Lead Temperature (Soldering, 10 sec).................. 300°C
OUT
, V
Voltage ............................ –0.3V to 6V
OUTS
UUW
PACKAGE/ORDER I FOR ATIO
TOP VIEW
LBO
VINV
25
10 11 12
GND
BURST
OUTVOUT
18
V
OUTS
V
17
OUT
SW
16
SW
15
SW
14 13
PGND
PGND
PGND
LTC3421EUF
VCLBI
24 23 22 21 20 19
FB
1
SHDN
2
V
3
REF
ENB
4
R
5
T
SS
6
7 8 9
LIM
I
SYNC
24-LEAD (4mm × 4mm) PLASTIC QFN
T
JMAX
= 35°C/W 4 LAYER BOARD, θJC = 2.6°C/W
θ
JA
EXPOSED PAD IS GND (PIN 25) MUST BE SOLDERED TO PCB
UF PACKAGE
= 125°C, θJA = 40°C/W 1 LAYER BOARD,
ORDER PART NUMBER
UF PART MARKING 3421
Consult LTC Marketing for parts specified with wider operating temperature ranges.
ELECTRICAL CHARACTERISTICS
temperature range, otherwise specifications are at TA = 25°C. VIN = 1.2V, V
PARAMETER CONDITIONS MIN TYP MAX UNITS
Minimum VIN Start-Up Voltage I Minimum VIN Operating Voltage (Note 4) 0.5 V Output Voltage Adjust Range 2.25 5.25 V
Feedback Voltage 1.196 1.220 1.244 V Feedback Input Current VFB = 1.22V 1 50 nA Quiescent Current—Burst Mode Operation VC = 0V, ENB = 0V (Note 3) 12 20 µA
Quiescent Current—Shutdown SHDN = 0V, ENB = 0V 0.1 1 µA
Quiescent Current—Active (Note 3) 0.6 1.1 mA NMOS Switch Leakage 0.1 5 µA PMOS Switch Leakage 0.1 10 µA NMOS Switch On Resistance 0.1 PMOS Switch On Resistance 0.14 NMOS Current Limit I
Max Duty Cycle 84 91 % Min Duty Cycle 0%
LOAD
V
= 0V, ENB = 2V (Note 3) 23 50 µA
C
SHDN = 0V, ENB > 1.4V 0.2 2 µA
Resistor = 105k 1 1.5 A
LIM
I
Resistor = 36.5k 3 4.2 A
LIM
The denotes the specifications which apply over the full operating
= 3.3V, RT = 28k, unless otherwise noted.
OUT
< 1mA 0.88 1 V
2.40 5.25 V
2
3421f
LTC3421
ELECTRICAL CHARACTERISTICS
temperature range, otherwise specifications are at TA = 25°C. VIN = 1.2V, V
PARAMETER CONDITIONS MIN TYP MAX UNITS
Frequency Accuracy 0.85 1 1.15 MHz SYNC Input High 2.2 V SYNC Input Low 0.8 V SYNC Input Current 0.01 1 µA ENB Input High 1.2 V ENB Input Low 0.4 V ENB Input Current 1 µA SHDN Input High V
SHDN Input Low 0.25 V SHDN Input Current 0.01 1 µA REF Output Voltage 1.183 1.22 1.257 V REF Output Current Range –100 8 µA Error Amp Transconductance 45 µs LBI Threshold Falling Edge 0.58 0.6 0.62 V LBI Input Current 0.01 1 µA LBO Low Voltage VIN = 0V, I
LBO Leakage V SS Current Source VSS = 1V 1.2 2.4 5 µA BURST Threshold Voltage Falling Edge 0.87 0.97 1.07 V
OUT
V
OUT
V
IN
PGOOD
= 0V, I
The denotes the specifications which apply over the full operating
= 3.3V, RT = 28k, unless otherwise noted.
OUT
= 0V (Initial Start-Up) 1.00 V > 2.4V 0.65 V
= 1mA 12.0 50 mV
SINK
= 20mA 0.25 0.5 V
SINK
= 5.5V 0.01 1 µA
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired.
Note 2: The LTC3421E is guaranteed to meet performance specifications from 0°C to 70°C. Specifications over the 40°C to 85°C operating temperature range are assured by design, characterization and correlation with statistical process controls.
Note 3: Current is measured into the V bootstrapped to the output. The current will reflect to the input supply by (V
) • Efficiency. The outputs are not switching.
OUT/VIN
pin since the supply current is
OUTS
Note 4: Once V supply.
Note 5: This IC includes overtemperature protection that is intended to protect the device during momentary overload conditions. Junction temperature will exceed 125°C when overtemperature protection is active. Continuous operation above the specified maximum operating junction temperature may impair device reliability.
is greater than 2.4V, the IC is not dependent on the V
OUT
IN
3421f
3
LTC3421
OUTPUT CURRENT (mA)
0
START VOLTAGE (V)
1.00
1.05
1.10
200
3421 G09
0.95
0.90
0.80 50
100
150
0.85
1.20
1.15
UW
TYPICAL PERFOR A CE CHARACTERISTICS
(TA = 25°C, unless otherwise specified)
Single Cell to 3.3V Efficiency
100
Burst Mode OPERATION
90 80 70 60 50 40
EFFICIENCY (%)
30 20
V
= 3.3V
10
OUT
= 1MHz
f
OSC
0
0.1 10 100 1000
1 OUTPUT CURRENT (mA)
VIN = 1.2V
Burst Mode Operation Load Transient Response Inrush Current Control
V
OUT
50mV/DIV
AC COUPLED
SW
INDUCTOR
CURRENT
0.5A/DIV
VIN = 1.5V
VIN = 1V
3421 G01
2-Cell to 3.3V Efficiency Li-Ion to 5V Efficiency
100
Burst Mode OPERATION
90 80 70 60 50 40
EFFICIENCY (%)
30 20
V
10
OUT
f
OSC
0
0.1 10 100 1000
V
OUT
100mV/DIV
AC COUPLED
600mA
I
OUT
50mA
VIN = 3V
= 3.3V
= 1MHz
1 OUTPUT CURRENT (mA)
VIN = 2.4V
VIN = 2V
3421 G02
100
90
Burst Mode
80
OPERATION
70 60 50 40
EFFICIENCY (%)
30 20
V
= 5V
10
OUT
= 1MHz
f
OSC
0
0.1 10 100 1000
V
OUT
1V/DIV
INDUCTOR
CURRENT
0.5A/DIV
1 OUTPUT CURRENT (mA)
VIN = 4.2V
= 3.6V
V
IN
= 2.7V
V
IN
3421 G03
100
90 80 70 60
50 40
EFFICIENCY (%)
30 20 10
0
4
2.5µs/DIV
3421 G04
= 2.4V 2.5ms/DIV 3421 G05
V
IN
V
= 3.3V
OUT
= 44µF
C
OUT
Efficiency vs Frequency Efficiency vs V
100
f = 300kHz
f = 3MHz
f = 1MHz
1
10 100 1000
OUTPUT CURRENT (mA)
VIN = 2.4V V
OUT
= 3.3V
3421 G07
90 80 70 60 50 40
EFFICIENCY (%)
30 20
10
0
1
1.5 2.5
2
INPUT VOLTAGE (V)
IN
PMOS LDO MODE
3
3.5
V
OUT
I
OUT
VIN > V
4
= 3.3V
= 200mA
OUT
4.5
3421 G08
= 0V TO 2.4V 500µs/DIV 3421 G06
V
IN
C
= 44µF
OUT
Start-Up Voltage vs Output Current
5
3421f
UW
TYPICAL PERFOR A CE CHARACTERISTICS
LTC3421
(TA = 25°C, unless otherwise specified)
Burst Mode Threshold vs R
180
160
140
120
100
80
60
OUTPUT CURRENT (mA)
40
20
INTO BURST
0
20
OUT OF BURST
70
R
BURST
BURST
120
(k)
3421 G10
FB Voltage Frequency Accuracy
1.24
1.23
1.22
VOLTAGE (V)
1.21
1.20 –45
–30 –15 0 15
TEMPERATURE (°C)
30 45 60 75 90
3421 G11
Burst Mode Quiescent Current Current Limit Accuracy R
20
15
10
CURRENT (µA)
5
0
–45
–30 –15 0 15
TEMPERATURE (°C)
30 45 60 75 90
3421 G13
1.70
R
LIM
1.65
1.60
1.55
1.50
1.45
1.40
CURRENT (A)
1.35
1.30
1.25
1.20
–30 0
–45
= 105k
–15
TEMPERATURE (°C)
30 90
45
15
60
75
3421 G14
1.03
1.01
0.99
FREQUENCY (MHz)
0.97
0.95 –45
–30 –15 0 15
DS(ON)
0.20
0.18
0.16
0.14
0.12
0.10
0.08
RESISTANCE ()
0.06
0.04
0.02
0
–30 0
–15
–45
TEMPERATURE (°C)
TEMPERATURE (°C)
30 45 60 75 90
PMOS
NMOS
30 90
45
15
3421 G12
60
75
3421 G15
UUU
PI FU CTIO S
FB (Pin 1): Feedback Pin. Connect resistor divider tap here. The output voltage can be adjusted from 2.4V to
5.25V. The feedback reference voltage is typically 1.220V. SHDN (Pin 2): Shutdown Pin. Less than 0.25V on this pin
shuts down the IC. The IC is enabled when the SHDN voltage is greater than 1V. Once V hysteresis is applied to the pin (–500nA out of the pin) allowing it to operate at a logic high while the battery can drop to 0.5V.
V
(Pin 3): Buffered 1.22V Reference Output. This pin
REF
can source up to 100µA and sink up to 8µA. This pin must be decoupled with a 0.1µF capacitor for stability.
is above 2.2V,
OUT
ENB (Pin 4): Reference Output (V Comparator Enable. When ENB = Low, the V
) and Low-Battery
REF
output and
REF
low-battery comparator are disabled, which lowers the quiescent current by 5µA. When ENB = High, the V
REF
output and the low-battery comparator are enabled. Dur­ing shutdown, if the ENB = High and the output voltage is pulled up to greater than 2.5V from a secondary source such as a coin cell through a Schottky diode, the V
REF
output and low-battery comparator becomes powered from the output voltage and enabled.
3421f
5
LTC3421
UUU
PI FU CTIO S
RT (Pin 5): Connect a resistor to ground to program the oscillator frequency according to the formula:
OSC
28 100,
=
R
T
is in kHz and RT is in kΩ.
OSC
f
where f SS (Pin 6): Soft-Start Pin. Connect a capacitor from this
pin to ground to set the soft-start time according to the formula:
t(ms) = CSS(µF) • 320
The nominal soft-start charging current is 2.5µA. The active range of SS is from 0.8V to 1.6V.
SYNC (Pin 7): Oscillator Synchronization Pin. A clock pulse width of 100ns to 2µs is required to synchronize the internal oscillator. If not used SYNC should be grounded.
I
(Pin 8): Current Limit Adjust Pin. Connect a resistor
LIM
from this pin to ground to set the peak current limit thresh­old for the N-channel MOSFET according to the formula (note that this is the peak current in the inductor):
GND (Pin 10): Signal Ground Pin. Connect to ground plane near the RT resistor, error amp compensation compo­nents and feedback divider.
PGND (Pins 11 to 13): Source Terminal of Power Internal N-Channel MOSFET.
SW (Pins 14 to 16): Switch Pin for Inductor Connection. For applications where V SW to V
or to a snubber circuit is required to maintain
OUT
> 4.3V, a Schottky diode from
OUT
absolute maximum rating for SW. (see Application Cir­cuits for 5V).
V
(Pins 17, 19 and 20): The output of the synchronous
OUT
rectifier and bootstrapped power source for the IC. A ceramic bypass capacitor is required to be very close to the V
V
OUTS
and PGND pins of the IC.
OUT
(Pin 18): V
Sense Pin. Connect V
OUT
OUTS
directly to an output filter capacitor. The top of the feedback divider network should also be tied to this point.
VIN (Pin 21): Input Supply Pin. Connect this pin to the input supply and decouple with at least a 4.7µF ceramic capacitor.
LIM
150
=
R
I
where I is in amps and R is in k. BURST (Pin 9): Burst Mode Threshold Adjust Pin. A
resistor/capacitor combination from this pin to ground programs the average load current at which automatic Burst Mode operation is entered, according to the formula:
R
BURST
where R
C
BURST
where C
BURST
BURST(MIN)
2
=
I
BURST
is in k and I
CV
OUT OUT
,10 000
and C
BURST
are in µF.
OUT
is in amps.
For manual control of Burst Mode operation, ground the BURST pin to force Burst Mode operation or connect it to V
to force fixed frequency PWM mode. Note that the
OUT
BURST pin must not be pulled higher than V
OUT
.
LBO (Pin 22): Open-Drain Output. This pin pulls low when the LBI input is below 0.6V. The open-drain output can sink up to 20mA. During Burst Mode operation LBO is only active during the time the IC wakes up to service the output.
LBI (Pin 23): Low-Battery Comparator Input. Typical threshold voltage is 0.6V with 30mV hysteresis. This function is enabled when the ENB pin is high. The low­battery comparator will operate off VIN or V
, whichever
OUT
is greater. VC (Pin 24): Error Amp Output. A frequency compensation
network is connected from this pin to ground to compen­sate the loop. See the section Compensating the Feedback Loop for guidelines.
Exposed Pad (Pin 25): Ground. This pin must be soldered to the PCB and is typically connected through the power GND plane.
3421f
6
BLOCK DIAGRA
W
+
LTC3421
1V TO 4.5V
21
V
IN
ANTIRING
VINV
ANTICROSS
CONDUCTION
CURRENT
LIMIT
SHDN
ENB
V
REF
SHUTDOWN
1.22V REF 2%
THERMAL
REG/SHDN
PWM
LOGIC
2
V
4
OUT
3
14
15
16
SW
SW
DD
NMOS
SW
I
SENSE
AMP
PMOS
V
IN
WELL SWITCH
+
I
ZERO
AMP
V
18
OUTS
V
OUT
17
V
OUT
19
V
OUT
20
R1
V
OUT
2.40V TO 5.25V
+
I
LIM
BURST
8
SS
6
FB
1
V
C
24
9
R
C1
C
SS
R2
C
P
R
Z
SLEEP
OFF
CURRENT
COMP
+
++
Σ
Burst Mode
CONTROL
1%
ERROR
AMP
I
LIMIT
150k/R
+
=
C1
1.22V
I/3000
+
SYNC
R1
R2
0.97V/1.05V
LBO
22
13
3421 BD
3421f
EXPOSED
PAD
25
+
–3%
BURST
COMP
+
3%
PGND
PGND12PGND
11
R
T
SYNC
LBI
0.6V/
OSC
V
+
INVOUT
ENB
SLOPE COMP
GND
10
5
7
IN
23
0.63V
UV
OV
7
LTC3421
OPERATIO
U
LOW VOLTAGE START-UP
The LTC3421 includes an independent start-up oscillator designed to start-up at input voltages of 0.85V typical. The frequency and peak current limit during start-up are inter­nally controlled. The device can start-up under some load (see graph of Start-Up Current vs Input Voltage). Soft­start and inrush current limiting are provided during start­up as well as normal mode. The same soft-start capacitor is used for each operating mode.
When either VIN or V normal operating mode. Once the output voltage exceeds the input by 0.3V, the IC powers itself from V of VIN. At this point the internal circuitry has no depen­dency on the VIN input voltage, eliminating the require­ment for a large input capacitor. The input voltage can drop as low as 0.5V without affecting circuit operation. The limiting factor for the application becomes the availability of the power source to supply sufficient energy to the output at the low voltages and the maximum duty cycle, which is clamped at 91% typical.
exceeds 2.25V, the IC enters
OUT
instead
OUT
Oscillator
The frequency of operation is set through a resistor from the RT pin to ground. An internally trimmed timing capaci­tor resides inside the IC. The oscillator can be synchro­nized with an external clock applied to the SYNC pin. When synchronizing the oscillator, the free running frequency must be set to an approximately 30% lower frequency than the desired synchronized frequency.
Current Sensing
Lossless current sensing converts the peak current signal to a voltage to sum in with the internal slope compensa­tion. This summed signal is compared to the error ampli­fier output to provide a peak current control command for the PWM. The slope compensation in the IC is adaptive to the input voltage and output voltage. Therefore, the con­verter provides the proper amount of slope compensation to ensure stability, but not an excess to cause a loss of phase margin in the converter.
Error Amplifier
LOW NOISE FIXED FREQUENCY OPERATION
Shutdown
The part is shut down by pulling SHDN below 0.3V, and activated by pulling the pin initially above 1V and maintain­ing a high state down to 0.5V. Note that the SHDN pin can be driven above VIN or V than the absolute maximum rating.
Soft-Start
The soft-start time is programmed with an external capaci­tor to ground on the SS pin. An internal current source charges it with a nominal 2.5µA. The voltage on the SS pin (in conjunction with the external resistor on the I is used to control the peak current limit until the voltage on the capacitor exceeds 1.6V, at which point the external resistor sets the peak current. In the event of a com­manded shutdown or a thermal shutdown, the capacitor is discharged automatically. Note that Burst Mode operation is inhibited during the soft-start time.
as long as it is limited to less
OUT
LIM
pin)
The error amplifier is a transconductance amplifier, with its positive input internally connected to the 1.22V refer­ence and its negative input connected to FB. A simple compensation network is placed from COMP to ground. Internal clamps limit the minimum and maximum error amplifier output voltage for improved large-signal tran­sient response. During sleep (in Burst Mode operation), the compensation pin is high impedance; however, clamps limit the voltage on the external compensation network, preventing the compensation capacitor from discharging to zero during the sleep time.
Current Limit
The programmable current limit circuit sets the maximum peak current. This clamp level is programmed with a resistor from I current limit is automatically set to a nominal value of 0.6A peak for optimal efficiency.
LIM
150
=
I
to ground. In Burst Mode operation, the
LIM
R
t(ms) = CSS(µF) • 320
8
where I is in amps and R is in k.
3421f
OPERATIO
LTC3421
U
Zero Current Amplifier
The zero current amplifier monitors the inductor current to the output and shuts off the synchronous rectifier once the current is below 50mA typical, preventing negative induc­tor current.
Antiringing Control
The antiringing control places a resistor across the inductor to damp the ringing on the SW pin in discontinu­ous conduction mode. The LCSW ringing (L = inductor, CSW = capacitance on SW pin) is low energy, but can cause EMI radiation.
V
REF
The internal 1.22V reference is buffered and brought out to REFOUT. It is active when the ENB pin is pulled high (above 1.4V). For stability, a minimum of a 0.1µF capacitor must be placed on the pin. The output can source up to 100µA and sink up to 8µA. For the lowest possible quies- cent current in Burst Mode operation, the reference output should be disabled by grounding the ENB pin.
increasing the output capacitance. Another method of reducing Burst Mode ripple is to place a small feed­forward capacitor across the upper resistor in the V feedback divider network.
During Burst Mode operation, the VC pin is disconnected from the error amplifier in an effort to hold the voltage on the external compensation network where it was before entering Burst Mode operation. To minimize the effects of leakage current and stray resistance, voltage clamps limit the min and max voltage on VC during Burst Mode opera­tion. This minimizes the transient experienced when a heavy load is suddenly applied to the converter after being in Burst Mode operation for an extended period of time.
For automatic operation, an RC network should be con­nected from BURST to ground. The value of the resistor will control the average load current (I Burst Mode operation will be entered and exited (there is hysteresis to prevent oscillation between modes). The equation given for the capacitor on BURST is for the minimum value to prevent ripple on BURST from causing the part to oscillate in and out of Burst Mode operation at the current where the mode transition occurs.
BURST
) at which
OUT
Burst Mode OPERATION
Burst Mode operation can be automatic or user controlled. In automatic operation, the IC will automatically enter Burst Mode operation at light load and return to fixed frequency PWM mode for heavier loads. The user can program the average load current at which the mode transition occurs using a single resistor.
The oscillator is shut down in this mode, since the on time is determined by the time it takes the inductor current to reach a fixed peak current and the off time is determined by the time it takes for the inductor current to return to zero.
In Burst Mode operation, the IC delivers energy to the output until it is regulated and then goes into a sleep mode where the outputs are off and the IC is consuming only 12µA of quiescent current. In this mode, the output ripple has a variable frequency component with load current and will be typically 2% peak-peak. This maximizes efficiency at very light loads by minimizing switching and quiescent losses. Burst Mode ripple can be reduced slightly by
R
BURST
where R
where C In the event that a sudden load transient causes FB to
deviate by more than 4% from the regulation value, an internal pull-up is applied to BURST, forcing the part quickly out of Burst Mode operation. For optimum tran­sient response when going between Burst Mode operation and PWM mode, the mode should be controlled manually by the host. This way PWM mode can be commanded before the load step occurs, minimizing output voltage droop. For manual control of Burst Mode operation, the RC network can be eliminated. To force fixed frequency PWM mode, BURST should be connected to V force Burst Mode operation, BURST should be grounded.
C
BURST
BURST
BURST(MIN)
2
=
I
BURST
is in k and I
CV
OUT OUT
,10 000
and C
BURST
are in µF.
OUT
is in amps.
OUT
. To
3421f
9
LTC3421
OPERATIO
U
Simplified Diagram of Automatic Burst Mode Control Circuit
V
CC
1mA I
V
REF
–4%
FB
1
+
REF
+
V ±1%
UV
ERROR AMP/ SLEEP COMP
24
SSDONE
V
C
R
COMP
C
COMP
TO MODULATOR
CLAMP
0.5V TO 1V
9
0.9V/
1.1V
BURST
R
B
/3000
OUT
SSDONE
+
C
B
SLEEP
MODE 1 = Burst Mode OPERATION 0 = PWM MODE
3421 TA03
The circuit connected to BURST should be able to sink or source up to 2mA. Note that Burst Mode operaton is inhibited during start-up and soft-start.
Note that if VIN is above V
– 0.3V, the part will exit Burst
OUT
Mode operation and the synchronous rectifier will be disabled.
Note that if the load applied during forced Burst Mode operation exceeds the current that can be supplied, the output voltage will start to droop and the part will auto­matically come out of Burst Mode operation and enter fixed frequency mode, raising V
. The maximum current that
OUT
can be supplied in Burst Mode operation is given by:
10
I
O MAX
()
=
2
055
VV
+
1
()
OUT IN
V
IN
in amps
.
OUTPUT DISCONNECT AND INRUSH LIMITING
The LTC3421 is designed to allow true output disconnect by eliminating body diode conduction of the internal P-channel MOSFET rectifier. This allows V
to go to zero
OUT
volts during shutdown without drawing any current from the input source. It also allows for inrush current limiting at turn-on, minimizing surge currents seen by the input supply. Note that to obtain the advantages of output
3421f
OPERATIO
LTC3421
U
disconnect, there must not be any external Schottky diodes connected between the SW pins and V
OUT
.
Note: Board layout is extremely critical to minimize volt­age overshoot on the SW pins due to stray inductance. Keep the output filter capacitors as close as possible to the
WUUU
APPLICATIO S I FOR ATIO
COMPONENT SELECTION
V
24 23 22 21 20 19
LBI LBO VINV
V
C
FB
1
2
SHDN
3
V
REF
4
ENB
R
5
T
SS
6
I
LIM
SYNC
BURST GND PGND PGND
7 8 9 10 11 12
OUTVOUT
V
OUTS
V
PGND
OUT
SW
SW
SW
V
OUT
18
17
16
15
14
13
3421 F01
Figure 1. Recommended Component Placement. Traces Carrying High Current are Direct (PGND, SW, V
). Trace Area at FB and
OUT
VC are Kept Low. Lead Length to Battery Should be Kept Short. VIN and V
Ceramic Capacitors Should be as Close to the IC
OUT
Pins as Possible
Inductor Selection
The high frequency operation of the LTC3421 allows the use of small surface mount inductors. The minimum inductance value is proportional to the operating fre­quency and is limited by the following constraints:
3
L
and L
>>
VV V
IN MIN OUT MAX IN MIN
f
•–
()
() ( ) ()
••
f Ripple V
OUT MAX
()
IN
GND
MULTIPLE VIAS TO GROUND PLANE
V
pins and use very low ESR/ESL ceramic capacitors,
OUT
tied to a good ground plane. In V a Schottky diode is required from the switch nodes to V
> 4.3V applications,
OUT
OUT
to limit the peak switch voltage to less than 6V unless some form of external snubbing is employed. (See 5V Applications section.)
where
f = Operating Frequency in MHz Ripple = Allowable Inductor Current Ripple (Amps
Peak-Peak) V V
= Minimum Input Voltage
IN(MIN) OUT(MAX)
= Maximum Output Voltage
The inductor current ripple is typically set to 20% to 40% of the maximum inductor current.
For high efficiency, choose an inductor with high fre­quency core material, such as ferrite, to reduce core loses. The inductor should have low ESR (equivalent series resistance) to reduce the I2R losses and must be able to handle the peak inductor current without saturating. Molded chokes or chip inductors usually do not have enough core to support peak inductor currents in the 1A to 4A region. To minimize radiated noise, use a toroidal or shielded inductor. See Table 1 for suggested inductor suppliers and Table 2 for a list of capacitor suppliers.
Table 1. Inductor Vendor Information
SUPPLIER PHONE FAX WEB SITE
Coilcraft (847) 639-6400 (847) 639-1469 www.coilcraft.com Coiltronics (561) 241-7876 (516) 241-9339 Murata USA: USA: www.murata.com
(814) 237-1431 (814) 238-0490 (800) 831-9172
Sumida USA: USA: www.sumida.com
(847) 956-0666 (847) 956-0702 Japan: Japan:
81-3-3607-5111 81-3-3607-5144 TDK (847) 803-6100 (847) 803-6296 www.component.tdk.com TOKO (847) 297-0070 (847) 669-7864 www.toko.com
3421f
11
LTC3421
WUUU
APPLICATIO S I FOR ATIO
Output Capacitor Selection
The output voltage ripple has two components to it. The bulk value of the capacitor is set to reduce the ripple due to charge into the capacitor each cycle. The maximum ripple due to charge is given by:
IV
V
RBULK
=
PIN
CVf
••
OUT OUT
where IP = peak inductor current. The ESR (equivalent series resistance) is usually the most
dominant factor for ripple in most power converters. The ripple due to capacitor ESR is simply given by:
V
where C
RCESR
ESR
= IP • C
ESR
= capacitor series resistance.
Low ESR capacitors should be used to minimize output voltage ripple. For surface mount applications, AVX TPS series tantalum capacitors, Sanyo POSCAP or Taiyo Yuden ceramic capacitors are recommended. For through-hole applications, Sanyo OS-CON capacitors offer low ESR in a small package size.
In some layouts it may be necessary to place a 1µF low ESR ceramic capacitor as close to the V
and GND pins as
OUT
possible.
Input Capacitor Selection
The input filter capacitor reduces peak currents drawn from the input source and reduces input switching noise. Since the IC can operate at voltages below 0.5V once the output is regulated, the demand on the input capacitor is much less. In most applications 1µF per amp of peak input current is recommended. Taiyo Yuden offers very low ESR ceramic capacitors, for example the 1µF in a 0603 case (JMK107BJ105MA).
Table 2. Capacitor Vendor Information
SUPPLIER PHONE FAX WEB SITE
AVX (803) 448-9411 (803) 448-1943 www.avxcorp.com Sanyo (619) 661-6322 (619) 661-1055 www.sanyovideo.com TDK (847) 803-6100 (847) 803-6296 www.component.tdk.com Murata USA: USA: www.murata.com
(814) 237-1431 (814) 238-0490 (800) 831-9172
Taiyo Yuden (408) 573-4150 (408) 573-4159 www.t-yuden.com
Operating Frequency Selection
There are several considerations in selecting the operating frequency of the converter. The first is, which are the sen­sitive frequency bands that cannot tolerate any spectral noise? The second consideration is the physical size of the converter. As the operating frequency goes up, the induc­tor and filter capacitors go down in value and size. The trade off is in efficiency since the switching losses due to gate charge are going up proportional with frequency.
Another operating frequency consideration is whether the application can allow “pulse skipping.” In this mode, the minimum on time of the converter cannot support the duty cycle, so the converter ripple will go up and there will be a low frequency component of the output ripple. In many applications where physical size is the main criterion, running the converter in this mode is acceptable. In appli­cations where it is preferred not to enter this mode, the maximum operating frequency is given by:
f
MAX NOSKIP
where t
ON(MIN)
=
Vt
OUT ON MIN_()
Hz
= minimum on time = 120ns.
VV
OUT IN
Thermal Considerations
To deliver the power that the LTC3421 is capable of, it is imperative that a good thermal path be provided to dissipate the heat generated within the package. This can be accomplished by taking advantage of the large thermal pad on the underside of the IC. It is recommended that mul­tiple vias in the printed circuit board be used to conduct heat away from the IC and into a copper plane with as much area as possible. In the event that the junction tempera­ture gets too high, the peak current limit will automatically be decreased. If the junction temperature continues to rise, the part will go into thermal shutdown, and all switching will stop until the temperature drops.
VIN > V
Operation
OUT
The LTC3421 will maintain voltage regulation when the input voltage is above the output voltage. This is achieved by terminating the switching on the synchronous PMOS and applying VIN statically on the gate. This will ensure the
3421f
12
WUUU
f
V
IL
RHPZ
IN
OUT
=
π
2
2• •
APPLICATIO S I FOR ATIO
LTC3421
volts • seconds of the inductor will reverse during the time current is flowing to the output. Since this mode will dissipate more power in the IC, the maximum output current is limited in order to maintain an acceptable junction temperature.
125
T
I
OUT MAX
()
=
•.
40 1 5
VV
()
()
IN OUT
A
+
where TA = ambient temperature. For example at VIN = 4.5V and V
= 3.3V, the maximum
OUT
output current is 370mA.
Short Circuit
The LTC3421 output disconnect feature allows output short circuit while maintaining a maximum set current limit. The IC has incorporated internal features such as current limit and thermal shutdown for protection from an excessive overload or short circuit. In applications that require a pro­longed short circuit, it is recommended to limit the power dissipation in the IC to maintain an acceptable junction temperature. The circuit in Figure 2 will limit the maximum current during a prolonged short by reducing the current limit value in a short circuit by disconnecting R2 with the N-channel MOSFET switch. R3 and C1 provide a soft-start function after a short circuit. Resistor R1 lowers the cur­rent limit value as VIN rises, maintaining a relatively con­stant power. The current limit equation for the circuit in Figure 2 is given by:
Closing the Feedback Loop
The LTC3421 uses current mode control with internal adaptive slope compensation. Current mode control elimi­nates the 2nd order filter due to the inductor and output capacitor exhibited in voltage mode controllers, and sim­plifies it to a single pole filter response. The product of the modulator control to output DC gain and the error amp open-loop gain gives the DC gain of the system:
V
GG
=
G
DC EA
G
CONTROL
CONTROL_OUTPUT
V
•,2
I
OUT
IN
=≈
••
G
EA
2000
V
REF
OUT
The output filter pole is given by:
I
f
FILTER POLE
where C
=
_
is the output filter capacitor.
OUT
OUT
••
π
VC
OUT OUT
The output filter zero is given by:
f
FILTER ZERO
where R
_
ESR
=
•• •
2
is the capacitor equivalent series resistance.
1
RC
π
ESR OUT
A troublesome feature of the boost regulator topology is the right-half plane zero (RHP) and is given by:
I
LIMIT
where I
06 06
=
R
is in Amps; R
LIMIT
Figure 2. Current Limit Foldback Circuit for Extended Short Conditions
.
LIM
I
LIM
8
R
LIM
100k
V
VN2222
IN
TO V
–.
R
1
IN
R1 1M
R2 50k
250
and R1 are in kΩ.
LIM
R3
10k
C1
0.1µF
3421 F02
TO V
OUT
At heavy loads this gain increase with phase lag can occur at a relatively low frequency. The loop gain is typically rolled off before the RHP zero frequency.
The typical error amp compensation is shown in Figure 3. The equations for the loop dynamics are as follows:
f
POLE
f
ZERO
f
POLE
1
2206
1
2
2
2
1
π
••
eC
1
π
•• •
RC
ZC
1
π
•• •
RC
ZC
which is extremely close to DC
C
1
1
2
3421f
13
LTC3421
WUUU
APPLICATIO S I FOR ATIO
U
TYPICAL APPLICATIO
5V Applications
ERROR
AMP
+
1.22V
FB
1
V
C
24
Figure 3
V
OUT
R1
R2
C
R
Z
C
C1
C2
3421 F03
When the output voltage is programmed above 4.3V it is necessary to add a Schottky diode either from SW to V
, or to a snubber network in order to maintain an
OUT
acceptable peak voltage on SW. The Schottky to the
V
2.7V TO
4.2V
Li-Ion
IN
C1* 10µF
+
*LOCATE COMPONENTS CLOSE TO PINS C1: TAIYO YUDEN JMK212BJ106MM C5: TAIYO YUDEN JMK325BJ226MM
23 22
R1 60k
C2
0.1µF
SHDN
4
ENB
3
V
REF
LBI LBO
7
SYNC
8
I
LIM
SS R
L1
3µH
221141516
SW SW
V
IN
LTC3421
GND
T
PGND PGNDPGND
R2 28k
SW
V
BURST
D1: MOTOROLA MBR0520L L1: SUMIDA CDRH6D28-3R0 M1: ZETEX ZXM61P025
OUTS
V
OUT
V
OUT
V
OUT
FB V
C
1312111056
0.1µF
D1*
18 17 19 20 1 24 9
C3
C4
470pF
R3 10k
R4
100k
output will provide a peak efficiency improvement but will negate the output disconnect feature. If output disconnect is required, the Schottky to an active snubber network is suggested as shown in Figure 4.
M1
R5
1.13M
R6 365k
C6*
1µF
C5* 22µF ×2
3421 F04
100
V
OUT
5V 1A
90 80 70 60 50 40
EFFICIENCY (%)
30 20 10
0
Li-Ion to 5V Efficiency
Burst Mode
OPERATION
V
= 5V
OUT
= 1MHz
f
OSC
0.1 10 100 1000
1 OUTPUT CURRENT (mA)
VIN = 4.2V
= 3.6V
V
IN
= 2.7V
V
IN
3421 G03
14
Figure 4. Lithium-Ion to 5V at 1A Application with an Active Snubber Circuit
3421f
PACKAGE DESCRIPTIO
LTC3421
U
UF Package
24-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1697)
0.70 ±0.05
4.50 ± 0.05
3.10 ± 0.05
2.45 ± 0.05
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
4.00 ± 0.10
(4 SIDES)
PIN 1 TOP MARK (NOTE 5)
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)—TO BE APPROVED
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
6. DRAWING NOT TO SCALE
0.25 ±0.05
0.50 BSC
PACKAGE OUTLINE
0.75 ± 0.05
2.45 ± 0.10
(4-SIDES)
0.200 REF
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
0.23 TYP
(4 SIDES)
24
23
0.38 ± 0.10
1 2
(UF24) QFN 0603
0.25 ± 0.05
0.50 BSC
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen­tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3421f
15
LTC3421
TYPICAL APPLICATIO
U
Single Cell to 3.3V at 500mA with Secondary Cell Backup During Shutdown. LOWBAT and V
L1
R2 28k
V
IN
LTC3421
GND
4.7µH
SW SW
SW
V
OUTS
V
V
V
BURST
PGND PGNDPGND
OUT
OUT
OUT
FB V
1312111056
0.1µF
18 17 19 20
1 24
C
9
C3
470pF
R3 40k
V
IN
1V TO 1.5V
1 CELL
PRIMARY CELL
C1*
4.7µF
301k
+
604k
*LOCATE COMPONENTS CLOSE TO PINS C1: TAIYO YUDEN JMK212BJ106MM
0.1µF
LOW BAT
OUTPUT
R1 60k
0.1µF
221141516
SHDN
4
ENB
3
V
REF
23
LBI
22
LBO
7
SYNC
8
I
LIM
SS R
T
C2
C5: TAIYO YUDEN JMK325BJ226MM L1: TOKO A916CY-4R7M
D1
+
C4
REF
3V SECONDARY CELL
R4 100k
Single Cell to 3.3V Efficiency
100
Burst Mode OPERATION
90 80 70 60 50 40
EFFICIENCY (%)
30 20
V
= 3.3V
10
OUT
= 1MHz
f
OSC
0
0.1 10 100 1000
1 OUTPUT CURRENT (mA)
VIN = 1.5V
VIN = 1.2V
VIN = 1V
3421 G01
Output are Enabled
V
OUT
3.3V 500mA
R5 340k
C5* 22µF
R6 200k
3421 TA05
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I
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SD
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I
SD
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Linear Technology Corporation
16
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
www.linear.com
: 35V/42V, IQ: 4mA, ISD: <12µA,
OUT(MAX)
OUT(MAX)
OUT(MAX)
LINEAR TECHNOLOGY CORPORATION 2003
: 5V, IQ: 19µA/300µA,
OUT(MAX)
: 5.5V, IQ: 38µA,
: 5.5V, IQ: 38µA,
: 5.25V, IQ: 12µA,
OUT(MAX)
LT/TP 1103 1K PRINTED IN USA
3421f
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