LINEAR TECHNOLOGY LTC3215 Technical data

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FEATURES
High Efficiency Operation: 1x, 1.5x or 2x Boost Modes with Automatic Mode Switching
Ultralow Dropout I
Output Current up to 700mA
Low Noise Constant Frequency Operation*
Wide VIN Range: 2.9V to 4.4V
Open/Shorted LED Protection
LED Disconnect in Shutdown
Low Shutdown Current: 2.5µA
4% LED Current Programming Accuracy
Automatic Soft-Start Limits Inrush Current
No Inductors
Tiny Application Circuit (All Components <1mm
Current Control
LED
Profile)
3mm × 3mm 10-Lead DFN Package
U
APPLICATIO S
LED Torch/Camera Light Supply for Cell Phones, PDAs and Digital Cameras
General Lighting and/or Flash/Strobe Applications
LTC3215
700mA Low Noise High
Current LED Charge Pump
U
The LTC®3215 is a low noise, high current charge pump DC/DC converter designed to power high current LEDs. The part includes an accurate programmable current source capable of driving loads up to 700mA from a 2.9V to 4.4V input. Low external parts count (two flying capaci­tors, one programming resistor and two bypass capaci­tors) makes the LTC3215 ideally suited for small, battery­powered applications.
Built-in soft-start circuitry prevents excessive inrush cur­rent during start-up. High switching frequency enables the use of small external capacitors. LED current is pro­grammed with an external resistor. The LED is discon­nected from V
An ultralow dropout current source maintains accurate LED current at very low I switching optimizes efficiency by monitoring the voltage across the LED current source and switching modes only when I
LED
a low profile 3mm × 3mm 10-Lead DFN package.
, LTC and LT are registered trademarks of Linear Technology Corporation.
*Protected by U.S. Patent 6411531.
during shutdown.
IN
voltages. Automatic mode
LED
dropout is detected. The LTC3215 is available in
TYPICAL APPLICATIO
2.9V TO 4.4V
2.2µF
C1
2.2µF
+C1–C2+C2–
C1
V
C
IN
IN
ENDISABLE ENABLE
I
SET
LED1: AOT2015 HPW 1751B
C2
2.2µF
LTC3215
20k 1%
CPO
I
LED
U
3215 TA01a
LED1
I
LED
200mA
C
CPO
4.7µF
100
90
80
70
) (%)
IN
/P
60
LED
50
40
30
EFFICIENCY (P
20
LED = AOT2015 HPW 1751B
10
= 3V TYP AT 200mA
V
F
0
2.8
3.0 3.4
3.2
Efficiency vs V
I
LED
3.6
3.8
VIN (V)
IN
= 200mA
4.0
4.2
3215 TA01b
4.4
3215f
1
LTC3215
WW
W
ABSOLUTE AXI U RATI GS
U
UUW
PACKAGE/ORDER I FOR ATIO
(Note 1)
VIN to GND ............................................... –0.3V to 5.5V
CPO to GND ............................................. –0.3V to 5.5V
EN ................................................... – 0.3V to V
I
, I
CPO
(Note 2) ........................................... 1000mA
ILED
+ 0.3V
IN
CPO Short-Circuit Duration ............................ Indefinite
Storage Temperature Range ................. –65°C to 125°C
Operating Temperature Range (Note 3) .. – 40°C to 85°C
ELECTRICAL CHARACTERISTICS
temperature range, otherwise specifications are at TA = 25°C. V
PARAMETER CONDITIONS MIN TYP MAX UNITS
Input Power Supply
VIN Operating Voltage 2.9 4.4 V
I
Operating Current I
VIN
I
Shutdown Current EN = LOW 2.5 7 µA
VIN
LED Current
LED Current Ratio (I
I
Dropout Voltage Mode Switch Threshold, I
LED
Mode Switching Delay (LED Warmup Time) 2.5 ms
LED Current On Time EN to LED Current On 130 µs
Charge Pump (CPO)
1x Mode Output Voltage I
1.5x Mode Output Voltage I
2x Mode Output Voltage I
1x Mode Output Impedance 0.25
1.5x Mode Output Impedance V
2x Mode Output Impedance V
CLK Frequency 0.6 0.9 1.2 MHz
EN
High Level Input Voltage (VIH) 1.4 V
Low Level Input Voltage (VIL) 0.4 V
Input Current (IIH) –1 1 µA
Input Current (IIL) –1 1 µA
)I
LED/ISET
The denotes the specifications which apply over the full operating
= 3.6V, CIN = C1 = C2 = 2.2µF, C
IN
= 0mA, 1x Mode 300 µA
CPO
= 0mA, 1.5x 7 mA
I
CPO
I
= 0mA, 2x Mode 9.2 mA
CPO
= 200mA to 600mA 3139 3270 3400 mA/mA
LED
= 0mA V
CPO
= 0mA 4.6 V
CPO
= 0mA 5.1 V
CPO
= 3.4V, V
IN
= 3.2V, V
IN
CPO
CPO
C2
C1
CPO
I
LED
I
SET
10-LEAD (3mm × 3mm) PLASTIC DFN
Consult LTC Marketing for parts specified with wider operating temperature ranges.
< 4.6V, C1 = C2 = 2.2µF 1.5
< 5.1V, C1 = C2 = 2.2µF 1.7
TOP VIEW
+
1
+
2
11
3
4
5
DD PACKAGE
T
= 125°C, θJA = 43°C/W
JMAX
EXPOSED PIN (PIN 11) IS GND
MUST BE SOLDERED TO PCB
= 200mA 120 mV
LED
10
9
8
7
6
C1
GND
C2
V
IN
EN
= 4.7µF.
CPO
ORDER PART
NUMBER
LTC3215EDD
DD PART
MARKING
LBPX
IN
V
2
3215f
LTC3215
ELECTRICAL CHARACTERISTICS
temperature range, otherwise specifications are at TA = 25°C. V
The denotes the specifications which apply over the full operating
= 3.6V, CIN = C1 = C2 = 2.2µF, C
IN
CPO
= 4.7µF.
PARAMETER CONDITIONS MIN TYP MAX UNITS
I
SET
V
ISET
I
ISET
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired.
Note 2: Based on long-term current density limitations. Assumes an operating duty cycle of 10% under absolute maximum conditions for
I
= 50µA 1.195 1.22 1.245 V
SET
225 µA
Note 3: The LTC3215E is guaranteed to meet performance specifications from 0°C to 70°C. Specifications over the –40°C to 85°C ambient operating temperature range are assured by design, characterization and correlation with statistical process controls.
durations less than 10 seconds. Max current for continuous operation is 350mA.
UW
TYPICAL PERFOR A CE CHARACTERISTICS
I
Dropout Voltage
LED
vs LED Current
0.8 VIN = 3.6V
0.7
0.6
0.5
0.4
0.3
DROPOUT VOLTAGE (V)
0.2
0.1
0
0 200
LED CURRENT (mA)
400 800600
3216 G01
I
Pin Current
LED
vs I
Pin Voltage
LED
600
500
400
300
PIN CURRENT (mA)
200
LED
I
100
0
0
0.2 0.4 0.6 0.8 I
PIN VOLTAGE (V)
LED
(TA = 25°C unless otherwise specified)
I
vs R
LED
1000
I
= 500mA
LED
800
400mA
300mA
200mA
100mA
1.0
3216 G02
600
(mA)
LED
I
400
200
0
0
515
SET
35
(k)
30
25
40
1573 G06
10
20
R
SET
1x Mode Charge Pump Open-Loop Output Resistance vs Temperature
0.31 I
= 200mA
CPO
OUTPUT RESISTANCE (Ω)
0.29
0.27
0.25
0.23
0.21
0.19
0.17
0.15
VIN = 3.6V
–15 10 60
–40
VIN = 3.3V
35
TEMPERATURE (°C)
VIN = 3.9V
3216 G07
1.5x Mode Charge Pump Open-Loop Output Resistance (1.5VIN – V
1.8
1.6
1.4
1.2
1.0
0.8
0.6
OUTPUT RESISTANCE (Ω)
VIN = 3V
0.4
0.2
85
V
CPO
= C1 = C2 = 2.2µF
C
IN
C
CPO
0
–40
= 4.2V
= 4.7µF
–15 35
)/I
CPO
TEMPERATURE (°C)
vs Temperature
CPO
10
85
60
3216 G05
2x Mode Charge Pump Open-Loop Output Resistance
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
OUTPUT RESISTANCE (Ω)
0.4
0.2
(2VIN – V
VIN = 3V V
CPO
= C1 = C2 = 2.2µF
C
IN
C
CPO
0
–40
)/I
CPO
CPO
= 4.8V
= 4.7µF
–15 35
10
TEMPERATURE (°C)
vs Temperature
85
60
3216 G06
3215f
3
LTC3215
UW
TYPICAL PERFOR A CE CHARACTERISTICS
(TA = 25°C unless otherwise specified)
Input Shutdown Current vs Input Voltage
4.0
3.5
3.0
2.5
2.0
1.5
1.0
INPUT SHUTDOWN CURRENT (µA)
0.5
TA = 85°C
0
2.9 4.5
TA = 25°C
3.3
3.7
INPUT VOLTAGE (V)
TA = –40°C
4.13.1 3.5 3.9
Efficiency vs V
100
90
80
70
) (%)
IN
/P
60
LED
50
40
100mA
30
EFFICIENCY (P
200mA
20
400mA
AOT2015 HPW 1751B
10
= 3V TYP AT 100mA
V
F
0
2.8
3.0 3.4
3.2
4.3
3216 G04
IN
3.6
VIN (V)
930
920
910
900
890
880
870
FREQUENCY (kHz)
860
850
840
4.0
3.8
Oscillator Frequency vs Supply Voltage
TA = 25°C
TA = –40°C
TA = 85°C
3.1 3.5 3.9
2.9 4.5
3.3
3.7
SUPPLY VOLTAGE (V)
4.1
4.3
3216 G03
I
SET/ILED
vs I
3400
3350
3300
3250
3200
CURRENT RATIO
3150
3100
4.2
4.4
3215 G15
0
Current Ratio
Current
LED
85°C
200 400
I
LED
Efficiency vs V
100
90
80
70
) (%)
IN
/P
60
LED
50
40
30
EFFICIENCY (P
20
LED = LXCL-PWF1 LUMILED
10
= 3V TYP AT 200mA
V
F
0
2.8
3.0 3.4
25°C
–40°C
CURRENT (mA)
200mA
3.2
600
IN
VIN (V)
3215 G16
3.6
800
400mA
3.8
600mA
4.0
4.2
4.4
3216 G11
V
CPO
50mV/DIV
A/C COUPLED
4
1.5x Mode CPO Output Ripple
I
IN
CPO
= 3.6V
= 200mA
500ns/DIVV
3216 G12
V
CPO
20mV/DIV
A/C COUPLED
2x Mode CPO Output Ripple
IN
I
CPO
= 3.6V
= 400mA
500ns/DIVV
3216 G13
Charge Pump Mode Switching and Input Current (I
V
CPO
1V/DIV
I
VIN
500mA/
DIV
EN2
5V/DIV
= 3V 1ms/DIV
V
IN
= 400mA)
LED
3215 G14
3215f
LTC3215
U
UU
PI FU CTIO S
C2+, C1+, C2–, C1– (Pins 1, 2, 8, 10): Charge Pump Flying Capacitor Pins. A 2.2µF X5R or X7R ceramic capacitor should be connected from C1+ to C1– and from
+
to C2–.
C2
CPO (Pin 3): Output. CPO is the output of the Charge Pump. This pin may be enabled or disabled using the EN input. A 4.7µF X5R or X7R ceramic capacitor is required from CPO to GND.
I
(Pin 4): Output. I
LED
The LED is connected between CPO (anode) and I (cathode). The current into the I programming resistor connected from I
is the LED current source output.
LED
pin is set by the
LED
to GND.
SET
LED
I
(Pin 5): LED Current Programming Resistor Pin. The
SET
pin will servo to 1.22V. A resistor connected between
I
SET
this pin and GND is used to set the LED current level. Connecting a resistor of 2k or less will cause the LTC3215 to enter overcurrent shutdown mode.
EN (Pin 6): Input. The EN is used to enable the part or put it into shutdown mode.
V
(Pin 7): Power. Supply voltage for the LTC3215. V
IN
IN
should be bypassed with a 2.2µF or greater low impedance ceramic capacitor to GND.
GND (Pin 9): Charge Pump Ground. This pin should be connected directly to a low impedance ground plane.
EXPOSED PAD (Pin 11): Control Signal Ground. This pad must be soldered to a low impedance ground plane for optimum thermal and electrical performance.
BLOCK DIAGRA
V
IN
7
W
OSCILLATOR
2
+
C1
MODE
CONTROL
10
C1
1X MODE: CPO = V
1.5X MODE: CPO = 4.6V 2X MODE: CPO = 5.1V
+
V
REF
1 8
+
C2
IN
DROPOUT
DETECTOR
C2
CPO
3
I
LED
4
EN
6
CONTROL
LOGIC
GND
CURRENT
SOURCE
CONTROL
I
SET
5
GND
119
3215 BD
3215f
5
LTC3215
OPERATIO
U
The LTC3215 uses a fractional switched capacitor charge pump to power a high current LED with a programmed regulated current. The part starts up into the 1x mode. In this mode, VIN is directly connected to CPO. This mode provides maximum efficiency and minimum noise. The LTC3215 will remain in this mode until the LED current source begins to dropout. When dropout is detected, the LTC3215 will switch to 1.5x mode after a soft-start period. Any subsequent dropout detected will cause the part to enter 2x mode. The part may be reset to 1x mode by bringing the part into shutdown mode and then reenabling the part.
A two phase nonoverlapping clock activates the charge pump switches. In the 2x mode, the flying capacitors are charged on alternate clock phases from VIN. While one capacitor is being charged from VIN, the other is stacked on top of VIN and connected to the output. Alternatively, in the 1.5x mode the flying capacitors are charged in series during the first clock phase, and stacked in parallel on top of VIN on the second clock phase. This sequence of charging and discharging the flying capacitors continues at a free running frequency of 900kHz (typ).
Table 1. Charge Pump Output Regulation Voltages
CHARGE PUMP MODE V
1.5x 4.6V
2x 5.1V
In shutdown mode all circuitry is turned off and the LTC3215 draws a very low current from the VIN supply. Furthermore, CPO is weakly connected to VIN. The LTC3215 enters shutdown mode when the EN pin is brought low. Since EN is a high impedance CMOS input it should never be allowed to float. To ensure that its state is defined, it must always be driven with valid logic levels.
Thermal Protection
The LTC3215 has built-in overtemperature protection. Thermal shutdown circuitry will shutdown the I when the junction temperature exceeds approximately 150°C. It will re-enable the I temperature drops back to approximately 135°C. The LTC3215 will cycle in and out of thermal shutdown indefi­nitely without latch up or damage until the heat source is removed.
output once the junction
LED
CPO
LED
output
The current delivered to the LED load is controlled by the internal programmable current source. The value of this current may be selected by choosing the appropriate programming resistor. The resistor is connected between the I the desired current level can be determined by Equation 1.
A resistor value of 2k or less (e.g., a short-circuit) will cause the LTC3215 to enter overcurrent shutdown mode. This mode will prevent damage to the part by shutting down the high power sections of the chip.
Regulation is achieved by sensing the voltage at the CPO pin and modulating the charge pump strength based on the error signal. The CPO regulation voltages are set internally, and are dependent on the charge pump mode as shown in Table 1.
pin and GND. The resistor value needed to attain
SET
R
= 3990/I
SET
LED
(1)
Soft-Start
To prevent excessive inrush current during start-up and mode switching, the LTC3215 employs built-in soft-start circuitry. Soft-start is achieved by increasing the amount of current available to the output charge storage capacitor linearly over a period of approximately 250µs.
Charge Pump Strength
When the LTC3215 operates in either the 1.5x mode or 2x mode, the charge pump can be modeled as a Thevenin­equivalent circuit to determine the amount of current available from the effective input voltage and effective open-loop output resistance, ROL(Figure 1).
6
3215f
OPERATIO
2.2µF 2.2µF
4.7µF
1µF
I
LED
V
IN
2.9V TO 4.4V
2.2µF
EN
LTC3215
C1
+C1–C2+C2–
I
SET
3215 F02b
CPO
1k
9.31k 1%
9.31k 1%
PWM
LTC3215
U
R
OL
+
1.5V
IN
+
OR
2V
IN
3215 F01
CPO
Figure 1. Charge Pump Open-Loop Thevenin-Equivalent Circuit
ROL is dependent on a number of factors including the oscillator frequency, flying capacitor values and switch resistances.
From Figure 1, we can see that the output current is proportional to:
(1.5V
– CPO)/ROL or (2VIN – CPO)/R
IN
OL
(2)
in the 1.5x mode or 2x mode respectively.
LED Current Programming
The LTC3215 includes an accurate, programmable cur­rent source that is capable of driving LED currents up to 350mA continuously and up to 700mA for pulsed opera­tion. Pulsed operation may be achieved by toggling the EN pin. In either continuous or pulsed operation, proper board layout is required for effective heat sinking.
The current may be programmed using a single external resistor. Equation 1, used to calculate the resistor value from the desired current level is repeated below:
For applications requiring multiple current levels, several schemes may be used to change the resistance for the
resistor. Figure 2 shows two such schemes. The
R
SET
circuit in Figure 2a uses the I/O output of a microcontroller to switch a second resistor (R2) in parallel or series with R1, changing the effective I
current. Alternatively, the
SET
circuit in Figure 2b uses a pulse-width modulator (PWM) to vary the current through R
, which changes the LED
SET
current.
Mode Switching
The LTC3215 will automatically switch from 1x mode to
1.5x mode, and subsequently from 1.5x mode to 2x mode whenever a dropout condition is detected at the I
LED
pin. The part will wait approximately 2ms before switching to the next mode. This delay allows the LED to warm up and reduce its forward voltage which may remove the dropout condition.
In order to reset the part back into 1x mode, the LTC3215 must be brought into shutdown (EN = LOW). Immediately after the part has been brought to shutdown, it may be enabled into the 1x mode via the EN pin. An internal comparator will not allow the main switches to connect V
IN
and CPO in 1x mode until the voltage at the CPO pin has decayed to less than or equal to the voltage at the VIN pin.
R
= 3990/I
SET
ON/OFF
TORCH/FLASH
LED
2.9V TO 4.4V
2.2µF
V
IO
V
IO
= [(1.22V/R1) – ((VIO – 1.22V)/R2)] • 3270
= [(1.22V/(R1 • R2/(R1 + R2))] • 3270
R2
*I
TORCH
I
FLASH
µP
(1)
2.2µF 2.2µF
+C1–C2+C2–
C1
V
IN
LTC3215
EN
I
SET
R1
(2a) (2b)
CPO
I
LED
3215 F02a
I
LED
4.7µF
*
Figure 2
3215f
7
LTC3215
WUUU
APPLICATIO S I FOR ATIO
VIN, CPO Capacitor Selection
The value and type of capacitors used with the LTC3215 determine several important parameters such as regulator control loop stability, output ripple, charge pump strength and minimum start-up time.
To reduce noise and ripple, it is recommended that low equivalent series resistance (ESR) ceramic capacitors be used for both C
VIN
and C
. Tantalum and aluminum
CPO
capacitors are not recommended because of their high ESR.
The value of C
directly controls the amount of output
CPO
ripple for a given load current. Increasing the size of C
will reduce the output ripple at the expense of higher
CPO
start-up current. The peak-to-peak output ripple for 1.5x mode is approximately given by the expression:
V
RIPPLE(P-P)
Where f
OSC
cally 900kHz) and C
= I
OUT
/(3f
OSC
• C
) (3)
CPO
is the LTC3215’s oscillator frequency (typi-
is the output storage capacitor.
CPO
Both the style and value of the output capacitor can significantly affect the stability of the LTC3215. As shown in the block diagram, the LTC3215 uses a control loop to adjust the strength of the charge pump to match the current required at the output. The error signal of this loop is stored directly on the output charge storage capacitor. The charge storage capacitor also serves as the dominant pole for the control loop. To prevent ringing or instability, it is important for the output capacitor to maintain at least
2.2µF of actual capacitance over all conditions.
Likewise, excessive ESR on the output capacitor will tend to degrade the loop stability of the LTC3215. The closed loop output resistance of the LTC3215 is designed to be 76m. For a 100mA load current change, the error signal will change by about 7.6mV. If the output capacitor has 76m or more of ESR, the closed-loop frequency re­sponse will cease to roll off in a simple one-pole fashion and poor load transient response or instability could result. Multilayer ceramic chip capacitors typically have exceptional ESR performance. MLCCs combined with a tight board layout will yield very good stability. As the value of C C
controls the amount of output ripple, the value of
CPO
controls the amount of ripple present at the input pin
VIN
(VIN). The input current to the LTC3215 will be relatively constant while the charge pump is on either the input
charging phase or the output charging phase but will drop to zero during the clock nonoverlap times. Since the nonoverlap time is small (~15ns), these missing “notches” will result in only a small perturbation on the input power supply line. Note that a higher ESR capacitor such as tantalum will have higher input noise due to the input current change times the ESR. Therefore, ceramic capaci­tors are again recommended for their exceptional ESR performance. Input noise can be further reduced by pow­ering the LTC3215 through a very small series inductor as shown in Figure 3. A 10nH inductor will reject the fast current notches, thereby presenting a nearly constant current load to the input power supply. For economy, the 10nH inductor can be fabricated on the PC board with about 1cm (0.4") of PC board trace.
Flying Capacitor Selection
10nH
2.2µF0.1µF
Figure 3. 10nH Inductor Used for Input Noise Reduction (Approximately 1cm of Wire)
V
IN
GND
LTC3215
3215 F03
Warning: Polarized capacitors such as tantalum or alumi­num should never be used for the flying capacitors since their voltage can reverse upon start-up of the LTC3215. Ceramic capacitors should always be used for the flying capacitors.
The flying capacitors control the strength of the charge pump. In order to achieve the rated output current it is necessary to have at least 2.2µF of actual capacitance for each of the flying capacitors. Capacitors of different mate­rials lose their capacitance with higher temperature and voltage at different rates. For example, a ceramic capacitor made of X7R material will retain most of its capacitance from –40oC to 85oC whereas a Z5U or Y5V style capacitor will lose considerable capacitance over that range. Z5U and Y5V capacitors may also have a very poor voltage coeffi­cient causing them to lose 60% or more of their capacitance when the rated voltage is applied. Therefore, when compar­ing different capacitors, it is often more appropriate to
3215f
8
WUUU
APPLICATIO S I FOR ATIO
LTC3215
compare the amount of achievable capacitance for a given case size rather than comparing the specified capacitance value. For example, over rated voltage and temperature conditions, a 1µF, 10V, Y5V ceramic capacitor in a 0603 case may not provide any more capacitance than a 0.22µF, 10V, X7R available in the same case. The capacitor manufacturer’s data sheet should be consulted to determine what value of capacitor is needed to ensure minimum capacitances at all temperatures and voltages.
Table 2 shows a list of ceramic capacitor manufacturers and how to contact them.
Table 2. Recommended Capacitor Vendors
AVX www.avxcorp.com
Kemet www.kemet.com
Murata www.murata.com
Taiyo Yuden www.t-yuden.com
Vishay www.vishay.com
TDK www.tdk.com
Layout Considerations and Noise
Due to its high switching frequency and the transient currents produced by the LTC3215, careful board layout is necessary. A true ground plane and short connections to all capacitors will improve performance and ensure proper regulation under all conditions.
The flying capacitor pins C1+, C2+, C1– and C2– will have very high edge rate waveforms. The large dv/dt on these
pins can couple energy capacitively to adjacent PCB runs. Magnetic fields can also be generated if the flying capaci­tors are not close to the LTC3215 (i.e., the loop area is large). To decouple capacitive energy transfer, a Faraday shield may be used. This is a grounded PCB trace between the sensitive node and the LTC3215 pins. For a high quality AC ground, it should be returned to a solid ground plane that extends all the way to the LTC3215.
The following guidelines should be followed when design­ing a PCB layout for the LTC3215.
• The Exposed Pad should be soldered to a large copper
plane that is connected to a solid, low impedance ground plane using plated, through-hole vias for proper heat sinking and noise protection.
• Input and output capacitors (CIN and C
) must also
CPO
be placed as close to the part as possible.
• The flying capacitors must also be placed as close to the
part as possible. The traces running from the pins to the capacitor pads should be as wide as possible.
•VIN, CPO and I
traces must be made as wide as
LED
possible. This is necessary to minimize inductance, as well as provide sufficient area for high current applications.
• LED pads must be large and should be connected to as
much solid metal as possible to ensure proper heat sinking.
C1
C
CPO
PIN 1
RSET
Figure 4. Example Board Layout
C2
C
IN
3215 F04
3215f
9
LTC3215
WUUU
APPLICATIO S I FOR ATIO
Power Efficiency
To calculate the power efficiency (η) of a white LED driver chip, the LED power should be compared to the input power. The difference between these two numbers repre­sents lost power whether it is in the charge pump or the current sources. Stated mathematically, the power effi­ciency is given by:
P
LED
η≡
P
IN
(4)
The efficiency of the LTC3215 depends upon the mode in which it is operating. Recall that the LTC3215 operates as a pass switch, connecting VIN to CPO, until dropout is detected at the I
pin. This feature provides the optimum
LED
efficiency available for a given input voltage and LED forward voltage. When it is operating as a switch, the efficiency is approximated by:
P
η≡ =
P
VI
LEDINLED LED
VIVV
IN IN
LED
IN
(5)
since the input current will be very close to the LED current.
At moderate to high output power, the quiescent current of the LTC3215 is negligible and the expression above is valid.
Once dropout is detected at the I
pin, the LTC3215
LED
enables the charge pump in 1.5x mode.
In 1.5x boost mode, the efficiency is similar to that of a linear regulator with an effective input voltage of 1.5 times the actual input voltage. This is because the input current for a 1.5x charge pump is approximately 1.5 times the load current. In an ideal 1.5x charge pump, the power efficiency would be given by:
η
IDEAL
P
LED
=
P
IN
VI
LED LED
VIVV
•. .15 15
IN LED
LED
IN
(6)
Similarly, in 2x boost mode, the efficiency is similar to that of a linear regulator with an effective input voltage of 2 times the actual input voltage. In an ideal 2x charge pump, the power efficiency would be given by:
η
IDEAL
P
LED
=
P
IN
VI
LED LED
VIVV
•• 22
IN LED
LED
IN
(7)
Thermal Management
For higher input voltages and maximum output current, there can be substantial power dissipation in the LTC3215. If the junction temperature increases above approximately 150°C, the thermal shutdown circuitry will automatically deactivate the output. To reduce maximum junction tem­perature, a good thermal connection to the PC board is recommended. Connecting the Exposed Pad to a ground plane and maintaining a solid ground plane under the device can reduce the thermal resistance of the package and PC board considerably.
10
3215f
PACKAGE DESCRIPTIO
LTC3215
U
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
0.675 ±0.05
3.50 ±0.05
1.65 ±0.05 (2 SIDES)2.15 ±0.05
PACKAGE OUTLINE
0.25 ± 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2). CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
0.50 BSC
2.38 ±0.05 (2 SIDES)
3.00 ±0.10 (4 SIDES)
0.75 ±0.05
0.00 – 0.05
1.65 ± 0.10 (2 SIDES)
R = 0.115
TYP
2.38 ±0.10 (2 SIDES)
BOTTOM VIEW—EXPOSED PAD
106
15
0.25 ± 0.05
0.50 BSC
0.38 ± 0.10
(DD10) DFN 1103
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen­tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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11
LTC3215
TYPICAL APPLICATIO
ON/OFF
U
High Power Camera Light and Flash
2.2µF 2.2µF
+C1–C2+C2–
C1
V
IN
EN
µP
2.9V TO 4.4V
2.2µF
2.8V
LTC3215
CPO
I
LED
I
LED
200mA/500mA
4.7µF
2.8V
TORCH/FLASH
30k
1%
I
SET
10.5k 1%
3215 TA02
RELATED PARTS
PART NUMBER DESCRIPTION COMMENTS
LT1618 Constant Current, 1.4MHz, 1.5A Boost Converter VIN: 1.6V to 18V, V
MS Package
LT1961 1.5A (ISW), 1.25MHz, High Efficiency Step-Up VIN: 3V to 25V, V
DC/DC Converter MS8E Package
LTC3205 250mA, 1MHz, Multi-Display LED Controller VIN: 2.8V to 4.5V, V
DFN Package
LTC3206 400mA, 800kHz, Multi-Display LED Controller VIN: 2.8V to 4.5V, V
DFN Package
LTC3216 1A Low Noise High Current LED Charge Pump with VIN: 2.9V to 4.4V, V
Independent Flash/Torch Current Control DFN Package
LTC3440/LTC3441 600mA/1.2A I
, 2MHz/1MHz, Synchronous VIN: 2.4V to 5.5V, V
OUT
Buck-Boost DC/DC Converter MS/DFN Packages
LTC3443 600mA/1.2A I
, 600kHz, Synchronous VIN: 2.4V to 5.5V, V
OUT
Buck-Boost DC/DC Converter DFN Package
LTC3453 1MHz, 800mA Synchronous Buck-Boost V
: 2.7V to 5.5V, V
IN(MIN)
High Power LED Driver QFN Package
LT3467/LT3467A 1.1A (ISW), 1.3/2.1MHz, High Efficiency Step-Up VIN: 2.4V to 16V, V
DC/DC Converters with Integrated Soft-Start ThinSOT Package
LT3479 3A, 42V, 3.5MHz Boost Converter VIN: 2.5V to 24V, V
DFN, TSSOP Packages
OUT(MAX)
= 36V, IQ = 1.8mA, ISD < 1µA
OUT(MAX)
= 35V, IQ = 0.9mA, ISD < 6µA
= 5.5V, IQ = 50µA, ISD < 1µA
OUT(MAX)
= 5.5V, IQ = 50µA, ISD < 1µA
OUT(MAX)
= 5.5V, IQ = 300µA, ISD < 2.5µA
OUT(MAX)
= 5.25V, IQ = 25µA/50µA, ISD <1µA
OUT(MAX)
= 5.25V, IQ = 28µA, ISD <1µA
OUT(MAX)
: 2.7V to 4.5V, IQ = 2.5mA, ISD < 6µA
IN(MAX)
= 40V, IQ = 1.2mA, ISD < 1µA
OUT(MAX)
= 40V, IQ = 2µA, ISD < 1µA
OUT(MAX)
12
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com
3215f
LT/TP 0305 1K • PRINTED IN USA
© LINEAR TECHNOLOGY CORPORATION 2005
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