LINEAR TECHNOLOGY LTC2978 Technical data

LINEAR TECHNOLOGY
LINEAR TECHNOLOGY
LINEAR TECHNOLOGY
SEPTEMBER 2009 VOLUME XIX NUMBER 3
V
PWR
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IN_EN
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DD33
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DD33
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DD25
SDA SCL ALERTB CONTROL0 CONTROL1 WDI/RESET FAULTB00 FAULTB01 FAULTB10 FAULTB11 SHARE_CLK
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IN_SNS
V
DACP0
V
SENSEP0
V
DACM0
V
SENSEM0
V
OUT_EN0
ASEL0 ASEL1
PWRGD
REFP
REFM
LTC2978*
PMBus
INTERFACE
TO INTEMEDIATE BUS CONVERTER
ENABLE
V
IN
4.5V < V
IBUS
< 15V
GNDWP
V
DD33
TO µP
0.1µF
0.1µF
0.1µF
TO/FROM OTHER
CONTROLLERS
*SOME DETAILS OMITTED FOR CLARITY ONLY ONE OF EIGHT CHANNELS SHOWN
V
IN
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OUT
R20
R30
R10
RUN/SS
SGND
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FB
GND
DC/DC
CONVERTER
LOAD
IN THIS ISSUE…
COVER ARTICLE Power Management IC Digitally
Monitors and Controls Eight Supplies
...........................................................1
Andrew Gardner
Linear in the News… ...........................2
DESIGN FEATURES PD Controller ICs with Integrated
Flyback or Forward Controllers
Meet Demands of 25.5W PoE+ .............6
Ryan Huff
Surge Stopper IC Simplifies Design of Intrinsic Safety Barrier for Electronics Destined for Hazardous Environments
...........................................................9
Murphy Pickard, Hach Co.
Consider New Precision Amplifiers for Updated Industrial Equipment Designs
.........................................................16
Brian Black
Analog VGA Simplifies Design and Outperforms Competing
Gain Control Methods ........................19
Walter Strifler

Power Management IC Digitally Monitors and Controls Eight Supplies

by Andrew Gardner

Introduction
Today’s high reliability systems require complex digital power management solutions to sequence, supervise, monitor and margin a large number of voltage rails. Indeed, it is not unusual for a single application board to have dozens of rails, each with its own unique requirements. Typically the power management solutions for these systems require that several discrete devices controlled by an FPGA or a microcontroller are sprinkled around the board in order to sequence, super­vise, monitor and margin the power supply array. In this scheme, signifi-
cant time is required to develop the necessary firmware, and the tendency to underestimate the complexity and duration of that task is well known.
The LTC®2978 octal PMBus power supply monitor and controller with EEPROM offers power supply system designers an integrated, modular solution that reduces debugging time and effort over microcontroller solu­tions. The LTC2978 can sequence on, sequence off, monitor, supervise, margin and trim up to eight power supplies. Multiple LTC2978s can be
continued on page 3
Accurate Silicon Oscillator Reduces Overall System Power Consumption
.........................................................22
Albert Huntington
Easy Multivoltage Layout with Complete Dual and Triple Output Point-of-Load µModule® Regulators
in 15mm × 15mm Packages...............24
Eddie Beville and Alan Chern
DESIGN IDEAS
....................................................27–40
(complete list on page 27)
New Device Cameos ...........................41
Design Tools ......................................43
Sales Offices .....................................44
Figure 1. Octal power supply controller with PMBus communication. One channel is shown.
L
, Linear Express, Linear Technology, LT, LTC, LTM, BodeCAD, Burst Mode, FilterCAD, LTspice, OPTI-LOOP, Over-The­Top, PolyPhase, SwitcherCAD, µModule and the Linear logo are registered trademarks of Linear Technology Corporation. Adaptive Power, Bat-Track, C-Load, DirectSense, Easy Drive, FilterView, Hot Swap, LTBiCMOS, LTCMOS, LinearView, Micropower SwitcherCAD, Multimode Dimming, No Latency ∆Σ, No Latency Delta-Sigma, No R PanelProtect, PowerPath, PowerSOT, SafeSlot, SmartStart, SNEAK-A-BIT, SoftSpan, Stage Shedding, Super Burst, ThinSOT, TimerBlox, Triple Mode, True Color PWM, UltraFast and VLDO are trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners.
, Operational Filter,
SENSE
L LINEAR IN THE NEWS

Linear in the News…

On the Road in China
For the past several years, Linear has participated in the IIC China Conference. Traditionally, this has been an opportunity for major electronics companies to showcase their product capabilities in the major Chinese centers in Beijing, Shenzhen and Shanghai. This year, for the first time, the IIC is also holding a trade show in the remote area of Wuhan, since this area is a growing technology center, and Linear will participate. This follows Linear’s participation at the IIC Conference in February/March in Shenzhen, Beijing and Xian.
At the IIC in Wuhan on September 14–15, Linear will focus on products for the automotive, industrial and telecom markets. Some of the product highlights include:
q
LED drivers for a range of applications
q
µModule receiver products for cellular basestations
q
DC/DC µModule regulators, providing easy-to-
implement power solutions
q
Battery stack monitors for hybrid and electric
vehicles
At its booth, Linear will run a demo of the LTC6802 Battery Stack Monitor, showing automotive electronics designers how to use the device to precisely monitor every cell in long strings of series-connected lithium-ion batteries.
Linear Debuts Isolated µModule Transceiver with Power
Leveraging its experience in µModule technology, Linear has just announced the first product in a new family of galvanically isolated µModule products aimed for use in industrial networks. The LTM®2881 is a complete isolated RS485/RS422 solution and the first transceiver product to utilize Linear’s isolator µModule technology, integrating a 2500V transceiver and all necessary power components into low profile LGA and BGA packages. No external components are required, eliminating issues with sourcing transformers. In addition, the LTM2881’s 1W DC/DC converter provides surplus current for powering external ICs and LEDs via a 5V regulated output. The LTM2881 exhibits high common mode transient im­munity, >30kV/µs, allowing the LTM2881 to continue communicating, rather than merely holding a data state, through severe transient events.
The features of the LTM2881 make it suit­able for a wide range of applications, including breaking ground loops, working with large com­mon mode voltages and when using multiple unterminated line taps. Integrated selectable termination allows cables to be properly termi­nated to avoid signal reflections and distorted
galvanic isolation barrier, a high performance
RMS
waveforms, with the flexibility to add or remove termination anywhere onto the bus via a software switch. Users will appreciate how the self-powered LTM2881 takes many precautions to guarantee safe and reliable communica­tions in RS485 or RS422 systems.
Solar Power Battery Charger Improves Panel Efficiency
For a given amount of light energy, a solar panel has a certain output voltage for peak output power production. Bypass diodes inside a panel can create complex power versus current characteristics that are not easily optimized when partial shading exists on the panel. However, virtu­ally all of the 12V system solar panels currently on the market that are specified with maximum output power less than 25W are constructed from a simple series cell arrangement with no bypass diodes. This type of arrange­ment yields peak output power within a narrow band of panel output voltages, regardless of lighting conditions. Peak power in excess of 95% may be produced from panel voltages of 12.5V–18.5V, depending on the characteristics of the panel.
ger, the LT®3652, designed to provide an elegant electrical operating characteristic while extracting the maximum available power from the solar panel. The LT3652 employs a simple but innovative input voltage regulation loop, which controls charge current to hold the input voltage at a programmed level. This input regulation loop maintains the panel at the output voltage corresponding to the peak output power point for the particular solar panel used. The specific desired peak-power voltage is programmed via a resistor divider. This method yields charging efficiencies virtually the same as more costly maximum peak power tracking (MPPT) solar charging techniques.
Linear has just announced a solar power battery char-
L
2
2
Linear Technology Magazine • September 2009
DESIGN FEATURES L
LTC2978 #1
SHARE_CLK
FAULT
LTC2978 #2
SHARE_CLK
FAULT
LTC2978 #N
SHARE_CLK
FAULT
POWER SUPPLY
ARRAY
V
OUTn
500mV/DIV
200ms/DIVSTART UP 8 SUPPLIES IN ANY ORDER
SHUT DOWN
8 SUPPLIES
IN ANY ORDER
INDIVIDUAL MARGINING
FOR 8 SUPPLIES
LTC2978, continued from page 1
easily cascaded using the 1-wire share­clock bus and one or more bidirectional fault pins (Figure 1 shows a typical application).
In addition, the LTC2978 uses a protected block of nonvolatile memory to record system voltage and fault information in the event of a critical system failure. Preserving critical system data in nonvolatile memory allows users to identify a failing volt­age rail and isolate the cause of board failures during system development, test debug or failure analysis.
A free, downloadable graphical PC interface is available to facilitate interaction with the part in design and testing. The LTC2978 utilizes the industry standard PMBus command protocol in order to simplify firmware development. The LTC2978’s most important feature, though, is that its precision integrated reference and 15­bit ∆Σ ADC delivers ±0.25% absolute accuracy when measuring or adjusting power supply voltages.
Improve Manufacturing Yields with Precision Margin Testing
Margin testing of system voltages is an effective means of weeding out premature failures in high reliability systems. Typically, voltages are mar­gined at least ±5% in order to guarantee
Linear Technology Magazine • September 2009
Figure 3. Multiple LTC2978s can be cascaded using only two connections.
Figure 2. The LTC2978 offers flexible sequencing and precision margining.
that the system under test is robust enough to operate reliably in the field. Depending on system tolerances, however, this approach can lead to excessive test fallout. Many of these test rejects might have been avoided if the tolerances of the supply voltages in question were tighter.
With its precision reference, mul­tiplexed 15-bit ∆Σ ADC, eight margin DACs and integrated servo algorithm, the LTC2978 offers a relatively easy­to-use, yet powerful, solution to this problem (see Figure 4 for the LTC2978 bock diagram). By simply writing an I2C command to either trim or margin to a specific voltage, the LTC2978 adjusts the DC/DC point-of-load con­verter within the prescribed software
and hardware limits to deliver the
commanded output voltage to ±0.25% absolute accuracy.
The margin DAC outputs are con­nected to the feedback nodes or trim inputs of the DC/DC POL converters via a resistor. The value of this resistor sets a limit on the range over which the output voltage can be margined, an important limitation for power sup­plies under software control. Another significant benefit of the 10-bit margin DACs is that they enable very fine resolution when margining voltages. This makes it possible to extract useful data from failure testing, as opposed to a trashcan full of failed, but not well understood, boards.
Flexible Power Sequencing and Fault Management
Many traditional power sequencing solutions rely on comparators and daisy-chained PCB connections. While relatively easy to implement for a hand­ful of supplies, this approach quickly becomes complicated as the number of voltage rails grows, and is relatively inflexible in the face of specification changes. It’s also extremely difficult to implement turn-off sequencing with this type of approach.
The LTC2978 makes sequencing easy for any number of supplies. By using a time-based algorithm, users can dynamically sequence on and sequence off in any order (see Fig­ure 2). Sequencing across multiple LTC2978s is also possible using the 1-wire share-clock bus and one or more of the bidirectional fault pins (see Figure 3). This approach greatly simplifies system design because channels can be sequenced in any order, regardless of which LTC2978 provides control. Additional LTC2978s can also be added later without hav­ing to worry about system constraints such as a limited supply of daughter card connector pins.
On sequencing can be triggered in response to a variety of conditions. For example, the LTC2978s can auto-se­quence when the downstream DC/DC POL converters’ intermediate bus voltage exceeds a particular turn-on voltage. Alternatively, on sequencing
3
L DESIGN FEATURES
15
3V REGULATOR
INTERNAL
TEMP
SENSOR
REFERENCE
1.232V (TYP)
MASKING
CLOCK
GENERATION
OSCILLATOR
UVLO
V
DD
OPEN-DRAIN
OUTPUT
EEPROM
NONVOLATILE MEMORY
RAM
ADC_RESULTS
MONITOR LIMITS
SERVO TARGETS
PMBus INTERFACE (400kHz I
2
C
COMPATIBLE)
CONTROLLER
PMBus ALGORITHM
FAULT PROCESSOR
WATCHDOG SEQUENCER
V
IN
V
DD
V
SENSEP0
V
SENSEM0
V
OUT
V
PWR
17
2.5V REGULATOR
V
IN
V
OUT
V
DD33
36
V
SENSEP0
37
V
SENSEM0
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SENSEP1
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SENSEM1
V
SENSEP2
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SENSEM2
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SENSEP3
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SENSEM3
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SENSEP4
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SENSEM4
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SENSEP5
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SENSEM5
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SENSEP6
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SENSEM6
2
V
SENSEP7
3
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SENSEM7
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DACP0
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DACP1
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DACP2
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DACP3
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DACP4
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DACP5
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DACP6
V
DACP7
V
DACM0
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DACM1
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DACM2
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DACM3
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DACM4
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DACM5
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DACM6
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DACM7
4
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OUT_EN0
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OUT_EN1
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OUT_EN2
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OUT_EN3
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OUT_EN4
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OUT_EN5
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OUT_EN6
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OUT_EN7
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IN_EN
18
V
DD25
65
GND
28
SCL
27
SDA
29
ALERTB
32
ASEL0
33
ASEL1
30
CONTROL0
19
WP
31
CONTROL1
WDI/RESET
22
23
FAULTB00
24
FAULTB01
25
FAULTB10
26
FAULTB11
20
21
SHARE_CLK
PWRGD
16
V
DD33
14
V
IN_SNS
REFP
REFM
3R
R
V
SENSEP1
V
SENSEM1
V
SENSEP2
V
SENSEM2
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SENSEP3
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SENSEM3
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SENSEP4
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SENSEM4
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SENSEP5
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SENSEM5
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SENSEP6
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SENSEM6
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SENSEP7
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15-BIT
∑ ADC
ADC
CLOCKS
V
DD
+ –
+ –
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VDAC
+
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4
Figure 4. Block diagram of the LTC2978
Linear Technology Magazine • September 2009
DESIGN FEATURES L
can initiate in response to the rising- or falling-edge of the control pin input. Sequencing can also be initiated by a simple I2C command. The LTC2978 supports any combination of these conditions.
The bidirectional fault pins can be used for various fault response dependencies between channels. For instance, on sequencing can be aborted for one or more channels in the event of short-circuit. Once a rail has powered-up, the undervoltage supervi­sor function is enabled (the overvoltage function is always enabled). The overvoltage and undervoltage thresh­olds and response times of the voltage supervisors are all programmable. In addition, input voltage and tempera­ture are also monitored. If any of these quantities exceed their over- or under­value limits, the customer can select from a rich variety of fault responses. Examples include immediate latchoff, deglitched latchoff, and latchoff with retry.
An integrated watchdog timer is available for supervising external microcontrollers. Two timeout inter­vals are available: the first watchdog interval and subsequent intervals. This makes it possible to specify a longer timeout interval for the micro just after the assertion of the power good signal. In the event of a watchdog fault, the LTC2978 can be configured to reset the micro for a predetermined amount of time before reasserting the power good output.
Multifaceted Telemetry
The LTC2978 serves up a variety of telemetry data in its registers. The multiplexed, 15-bit ∆Σ ADC monitors input and output voltages and on-chip temperature, storing minimum and maximum values for all voltages and temperature readings. In addition, the ADC inputs for odd-numbered output channels can be reconfigured to mea­sure sense resistor voltages. In this mode, the ∆Σ ADC can resolve voltages
down to 15.3µV, which is invaluable when attempting to measure current with inductor DCR circuits.
Although the LTC2978 can be directly powered from a 3.0V to 3.6V supply, the ADC is capable of accepting input voltages of up to 6V—no need to worry about body diodes or exotic standby supply voltages. The LTC2978 can also run off of a 4.5V to 15V input supply using its internal regulator. A separate high voltage (15V max) sense input is provided for measur­ing the input supply voltage for the DC/DC POL converters controlled by the LTC2978.
Black Box Data Recorder
In the event a channel is disabled in response to a fault, the LTC2978’s data log can be dumped into protected EEPROM. This 255-byte block of data is held in NVM until it is cleared with an I2C command. The data block contains output and input voltages and temperature data for the 500ms preceding the fault as well as the cor­responding minimum and maximum values. Status register values and total up time since the last system reset are also stored in the log.
Figure 5 shows the data log con­tents viewed in the PC-based LTC2978 interface. In this way, the LTC2978 provides a complete snapshot of the state of the power system immediately preceding the critical fault, thus mak­ing it possible to isolate the source of the fault well after the fact. This is an invaluable feature for debugging both prerelease characterization or in-field failures in high reliability systems.
Figure 5. The LTC2978 comes with free software that allows easy data monitoring and cofiguration. The data log shows monitor readings just before a failure for debugging analysis.
Linear Technology Magazine • September 2009
Graphical User Interface and PMBus
Linear T echnology’s easy-to-use PC-based graphical user interface (GUI) allows users to configure the LTC2978 via a USB interface and a dongle card. The GUI, which is free and downloadable, takes much of the coding out of the development process and improves time-to-market by al­lowing the designer to configure all device parameters within an intuitive framework. Once the device configura-
continued on page 18
5

L DESIGN FEATURES

100k
20Ω
3.01k 1%
27.4k 1%
10µF
39k
1µF
BAS21
1.2k
38.3k
33pF
1.5nF
10µF 100V
0.1µF
t
ON
12k
PGDLYV
NEG
SYNC
R
CLASS
SHDN
V
CMP
R
CMP
ENDLY OSC SFST
LTC4269-1
GND
UVLO
V
PORTP
V
CC
T2P
T2P
FB
C
CMP
+
+
V
PORTN
383k 1%
3.01k 1%
10k
1nF
3.3nF
33mΩ 1%
FDS2582
10k
15Ω
150Ω
PE-68386
BAT54
100Ω
2200pF
MMBT3906 MMBT3904
1µF
1µF 16V
T1
PA2369NL
SENSE
SENSE
+
SG
PG
L1
0.18µH
22pF
100µF
5.1Ω
FDS8880
47µF
5V 5A
+
SMAJ58A
30.9Ω
24k
107k
10k
S1B
B1100 s 8 PLCS
2.2µF 100V
10µH
DO1608C-103
0.1µF 100V
36V PDZ36B
BSS63LT1
V
PORTP
48V
AUXILIARY
POWER
–54V FROM
DATA PAIR
–54V FROM
SPARE PAIR
+

PD Controller ICs with Integrated Flyback or Forward Controllers Meet Demands of 25.5W PoE+

Introduction
The IEEE 802.3af Power over Ether­net (PoE) standard allows a powered device (PD), such as an internet protocol (IP) telephone, to draw up to
12.95W from an Ethernet cable. When the 802.3af standard was drafted,
12.95W appeared sufficient to cover the immediately imaginable range of PD products (primarily IP phones). Of course, application developers are always far more innovative than standards committees anticipate, so new power-hungry applications for PoE immediately started to appear, such as dual-radio IEEE 802.11a/g and 802.11n wireless access points, security cameras with pan/tilt/zoom motors, and color LCD IP video phones. 12.95W was suddenly not enough. The IEEE committee re­sponded with the 802.3at standard, which raises the available PD power
to 25.5W. The new “at” standard, com­monly referred to as PoE+, also adds a “handshaking” communications requirement between PDs and power sourcing equipment (PSEs), while al­lowing backward compatibility with the legacy “af” standard.
New power control ICs are required to take advantage of these expanded requirements. The DC/DC conversion and control schemes used for legacy “af” PDs are not optimized for the in­creased power capability and feature requirements of PoE+. For instance, in both standards the 37V to 57V PoE voltage is converted to lower voltages that digital circuitry can tolerate. This DC/DC conversion is handled in the lower power 12.95W standard with a conventionally rectified (i.e., diode rectified) flyback converter. The higher power 25.5W standard is better

by Ryan Huff

served by a synchronously rectified (i.e. MOSFET rectified) flyback or a forward power supply topology.
To meet the new performance requirements of PoE+, including handshaking, Linear Technology offers a new family of PD controller ICs that integrate a front-end PD controller with a high performance synchronously rectified flyback (LTC4269-1) or a forward (LTC4269-2) power supply controller.
Features
Both parts combine a PD control­ler—which includes the handshaking circuitry, Hot Swap™ FET, and input protection—with a DC/DC power supply controller. While the power supply sections of the two parts are very different, the PD controller in both is identical.
6
Figure 1. LTC4269-1-based synchronous flyback converter
Linear Technology Magazine • September 2009
+
T2P
T2P
V
NEG
V
PORTN
SHDN
SMAJ58A
R
CLASS
V
PORTP
PGND GND BLANK DELAY
82k
30.9Ω24k
158k 332k
133Ω
BAS516
BAS516
PA2431NL
BAS516
10k
IRF6217
FDS8880
FDS8880
5.1Ω
158k
22.1k
33k
1.5k
50mΩ
2k
5.1Ω
1.2k
TLV431A
PS2801-1-L
V
CC
11.3k
3.65k
22k
0.22µF
0.1µF
R
OSC
V
REF
FB
COMP
I
SENSE
OC
SS_MAXDC
FDS2582
SD_V
SEC
V
IN
S
OUT
LTC4269-2
0.1µF
18V
PDZ18B
10µF
16V
V
CC
33k
237k
107k
10.0k
S1B
B1100 s 8 PLCS
2.2µF
100V
+
10µF
100V
10µH
DO1608C-103
1mH
DO1608C-105
6.8µH PG0702.682
10.0k
OUT
4.7nF
1nF
5.1Ω
1nF
0.1µF
100V
4.7nF
250V
10nF
+
220µF
6.3V
PSLVOJ227M(12)A
5V
5A
36V
PDZ36B
BSS63LT1
V
PORTP
–48V
AUXILIARY
POWER
–54V FROM
DATA PAIR
–54V FROM
BC857BF
EFFICIENCY (%)
LOAD CURRENT (A)
50.5
95
65
1 1.5 2 2.5 3 3.5 4 4.5
70
75
85
80
90
VIN = 42V VIN = 50V VIN = 57V
In the LTC4269, handshaking cir­cuitry, also known as the “High Power Available,” “Two Finger Detect,” or “Ping Pong” indicator, allows the PD to take full advantage of a new PSE’s full 25.5W of available power. Both parts include an integrated Hot Swap MOSFET for a controlled power up of the PD. The switch has a low 700m (typical) resistance and a robust 100V max rating, thus meeting the needs of a wide range of applications. Auxiliary power supplies (“wall warts”) can be accommodated by interfacing to the SHDN pin to disable the PoE power path. Setting a programmable clas­sification current allows different power leveled PDs to be recognized by the PSE. Achieving this is as easy as choosing the proper resistor and placing it from the R pin. The ICs are chock-full of protec­tion features, including overvoltage, undervoltage, and overtemperature to name a few. Finally, complementary power good indicators signal that the
CLASS
pin to V
PORTN
PD Hot Swap MOSFET is out of the inrush limit and ready to draw full power.
The power supply controllers of the LTC4269s also share some features. Both offer programmable switching frequency, which allows the designer to optimize the trade-off between ef­ficiency and size, or the designer can choose a specific frequency to meet application specific EMI require­ments. The power supply soft-start time is also adjustable to prevent the PSE from dropping out its power due to excessive inrush current and virtually eliminate any power supply
DESIGN FEATURES L
Figure 3. LTC4269-2-based self-driven synchronous forward converter
Figure 2. Efficiency of the circuit in Figure 1
Linear Technology Magazine • September 2009
7
L DESIGN FEATURES
EFFICIENCY (%)
LOAD CURRENT (A)
50.5
95
65
1 1.5 2 2.5 3 3.5 4 4.5
70
75
85
80
90
VIN = 42V VIN = 50V VIN = 57V
output voltage overshoot. Both parts include short circuit protection with automatic restart.
LTC4269-1 Synchronous Flyback for Optimized Combination of Efficiency, Simplicity, Size and Cost
A synchronous flyback supply utiliz­ing the LTC4269-1 offers the best combination of efficiency, simplicity, size and cost. See Figures 1 and 2 for the schematic and efficiency curves, respectively, for an LTC4269-1-based PD power supply capable of a 5V out­put voltage at 5A.
The flyback parts count is low for a few reasons. There is no need for the large output inductor that a forward converter (see Figure 3) needs, for this function is rolled into the isolation transformer (T1). A small, inexpensive second-stage filter inductor (L1) is used in the flyback in order to reduce output voltage ripple, but it should not be confused with a traditional output inductor.
In the case of the LTC4269-1, nei­ther a secondary side reference nor an optocoupler are needed to transmit the output voltage regulation information across the isolation boundary. This is because the IC uses the third (bias) winding on the transformer, T1, to get the output voltage information across the boundary. Finally, the synchro­nous flyback topology requires half of the switching MOSFETs (only two) needed by the forward converter.
Performance, in terms of effi­ciency, tops out at above 90% for the
Figure 4. Efficiency of the circuit in Figure 3
LTC4269-1 synchronous flyback. As a contrast, typical PoE efficiencies at the “af” power level for a convention­ally rectified flyback were in the lower half of the 80%’s. This higher effi­ciency is due to the IC’s well-controlled implementation of the synchronous rectifier’s gate drive. This efficiency is not attainable with an uncontrolled self-driven synchronous rectification scheme that is sometimes used.
Regulation over the full PoE+ input voltage range and 0A to 5A output cur­rent range for the LTC4269-1 is better than ±1%. Output voltage ripple for the fundamental switching frequency is less than 30mV peak-to-peak.
LTC4269-2 Synchronous Forward to Maximize Efficiency
If the efficiency of a PoE+ power supply is paramount, an LTC4269-2-based synchronous forward supply is the an­swer at 92.5% efficiency. The increased efficiency comes with the trade-off of increased circuit size and complexity.
Figure 3 shows a complete PD power supply. Figure 4 shows efficiency, and Figure 5 compares the physical size of the flyback (LTC4269-1) versus the forward (LTC4269-2). The forward supplies 5V at 5A.
The increase in the forward’s ef­ficiency comes about in part from decreased RMS currents in the second­ary side MOSFETs and in part from separating the transformer and output inductor. Both of these changes from the flyback reduce resistive losses. The forward supply uses twice the number of MOSFETs as a flyback so each switch handles just a portion of the current that the switches in the flyback do, thus reducing the I2R power losses. By separating the isola­tion transformer and output inductor, instead of using the transformer for both as in the flyback, the same power is processed through two components instead of one. The net effect is more copper, thus less resistance and lower resistive losses.
The cost of the circuit obviously increases with the addition of larger and more expensive power path components. Complexity also goes up with the need to control twice as many MOSFETs. Also, the forward topology does not lend itself to the third winding feedback method. This means extra complexity in the design and compensation of a secondary side reference and opto-coupler circuitry.
Other than the ultra high efficiency of the LTC4269-2’s synchronous forward, the solution has similar per­formance to the flyback. The output ripple of the fundamental switching frequency is about 40mV peak-to­peak. The regulation over the entire input voltage and load current range is well under ±1%.
8
Figure 5. LTC4269-1 and -2 solutions
Conclusion
Two new highly integrated PD control­ler ICs are fully compliant with, and take full advantage of, the upcoming IEEE 802.3at PoE+ standard. The LTC4269 family of parts support the preferred high performance power supply topologies for use in the new standard.
Linear Technology Magazine • September 2009
L
DESIGN FEATURES L
IGNITION SOURCE
THERMAL OR
ELECTRIC
OXIDIZER
AIR OR
OXYGEN
FUEL
GAS, VAPOR OR POWDER
COMBUSTION
Surge Stopper IC Simplifies Design of Intrinsic Safety Barrier for Electronics Destined for Hazardous Environments

by Murphy Pickard, Hach Co.

Introduction
As applications for electronic instru­mentation proliferate, an increasing number of applications require equip­ment safe enough to operate in hazardous environments. Chemical plants, refineries, oil/gas wells, coal, and textile operations are all examples of potentially explosive environments that use electronic instrumentation. In order to operate safely in such en­vironments, instrumentation must be made explosion proof.
Companies that supply appara­tus to these markets must integrate protection into the design. It falls to the electronic designer to consider available safety measures and imple­ment them with minimum cost and impact on proper circuit operation. This is a daunting task from a design standpoint, made even more difficult by the number of hazardous environ­ment standards that must be met to satisfy global or domestic markets. Although the various standards are moving slowly to harmonization, in some cases they still contradict them­selves and each other.
This article discusses the essential requirements of safety standards, and methodologies for meeting these re-
Table 1. Established protection techniques
‘Ex’ Designation Technique Description Application
‘p’ Separation: Gas Pressurization Equipment Rooms ‘o’ Separation: Liquid Oil Fill Transformers ‘q’ Separation: Semi-Solid Sand Fill Instrumentation
‘m’ Separation: Solid Encapsulation Instrumentation
‘n’ Construction Nonincendive Switchgear
‘e’ Construction Increased Safety Lighting, Motors
‘d’ Containment Flameproof Pumps
‘i’ Electrical Design Intrinsic Safety Instrumentation
Figure 1. The ignition triangle
LT4356 series surge stopper
IC can be used to design
an active barrier with
parameters that can be
easily altered to quickly
produce custom barriers.
Since the fundamental
circuit topology won’t
be changing much, once
such an active design is
approved, it will be more
readily approved when only
component value changes
are made.
About the Author
Murphy Pickard is an Electronic Engineer in the Flow & Sampling Business Unit of Hach Company (www.hach.com) of Loveland, CO. If you have questions about this article or intrinsic safety bar ­rier design, feel free to contact the author at 800-227-4224 or mpickard@hach.com.
quirements. In particular, the LT4356 series of overvoltage/overcurrent pro­tection devices offers an efficient and elegant means of creating protection barriers in electronic apparatus. To fully understand the requirements and solutions, one must become mod­erately acquainted with the standards themselves, and the agencies that enforce them.
Intrinsic Safety and the Classification of Hazardous Environments
Simply put, in a hazardous environ­ment, the designer’s task is to prevent an ignition source from meeting an explosive atmosphere. There are sev­eral techniques for achieving this end, and this article focuses on a design discipline referred to as intrinsically safe (IS) design. Figure 1 depicts the ignition triangle, illustrating that a fuel, an oxidizer and an ignition source must all be present for an explosion to occur. Several techniques simply pre­vent an existing ignition source from contacting an explosive atmosphere, while Intrinsically Safe design actually eliminates the ignition source. The principal protection techniques are listed in Table 1.
Separation techniques are well suited for many applications but require special sealing methods and
Linear Technology Magazine • September 2009
9
L DESIGN FEATURES
substances, often creating a perma­nent barrier, making repair or service impossible. Construction techniques are mechanical approaches, and again require special materials.
Only the Intrinsic Safety technique allows normal instrument fabrication methods and materials and requires no exotic construction or packag­ing. Additionally, IS circuits may be serviced with power present, and are generally the lowest cost approach to gaining certification. Further, only IS certified equipment is allowed in ATEX Zone 0 areas (Directive 94/9/ EC ATEX “Atmosphères Explosibles”). This is true because the instrument design ensures that there is not enough electrical (spark) or thermal energy present to serve as an ignition source. Specifically, an Intrinsically Safe circuit is one in which any spark or any thermal effect produced in the conditions specified in the principal Standard (IEC 60079-2006), which includes normal operation and speci­fied fault conditions, is not capable of causing ignition of a given explosive gas atmosphere.
Several bodies oversee compliance to standards and issue certifications to manufacturers. In North America FM, UL and CSA govern IEC-79 series standard certification, while ATEX standard compliance in the European Union is certified principally by DEM­KO. The level of protection required depends on the environment in which the instrument will operate. Interna­tional Standards and Codes of Practice classify environments according to the risk of explosion. The type and the volatility of the gas/vapor/dust present and the likelihood of its pres­ence determine such risk. Depending on the jurisdiction, the classification system is by Class/Division (North America) or Zone (EU). These systems are generally compatible, and for the purposes of this article, we concentrate on the Class/Division system as many countries have adopted IEC79 series Standards, the most fully utilized and harmonized of all standards extant.
When electrical equipment and flammable materials are present si­multaneously, both the equipment and
Table 2. Hazardous environment classification systems
Class Hazard
I Gas/Vapor
II Dust
III Particles/Fibers/Filings
Division
(North America)
1 Likely
2 Unlikely 2 Unlikely
Gas Group Industry
I Underground
II Surface
Apparatus Group Representative Gas
IIA Propane IIB Ethylene IIC Hydrogen
Temperature Code Maximum Surface Temperature °C (40°C Ambient)
T1 450 T2 300 T3 200 T4 135 T5 100 T6 85
Presence
explosive atmospheres must be clas­sified. The level of protection provided must be the same or better than that required by the standards for use in such environment. The environment, or “plant,” is classified according to the type (Class and Group) and probability of presence (Division) of the explosive atmosphere. The equipment is classi­fied according to the maximum surface temperature (Temperature Code) of any component of the equipment ex­posed to the hazardous atmosphere, and by the maximum amount of energy (Apparatus Group) it can produce or release in a spark event. It is important to understand that there is no relation­ship between the surface temperature and the spark ignition energy neces­sary to ignite a given gas. These limits
Zone
(Europe)
0 Continually 1 Likely
Presence
The Role of Electronic Design in Intrinsic Safety
An IS circuit is defined in Standard IEC79-11 as:
“A circuit in which any spark or thermal effect produced in the con­dition specified in this International Standard, which include normal op­eration and specified fault conditions, is not capable of causing ignition in a given explosive gas atmosphere.”
Thus, a circuit must contain safety components that prevent spark or heat energy of a sufficient level to cause an explosion under fault conditions. It is the responsibility of the circuit de­signer to incorporate these protective components into the design while still maintaining proper circuit operation. This is seldom an easy task.
are summarized in Table 2.
10
Linear Technology Magazine • September 2009
Any device designed for use in
R
V
OC
I
SC
INTRINSICALLY
SAFE
EQUIPMENT
HAZARDOUS AREA NON-HAZARDOUS AREA
APPROVED APPROVED
INTRINSIC
SAFETY
BARRIER
CONTROL
EQUIPMENT
ROOM
hazardous environments may be categorized as either a simple or non­simple apparatus. Without going into detail, a simple apparatus requires no agency certification if it contains pas­sive components, does not generate or store significant energy greater than
1.5V, 100mA, and 25mW. Examples of simple apparatus are resistors, diodes, LEDs, photocells, thermocouples, switches, terminal blocks and the like. For obvious reasons we will not dwell on this class of equipment.
A non-simple IS apparatus, with which electronic instrument design­ers are concerned, are categorized as either “Ex ib,” which may have one countable fault, and “Ex ia,” which may have two countable faults. Countable faults refer to arbitrary faults imposed by the examiner to analyze efficacy of protection against thermal and spark ignition faults. A non-countable fault occurs not from component failures, but from circuit spacing issues such as creepage/clearance, improper component voltage/current/power rating or component construction. It is the designer’s job to ensure that his component selection and circuit layout do not contain any non-count­able faults or he may fail certification from these alone.
During the compliance examination the assessor is allowed to fail one (Ex ib) or two (Ex ia) protective compo­nents and explore the implications for safety of these failures. If these failures do not degrade the circuit’s safety features, the apparatus is awarded a hazardous location certification. Referring to Table 2, a certification to Class I, Division 1, Group IIC, T6 allows operation in any hazardous environment, including ATEX Zone 0
Linear Technology Magazine • September 2009
Figure 2. Isolation/protective barrier location
areas. Clearly, Ex ia is the most dif­ficult certification to obtain, and the manufacturer should determine that he must have this level of protection before incurring the cost of doing so. Most applications require only Class I/Div 1 or 2 (Zone 1) certification.
The Barrier Concept
A barrier that limits power/voltage/ current to safe levels for the par­ticular environment must moderate any power or signaling flow between a hazardous location and a non­hazardous location. Such a barrier is termed an Associated Apparatus in the Standards. It is important to realize that an IS barrier, containing protective components, resides in the non-hazardous area and supplies power to the IS certified apparatus in the hazardous area, including Simple Apparatus. Both pieces of equipment must comply with IS rules. That is to say that for an Ex ia certification, both units must be approved to suffer double faults while maintaining safety from ignition as Figure 2 illustrates. Proper or merchantable operation of the apparatus is irrelevant to the examiner, as long as it is safe.
The concept of a barrier is a powerful tool in gaining compliance. It is clear that the non-hazardous area barrier in Figure 2 must limit the total power available to the IS apparatus in the hazardous area. However, multiple barriers may also exist within the
Figure 3. Simple passive component barrier
DESIGN FEATURES L
hazardous area apparatus. Internal barriers may be used to further limit power to sub-circuits within the equip­ment to prevent application of multiple countable faults.
In the broadest terms, protective components are either series type or shunt type. A current-limiting resistor is the most common series protective device, while a voltage-limiting Zener diode is the most common shunt protective device. When used in com­binations to limit power, protective devices are referred to as barriers. Barriers in which true galvanic isola­tion is maintained are referred to as “isolators.” Examples of isolators are transformers, capacitive couplers and optical couplers. Isolators however will not provide DC power or transfer DC signals and are not germane to this discussion. We will not delve into the use of resistors or diodes to isolate energy-storing components to provide spark ignition protection, but this is provided for in the Standards and is a different concept from galvanic isolators.
Safety Components and Barrier Design
Barriers can be categorized as either passive or active according to the components used to design them. Passive barriers have the advantage of conceptual simplicity, ease of design and ready availability in the market. However, the protected field apparatus must suffer the voltage burden imposed by the barrier and still function properly. Passive barriers are energy inefficient and bulky. If any significant power must be transferred to the field device beyond a few mil­liwatts, the safety components become very large.
Active barriers have a tremendous advantage in efficiency and component size, but are generally more difficult to design and may be more expensive to produce. Additionally, these are typi­cally custom designs that are not easily reused. The most serious disadvantage of active barriers is not conceptual, but bureaucratic. The examiners who analyze the barrier design are completely familiar with common pas-
11
L DESIGN FEATURES
SHORT CIRCUIT CURRENT (mA)
OPEN CIRCUIT VOLTAGE (V)
1k10
10k
10
100
100
1k
Grp-A&B: Acetylene,Hydrogen Grp-C: Ethylene Grp-D: Propane Grp-D: Methane
+
+
V
CC
SHDN
IN+
AMPLIFIER
TIMER
IA
1.25V
50mV
1.25V
SNS
OUTPUT TO LOAD
SUPPLY
INPUT
TMRGND
GATE
A
OUT
OUT
FLT
EN
FB
+
30MA
VA
LT4356-1
sive designs, and may require actual spark testing (at your expense) before approving active designs. However, as we will see, the LT4356 series surge stopper IC can be used to design an active barrier whose parameters can be easily altered to quickly provide custom barriers. Since the fundamen­tal circuit topology won’t be changing much, once such an active design is approved, it will be more readily ap­proved when only component value changes are made. If the IS instrument supplier is performing even a few IS barrier designs, significant savings are realized in energy efficiency, barrier size and cost.
A passive design for associated ap­paratus, the barrier, that supplies DC power to the field apparatus utilizes three venerable passive devices to implement protection: fuses, resistors and Zener diodes. Safety factors of
1.5 or 1.7 are applied to these device parameters. Furthermore, for double­fault protection at ‘ia’ protection level, multiply redundant components are necessary. Figure 3 shows the most common type of passive barrier design as an example.
Only the Zener diodes can limit open circuit voltage and only the resistor and fuse can limit current. Fuses are not considered as a spark-ignition energy limit device because of its slow reaction time. In each case, the devices dissipate power and must be
12
at a worst-case barrier performance, always erring on the side of safety.
The barrier is assumed to pass a
maximum power of V
OC
• I
SC
= P
MAX
/2 when the field apparatus impedance is equal to the barrier source impedance, the point of maximum power transfer. For this analysis the resistor value is assumed to be (R – %tolerance) and V
OC
at (Vz + %tolerance). Any component in the field apparatus must be able
Figure 4. Resistive circuit spark ignition curves
to tolerate P lower values by secondary means. If we assume that the field apparatus is
/2 unless protected at
MAX
nothing more than an LED, the LED
properly rated. The Zeners actually do sink some reverse leakage current even though they are not fully on.
The examiner assumes the Zener voltage knee to occur at the high end of its tolerance, usually 5%. The Zener must be rated at 1.5 times the maximum power of the barrier, the resistors must be rated at 1.5 times the maximum power and the fuse is presumed to pass 1.7 times its rated current. The resistor is presumed to be at the low end of its tolerance range. All active and passive devices must also have an absolute maximum breakdown voltage specification that is 1.5 times the maximum operating voltage they will encounter in normal or fault conditions. These presump­tions are imposed not to frustrate the electronic designer, but to arrive
must be able to dissipate P
MAX
/2 with­out exceeding the apparatus Surface Temperature code, such as 85°C for a T6 rated product.
In practical barrier designs, pro­tective component redundancy is necessary for compliance, especially for Zener diodes. Two Zeners in parallel are required for Ex ib rated equipment, and three parallel Zeners for Ex ia protection level. Note that the Zener power dissipation rating depends on the fuse clearing. If the fuse were not present, proof must be supplied that the Zener can dissipate the full barrier power indefinitely without failing or exceeding the temperature rating of the apparatus. In addition, the IEC79 Standard requires that all fuses not contained in approved holders must be encapsulated. Further require­ments exist for the protective resistor: it must be “infallible.” If two resistors are used in series, each resistor must be of a high enough value as to limit current if one of them fails short. If two resistors are used in parallel, each must be specified to dissipate the maximum fault power if one resistor fails open. An infallible resistor is one of metal film, ceramic glazed wire­wound, or thick film SMD type with a conformal coating, all with suitable creepage/clearance spacing to avoid a non-countable fault. The infallible resistor is considered to fail only to
Figure 5. Simplified block diagram of the LT4356
an open circuit. The examiner may take this as one countable fault, but unless it reveals failures downstream of the resistor, it does not inform the analysis.
Linear Technology Magazine • September 2009
DESIGN FEATURES L
C
TMR
0.1µF
R
SNS
10mΩ
Q1
IRLR2908
Q2
IRLR2908
V
IN
12V
V
OUT
12V, 3A CLAMPED AT 16V
LT4356S
GND TMR
OUTSNS
SHDN
A
OUT
IN
+
V
CC
EN
FLT
FB
D2*
SMAJ58CA
R2
4.99k
R1 59k
GATE
R7 10k
R5
1M
Q3
2N3904
D1
1N4148
R3 10Ω
R4 10Ω
*DIODES INC.
Despite their simplicity, passive barriers exact a high price in power loss and size. Maximum power is transferred to field apparatus only when its input impedance is equal to the resistance of the current limiting resistor in the barrier, and this is only half of the power supplied to the bar­rier. If more than a few milliwatts are required in the field apparatus, the barrier resistor may become physically large. Such resistors are understand­ably expensive, have a limited value range and are difficult to source and mount. If a fuse is not included in the design, the Zener diodes likewise become bulky and expensive. The fact that the fuse must be encapsulated (Paragraph 7.3) usually dictates that the entire barrier is encapsulated, making it impossible to service as well as messy and more expensive to manufacture.
Determining Maximum Safe Field Apparatus Power Limits
The actual power that may be trans­ferred to a field apparatus through the associated apparatus barrier is determined entirely by the level of certification the instrument supplier is seeking. This in turn is determined entirely by the environment it will encounter.
The Class and Division rating de­sired is easily determined. However,
Linear Technology Magazine • September 2009
Figure 6. Redundant pass transistors
the flammable gas/dust type is what determines the Apparatus Group and T code. The fact that hydrogen has a relatively high ignition temperature (560°C) and very low spark ignition energy (20µJ) demonstrates that careful thought must given to these parameters before seeking certification testing. Here we confine our discus­sions to Class I locations, gasses and vapors in surface operations, Group II. To determine how much power can be available at the output of a barrier, and still be safely faulted open or shorted, we utilize the empirically determined gas ignition curves published in the standards. These curves indicate the maximum voltage and current allow­able for a given gas group.
There are three charts published in the standards, one for resistive, induc­tive and capacitive circuits. Figure 4 shows the curve for a simple resistive circuit. For sake of discussion, we assume that we are dealing with the worst environment for spark ignition, acetylene, Group IIA. Referring to Fig­ure 4, at 20V
it appears that up to
OC
400mA ISC is allowed without danger of ignition. Additionally, this power must not permit a corresponding surface temperature rise high enough to thermally ignite the gas in normal or fault conditions.
Some authorities recommend derat­ing the voltage V
by 10% and the
OC
current ISC by 33%. This is stated in the standards (IEC 60079-11, 10.1.4.2) under safety factors. The calculated value of the current limiting series resistor is simply V
OC
/I
= 20/0.4
SC
= 5. The power the resistor must dissipate is V (V
)2/R, whichever is highest dur-
OC
OC
• I
or (ISC)2/R or
SC
ing circuit operation or fault. Simple calculations show that even small amounts of power may require rather physically large current-limiting resis­tors. A final note: the Standards state that from empirical and analytical data, a T4 (135°C) temperature code is automatically awarded to any circuit using 1.3 watts or less.
Using the LT4356 Surge Stopper as an Intrinsic Safety Barrier
The LT4356 series of overvoltage/ overcurrent limiters are excellent choices for designing active protective barriers with minimum parts count and wasted power. Recognizing this fact, Linear Technology offers the IC in a 16-lead SO package with pin spacing sufficient to avoid penalizing the design with a non-countable fault when encapsulated. For voltages up to 10V, some Standards require a
1.5mm (59.1mil) creepage spacing, and 2.0mm (78.7 mil) for up to 30V. Before the 2006 79 series Standard, the IC must be encapsulated to meet these requirements because of the 50 mil (1.2mm) lead spacing of the 16­lead SO package, but encapsulation has the added advantage of raising the thermal limits on any associated components in the circuit.
However, the latest version of the harmonized Standard, IEC60079-11 (5th edition 2006-07) dramatically reduces these creepage requirements on printed circuit boards when the apparatus is enclosed in such a way as to meet ingress protection stan­dards. These standards, known as IP levels, prevent ingress of dust or moisture, thereby guaranteeing a pol­lution degree of 2 or less. The idea is that the cleaner and drier the circuit board stays, the lower the board’s CTI (Comparative Tracking Index) and the less likely leakage current will occur.
13
L DESIGN FEATURES
C
TMR
0.1µF
R
SENSE
3 s 0.5Ω
IN PARALLEL
Q1
IRLR2906
INPUT TEST
VOLTAGE STEP
0V TO 15V
VINV
IN
V
OUT
9.9V 300mA
LT4356CDE
GNDTMR
OUTSNS
SHDNSHDN
A
OUT
IN
+
V
CC
EN
FLT
FB
C
TMR
0.1µF
4.99k
GATE
22µF 25V
100k
10Ω
SMAJ58A*
*DIODES INC.
UNDERVOLTAGE LOCKOUT
LED SUPPLY
C
SNUB
0.1µF 100V
1M
1k
BZT52C16T
BZT52C5V6T
1M OPT
R
SNUB
10Ω
3.9k
250mW
LED
GREEN
3.9k
3.9k
22k
34.8k
LED GREEN
LED RED
LED
GREEN
DRAN
DRAN
+
MMBT5551
Figure 7. Schematic of a modified DC1018A evaluation board
Annex F of 79-11 therefore allows only
0.2mm creepage all the way up to 50V for Class I environments. Since most instrumentation is enclosed anyway, it behooves the designer to use an enclosure with a high IP rating, such as IP67 or IP68 to avoid encapsulation requirements. Unless encapsulation is necessary to meet thermal limits, its cost and associated problems are best avoided.
Figure 5 is a simplified block dia­gram of the LT4356 IC. The LT4356 monitors both current and voltage continually and turns off the series pass MOSFET quickly if a fault oc­curs. Both current and voltage limits are set by external components, so limits may be changed easily. The current shunt resistor and the voltage feedback resistors should be made in­fallible to achieve certification. Usually the feedback resistors can be made arbitrarily large so that a MOSFET fault that shorts input power directly to the feedback resistors cannot cause significant power dissipation.
Nevertheless, two cautionary notes are in order. The first is that active devices (controllable semiconductors) can be used in Ex ib situations for power limitation (thermal ignition)
14
but not for spark ignition protection. See paragraphs 7.5.2 and 7.5.3 in the Standards. Some interpretations may allow active barrier use in Zone 0, but only in triplicate form. The second caution is that, as with any IS barrier, even for Ex ib (single fault) applica­tions, barrier failure usually results in non-countable thermal fault failure downstream of the barrier. Therefore, redundancy is required in case one of the barriers fails.
The LT4356 provides for two series pass transistors, typically for reverse polarity protection. Protection against polarity reversal is required “where this could occur.” A single diode is deemed acceptable to satisfy this requirement, but two pass transistors offer better protection from countable faults with­out a significant voltage drop.
For Ex ib environments, the exam­iner can use his single countable fault to internally short all the pins on the IC to analyze resultant failures. While properly rated redundant Zeners could be positioned at the output of the LT4356 to provide a voltage limit, at any appreciable power level the cost and difficulty of specifying these Zeners makes it more cost effective to simply duplicate the entire barrier. Note that
for Ex ia applications, either triplicate barriers, or two barriers with a series infallible resistor are required to meet the double-fault analysis rule.
From here on, we assume that spacing and thermal rise, component ratings, PCB tack width and redun­dancy rules are followed and the circuit cannot be failed with either countable or non-countable faults. The remain­ing question is that of spark ignition energy. For this purpose, the LT4356 may not prove useful, depending on the application.
The LT4356 reacts to both current and voltage faults by turning off the pass transistor(s). However, since it does not shut down instantaneously, some amount of energy squirts through the barrier. In the standards this is termed the let-through energy, and is usually assessed using oscil­loscope measurements and/or an actual spark ignition test in a cham­ber. If this energy is enough to ignite the subject gas, the barrier has failed certification. Acceptable let-through energy is summarized in Table 3.
Bench tests reveal that the LT4356 is much more than adequate for even Ex ia thermal ignition applications. Bench testing was done using a modified
Linear Technology Magazine • September 2009
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