Linear Technology LTC1873 Datasheet

FEATURES
LTC1873
Dual 550kHz Synchronous
2-Phase Switching Regulator
Controller with 5-Bit VID
U
DESCRIPTIO
Two Independent PWM Controllers in One Package
Side 1 Output Is Compliant with Intel Desktop VRM 8.4 Specifications (Includes 5-Bit VID DAC)
1.3V to 3.5V Output Voltage with 50mV/100mV Steps
Two Sides Run Out-of-Phase to Minimize C
All N-Channel External MOSFET Architecture
No External Current Sense Resistors Required
Precison Internal 0.8V ±1% Reference
550kHz Switching Frequency Minimizes External
IN
Component Size
Very Fast Transient Response
Up to 25A Output Current per Channel
Low Shutdown Current: < 100µA
Small 28-Pin SSOP Package
U
APPLICATIO S
Microprocessor Core and I/O Supplies
Multiple Logic Supply Generator
High Efficiency Power Conversion
Chipset Power Supply
The LTC®1873 is a dual switching regulator controller opti­mized for high efficiency with low input voltages. It includes two complete, on-chip, independent switching regulator con­trollers. Each is designed to drive a pair of external N-channel MOSFETs in a voltage mode feedback, synchro­nous buck configuration. The LTC1873 includes digital out­put voltage adjustment on side 1 that conforms to the Intel Desktop VID specification. A constant-frequency, true PWM design minimizes external component size and cost and optimizes load transient performance. The synchronous buck architecture automatically shifts to discontinuous and then to Burst ModeTM operation as the output load decreases, ensur­ing maximum efficiency over a wide range of load currents.
The LTC1873 features an onboard reference trimmed to 1% and delivers better than 1.5% regulation at the converter outputs over all combinations of line, load and temperature. Each channel can be enabled independently; with both chan­nels disabled, the LTC1873 shuts down and supply current drops below 100µA.
, LTC and LT are registered trademarks of Linear Technology Corporation.
Burst Mode is a trademark of Linear Technology Corporation.
TYPICAL APPLICATIO
4.5V TO 5.5V
+
STBY/ON
10k
0.1%
1k
1k
QSS1
68k
4.75k
0.1%
330pF
56k
5-BIT VID
10µF
QSS2
220pF
U
Low Cost Desktop CPU Supply with RDRAM Keepalive
1µF
MBR0530T
1µF
IN OUT
LT1761
GND
ADJ
L2
L1
56pF
0.1µF
39pF
FB2
COMP2
RUN/SS2 RUN/SS1
SENSE
FB1
COMP1
FCB
VID4:0
10
V
SGND PGND
CC
LTC1873
PV
BOOST2
I
FAULT
BOOST1
I
CC
TG2
SW2
BG2
MAX2
TG1
SW1
BG1
MAX1
+
C
IN
MBR0530T
1µF
QT2
QB2
47k
QT1B
QT1A
QB1A
33k
QB1B
16.2k
0.1%
16.9k
0.1%
1873 TA01
V
RDRAM
2.5V/7A
+
2.45V/100mA STANDBY
C
OUT2
V
CORE
1.3V TO 3.5V
+
20A
C
C
= SANYO 10MV1200GX (6 IN PARALLEL)
OUT1
IN
= SANYO 6MV1500GX (8 IN PARALLEL)
C
OUT1
= SANYO 6MV1500GX (3 IN PARALLEL)
C
OUT2
L1: 1µH SUMIDA CEP125-1R0MC-H L2: 2.2µH COILTRONICS UP2B-2R2 QSS1, QSS2: MOTOROLA MMBT3904LT1 QT1A, QT1B, QB1A, QB1B: FAIRCHILD FDS6670A QT2, QB2: 1/2 SILICONIX Si4966
1
LTC1873
PACKAGE/ORDER I FOR ATIO
UU
W
WWWU
ABSOLUTE AXI U RATI GS
(Note 1)
Supply Voltage
V
...........................................................................................
CC
BOOST
n...............................................................
BOOSTn – SWn.................................................... 7V
Input Voltage
SWn.......................................................... –1V to 8V
VIDn....................................................... –0.3V to 7V
All Other Inputs ......................... – 0.3V to VCC + 0.3V
Peak Output Current < 10µs
TGn, BGn............................................................... 5A
Operating Temperature Range
(Note 2) ............................................. – 40°C to 85°C
Storage Temperature Range ................. –65°C to 150°C
Lead Temperature (Soldering, 10 sec).................. 300°C
7V
15V
PV
BOOST1
BG1 TG1
SW1
I
MAX1
FCB
RUN/SS1
COMP1
SGND
FB1
SENSE
VID0 VID1
TOP VIEW
1
CC
2 3 4 5 6 7 8
9 10 11 12 13 14
G PACKAGE
28-LEAD PLASTIC SSOP
T
= 125°C, θJA = 55°C/W
JMAX
28 27 26 25 24 23 22 21 20 19 18 17 16 15
I
MAX2
BOOST2 BG2 TG2 SW2 PGND FAULT RUN/SS2 COMP2 FB2 V
CC
VID4 VID3 VID2
ORDER PART
LTC1873EG
Consult factory for Industrial and Military grade parts.
NUMBER
ELECTRICAL CHARACTERISTICS
The denotes specifications which apply over the full operating temperature range, otherwise specifications are TA = 25°C. VCC = 5V unless otherwise specified. (Note 4)
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS Main Control Loop
V
CC
PV
CC
BV
CC
I
CC
IPV
I
BOOST
V
FB
V
FB
I
FB
V
FCB
V
FCB
I
FCB
V
RUN
I
SS
CC
VCC Supply Voltage 37V PVCC Supply Voltage (Note 3) 37V BOOST Pin Voltage V
– VSW (Note 3) 2.7 7 V
BOOST
VCC Supply Current Test Circuit 1 2.2 8 mA
RUN/SS1 = RUN/SS2 = 0V (Note 6)
30 100 µA
PVCC Supply Current Test Circuit 1 (Note 5) 2.2 6 mA
RUN/SS1 = RUN/SS2 = 0V (Note 6)
6 100 µA
BOOST Pin Current Test Circuit 1 (Note 5) 1.3 3 mA
RUN/SS1 = RUN/SS2 = 0V
0.1 10 µA
Feedback Voltage Test Circuit 1 0.790 0.800 0.810 V Feedback Voltage Line Regulation VCC = 3V to 7V ±0.005 ±0.05 %/V Feedback Current FB2 Only (Note 7) ±0.001 ±1 µA FCB Threshold 0.75 0.8 0.85 V FCB Feedback Hysteresis 20 mV FCB Pin Current ±0.001 ±1 µA RUN/SS Pin RUN Threshold 0.45 0.55 0.65 V Soft Start Source Current RUN/SSn = 0V –1.5 –3.5 –5.5 µA
2
LTC1873
ELECTRICAL CHARACTERISTICS
The denotes specifications which apply over the full operating temperature range, otherwise specifications are TA = 25°C. VCC = 5V unless otherwise specified. (Note 4)
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS Switching Characteristics
V
OSC
f
OSC
Φ
OSC2
DC
MIN1
DC
MIN2
DC
MAX
t
NOV
tr, t
f
Feedback Amplifier
A
VFB
GBW FB Gain Bandwidth 25 MHz I
ERR
V
MIN
V
MAX
Current Limit Loop
A
VILIM
I
IMAX
Status Outputs
V
FAULT
V
OLF
I
FAULT
t
FAULT
VID Inputs
R1 Resistance Between SENSE and FB1 Side 1 Only 20 k V
Error % Output Voltage Accuracy Programmed from 1.3V to 3.5V –1.5 1.5 %
OUT
R
PULLUP
VID
T
I
VID-LEAK
V
PULLUP
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired.
Note 2: The LTC1873 is guaranteed to meet performance specifications from 0°C to 70°C. Specifications over the –40°C to 85°C operating temperature range are assured by design, characterization and correlation with statistical process controls.
Note 3: PV the external MOSFETs used to ensure proper operation.
Note 4: All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to ground unless otherwise specified.
Oscillator Amplitude 1V
P-P
Oscillator Frequency Test Circuit 1 475 550 750 kHz Controller 2 Oscillator Phase Relative to Controller 1 180 DEG Minimum Duty Cycle VFB < V Minimum Duty Cycle VFB > V
MAX MAX
710 %
0%
Maximum Duty Cycle 87 90 93 % Driver Nonoverlap Test Circuit 1 (Note 9) 40 100 ns Driver Rise/Fall Time Test Circuit 1 (Note 9) 12 80 ns
FB DC Gain 74 85 dB
FB Sink/Source Current COMPN Output ±3 ±10 mA MIN Comparator Threshold 760 785 mV MAX Comparator Threshold 815 840 mV
I
Gain 40 dB
LIM
I
Source Current I
MAX
FAULT Trip Point VFB Relative to Regulated V FAULT Output Low Voltage I FAULT Output Current V FAULT Delay Time VFB > V
VID Input Pull-Up Resistance V
= 0V –7 –10 –14 µA
MAX
OUT
= 1mA 0.03 0.1 V
FAULT
= 0V –10 µA
FAULT
to FAULT (Note 9) 25 µs
FAULT
= 0.6V (Note 8) 40 k
DIODE
+10 +15 +20 %
VID Input Voltage Threshold VIL (2.7V ≤ VCC 5.5V) 0.4 V
(2.7V ≤ VCC 5.5V) 1.6 V
V
IH
VID Input Leakage Current VCC < VID < 7V (Note 8) 0.01 ±1 µA VID Pull-Up Voltage VCC = 3.3V 2.8 V
= 5V 4.5 V
V
CC
Note 5: Supply current in normal operation is dominated by the current needed to charge and discharge the external MOSFET gates. This current will vary with supply voltage and the external MOSFETs used.
Note 6: Supply current in shutdown is dominated by external MOSFET leakage and may be significantly higher than the quiescent current drawn by the LTC1873, especially at elevated temperature.
and BVCC (V
CC
– VSW) must be greater than V
BOOST
GS(ON)
of
Note 7: Feedback current at FB1 will be higher due to internal VID resistors.
Note 8: Each built-in pull-up resistor attached to the VID inputs also has a series diode connected to V
to allow input voltages higher than the V
CC
CC
supply without damage or clamping. (See Block Diagram.) Note 9: Rise and fall times are measured at 20% to 80% levels. Delay and
nonoverlap times are measured using 50% levels.
3
LTC1873
TEMPERATURE (°C)
–50
0.4
R
ON
()
0.5
0.7
0.8
0.9
1.4
1.1
0
50
75
1873 G06
0.6
1.2
1.3
1.0
–25
25
100
125
V
PVCC
= 5V
V
BOOST
– VSW = 5V
GATE CAPACITANCE (pF)
0
25
30
35
6000 8000
1873 G03
20
15
2000 4000 10000
10
5
0
DRIVER SUPPLY CURRENT (mA)
TEST CIRCUIT 1 ONE DRIVER LOADED MULTIPLY BY # OF ACTIVE DRIVERS TO OBTAIN TOTAL DRIVER SUPPLY CURRENT
TEMPERATURE (°C)
–50 –25
12
RISE/FALL TIME (ns)
12
15
0
50
75
1873 G09
11
14
13
25
100
125
TEST CIRCUIT 1 C
L
= 2000pF
UW
TYPICAL PERFOR A CE CHARACTERISTICS
Efficiency vs Load Current
100
= 5V
V
IN
90
EFFICIENCY (%)
80
V
OUT
V
OUT
V
OUT
= 3.3V
= 2.5V
= 1.6V
Transient Response
VIN = 5V
= 1.8V
V
OUT
I
= 0A-10A-0A
LOAD
±2.2% MAX DEVIATION
20mV/
DIV
MOSFET Driver Supply Current vs Gate Capacitance
70
0
Supply Current vs Temperature
2.6 TEST CIRCUIT 1
= 0pF
C
2.4
L
2.2
2.0
1.8
1.6
SUPPLY CURRENT (mA)
1.4
1.2
1.0
–25 0 50
–50
RUN/SS Source Current vs Temperature
5.0 VCC = 5V
4.5
4.0
3.5
3.0
SOURCE CURRENT (µA)
2.5
2.0
–50
–25 0
4
510
LOAD CURRENT (A)
PV
CC
V
CC
BOOST1, BOOST2
25
TEMPERATURE (°C)
50 100 125
25 75
TEMPERATURE (°C)
15
1873 G01
75 100 125
1873 G04
1873 G07
10µs/DIV
Frequency Drift vs Temperature
2.5 VCC = 5V
2.0
1.5
1.0
0.5
0 –0.5 –1.0
FREQUENCY DRIFT (%)
–1.5 –2.0 –2.5
–50
–25
0
TEMPERATURE (°C)
50
25
1873 G02
Driver RON vs Temperature
100
125
1873 G05
75
Nonoverlap Time vs Temperature Driver Rise/Fall vs Temperature
70
TEST CIRCUIT 1 C
= 2000pF
L
60
TG FALLING EDGE
50
BG RISING EDGE
40
30
20
NONOVERLAP TIME (ns)
10
0
–50
–25 0
BG FALLING EDGE TG RISING EDGE
50 100 125
25 75
TEMPERATURE (°C)
1873 G08
LTC1873
U
UU
PI FU CTIO S
PVCC (Pin 1): Driver Power Supply Input. PVCC provides power to the two BGn output drivers. PVCC must be connected to a voltage high enough to fully turn on the external MOSFETs QB1 and QB2. PVCC should generally be connected directly to VIN. PVCC requires at least a 1µF bypass capacitor directly to PGND.
BOOST1 (Pin 2): Controller 1 Top Gate Driver Supply. The BOOST1 pin supplies power to the floating TG1 driver. BOOST1 should be bypassed to SW1 with a 1µF capacitor. An additional Schottky diode from VIN to BOOST1 pin will create a complete floating charge-pumped supply at BOOST1. No other external supplies are required.
BG1 (Pin 3): Controller 1 Bottom Gate Drive. The BG1 pin drives the gate of the bottom N-channel synchronous switch MOSFET, QB1. BG1 is designed to drive up to 10,000pF of gate capacitance directly. If RUN/SS1 goes low, BG1 will go low, turning off QB1. If FAULT mode is tripped, BG1 will go high and stay high, keeping QB1 on until the power is cycled.
TG1 (Pin 4): Controller 1 Top Gate Drive. The TG1 pin drives the gate of the top N-channel MOSFET, QT1. The TG1 driver draws power from the BOOST1 pin and returns to the SW1 pin, providing true floating drive to QT1. TG1 is designed to drive up to 10,000pF of gate capacitance directly. In shutdown or fault modes, TG1 will go low.
SW1 (Pin 5): Controller 1 Switching Node. SW1 should be connected to the switching node of converter 1. The TG1 driver ground returns to SW1, providing floating gate drive to the top N-channel MOSFET switch, QT1. The voltage at SW1 is compared to I comparator while the bottom MOSFET, QB1, is on.
I
(Pin 6): Controller 1 Current Limit Set. The I
MAX1
pin sets the current limit comparator threshold for controller 1. If the voltage drop across the bottom MOSFET, QB1, exceeds the magnitude of the voltage at I controller 1 will go into current limit. The I internal 10µA current source pull-up, allowing the current threshold to be set with a single external resistor to PGND. This current setting resistor should be Kelvin connected to the source of QB1. See the Current Limit Programming section for more information on choosing R
by the current limit
MAX1
MAX1
IMAX
MAX1
MAX1
pin has an
.
,
FCB (Pin 7): Force Continuous Bar. The FCB pin forces both converters to maintain continuous synchronous operation regardless of load when the voltage at FCB drops below 0.8V. FCB is normally tied to VCC. To force continuous operation, tie FCB to SGND. FCB can also be connected to a feedback resistor divider from a secondary winding on one converter’s inductor to generate a third regulated output voltage. Do not leave FCB floating.
RUN/SS1 (Pin 8): Controller 1 Run/Soft-Start. Pulling RUN/SS1 to SGND will disable controller 1 and turn off both of its external MOSFET switches. Pulling both RUN/SS pins down will shut down the entire LTC1873, dropping the quiescent supply current below 50µA. A capacitor from RUN/SS1 to SGND will control the turn-on time and rate of rise of the controller 1 output voltage at power-up. An internal 3.5µA current source pull-up at RUN/SS1 pin sets the turn-on time at approximately 50ms/µF.
COMP1 (Pin 9): Controller 1 Loop Compensation. The COMP1 pin is connected directly to the output of the first controller’s error amplifier and the input to the PWM comparator. An RC network is used at the COMP1 pin to compensate the feedback loop for optimum transient response.
SGND (Pin 10): Signal Ground. All internal low power circuitry returns to the SGND pin. Connect to a low impedance ground, separated from the PGND node. All feedback, compensation and soft-start connections should return to SGND. SGND and PGND should connect only at a single point, near the PGND pin and the negative plate of the CIN bypass capacitor.
FB1 (Pin 11): Controller 1 Feedback Input. The loop compensation network for controller 1 should be con­nected to FB1. FB1 is connected internally to the VID resistor network to set the output voltage at side 1.
SENSE (Pin 12): Output Sense. Connect to V VID0 to VID4 (Pins 13 to 17): VID Programming Inputs.
These are logic inputs that set the output voltage at side 1 to a preprogrammed value (see Table 1). VID4 is the MSB, VID0 is the LSB. The codes selected by the VIDn inputs correspond to the Intel Desktop VID specification. Each
OUT1
.
5
LTC1873
U
UU
PI FU CTIO S
VIDn pin includes an on-chip 40k pull-up resistor in series with a diode (see Block Diagram).
VCC (Pin 18): Power Supply Input. All internal circuits except the output drivers are powered from this pin. V should be connected to a low noise power supply voltage between 3V and 7V and should be bypassed to SGND with at least a 1µF capacitor in close proximity to the LTC1873.
FB2 (Pin 19): Controller 2 Feedback Input. FB2 should be connected through a resistor divider network to V set the ouput voltage. The loop compensation network for controller 2 also connects to FB2.
COMP2 (Pin 20): Controller 2 Loop Compensation. See COMP1.
RUN/SS2 (Pin 21): Controller 2 Run/Soft-Start. See RUN/ SS1.
FAULT (Pin 22): Output Overvoltage Fault (Latched). The FAULT pin is an open-drain output with an internal 10µA pull-up. If either regulated output voltage rises more than 15% above its programmed value for more than 25µs, the FAULT output will go high and the entire LTC1873 will be
OUT2
CC
to
disabled. When FAULT is high, both BG pins will go high, turning on the bottom MOSFET switches and pulling down the high output voltage. The LTC1873 will remain latched in this state until the power is cycled. When FAULT mode is active, the FAULT pin will be pulled up with an internal 10µA current source. Tying FAULT directly to SGND will disable latched FAULT mode and will allow the LTC1873 to resume normal operation when the overvoltage fault is removed.
PGND (Pin 23): Power Ground. The BGn drivers return to this pin. Connect PGND to a high current ground node in close proximity to the sources of external MOSFETs, QB1 and QB2, and the VIN and V
bypass capacitors.
OUT
SW2 (Pin 24): Controller 2 Switching Node. See SW1. TG2 (Pin 25): Controller 2 Top Gate Drive. See TG1. BG2 (Pin 26): Controller 2 Bottom Gate Drive. See BG1. BOOST2 (Pin 27): Controller 2 Top Gate Driver Supply.
See BOOST1.
I
(Pin 28): Controller 2 Current Limit Set. See I
MAX2
MAX1
.
TEST CIRCUIT
f
OSC
MEASURED
V
FB1
Test Circuit 1
5V
I
0.1µF
2k
BOOST1ICC
V
CC
BOOST1 TG1 BG1
2000pF2000pF 2000pF
SW1 I
MAX1
LTC1873
FCB
NC
VID0:4 RUN/SS1
NC NC
COMP1 FB1 SENSE
GND PGND
I
PVCC
PV
CC
BOOST2
SW2
I
MAX2
FAULT
RUN/SS2
COMP2
TG2 BG2
FB2
I
BOOST2
2000pF
2k
+
100µF
V
V
FAULT
FB2
1873 TC
6
BLOCK DIAGRA
V
CC
OSC
550kHz
3.5µA
RUN/SS1,2
COMP1,2
I
LIM
800mV 760mV 840mV
SHUTDOWN TO
THIS CONTROLLER
I
MAX1,2
10µA
500mV
W
90% DUTY CYCLE
SOFT
START
FB
+
FROM
OTHER
CONTROLLER
MIN MAX
BURST LOGIC
920mV
SHUTDOWN TO ENTIRE CHIP
FLT
0V
FCB
VID0
VID1
VID2
VID3
VID4
DRIVE LOGIC
25µs
DELAY
CONTROLLER
FROM
OTHER
V
CC
V
CC
V
CC
V
CC
V
CC
DIS
LTC1873
PV
40k
40k
40k
40k
40k
CC
10µA
SWITCH
CONTROL
LOGIC
BOOST1,2 TG1,2 SW1,2 BG1,2 PGND SGND
FAULT
FB1,2
R11 20k
R
SENSE
TO FB1
B1
1873 BD
WUUU
APPLICATIO S I FOR ATIO
OVERVIEW
The LTC1873 is a dual, step-down (buck), voltage mode feedback switching regulator controller. It is designed to be used in a synchronous switching architecture with two external N-channel MOSFETs per channel. It is intended to operate from a low voltage input supply (7V maximum) and provide a high power, high efficiency, precisely regu­lated output voltage. Several features make it particularly suited for microprocessor supply regulation. Output regu­lation is extremely tight, with DC line and load regulation and initial accuracy better than 1.5%, and total regulation including transient response inside of 3.5% with a prop-
erly designed circuit. The 550kHz switching frequency allows the use of physically small, low value external components without compromising performance. An onboard DAC sets the output voltage at channel 1, consis­tent with the Intel desktop VID specification (Table 1).
The LTC1873’s internal feedback amplifier is a 25MHz gain-bandwidth op amp, allowing the use of complex multipole/zero compensation networks. This allows the feedback loop to maintain acceptable phase margin at higher frequencies than traditional switching regulator controllers allow, improving stability and maximizing tran­sient response. The 800mV internal reference at channel
2
7
LTC1873
WUUU
APPLICATIO S I FOR ATIO
Table 1. VID Inputs and Corresponding Output Voltage for Channel 1
CODE VID4 VID3 VID2 VID1 VID0 V
00000 GND GND GND GND GND 2.05V 00001 GND GND GND GND Float 2.00V 00010 GND GND GND Float GND 1.95V 00011 GND GND GND Float Float 1.90V 00100 GND GND Float GND GND 1.85V 00101 GND GND Float GND Float 1.80V 00110 GND GND Float Float GND 1.75V 00111 GND GND Float Float Float 1.70V 01000 GND Float GND GND GND 1.65V 01001 GND Float GND GND Float 1.60V 01010 GND Float GND Float GND 1.55V 01011 GND Float GND Float Float 1.50V 01100 GND Float Float GND GND 1.45V 01101 GND Float Float GND Float 1.40V 01110 GND Float Float Float GND 1.35V 01111 GND Float Float Float Float 1.30V
* 11111 is defined by Intel to signify “no CPU.” The LTC1873 will generate the output voltage shown when this codes is selected.
OUT1
CODE VID4 VID3 VID2 VID1 VID0 V
10000 Float GND GND GND GND 3.50V 10001 Float GND GND GND Float 3.40V 10010 Float GND GND Float GND 3.30V 10011 Float GND GND Float Float 3.20V 10100 Float GND Float GND GND 3.10V 10101 Float GND Float GND Float 3.00V 10110 Float GND Float Float GND 2.90V 10111 Float GND Float Float Float 2.80V 11000 Float Float GND GND GND 2.70V 11001 Float Float GND GND Float 2.60V 11010 Float Float GND Float GND 2.50V 11011 Float Float GND Float Float 2.40V 11100 Float Float Float GND GND 2.30V 11101 Float Float Float GND Float 2.20V 11110 Float Float Float Float GND 2.10V 11111* Float Float Float Float Float 2.00V
OUT1
allows regulated output voltages as low as 800mV without external level shifting amplifiers.
The LTC1873’s synchronous switching logic transitions automatically into Burst Mode operation, maximizing effi­ciency with light loads. An onboard overvoltage (OV) fault flag indicates when an OV fault has occurred. The OV flag can be set to latch the device off when an OV fault has occurred, or to automatically resume operation when the fault is removed.
2-Phase Operation
The LTC1873 dual switching regulator controller offers considerable benefits using 2-phase operation. Circuit benefits include lower input filtering requirements, reduced electromagnetic interference (EMI) and increased efficiency associated with 2-phase operation.
Why the need for 2-phase operation? Until recently, con­stant-frequency dual switching regulators operated both channels in phase (i.e., single-phase operation). This means that both topside MOSFETs turned on at the same time, causing current pulses of up to twice the amplitude of those for one regulator to be drawn from the input
capacitor. These large amplitude current pulses increased the total RMS current flowing from the input capacitor, requiring the use of more expensive input capacitors and increasing both EMI and losses in the input capacitor and input power supply.
With 2-phase operation, the two channels of the LTC1873 are operated 180 degrees out of phase. This effectively interleaves the current pulses coming from the switches, greatly reducing the overlap time where they add together. The result is a significant reduction in total RMS input current, which in turn allows less expensive input capaci­tors to be used, reduces shielding requirements for EMI and improves real world operating efficiency.
Figure 7 shows example waveforms for a single switching regulator channel versus a 2-phase LTC1873 system with both sides switching. A single-phase dual regulator with both sides operating would exhibit double the single side numbers. In this example, 2-phase operation reduced the RMS input current from 9.3A
4.8A
. While this is an impressive reduction in itself,
RMS
remember that the power losses are proportional to I
(2 × 4.66A
RMS
RMS
) to
RMS
2
,
meaning that the actual power wasted is reduced by a
8
WUUU
APPLICATIO S I FOR ATIO
LTC1873
factor of 3.75. The reduced input ripple voltage also means less power is lost in the input power path, which could include batteries, switches, trace/connector resistances and protection circuitry. Improvements in both conducted and radiated EMI also directly accrue as a result of the reduced RMS input current and voltage.
Small Footprint
The LTC1873 operates at a 550kHz switching frequency, allowing it to use low value inductors without generating excessive ripple currents. Because the inductor stores less energy per cycle, the physical size of the inductor can be reduced without risking core saturation, saving PCB board space. The high operating frequency also means less energy is stored in the output capacitors between cycles, minimizing their required value and size. The remaining components, including the SSOP-28 LTC1873, are tiny, allowing an entire dual-output LTC1873 circuit to be constructed in 1.5in2 of PCB space. Further, this space is generally located right next to the microprocessor or in some similarly congested area, where PCB real estate is at a premium.
Fast Transient Response
The voltage mode feedback loop and MOSFET VDS current limit sensing remove the need for an external current sense resistor, eliminating an external component and a source of power loss in the high current path. Properly designed circuits using low gate charge MOSFETs are capable of efficiencies exceeding 90% over a wide range of output voltages.
VID Programming
The LTC1873 includes an onboard feedback network that programs the output voltage at side 1 in accordance with the Intel Desktop VID specification (Table 1). The network includes a 20k resistor (R1) connected from SENSE to FB1, and a variable value resistor (RB) from FB1 to SGND, with the value set by the digital code present at the VID0:4 pins. SENSE should be connected to V network to monitor the output voltage. No additional feedback components are required to set the output volt­age at controller 1, although loop compensation compo­nents are still required. Each VIDn pin includes an internal 40k pull-up resistor, allowing it to float high if left uncon­nected. The pull-up resistors are connected to VCC through diodes (see Block Diagram), allowing the VIDn pins to be pulled above VCC without damage.
to allow the
OUT1
The LTC1873 uses a fast 25MHz GBW op amp as an error amplifier. This allows the compensation network to be designed with several poles and zeros in a more flexible configuration than with a typical gm feedback amplifier. The high bandwidth of the amplifier, coupled with the high switching frequency and the low values of the external inductor and output capacitor, allow very high loop cross­over frequencies. The low inductor value is the other half of the equation—with a typical value on the order of 1µH, the inductor allows very fast di/dt slew rates. The result is superior transient response compared with conventional solutions.
High Efficiency
The LTC1873 uses a synchronous step-down (buck) architecture, with two external N-channel MOSFETs per output. A floating topside driver and a simple external charge pump provide full gate drive to the upper MOSFET.
Note that code 11111, defined by Intel to indicate “no CPU present,” does generate an output voltage at V Note also that controller 2 on the LTC1873 is not con­nected to the VID circuitry, and works independently from controller 1.
ARCHITECTURE DETAILS
The LTC1873 dual switching regulator controller includes two independent regulator channels. The two sides of the chip and their corresponding external components act independently of each other with the exception of the common input bypass capacitor, the VID circuitry at side 1, and the FCB and FAULT pins, which affect both chan­nels. In the following discussions, when a pin is referred to without mentioning which side is involved, that discus­sion applies equally to both sides.
OUT1
(2.00V).
9
LTC1873
+
TG
BOOST
SW
BG
PGND
PV
CC
D
CP
C
IN
+
C
OUT
1873 F02
V
OUT
L
EXT
V
IN
QT
QB
C
CP
1µF
LTC1873
WUUU
APPLICATIO S I FOR ATIO
Switching Architecture
Each half of the LTC1873 is designed to operate as a synchronous buck converter (Figure 1). Each channel includes two high power MOSFET gate drivers to control external N-channel MOSFETs QT and QB. These drivers have 0.5 output impedances and can carry well over an amp of continuous current with peak currents up to 5A to slew large MOSFET gates quickly. The external MOSFETs are connected with the drain of QT attached to the input supply and the source of QT at the switching node SW. QB is the synchronous rectifier with its drain at SW and its source at PGND. SW is connected to one end of the inductor, with the other end connected to V capacitor is connected from V
to PGND.
OUT
. The output
OUT
When a switching cycle begins, QB is turned off and QT is turned on. SW rises almost immediately to VIN and the inductor current begins to increase. When the PWM pulse finishes, QT turns off and one nonoverlap interval later, QB turns on. Now SW drops to PGND and the inductor current decreases. The cycle repeats with the next tick of the master clock. The percentage of time spent in each mode is controlled by the duty cycle of the PWM signal, which in turn is controlled by the feedback amplifier. The master clock runs at a 550kHz rate and turns QT once every 1.8µs. In a typical application with a 5V input and a 1.5V output, the duty cycle will be set at 1.5/5 × 100% or 30% by the feedback loop. This will give roughly a 540ns on-time for QT and a 1.26µs on-time for QB.
This constant frequency operation brings with it a couple of benefits. Inductor and capacitor values can be chosen with a precise operating frequency in mind and the feed­back loop components can be similarly tightly specified. Noise generated by the circuit will always be in a known
frequency band with the 550kHz frequency designed to leave the 455kHz IF band free of interference. Subharmonic oscillation and slope compensation, common headaches with constant frequency current mode switchers, are absent in voltage mode designs like the LTC1873.
During the time that QT is on, its source (the SW pin) is at VIN. VIN is also the power supply for the LTC1873. How­ever, QT requires VIN + V
at its gate to achieve
GS(ON)
minimum RON. This presents a problem for the LTC1873— it needs to generate a gate drive signal at TG higher than its highest supply voltage. To accomplish this, the TG driver runs from floating supplies, with its negative supply attached to SW and its power supply at BOOST. This
allows it to slew up and down with the source of QT. In combination with a simple external charge pump (Figure 2),
this allows the LTC1873 to completely enhance the gate of QT without requiring an additional, higher supply voltage.
The two channels of the LTC1873 run from a common clock, with the phasing chosen to be 180° from side 1 to side 2. This has the effect of doubling the frequency of the switching pulses seen by the input bypass capacitor, significantly lowering the RMS current seen by the capaci­tor and reducing the value required (see the 2-Phase section).
Feedback Amplifier
Each side of the LTC1873 senses the output voltage at V
with an internal feedback op amp (see Block Dia-
OUT
gram). This is a real op amp with a low impedance output, 85dB open-loop gain and 25MHz gain-bandwidth product. The positive input is connected internally to an 800mV reference, while the negative input is connected to the FB
10
V
IN
TG
1/2
SW
LTC1873
PGND
BG
Figure 1. Synchronous Buck Architecture
QT
L
EXT
QB
+
C
IN
V
+
OUT
C
OUT
1873 F01
Figure 2. Floating TG Driver Supply
Loading...
+ 22 hidden pages