LG Innotek RBFAC21XX User Manual
• Product Information
Dimensions
Description
This product is applied to Class 2 Bluetooth Multimedia Module
RBFA-C217/8/9A which includes the CSR BC5-MM chipset
and the integrated pattern antenna.
Features
- Sensitivity : Typ. -88dBm
- Output Power : Typ. +2dBm Class 2
- Temperature Range : -40℃ ~ +85℃
- Supply Voltage : VDD – 3.1V to 3.6V
- Interface : UART, USB
- Audio Interface : Analog In/Out, Digital In/Out(I2S)
- Bluetooth Specification v3.0 with EDR Compliant
Applications
- Handsfree
- Bluetooth automotive wireless gateways
PART NO.
NO. Changes APPD
1. 0. `13.10.10
Initialize
NAME MATERIAL SPEC FINISH SIZE
LG Innotek Co, Ltd
UNIT SCALE
DRAW DSGD CHKD APPD
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Choi
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TITLE
User Manual(1/5)
DOCUMENT NO.
RBFA-C217/8/9A(1-2)
* Power Supply Specification
The power of DC3.1V ~ 3.6V is should be supplied to the Bluetooth module power(VDD). The
module supplies the power to the each block depending on the function. Module input power in
excess of the rated input power may cause damage to the internal components. And the influx of
Surge and ESD also may lead to the damage of the modem in the vehicle. For the prevention of this,
the module is necessary to design block the infloux of Sugre and EDS.
Pin NO. Signal Name
13.14 VDD In 3.1V 3.3V 3.6V
* Memory Interface
① Memory Management Unit
The MMU provides a number of dynamically allocated ring buffers that hold the data that is in transit
between the host, the air or the Kalimba DSP. The dynamic allocation of memory ensures efficient
use of the available RAM and is performed by a hardware MMU to minimise the overheads on the
processor during data/voice transfers.
② System RAM
48Kbyte of on-chip RAM supports the RISC MCU and is shared between the ring buffers used to
hold voice/data for each active connection and the general-purpose memory required by the
Bluetooth stack.
③ Kalimba DSP RAM
Additional on-chip RAM is provided to support the Kalimba DSP:
■ 16K x 24-bit for data memory 1 (DM1)
■ 12K x 24-bit for data memory 2 (DM2)
■ 6K x 32-bit for program memory (PM)
* UART Interface
RBFA-C21XX UART interface provides a simple mechanism for communicating with other serial
devices using the RS232 protocol. UART configuration parameters, such as baud rate and packet
format, are set using LGIT firmware.
Function
(Module case)
MIN TYP MAX
Parameter Value
Baud rate 115,200 baud
Flow control None
Parity None
Number of stop bits 1
Bits per byte 8
PART NO.
Initialize
NO. Changes APPD
1. 0. `13.10.10
NAME MATERIAL SPEC FINISH SIZE
UNIT SCALE
DRAW DSGD CHKD APPD
B
H
Choi
I
P
Park
TITLE
K
S
DOCUMENT NO.
Kim
User Manual(2/5)
RBFA-C217/8/9A(1-2)
LG Innotek Co, Ltd
General Features
1) Bluetooth Module Features
• Bluetooth Power Class 2
• Embedded Fully Bluetooth v2.0/v2.1 + EDR System Compliant
• Embedded Bluetooth Profile
• Embedded AEC/NR Algorithm for Handsfree
• Full-speed Bluetooth Operation with Full Piconet Support
• Operation Voltage is 3.3V Single Power Rail
• Excellent Compatibility with Cellular Telephones
• Command and data Interface is UART and USB
• 16-bit Internal Stereo CODEC
• Support for 802.11 Co-existence
• RoHS Compliant
2) Functionality Key Features : 2.1+EDR
• Secure simple pairing
• Sniff subrating
• Encryption pause resume
• Packet boundary flags
• Encryption
• Extended inquiry response
3) Functionality Key Features : 2.0+EDR
• AFH, including classifier
• Faster connection: enhanced inquiry scan (immediate FHS response)
• LMP improvements
• Parameter ranges
• AFH as master and automatic channel classification
• Fast connect: interlaced inquiry and page scan plus RSSI during inquiry
• eSCO, eV3 + CRC, eV4, eV5
• SCO handle
• Synchronization.
4) RBFA-C21xxFirmware Support Profile
-. HFP1.6
-. AVRCP1.4
-. SPP1.1
-. GAP
-. OPP
-. PBAP1.0
-. GAVDP1.3
-. HID
-. MAP1.0
-. PAN(USER)
PART NO.
Initialize
NO. Changes APPD
1. 0. `13.10.10
NAME MATERIAL SPEC FINISH SIZE
UNIT SCALE
DRAW DSGD CHKD APPD
B
H
Choi
I
P
Park
K
S
Kim
TITLE
User Manual(3/5)
DOCUMENT NO.
RBFA-C217/8/9A(1-2)
LG Innotek Co, Ltd
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