LG Innotek RBFAC21XX User Manual

Product Information
Dimensions
Description
This product is applied to Class 2 Bluetooth Multimedia Module RBFA-C217/8/9A which includes the CSR BC5-MM chipset and the integrated pattern antenna.
Features
- Sensitivity : Typ. -88dBm
- Output Power : Typ. +2dBm Class 2
- Temperature Range : -40 ~ +85
- Supply Voltage : VDD – 3.1V to 3.6V
- Interface : UART, USB
- Audio Interface : Analog In/Out, Digital In/Out(I2S)
- Bluetooth Specification v3.0 with EDR Compliant
Applications
- Handsfree
- Bluetooth automotive wireless gateways
PART NO.
NO. Changes APPD
Initialize
NAME MATERIAL SPEC FINISH SIZE
LG Innotek Co, Ltd
UNIT SCALE
DRAW DSGD CHKD APPD
B H
Choi
I P
Park
K S
Kim
TITLE
User Manual(1/5)
DOCUMENT NO.
RBFA-C217/8/9A(1-2)
* Power Supply Specification
The power of DC3.1V ~ 3.6V is should be supplied to the Bluetooth module power(VDD). The module supplies the power to the each block depending on the function. Module input power in excess of the rated input power may cause damage to the internal components. And the influx of Surge and ESD also may lead to the damage of the modem in the vehicle. For the prevention of this, the module is necessary to design block the infloux of Sugre and EDS.
Pin NO. Signal Name
13.14 VDD In 3.1V 3.3V 3.6V
* Memory Interface
Memory Management Unit The MMU provides a number of dynamically allocated ring buffers that hold the data that is in transit between the host, the air or the Kalimba DSP. The dynamic allocation of memory ensures efficient use of the available RAM and is performed by a hardware MMU to minimise the overheads on the processor during data/voice transfers. System RAM 48Kbyte of on-chip RAM supports the RISC MCU and is shared between the ring buffers used to hold voice/data for each active connection and the general-purpose memory required by the Bluetooth stack. Kalimba DSP RAM Additional on-chip RAM is provided to support the Kalimba DSP:
16K x 24-bit for data memory 1 (DM1)
12K x 24-bit for data memory 2 (DM2)
6K x 32-bit for program memory (PM)
* UART Interface
RBFA-C21XX UART interface provides a simple mechanism for communicating with other serial devices using the RS232 protocol. UART configuration parameters, such as baud rate and packet format, are set using LGIT firmware.
Function
(Module case)
MIN TYP MAX
Parameter Value
Baud rate 115,200 baud Flow control None Parity None Number of stop bits 1 Bits per byte 8
PART NO.
Initialize
NO. Changes APPD
NAME MATERIAL SPEC FINISH SIZE
UNIT SCALE
DRAW DSGD CHKD APPD
B H
Choi
I P
Park
TITLE
K S
DOCUMENT NO.
Kim
User Manual(2/5)
RBFA-C217/8/9A(1-2)
LG Innotek Co, Ltd
General Features
1) Bluetooth Module Features
• Bluetooth Power Class 2
• Embedded Fully Bluetooth v2.0/v2.1 + EDR System Compliant
• Embedded Bluetooth Profile
• Embedded AEC/NR Algorithm for Handsfree
• Full-speed Bluetooth Operation with Full Piconet Support
• Operation Voltage is 3.3V Single Power Rail
• Excellent Compatibility with Cellular Telephones
• Command and data Interface is UART and USB
• 16-bit Internal Stereo CODEC
• Support for 802.11 Co-existence
RoHS Compliant
2) Functionality Key Features : 2.1+EDR
• Secure simple pairing
• Sniff subrating
• Encryption pause resume
• Packet boundary flags
• Encryption
• Extended inquiry response
3) Functionality Key Features : 2.0+EDR
• AFH, including classifier
• Faster connection: enhanced inquiry scan (immediate FHS response)
• LMP improvements
• Parameter ranges
• AFH as master and automatic channel classification
• Fast connect: interlaced inquiry and page scan plus RSSI during inquiry
eSCO, eV3 + CRC, eV4, eV5
• SCO handle
Synchronization.
4) RBFA-C21xxFirmware Support Profile
-. HFP1.6
-. AVRCP1.4
-. SPP1.1
-. GAP
-. OPP
-. PBAP1.0
-. GAVDP1.3
-. HID
-. MAP1.0
-. PAN(USER)
PART NO.
Initialize
NO. Changes APPD
NAME MATERIAL SPEC FINISH SIZE
UNIT SCALE
DRAW DSGD CHKD APPD
B H
Choi
I P
Park
K S
Kim
TITLE
User Manual(3/5)
DOCUMENT NO.
RBFA-C217/8/9A(1-2)
LG Innotek Co, Ltd
PIN Descriptions
No.
I/O
Bidirectional CMOS output, tristate, with weak internal pull
UART data output
-
up resisto
r.
CMOS input with weak internal pull
-down
UART data input
Bidirectional CMOS output, tristate, with weak internal pull
UART request to send active low
CMOS input with weak internal pull
-down
UART clear to send active low
Ground
CMOS input with weak internal pull
-up
Reset if low. Input debounced so must be low for >5ms to cause a reset Recommended external 4.7k
up resistor
& stability capacitor
Ground
VDD
Positive supply for Module
-
TBD
TBD
Internal MIC B
Analog
Internal microphone bias
Ground
Analog Ground
Analog
Microphone input positive, left
Analog
Microphone input negative, left
-
Analog Ground
Analog
Speaker output
Analog
Speaker output positive, right
Analog
Speaker output negative, left
Analog
Speaker output positive, left
Ground
Ground
Ground
Pin Name
1 UART_Tx O
2 UART_Rx I
3 UART_RTS O
4 UART_CTS I
5 GND - -
6 RESET# I
7 GND - -
8 VDD_3V3 I
9 RESERVED - -
10 RESERVED - -
Pad Type Description
-up
-up
Recommended external 4.7k Pull-
Pull-
Supply voltage : Typical 3.3V.
11 12
13 14 MIC_A_P I
15 MIC_A_N I
16 17 SPK_B_N O 18 SPK_B_P O 19 SPK_A_N O 20 SPK_A_P O 21 22 23
PART NO.
NO. Changes APPD
ias
GND - -
AGND - -
AGND - -
GND - ­GND - ­GND - -
Initialize
-
NAME MATERIAL SPEC FINISH SIZE
LG Innotek Co, Ltd
Must be use external ESD protection
negative, right
UNIT SCALE
DRAW DSGD CHKD APPD
B H
Choi
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TITLE
User Manual(4/5)
DOCUMENT NO.
RBFA-C217/8/9A(1-2)
PIN Descriptions
No.
I/O
CMOS input, with weak internal pull
-down
Synchronous data input
-
CMOS output, with weak internal p ull
Synchronous data output
-
I/O
Bidirectional with weak internal pul l-
Synchronous data Sync
-
I/O
Bidirectional with weak internal pul l-
Synchronous data clock
-
EC/NR Logger
Bidirectional with programmable st rength internal pull
Programmable input/output line
-
CMOS output, tristate, with weak in ternal pull
SPI data output
- Used to program and configure (PS Keys), an d debug the BC5
CMOS input, with weak internal pull
-down
SPI data input
- Used to program and configure (PS Keys), an d debug the BC5
I/O
Input with weak internal pull
Chip select for SPI, active low
- Used to program and configure (PS Keys), an d debug the BC5
I/O
Input with weak internal pull
SPI clock
- Used to program and configure (PS Keys), an d debug the BC5
Ground
Ground
Ground
Ground
Pin Name
24
25 PCM_OUT O
26 PCM_SYNC
27 PCM_CLK
28
29 SPI_MISO O
30 SPI_MOSI I
31 SPI_CSB
32 SPI_CLK
33 34 35 36
PCM_IN I
GND - ­GND - ­GND - ­GND - -
Pad Type Description
-down
down
down
O
-down
-up/down
-up
-down
The same pin as the I2S interface : SD_IN
The same pin as the I2S interface : SD_OUT
The same pin as the I2S interface : WS
The same pin as the I2S interface : SCK
Using the AEC/NR data logger
-MM
-MM
-MM
-MM
PART NO.
NO. Changes APPD
Initialize
NAME MATERIAL SPEC FINISH SIZE
LG Innotek Co, Ltd
UNIT SCALE
DRAW DSGD CHKD APPD
B H
Choi
I P
Park
K S
Kim
TITLE
User Manual(5/5)
DOCUMENT NO.
RBFA-C217/8/9A(1-2)
RSS-GEN 7.1.3 User manual Notice for Licence-Exempt Radio Appartus.
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.
L'exploitation est autoris e aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radio lectrique subi, m me si le brouillage est susceptible d'en compromettre le fonctionnement.
FCC Statement FCC Part 15.19 This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation
FCC Part 15.21 Any changes or modifications (including the antennas) to this device that are not expressly approved by the manufacturer may void the user's authority to operate the equipment.
Part 15.105 (B) Note : This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications, However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
Modifications not expressly approved by the manufacturer could void your authority to operate the equipment under FCC rules.
RF Exposure Statement (2.1091) FCC RF Radiation Exposure Statement: FCC RF Radiation Exposure Statement: This equipment complies with FCC RF Radiation exposure limits set forth for an uncontrolled environment. This device and its antenna must not be co-located or operating in conjunction with any other antenna or transmitter.
This equipment should be installed and operated with a minimum distance of 20cm between the radiator and your body.
RF du FCC d'exposition aux radiations: Cet équipement est conforme à l'exposition de la FCC rayonnements RF limites établies pour un environnement non contrôlé. L’antenne pour ce transmetteur ne doit pas être même endroit avec d’autres émetteurs sauf conformément à la FCC procédures de produits Multi-émetteur. Cet équipement doit être installé et utilisé avec une distance minimale de 20cm entre le radiateur et votre corps.
* Information for OEM integrator The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user manual of the end product. The user manual which is provided by OEM integrators for end users must include the following information in a prominent location. “To comply with FCC RF exposure compliance requirements, the antenna used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter.” Label for end product must include “Contains FCC ID: YZPRBFAC21XX, IC: 7414A­RBFAC21XX" or “ A RF transmitter inside, FCC ID: YZPRBFAC21XX, IC: 7414A- RBFAC21XX”.
* Information pour les OEM intégrateur L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final concernant la façon d'installer ou de retirer ce module RF dans le manuel utilisateur du produit final. Le manuel de l'utilisateur qui est fourni par les intégrateurs OEM pour les utilisateurs finaux doivent inclure les renseignements suivants dans un endroit bien en vue. «Pour se conformer aux exigences de conformité d'exposition RF de la FCC, l'antenne utilisée pour ce transmetteur doit être installé pour fournir une distance de séparation d'au moins 20 cm de toute personne et ne doit pas être co-localisés ou fonctionnant en conjonction avec une autre antenne ou transmetteur. " Étiquette pour le produit final doit inclure "Contient FCC ID: YZPRBFAC21XX, IC: 7414A-
RBFAC21XX" ou "A l'intérieur du transmetteur RF, FCC ID: YZPRBFAC21XX, IC: 7414A­RBFAC21XX".
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