LG U8550 Service Manual

Date: November, 2005 / Issue 1.0

Service Manual

U8550

Service Manual

Model : U8550

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1. INTRODUCTION .............................. 6

1.1 Purpose................................................... 6

1.2 Regulatory Information............................ 6

1.3 Abbreviations .......................................... 8

2. PERFORMANCE............................ 10

2.1 System Overview.................................. 10

2.2 Usable environment.............................. 11

2.3 Radio Performance............................... 11

2.4 Current Consumption............................ 19

2.5 RSSI...................................................... 19

2.6 Battery Bar............................................ 19

2.7 Sound Pressure Level........................... 20

2.8 Charging ............................................... 21

3. Technical Brief .............................. 22

3.1 Digital Baseband(DBB) & Multimedia

Processor ............................................ 22

3.1.1 General Description .........................22

3.1.2 Hardware Architecture .....................23

3.1.3 External memory interface...............27

3.1.4 RF Interface .....................................28

3.1.5 SIM Interface ...................................30

3.1.6 UART Interface ................................31

3.1.7 GPIO (General Purpose Input/Output)

map..................................................32

3.1.8 USB .................................................33

3.1.9 Folder ON/OFF Detection................35

3.1.10 Bluetooth Interface.........................36

3.1.11 TransFlash Interface......................39

3.1.12 Power On Sequence......................40

3.1.13 Keypad...........................................41

3.2 GAM Hardware Subsystem ...................43

3.2.1 General Description .........................43

3.2.2 Block Description .............................44

3.2.3 Camera & Camera FPC Interface... 46

3.2.4 Camera Regulator ...........................49

3.2.5 Display & LCD FPC Interface ..........50

3.2.6 Main&Sub LCD Backlight Illumination...52

3.2.7 Camera Flash LED Illumination ...... 52

3.2.8 Keypad Illumination .........................53

3.3 LCD Module...........................................54

3.4 Analog Baseband (ABB) Processor.......55

3.4.1 Overview of Audio path....................55

3.4.2 Audio Signal Processing

& Interface........................................56

3.4.3 Audio Mode..................................... 58

3.4.4 Voice Call.........................................59

3.4.5 MIDI (Ring Tone Play) .....................62

3.4.6 MP3 (Audio Player)..........................63

3.4.7 Video Telephony..............................64

3.4.8 Audio Part Main Components..........65

3.4.9 GPADC(General Purpose ADC) and

AUTOADC2 .....................................67

3.4.10 Charger control ..............................68

3.4.11 Fuel Gauge ....................................69

3.4.12 Battery Temperature

Measurement.................................70

3.4.13 Charging Part.................................71

3.5 Voltage Regulation.................................74

3.5.1 Internal Regulation...........................74

3.5.2 External Regulation .........................74

3.6 General Description of RF Part..............76

3.7 GSM Mode.............................................78

3.7.1 Receiver...........................................78

3.7.2 Transmitter.......................................83

3.8 WCDMA Mode.......................................85

3.8.1 Receiver.......................................... 85

3.8.2 Transmitter.......................................88

Table of Contents

Table Of Contents

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3.8.3 Frequency Generation .....................92

4. TROUBLE SHOOTING ...................94

4.1 Power ON Trouble .................................94

4.2 USB Trouble ..........................................96

4.3 SIM Detect Trouble................................97

4.4 TransFlash Trouble................................98

4.5 Keypad Trouble......................................99

4.6 1.3M Camera Trouble..........................101

4.7 VGA Camera Trouble ..........................103

4.8 Main LCD Trouble................................105

4.9 Sub LCD Trouble .................................107

4.10 Keypad Backlight Trouble..................109

4.11 Camera Flash Trouble .......................111

4.12 Audio Trouble.....................................113

4.12.1 Receiver.......................................113

4.12.2 Speaker .......................................117

4.12.3 Microphone ..................................121

4.12.4 Headset - Receiver ......................125

4.12.5 Headset - MIC..............................126

4.12.6 Headset .......................................127

4.13 Charger Trouble.................................128

4.14 RF Component...................................130

4.15 Procedure to check............................132

4.16 Checking Common Power

Source Block......................................133

4.17 Checking VCXO Block.......................140

4.18 Checking Ant. SW Module Block .......145

4.19 Checking Antenna Switch Block input

logic....................................................146

4.19.1 Mode Logic by TP Command ......146

4.19.2 Checking Switch Block

power source ...............................148

4.20 Checking WCDMA Block ...................153

4.20.1 Checking VCXO Block.................154

4.20.2 Checking Ant. SW module...........154

4.20.3 Checking Control Signal ..............154

4.20.4 Checking RF TX Level.................156

4.20.5 Checking PAM Block ...................159

4.20.6 Checking RX I,Q ..........................162

4.21 Checking GSM Block.........................164

4.21.1 Checking Regulator Circuit ..........165

4.21.2 Checking VCXO Block.................165

4.21.3 Checking Ant. SW Module...........165

4.21.4 Checking Control Signal ..............166

4.21.5 Checking RF Tx Path...................168

4.22 Checking Bluetooth Block..................181

5. BLOCK DIAGRAM ........................185

5.1 GSM & WCDMA RF Block...................185

6. DOWNLOAD .................................187

6.1 The Purpose of Downloading

Software ............................................187

6.2 Download Environment Setup .............187

6.3 U8XXX Download ................................188

7. CALIBRATION ..............................200

7.1 General Description ............................ 200

7.2 XCALMON Environment..................... 200

7.2.1 H/W Environment.......................... 200

7.2.2 S/W Environment.......................... 200

7.2.3 Configuration Diagram of

Calibration Environment................ 200

7.3 Calibration Explanation....................... 201

7.3.1 Overview....................................... 201

7.3.2 Calibration Items........................... 201

7.3.3 EGSM 900 Calibration Items ........ 202

7.3.4 DCS 1800 Calibration Items ......... 207

Table Of Contents

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7.3.5 WCDMA Calibration Items............ 210

7.3.6 Baseband Calibration Item ........... 218

7.4 Program Operation ............................. 219

7.4.1 XCALMON Program Overview ..... 219

7.4.2 XCALMON Icon Description ......... 220

7.4.3 Calibration Procedure ................... 223

7.4.4 Calibration Result Message.......... 225

8. Circuit Diagram ............................229

9. pcb layout .....................................239

10. EXPLODED VIEW &

REPLACEMENT PART LIST ..... 248

10.1 EXPLODED VIEW ............................ 248

10.2 Replacement Parts

<Mechanic component>.................... 251

<Main component> ........................... 255

10.3 Accessory ......................................... 282

1. INTRODUCTION

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1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the
features of this model.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system.
There are may be risks of toll fraud associated with your telecommunications system. System users
are responsible for programming and configuring the equipment to prevent unauthorized use. The
manufacturer does not warrant that this product is immune from the above case but will prevent
unauthorized use of common-carrier telecommunication service of facilities accessed through or
connected to it. The manufacturer will not be responsible for any charges that result from such
unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the phones or compatibility with the
network, the telephone company is required to give advanced written notice to the user, allowing the
user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on the phones must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.

1. INTRODUCTION

1. INTRODUCTION

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E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.

G. Interference and Attenuation

A phone may interfere with sensitive laboratory equipment, medical equipment, etc.
Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as
described.

1. INTRODUCTION

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1.3 Abbreviations

For the purpose of this manual, following abbreviations apply.

APC Automatic Power Control

BB Baseband

BER Bit Error Ratio

CC-CV Constant Current - Constant Voltage

CLA Cigar Lighter Adapter

DAC Digital to Analog Converter

DCS Digital Communication System

dBm dB relative to 1 milliwatt

DSP Digital Signal Processing

DTC DeskTop Charger

EEPROM Electrical Erasable Programmable Read-Only Memory

EL Electroluminescence

ESD Electrostatic Discharge

FPCB Flexible Printed Circuit Board

GMSK Gaussian Minimum Shift Keying

GPIB General Purpose Interface Bus

GPRS General Packet Radio Service

GSM Global System for Mobile Communications

IPUI International Portable User Identity

IF Intermediate Frequency

LCD Liquid Crystal Display

LDO Low Drop Output

LED Light Emitting Diode

OPLL Offset Phase Locked Loop

PAM Power Amplifier Module

PCB Printed Circuit Board

PGA Programmable Gain Amplifier

PLL Phase Locked Loop

1. INTRODUCTION

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1.3 Abbreviations

For the purpose of this manual, following abbreviations apply.

I. Introduction

PSTN Public Switched Telephone Network

RF Radio Frequency

RLR Receiving Loudness Rating

RMS Root Mean Square

RTC Real Time Clock

SAW Surface Acoustic Wave

SIM Subscriber Identity Module

SLR Sending Loudness Rating

SRAM Static Random Access Memory

UMTS Universal Mobile Telephony System

2. PERFORMANCE

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2.1 System Overview

2. PERFORMANCE

Item Specification

Shape GSM900/1800/1900 & WCDMA Folder- Dual Mode Handset

Size 90 x 55 x 24.7mm

Weight 134g (with Standard Battery)

Power 1400mA Li-Polymer

Talk Time

Over 180 Min (WCDMA, Tx=12 dBm, Voice)

Over 220 Min (GSM, Tx=Max, Voice)

Standby Time

Over 165 hrs (WCDMA, DRX=1.28)

Over 223 hrs (GSM, Paging period=9)

Antenna Fixed Type (Fixed Screw)

Main LCD 220 x 220 TFT LCD 262K Color

Sub LCD 128 x 160 TFT LCD 262K Color

Main/Sub LCD BL White LED Backlight

Vibrator Yes (Cylinder Type)

LED Indicator Blue

C-MIC Yes

Receiver Yes

Earphone Jack Yes

SIM Socket Yes (3.0V/1.8V)

Volume Key Push Type(+,-)

Voice Key Push Type (Memo)

External Memory T - Flash Socket

I/O Connect 24 Pin

2. PERFORMANCE

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2.2 Usable environment

1) Environment

2) Environment(Accessory)

* CLA: 12~24V(DC)

2.3 Radio Performance

1) Transmitter -GSM Mode

Item Spec. Unit

Voltage 4.0 (Typ), 3.4 (Min), (Shut Down: 3.2) V

Operating Temp. -20 ~ + 60 °C

Storage Temp. -30 ~ + 85 °C

Humidity max. 85 %

Item Spec. Min Typ. Max Unit

Power Available power 100 220 240 Vac

No Item GSM DCS/PCS

100k ~ 1GHz -39dBm

9k ~ 1GHz -39dBm

MS allocated 1G ~ 1710MHz -33dBm

Channel

1G ~ 12.75GHz -33dBm

1710M ~ 1785MHz -39dBm

Conducted 1785M ~ 12.75GHz -33dBm

1Spurious 100k ~ 880MHz -60dBm 100k ~ 880MHz -60dBm

Emission 880M ~ 915MHz -62dBm 880M ~ 915MHz -62dBm

Idle Mode

915M ~ 1000Mz -60dBm 915M ~ 1000MHz -60dBm

1G ~ 1.71GHz -50dBm 1G ~ 1.71GHz -50dBm

1.71G ~ 1.785GHz -56dBm 1.71G ~ 1.785GHz -56dBm

1.785G ~ 12.75GHz -50dBm 1.785G ~ 12.75GHz -50dBm

2. PERFORMANCE

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No Item GSM DCS/PCS

30M ~ 1GHz -36dBm

30M ~ 1GHz -36dBm

MS allocated 1G ~ 1710MHz -30dBm

Channel

1G ~ 4GHz -30dBm

1710M ~ 1785MHz -36dBm

Radiated 1785M ~ 4GHz -30dBm

1 Spurious 30M ~ 880MHz -57dBm 30M ~ 880MHz -57dBm

Emission 880M ~ 915MHz -59dBm 880M ~ 915MHz -59dBm

Idle Mode

915M ~ 1000Mz -57dBm 915M ~ 1000MHz -57dBm

1G ~ 1.71GHz -47dBm 1G ~ 1.71GHz -47dBm

1.71G ~ 1.785GHz -53dBm 1.71G ~ 1.785GHz -53dBm

1.785G ~ 4GHz -47dBm 1.785G ~ 4GHz -47dBm

2 Frequency Error ±0.1ppm ±0.1ppm

3 Phase Error

±5(RMS) ±5(RMS)

±20(PEAK) ±20(PEAK)

3dB below reference sensitivity 3dB below reference sensitivity

Frequency Error Under RA250: ±200Hz RA250: ±250Hz

4 Multipath and Interference HT100: ±100Hz HT100: ±250Hz

Condition TU50: ±100Hz TU50: ±150Hz

TU3: ±150Hz TU1.5: ±200Hz

0 ~ 100kHz +0.5dB 0 ~ 100kHz +0.5dB

200kHz -30dB 200kHz -30dB

250kHz -33dB 250kHz -31dB

Due to 400kHz -60dB 400kHz -33dB

Output RF

modulation 600 ~ 1800kHz -66dB 600 ~ 1800kHz -60dB

5 1800 ~ 3000kHz -69dB 1800 ~ 6000kHz -60dB

Spectrum

3000 ~ 6000kHz -71dB ≥6000kHz -73dB

≥6000kHz -77dB

Due to

400kHz -19dB 400kHz -22dB

Switching

600kHz -21dB 600kHz -24dB

transient

1200kHz -21dB 1200kHz -24dB

1800kHz -24dB 1800kHz -27dB

2. PERFORMANCE

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No Item GSM DCS/PCS

Frequency offset 800kHz

7 Intermodulation attenuation –

Intermodulation product should

be Less than 55dB below the

level of Wanted signal

Power control

Power Tolerance

Power control

Power Tolerance

Level (dBm) (dB) Level (dBm) (dB)

533±3 030±3

631±3 128±3

729±3 226±3

827±3 324±3

925±3 422±3

10 23 ±3 5 20 ±3

8 Transmitter Output Power 11 21 ±3 6 18 ±3

12 19 ±3 7 16 ±3

13 17 ±3 8 14 ±3

14 15 ±3 9 12 ±4

15 13 ±3 10 10 ±4

16 11 ±5 11 8 ±4

17 9 ±5 12 6 ±4

18 7 ±5 13 4 ±4

19 5 ±5 14 2 ±5

15 0 ±5

9 Burst timing Mask IN Mask IN

2) Transmitter-WCDMA Mode

2. PERFORMANCE

- 14 -

No Item Specification

1 Maximum Output Power

Class3: +24dBm(+1/-3dB)

Class4: +21dBm(±2dB)

2 Frequency Error ±0.1ppm

3 Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme

Adjust output(TPC command)

cmd 1dB 2dB 3dB

+1 +0.5/1.5 +1/3 +1.5/4.5

4 Inner Loop Power control in uplink 0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5

-1 -0.5/-1.5 -1/-3 -1.5/-4.5

group(10equal command group)

+1 +8/+12 +16/+24

5 Minimum Output Power -50dBm(3.84MHz)

Qin/Qout:DPCCH quality levels

6 Out-of-synchronization handling of output power Toff@DPCCH/lor:-22->-28dB

Ton@DPCCH/lor:-24->-18dB

7 Transmit OFF Power -56dBm(3.84M)

8 Transmit ON/OFF Time Mask

±25us

PRACH, CPCH, uplink compressed mode

±25us

9 Change of TFC

power varies according to the data rate

DTX: DPCH off

(minimize interference between UE)

10 Power setting in uplink compressed ±3dB(after 14slots transmission gap)

11 Occupied Bandwidth(OBW) 5MHz(99%)

-35-15*(∆f-2.5)dBc@∆f=2.5~3.5MHz, 30k

12 Spectrum emission Mask

-35-1*(∆f-3.5)dBc@∆f=3.5~7.5MHz, 1M

-39-10*(∆f-7.5)dBc@∆f=7.5~8.5MHz, 1M

-49 dBc@∆f=8.5~12.5MHz, 1M

2. PERFORMANCE

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3)Receiver - GSM Mode

No Item Specification

13 Adjacent Channel Leakage Ratio(ACLR)

33dB@5MHz, ACP>-50dBm

43dB@10MHz, ACP>-50dBm

-36dBm@f=9~150KHz, 1k BW

-36dBm@f=150KHz~30MHz, 10k

-36dBm@f=30~1000MHz, 100k

14

Spurious Emissions -30dBm@f=1~12.75GHz, 1M

*: additional requirement -41dBm*@1893.5~1919.6MHz, 300k

-67dBm*@925~935MHz, 100k

-79dBm*@935~960MHz, 100k

-71dBm*@1805~1880MHz, 100k

15 Transmit Intermodulation

-31dBc@5MHz, Interferer -40dBc

-41dBc@10MHz, Interferer -40dBc

16 Error Vector Magnitude(EVM)

17.5% (>-20dBm)

(@12.2k, 1DPDCH+1DPCCH)

17 Transmit OFF Power

-15dB@SF=4, 768kbps, multi-code

transmission

No Item GSM DCS/PCS

1

Sensitivity (TCH/FS Class II) -105dBm -105dBm

2

Co-Channel Rejection

C/Ic=7dB C/Ic=7dB

(TCH/FS Class II, RBER, TUhigh/FH)

3 Adjacent Channel 200kHz C/Ia1=-12dB C/Ia1=-12dB

Rejection 400kHz C/Ia2=-44dB C/Ia2=-44dB

Wanted Signal: -98dBm Wanted Signal: -96dBm

4

Intermodulation Rejection 1’st interferer: -44dBm 1’st interferer: -44dBm

2’st interferer: -45dBm 2’st interferer: -44dBm

5

Blocking Response Wanted Signal: -101dBm Wanted Signal: -101dBm

(TCH/FS Class II, RBER) Unwanted Signal: Depend on freq. Unwanted Signal: Depend on freq.

4) Receiver - WCDMA Mode

2. PERFORMANCE

- 16 -

No Item Specification

18 Reference Sensivitivity Level -106.7dBm(3.84M)

-25dBm(3.84MHz)

19 Maximum Input Level -44dBm/3.84MHz(DPCH_Ec)

UE@+20dBm output power(class3)

20 Adjacent Channel Selectivity(ACS)

33dB

UE@+20dBm output power(class3)

-56dBm/3.84MHz@10MHz

21 In-band Blocking UE@+20dBm output power(class3)

-44dBm/3.84MHz@15MHz

UE@+20dBm output power(class3)

-44dBm/3.84MHz@f=2050~2095 &

2185~2230MHz, band a)

UE@+20dBm output power(class3)

-30dBm/3.84MHz@f=2025~2050 &

22 Out-band Blocking 2230~2255MHz, band a)

UE@+20dBm output power(class3)

-15dBm/3.84MHz@f=1~2025 &

2255~12500MHz, band a)

UE@+20dBm output power(class3)

23 Spurious Response

-44dBm CW

UE@+20dBm output power(class3)

-46dBm CW@10MHz &

24 Intermodulation Characteristic -46dBm/3.84MHz@20MHz

UE@+20dBm output power(class3)

-57dBm@f=9KHz~1GHz, 100k BW

25 Spurious Emissions -47dBm@f=1~12.75GHz, 1M

-60dBm@f=1920~1980MHz, 3.84MHz

-60dBm@f=2110~2170MHz, 3.84MHz

2. PERFORMANCE

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5) Bluetooth Mode

5.1) Transmitter

1 Out Power Class 2 : -6~4dBm

2 Power Density Power density < 20dBm per 100kHz EIRP

3

Power Control

Option

2dB ≤ step size ≤ 8dB

4

TX Output Spectrum fmax & fmin @ below the level of -30dBm(100khz BW)

-Frequency range within 2.4GHz~2.4835GHz

5

TX Output Spectrum

≤ 1MHz

-20dB Bandwidth

6

Tx Output Spectrum ≤ -20dBm @ C/I = 2MHz

-Adjacent channel Po ≤ -40dBm @ C/I ≥ 3MHz

140kHz ≤ delta f1 avg ≤175kHz

7 Modulation Characteristics delta f2max ≥115kHz at least 99.9% of all deltaf2max

delta f2avg/deata f1avg≥0.8

8 Init. Carrier Freq. Tolerance ≤ ±75KHz

1 slot : ≤ ± 25kHz

9 Carrier Frequency Drift

3 slot : ≤ ± 40kHz

5 slot : ≤ ± 40kHz

Maximum drift rate ≤ 20KHz/50usec

Freq.Range Operating Standby

30MHz~1GHz -36dBm -57dBm

10 Out of Band Spurious Emissions Above 1GHz~12.75GHz -30dBm -47dBm

1.8~1.9GHz -47dBm -47dBm

5.15~5.3GHz -47dBm -47dBm

2. PERFORMANCE

- 18 -

5.2) Receiver

11 Sensitivity single slot packets BER≤0.1%@-70dBm

12 Sensitivity multi slot packets BER≤0.1%@-70dBm

13 BER ≤ 0.1%@ (Low,Mid,High Frequency)

2405MHz, 2441MHz, 2477MHz

Interference Ratio

Co-Channel interference, C/I co-channel 11dB

C/I performance Adjacent(1MHz)interference, C/I 1MHz 0dB

Adjacent(2MHz)interference, C/I 2MHz -30dB

Adjacent(≥3MHz)interference, C/I ≥3MHz -40dB

Adjacent(≥3MHz)interference to in band -9dB

mirror frequency, C/I image ±1MHz -20dB

14 BER ≤ 0.1%@wanted signal -67dBm

interfering Signal Frequency Power Level

Blocking Characteristic

30MHz~2000MHz -10dBm

2000MHz~2400MHz -27dBm

2500MHz~3000MHz -27dBm

3000MHz~12.75GHz -10dBm

15 BER ≤ 0.1%@wanted signal -64dBm

Intermodluation Performance static sinwave signal at f1=-39dBm

a BT modulated signal f2=-39dBm(payload PRBS15)

16 Maximum Input Level BER ≤ 0.1%@-20dBm

2. PERFORMANCE

- 19 -

2.4 Current Consumption

(VT test : Speaker off, LCD backlight On)

2.5 RSSI

TBD

2.6 Battery Bar

Stand by Voice Call VT

WCDMA 165Hours=8.48mA 180Min=467mA 130Min=646mA

(DRX=1.28) (Tx=12dBm) (Tx=12dBm)

GSM 223Hours=6.28mA 220Min=380mA

(paging=9period) (Tx=Max)

GSM WCDMA(TBD)

BAR 4 → 3 -91 ±2dBm -87 ±2dBm

BAR 3 → 2 -96 ±2dBm -97 ±2dBm

BAR 2 → 1 -101 ±2dBm -107 ±2dBm

BAR 1 → 0 -106 ±2dBm -112 ±2dBm

Indication Voltage

BAR 4 → 3 (65%) 3.87 ± 0.05V

BAR 3 → 2 (43%) 3.77 ± 0.05V

BAR 2 → 1 (24%) 3.72 ±0.05V

BAR 1 → Icon Blinking (3%) 3.54 ±0.05V

Low voltage, warning message

3.54 ±0.03V(Talk: 1min. interval) -3%

3.50 ±0.03V(Standby: 3min. Inverval) -2%

Power OFF

3.15 ±0.03V ↓ (WCDMA Talk)

3.23 ±0.03V ↓ (else)

2. PERFORMANCE

- 20 -

2.7 Sound Pressure Level

No Test Item Specification

1 Sending Loudness Rating (SLR)

NOM

8±3dB

MAX

2 Receiving Loudness Rating (RLR)

NOM -1±3dB

MAX -15±3dB

3 Side Tone Masking Rating (STMR)

NOM

17dB over

MAX

4 Echo Loss (EL)

NOM

40dB over

MAX
5 Sending Distortion (SD) refer to TABLE 30.3
6 Receiving Distortion (RD) refer to TABLE 30.4

7 Idle Noise-Sending (INS)

NOM

-64dBm0p under

MAX

8 Idle Noise-Receiving (INR)

NOM -47dBPA under

MAX -36dBPA under

9 Sending Loudness Rating (SLR)

NOM

8±3dB

MAX

10 Receiving Loudness Rating (RLR)

NOM -1±3dB

MAX -12±3dB

11 Side Tone Masking Rating (STMR)

NOM

25dB over

MAX

12 Echo Loss (EL)

NOM

40dB over

MAX

13 Sending Distortion (SD) refer to TABLE 30.3
14 Receiving Distortion (RD) refer to TABLE 30.4

15 Idle Noise-Sending (INS)

NOM

-55dBm0p under

MAX

16 Idle Noise-Receiving (INR)

NOM -45dBPA under

MAX -40dBPA under

TDMA NOISE

GSM

SEND

–.GSM: Power Level: 5

MS

REV.

DCS: Power Level: 0

DCS

SEND

17

(Cell Power: -90 ~ -105dBm) REV.

-62dBm under

–.Acoustic(Max Vol.)

GSM

SEND

MS/HEADSET SLR: 8±3dB

Headset

REV.

MS/HEADSET RLR: -13±1dB/-15dB

DCS

SEND

(SLR/RLR: mid-Value Setting) REV.

A
C
O
U
S

T

I

C

MS

HEAD

SET

2. PERFORMANCE

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2.8 Charging

• Normal mode: Complete Voltage: 4.2V
Charging Current: 800mA

• Await mode: In case of During a Call, should be kept 3.9V

(GSM: It should be kept 3.9V in all power level
WCDMA: It will not be kept 3.9V in some power level)

• Extend await mode: At Charging prohibited temperature(-20C under or 60C over)

(GSM: It should be kept 3.7V in all power level
WCDMA: It will not be kept 3.7V in some power level)

3. Technical Brief

- 22 -

3.1 Digital Baseband(DBB) & Multimedia Processor

3.1.1 General Description

A. Features

• CPU ARM946 running at 104 MHz

- 32 kB Instruction Cache, 16 kB Data Cache, 128 kB Instruction TCM and 128 kB Data TCM

- 8 channel DMAC

• DSP C55x (LEAD3) Megastar (MGS3_2.0B) running at 170 MHz

- 144 kWord ROM, 32 kWord DARAM, 32 kWord SARAM

- 7 channel DMAC

- Dedicated API channel to DSP memory (not locked up to other DMA channels)

• UMTS Access

- Support for WCDMA/GSM Dual Mode

- GSM/GPRS network signaling (from Layer 1 to 3)

- WCDMA Ciphering and Integrity

- High Speed Serial Link (HSSL) to the WCDMA Modem (at Layer 1)

- GSM AMR

- Multislot Class 8

- HSCSD 14.4 kb/s

• MMI

- Keypad Interface

- Tone Generator Interface

- Camera Data and Programmable Display Interfaces

- Enhanced graphics support for QCIF display

• Operation and Services

- I2 CTM‚ Interface

- SIM Interfaces

- General Purpose I/O (GPIO) Interface

- External Memory Interface that supports FLASH, SRAM and PSRAM

- JTAG

- RTC

• Data Communication

- IrDA ® (SIR)

- UARTs (ACB, EDB (RS232), Bluetooth® HCI)

- Slave USB

• Package

- 12 by 12 mm 289 pin FPBGA Production Package

3. Technical Brief

3. Technical Brief

- 23 -

3.1.2 Hardware Architecture

The hardware structure is delivered as five separate hardware macros to the top-level design, also
depicted in Figure.

CPU Subsystem

GAM Subsystem

Peripheral Subsystem

DPS Subsystem

GSM Core

Subsystem

SYSCON

Figure 3-1-1 Simplified Block Diagram of Ericsson DB 2000

3. Technical Brief

- 24 -

A. Block Diagram

Figure 3-1-2 Detailed Block Diagram of Ericsson DB 2000

CPU Sub-Chip

Camera Module Display Module

DSP Sub-System

MGS3_2.0B

DSP_INT

MGS3
peripherals

GAM Sub-System

DL

UL

Control CPU I/O int erface

eight bit wide mul tiplexed bus,

DL

UL

DL

UL

UL

UL

UL

DL
DL

UL

DL

DL

DL
UL

DL

CHE

NODI

4 x CHD

EQU

GPRS
CRC24

GPRS

CRYPTO

SERCON

TIMGEN

FCHDET

CLKCON

RXIF

CRYPTO

DIRMOD

DMA Channels

6.5 Mbps

43x16 bit RAM

43x16 bit RAM

360x38bit RAM

144 bit

AHB1 ( CPU)

AHB2 ( DMA)

AHB

Slave

AHB
Slave

AHB Master

AHB

Master

DMA

(16Rq 8Ch)

Boot ROM

16k bytes

(4K x 32bit)

MPPCM

Ciphering

Integrity

HSSL

I2C

SYSCON

RTC

TONGEN

GPIO

UART1

EDB

UART3

BT

UART6

UART7

DSP debug

AHB
Slave

SIMIF_0

MEM

STICK

Control

SIMIF_1

AHB
Slave

AHB
Slave

Conceptual Diagram of bus

Bridge

Asynchronou s

System

BRAM

16k bytes

(4K x 32bit)

13MHz

MUX

16

16

16

16

32

32

32

16

16

16

RHEA

API (16)

IRAM

(Internal radio data RAM)

16 kB dual port SRAM

AHB

Slave

AHB

Slave

AHB

Slave

32

EMIFS

MEMSYS (DMA bus)

UART0

ACB

INTCON

KEYPAD

UART5

UART2

GPS

UART4

TS

16

16

16

16

16

32

16

13MHz

13MHz

13MHz, 26MHz

AHB
Slave

TIMER

32

IRDA

32

JOGDIAL

ETX

208

DPLL

13

APLL

48

APLL

APB Bridge

(1)

APB Bridge

(2)

MMC

APB Bridge

(Slow)

APB Bridge

(Data)

Interconnect Matrix

USB

CPU Sub-System

AHB

Slave

Peripheral Sub-System

16

16

16

32

32

16

16

32

GSM Sub-System

Default

Slave

AHB

Slave

16

26

APLL

CLK

SQR

16

16

16

16

16

ROM

144 kWords

(18 x 8 kW) BX

RHEA

DMA

DARAM

32 kWords
(8 x 4kW)

BRE

API

SARAM

32 kWords

(8 x 4kW)

BRE

HPRTD

TRACE

Timer2

DPLL

DGPIO

JTAG

Timer1

C55x CPU

AHB

Slave

AHB

Slave

AHB
Slave

CIPCLK

CID [7:0]

CIVSYNC

CIHSYNC

CIRES_N

PDIRES_N

PDIC [4:0]

PDID [7:0]

CDI

PDI

GRAPHCON

GAMCON

GRAM

160k byte

7kB RAM

4

4

4

11

3

GAM

3

3

3

5

2

3

3

CLKREQ7

BPW

MUX MUX MUX MUX

MUX MUXMUXMUX

MUX

ARM9 E

CP15

RAM Control

ETM

Data

RAM

128kB

Instruction

SRAM
128kB

IPU

I Cache
Control

I Cache

32kB

DPU

D Cache

Control

D Cache

16kB

Write Buffer & AHB IF

ETM IF

JTAG

946

11

8 JTAG

23

GAM

AHB-Lite

AHB-Lite

DAT [16]

ADD [24]

CS [4]

we/oe [2]

MEME[5]

SYSCLK [3]

MCLK

PWRREQ_N

RESOUT [5]

SERVICE

RESPOW_N

3

4

GPIO MUX

RHEA

GPIO MUX

1

External Memory

PAR/ SSI

data

data

cpu

40

28

1325

53

8

26

59

0

89

key

unused

2

4

4

4

4

4

6

3. Technical Brief

- 25 -

B. CPU Hardware Subsystem

The CPU subsystem incorporates:

• CPU Sub chip

• Backplane

• JTAG

• DMA Controller

• System Buffer RAM

• Boot ROM

• External Memory Interface (EMIF) for connection to external SRAM and Flash memories. The bus

architecture is built on the ARM AMBA standard with multi-layer AHB (Advanced High-speed Bus)
and APB (Advanced Peripheral Bus) for the peripheral buses. There are two AHB busses, the CPU
AHB and the DMA AHB.
Clocks to the CPU subsystem are distributed from the system control (SYSCON) backplane clocking.
The reset lines are all asynchronously asserted low and synchronously negated high. The CPU
subsystem has separate clocking and reset for the ARM946, AHB system, EMIF and DMAC.

C. Peripheral Hardware Subsystem

There are 29 peripherals within the peripheral hardware subsystem. With the exception of the USB, all
hardware peripheral blocks are APB slave peripherals. From an architecturehierarchy perspective, the
SYSCON block is an APB slave on the slow APB bridge, but resides at the top level of the ASIC. The
APB provides a simple interface to support low-performance peripherals. Within the peripheral
subsystem, there are four separate APB busses with AHB to APB (AHB2APB) bridges to the multi­layer AHB.

D. DSP Hardware Subsystem

The DSP subsystem provides support for processor intensive activity, such as voice coding and
multimedia application support. The DSP subsystem includes the standard C55xTM Core (LEAD3)
from Texas Instruments with associated memory system and peripherals.

E. GAM Hardware Subsystem

The Graphics Accelerator Module (GAM) subsystem provides hardware support in the creation of
visual imagery and the transfer of this data to the display. GAM also provides support for the camera
module. The visual data could be graphics, still images or video.
The GAM subsystem consists of five modules:

• GRAM - graphics memory (160 kB).

• GAMCON - GAM controller.

• GRAPHCON - graphics controller.

• PDI/SSI - programmable display interface for parallel/serial displays.

• CDI - camera data interface.

3. Technical Brief

- 26 -

F. GSM Hardware Subsystem

The GSM subsystem is a stand-alone sub-chip incorporating GSM modem and interface to GSM radio
together with memory control (MEMSYS) and internal RAM (IRAM).
The hardware peripheral blocks are RXIF, FCHDET, CRYPTO, EQU, NODI, 4 x CHD, GPRS
CRYPTO, GPRS CRC24, CHE, DIRMOD, CLKCON, SERCON, TIMGEN, MEMSYS and IRAM.
The peripherals are accessible to the AHB (CPU-only) by an asynchronous I/O bridge.
The dual port IRAM is accessible to the AHB (CPU and DMA) by a synchronous AHB slave interface.

G. System Control Subsystem

The system controller subsystem (SYSCON) is primarily responsible for generating clock signals and
distributing the clock and reset signals within the ASIC and certain external devices. The GSM core,
GAM and DSP subsystems include their own system controllers that are sourced from SYSCON.
SYSCON consists of analog and digital PLL clocks and a clock squarer. The block is a slave
peripheral on the slow APB bus under control of the CPU.
The programming of SYSCON controls the fundamental modes of operation within the ASIC.
Individual blocks can also be reset and their clocks held inactive by accessing the appropriate control
registers. SYSCON also controls the requesting protocol through which different subblocks in Ericsson
DB 20000 can request clocks derived from the system clock.
The system controller also stores the chip-ID number in a read only register.

3. Technical Brief

- 27 -

3.1.3 External memory interface

There are four independent chip selects (CS0, CS1, CS2, CS3) provided for external memories
and each has an address range of 256 Mb.
RF calibration data, Audio parameters and battery calibration data etc are stored in flash memory
area.

A. U8550

• 1-MCP used (512Mb flash memory + 128Mb PSRAM)

• 4-CS (Chip Select) are used

Table 3-1-1. External Memory Interface Spec. of U8550

Figure 3-1-3. External Memory Configuration of U8550

Interface Spec.

Device Part Name Maker

Read Access Time

Write

Async Page Burst

Access

Time

Flash 85 ns 25 ns

14 ns

90 ns

RD38F4455LLYBQ1 Intel

at 54MHz

PSRAM 85 ns 25 ns

10 ns

85 ns

at 66MHz

CS0

CS1

CS2

CS3

Flash

256 Mb

(Top boot)

Flash

256 Mb

(Bottom boot)

PSRAM

64 Mb

PSRAM

64 Mb

MARITA Intel MCP

3. Technical Brief

- 28 -

3.1.4 RF Interface

A. MARITA Interface

Marita controls GSM RF part using these signals through GSM RF chip-Ingela.

• RFCLK, RFDAT, RFSTR : Control signals for Ingela

• TXON, RXON : Control signals for TX and RX part of Ingela

• PCTL : Control signal for GSM TX PAM

• BANDSEL0 : Band selection signal for GSM or DCS

• ANTSW[0:3] : Control signals for antenna switch

• DCLK, IDATA, QDATA : GSM/DCS RX Data

• DIRMOD[A:D] : GSM/DCS TX Data

RF I/F

R631 100

0R627

TXON

G3

G2

RXON

L7

QDATA

K8

RFCLKG1RFDAT

RFSTR

H4

PCTL

L8

K3

IDATA

DIRMOD3

DCLK

K4

DIRMOD0E2DIRMOD1

J7

F3

DIRMOD2

F2

J2

ANTSW0

ANTSW1

J4

J3

ANTSW2J1ANTSW3

H3

BANDSEL0

K7

BANDSEL1

R632 NA

MODC

MODB

MODA

DCLK

BSEL0

ANTSW3

ANTSW2

ANTSW1

ANTSW0

IDATA

MODD

PCTL

RXON

RADDAT

RADCLK

QDATA

GPRFCTRL

RADSTR

TXON

Figure 3-1-4. Schematic of MARITA RF Interface

3. Technical Brief

- 29 -

B. WANDA Interface

Wanda controls WCDMA RF part using these signals through W-CDMA RF chip-Wopy & Wivi.

• WCLK, WDAT, WSTR : Control signals for Wivi & Wopy

• RXIA, RXIB, RXQA, RXQB : WCDMA RX Data

• TXIA, TXIB, TXQA, TXQB : WCDMA TX Data

• HSSLRX_D, HSSLRX_CLK : Marita & Wanda Communication Signal

• HSSLTX_D, HSSLTX_CLK : Marita & Wanda Communication Signal

R748 100K

G13

JTAG_TMS

G15

G16

JTAG_TRSTN

R17

RADIO_CLK
RADIO_DAT

P15
M13

RADIO_STR

C14

HSSLRX_CLK

HSSLRX_D

B16
A16

HSSLTX_CLK
HSSLTX_D

A15

D4

ID_BALL

IS_EVENT_N

B12

A13

IS_SYNC_N

JTAG_TCK

G17

F16

JTAG_TDI
JTAG_TDO

EMU0

F13

E15

EMU1

N8

DAC_I_OUT
DAC_I_OUT_INV

U8

DAC_Q_OUT

U7

DAC_Q_OUT_INV

R7
T7

DAC_TXEXTRES

ADC_I_IN_INV
ADC_Q_IN

R9
T9

ADC_Q_IN_INV

N9

ADC_RXEXTREF_N

ADC_RXEXTREF_P

T10

AD_STR

M16

U12

APLL_ATEST1

ADC_I_IN

R10
N10

R749 100K

VDIG

NA

R746

VCORE

C730 0.1u

3.3K

R744

VCORE

Q702

2

3

1

PMST3904

2.7K

R745

47p

C726

TXQB

HSSLTX

HSSLRXCLK

HSSLRX

HSSLTXCLK

ISSYNCn

ISEVENTn

RXIB
RXQA
RXQB

ADCSTR

TXIA

TXIB

TXQA

WCLK
WDAT

RXIA

WSTR

Figure 3-1-5. Schematic of WANDA RF Interface

3. Technical Brief

- 30 -

3.1.5 SIM Interface

SIM interface scheme is shown in Figure 3-1-6
SIMDAT0, SIMCLK0, SIMRST0 ports are used to communicate DBB(MARITA) with
ABB(VINCENNE) and filter.

SIM (Interface between DBB and ABB)

SIMDATO SIM card bidirectional data line

SIMCLKO SIM card reference clock

SIMRSTO SIM card async/sync reset

Table 3-1-2. SIM Interface

VDD

DAT
CLK CARD
RST

SIMVCC

VINCENNE

SDAT SIMDAT

SCLK SIMCLK

SRST SIMRST

MARITA

SIMDAT0

SIMCLK0

SIMRST0

VDIG

10K

15K

Figure 3-1-6. SIM Interface Scheme

3. Technical Brief

- 31 -

3.1.6 UART Interface

UART signals are connected to MARITA GPIO through IO connector and Bluetooth interface.

UART0

Resource Name Note

GPIO10 UARTRX0 Receive Data

GPIO11 UARTTX0 Transmit Data

UART3 for the bluetooth

GPIO24 UARTRX3 Receive Data

GPIO25 UARTTX3 Transmit Data

GPIO26 UARTCTS3 Clear To Send

GPIO27 UARTRTS3 Request To Send

Table 3-1-3. UART Interface