LG U8100 Service Manual
Service Manual
Model : U8100
Service Manual
U8100
P/N : MMBD0042001 Date: November, 2004 / Issue 1.0
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1. INTRODUCTION .............................. 6
1.1 Purpose................................................... 6
1.2 Regulatory Information............................ 6
1.3 Abbreviations .......................................... 8
2. PERFORMANCE............................ 10
2.1 System Overview .................................. 10
2.2 Usable environment .............................. 11
2.3 Radio Performance ............................... 11
2.4 Current Consumption............................ 17
2.5 RSSI...................................................... 17
2.6 Battery Bar ............................................ 17
2.7 Sound Pressure Level........................... 18
2.8 Charging ............................................... 19
3. Technical Brief .............................. 20
3.1 Digital Baseband(DBB)&
Multimedia Processor ........................... 20
3.1.1 General Description ........................ 20
3.1.2 Hardware Architecture .................... 21
3.1.3 External memory interface.............. 25
3.1.4 RF Interface .................................... 26
3.1.5 SIM Interface .................................. 28
3.1.6 UART Interface ............................... 28
3.1.7 GPIO (General Purpose Input/Output)
map................................................. 29
3.1.8 USB ................................................ 31
3.1.9 IrDA Interface.................................. 33
3.1.10 Folder ON/OFF Operation ............ 34
3.1.11 Power On Sequence..................... 35
3.1.12 Key Pad ........................................ 36
3.2 GAM Hardware Subsystem .................. 37
3.2.1 General Description ........................ 37
3.2.2 Block Description ............................ 38
3.2.3 Camera & Camera FPC Interface... 40
3.2.4 Camera Position Detection ............. 42
3.2.5 Camera Regulator .......................... 42
3.2.6 Display & LCD FPC Interface ......... 43
3.2.7 Main LCD Backlight Illumination ..... 46
3.2.8 Sub LCD Backlight Illumination ...... 47
3.2.9 Keypad Illumination ........................ 48
3.2.10 Camera Flash Illumination ............ 49
3.3 LCD Module .......................................... 50
3.4 Analog Baseband (ABB) Processor...... 51
3.4.1 Overview of Audio path................... 51
3.4.2 Audio Signal Processing &
Interface.......................................... 52
3.4.3 Audio Mode..................................... 54
3.4.4 Voice Call........................................ 55
3.4.5 MIDI (Ring Tone Play) .................... 59
3.4.6 MP3 (Audio Player)......................... 60
3.4.7 Video Telephony............................. 61
3.4.8 Audio Main Component .................. 62
3.4.9 GPADC(General Purpose ADC) and
AUTOADC2 .................................... 64
3.4.10 Charger control ............................. 65
3.4.11 Fuel Gauge ................................... 66
3.4.12 Battery Temperature
Measurement ................................ 67
3.4.13 Charging Part................................ 68
3.5 Voltage Regulation ............................... 71
3.5.1 Internal Regulation.......................... 71
3.5.2 External Regulation ........................ 71
3.6 General Description .............................. 73
3.7 GSM Mode............................................ 75
3.7.1 Receiver.......................................... 75
3.7.2 Transmitter...................................... 80
3.8 WCDMA Mode ...................................... 82
3.8.1 Receiver.......................................... 82
Table Of Contents
Table Of Contents
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3.8.2 Transmitter...................................... 85
3.8.3 Frequency Generation .................... 89
4. TROUBLE SHOOTING .................. 91
4.1 Power ON Trouble ................................ 91
4.2 USB Trouble ......................................... 93
4.3 SIM Detect Trouble ............................... 94
4.4 Keypad Trouble..................................... 95
4.5 Camera Trouble .................................... 96
4.6 Main LCD Trouble................................. 98
4.7 Sub LCD Trouble .................................. 99
4.8 Keypad Backlight Trouble ................... 100
4.9 Folder ON/OFF Trouble ...................... 102
4.10 Camera Detection Trouble................ 104
4.11 Camera Flash Trouble ...................... 106
4.12 Audio Trouble Shooting .................... 108
4.13 Charger Trouble Shooting................. 123
4.14 RF Component.................................. 126
4.15 Procedure to check ........................... 128
4.16 Checking Common
Power Source Block.......................... 129
4.16.1 Step 1 ......................................... 130
4.16.2 Step 2 ......................................... 131
4.16.3 Step 3 ......................................... 132
4.16.4 Step 4 ......................................... 133
4.16.5 Checking Regular Part................ 136
4.17 Checking VCXO Block ...................... 137
4.18 Checking Ant. SW Module Block ...... 142
4.19 Checking Antenna Switch Block
input logic.......................................... 143
4.19.1 Mode Logic by TP Command ..... 143
4.19.2 Checking Switch Block
power source .............................. 145
4.20 Checking WCDMA Block .................. 151
4.20.1 Checking..................................... 152
4.20.2 Checking Ant. SW module.......... 152
4.20.3 Checking Control Signal ............. 152
4.20.4 Checking RF TX Level................ 155
4.20.5 Checking PAM Block .................. 158
4.20.6 Checking RX I,Q ......................... 162
4.20.7 Checking RX Level ..................... 164
4.21 Checking GSM Block ........................ 166
4.21.1 Checking Regulator Circuit ........ 167
4.21.2 Checking VCXO Block ............... 167
4.21.3 Checking Ant. SW Module.......... 167
4.21.4 Checking Control Signal ............. 168
4.21.5 Checking RF Tx Path.................. 170
4.21.6 Checking RF Rx Path ................. 175
5. BLOCK DIAGRAM ....................... 180
5.1 GSM & WCDMA RF Block.................. 180
5.2 Interface Diagram ............................... 182
5.3 Detailed Interface Signal..................... 184
6. DISASSEMBLY INSTRUCTION... 186
7. DOWNLOAD ................................ 194
8. CALIBRATION ............................. 207
8.1 General Description ............................ 207
8.2 XCALMON Environment ..................... 207
8.2.1 H/W Environment.......................... 207
8.2.2 S/W Environment.......................... 207
8.2.3 Configuration Diagram of
Calibration Environment................ 207
8.3 Calibration Explanation ....................... 208
8.3.1 Overview....................................... 208
8.3.2 Calibration Items........................... 208
8.3.3 EGSM 900 Calibration Items ........ 209
Table Of Contents
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8.3.4 DCS 1800 Calibration Items ......... 214
8.3.5 WCDMA Calibration Items............ 217
8.3.6 Baseband Calibration Item ........... 225
8.4 Program Operation ............................. 226
8.4.1 XCALMON Program Overview ..... 226
8.4.2 XCALMON Icon Description ......... 227
8.4.3 Calibration Procedure ................... 230
8.4.4 Calibration Result Message.......... 232
9. CIRCUIT DIAGRAM ..................... 235
10. PCB LAYOUT............................. 244
11. EXPLODED VIEW &
REPLACEMENT PART LIST ..... 248
11.1 EXPLODED VIEW ............................ 248
11.2 Replacement Parts
<Mechanic component>.................... 249
<Main component> ........................... 252
11.3 Accessory ......................................... 272
1. INTRODUCTION
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1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud
associated with your telecommunications system. System users are responsible for programming and
configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this
product is immune from the above case but will prevent unauthorized use of common-carrier
telecommunication service of facilities accessed through or connected to it. The manufacturer will not
be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the phones or compatibility with the
network, the telephone company is required to give advanced written notice to the user, allowing the
user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.
1. INTRODUCTION
1. INTRODUCTION
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E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
A phone may interfere with sensitive laboratory equipment, medical equipment, etc.
Interference from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as
described.
1. INTRODUCTION
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1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
APC Automatic Power Control
BB Baseband
BER Bit Error Ratio
CC-CV Constant Current – Constant Voltage
CLA Cigar Lighter Adapter
DAC Digital to Analog Converter
DCS Digital Communication System
dBm dB relative to 1 milliwatt
DSP Digital Signal Processing
DTC DeskTop Charger
EEPROM Electrical Erasable Programmable Read-Only Memory
EL Electroluminescence
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GPRS General Packet Radio Service
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diode
OPLL Offset Phase Locked Loop
PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loop
1. INTRODUCTION
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PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
SAW Surface Acoustic Wave
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
UMTS Universal Mobile Telephony System
2. PERFORMANCE
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2.1 System Overview
2. PERFORMANCE
Item Specification
Shape GSM900/1 800 & WCDMA Folder- Dual Mode Handset
Size 49.5 x 95.7 x 22.5 mm
Weight 120g (with Battery)
Power 4.0V > 1200mAh Li-Ion
Talk Time
Over 140 Min (WCDMA, Tx=12 dBm, Voice)
Over 180 Min (GSM, Tx=Max, Voice)
Standby Time
Over 120 hrs (WCDMA, DRX=1.28)
Over 1 50 hrs (GSM, Paging period=9)
Antenna Fixed Type (Fixed Screw)
LCD 176 x 220 Pixel
Main LCD BL White LED Back Light
Sub LCD BL 7-color LED
Vibrator Yes (Coin Type)
LED Indicator 7-color(Sub LCD BL)
C-MIC Yes
Receiver Yes
Earphone Jack Yes
SIM Socket Yes (3.0V/1.8V)
Volume Key Push Type(+,-)
Voice Key Push Type (Memo)
I/O Connect 24 Pin
2. PERFORMANCE
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2.2 Usable environment
1) Environment
2) Environment(Accessory)
* CLA: 12~24V(DC)
2.3 Radio Performance
1) Transmitter -GSM Mode
Item Spec. Unit
Voltage 4.0 (Typ), 3.4 (Min), (Shut Down: 3.2) V
Size -20 ~ + 60 °C
Storage -30 ~ + 85 °C
Humidity max. 85 %
Item Spec. Min Typ. Max Unit
Power Available power 100 220 240 Vac
No Item GSM DCS
100k ~ 1GHz -39dBm
9k ~ 1GHz -39dBm
MS allocated 1G ~ 1710MHz -33dBm
Channel
1G ~ 12.75GHz -33dBm
1710M ~ 1785MHz -39dBm
Conducted 1785M ~ 12.75GHz -33dBm
1 Spurious 100k ~ 880MHz -60dBm 100k ~ 880MHz -60dBm
Emission 880M ~ 915MHz -62dBm 880M ~ 915MHz -62dBm
Idle Mode
915M ~ 1000Mz -60dBm 915M ~ 1000MHz -60dBm
1G ~ 1.71GHz -50dBm 1G ~ 1.71GHz -50dBm
1.71G ~ 1.785GHz -56dBm 1.71G ~ 1.785GHz -56dBm
1.785G ~ 12.75GHz -50dBm 1.785G ~ 12.75GHz -50dBm
2. PERFORMANCE
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No Item GSM DCS
30M ~ 1GHz -36dBm
30M ~ 1GHz -36dBm
MS allocated 1G ~ 1710MHz -30dBm
Channel
1G ~ 4GHz -30dBm
1710M ~ 1785MHz -36dBm
Radiated 1785M ~ 4GHz -30dBm
1 Spurious 30M ~ 880MHz -57dBm 30M ~ 880MHz -57dBm
Emission 880M ~ 915MHz -59dBm 880M ~ 915MHz -59dBm
Idle Mode
915M ~ 1000Mz -57dBm 915M ~ 1000MHz -57dBm
1G ~ 1.71GHz -47dBm 1G ~ 1.71GHz -47dBm
1.71G ~ 1.785GHz -53dBm 1.71G ~ 1.785GHz -53dBm
1.785G ~ 4GHz -47dBm 1.785G ~ 4GHz -47dBm
2 Frequency Error ±0.1ppm ±0.1ppm
3 Phase Error
±5(RMS) ±5(RMS)
±20(PEAK) ±20(PEAK)
3dB below reference sensitivity 3dB below reference sensitivity
Frequency Error Under RA250: ±200Hz RA250: ±250Hz
4 Multipath and Interference HT100: ±100Hz HT100: ±250Hz
Condition TU50: ±100Hz TU50: ±150Hz
TU3: ±150Hz TU1.5: ±200Hz
0 ~ 100kHz +0.5dB 0 ~ 100kHz +0.5dB
200kHz -30dB 200kHz -30dB
250kHz -33dB 250kHz -31dB
Due to 400kHz -60dB 400kHz -33dB
Output RF
modulation 600 ~ 1800kHz -66dB 600 ~ 1800kHz -60dB
5 1800 ~ 3000kHz -69dB 1800 ~ 6000kHz -60dB
Spectrum
3000 ~ 6000kHz -71dB ≥6000kHz -73dB
≥6000kHz -77dB
Due to
400kHz -19dB 400kHz -22dB
Switching
600kHz -21dB 600kHz -24dB
transient
1200kHz -21dB 1200kHz -24dB
1800kHz -24dB 1800kHz -27dB
2. PERFORMANCE
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No Item GSM DCS
Frequency offset 800kHz
7 Intermodulation attenuation –
Intermodulation product should
be Less than 55dB below the
level of Wanted signal
Power control
Power Tolerance
Power control
Power Tolerance
Level (dBm) (dB) Level (dBm) (dB)
533±3 030±3
631±3 128±3
729±3 226±3
827±3 324±3
925±3 422±3
10 23 ±3 5 20 ±3
8 Transmitter Output Power 11 21 ±3 6 18 ±3
12 19 ±3 7 16 ±3
13 17 ±3 8 14 ±3
14 15 ±3 9 12 ±4
15 13 ±3 10 10 ±4
16 11 ±5 11 8 ±4
17 9 ±5 12 6 ±4
18 7 ±5 13 4 ±4
19 5 ±5 14 2 ±5
15 0 ±5
9 Burst timing Mask IN Mask IN
2. PERFORMANCE
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2) Transmitter-WCDMA Mode
No Item Specification
1 Maximum Output Power
Class3: +24dBm(+1/-3dB)
Class4: +21dBm(±2dB)
2 Frequency Error ±0.1ppm
3 Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme
Adjust output(TPC command)
cmd 1dB 2dB 3dB
+1 +0.5/1.5 +1/3 +1.5/4.5
4 Inner Loop Power control in uplink 0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5
-1 -0.5/-1.5 -1/-3 -1.5/-4.5
group(10equal command group)
+1 +8/+12 +16/+24
5 Minimum Output Power -50dBm(3.84MHz)
Qin/Qout:DPCCH quality levels
6 Out-of-synchronization handling of output power Toff@DPCCH/lor:-22->-28dB
Ton@DPCCH/lor:-24->-18dB
7 Transmit OFF Power -56dBm(3.84M)
8 Transmit ON/OFF Time Mask
±25us
PRACH, CPCH, uplink compressed mode
±25us
9 Change of TFC
power varies according to the data rate
DTX: DPCH off
(minimize interference between UE)
10 Power setting in uplink compressed ±3dB(after 14slots transmission gap)
11 Occupied Bandwidth(OBW) 5MHz(99%)
-35-15*(∆f-2.5)dBc@∆f=2.5~3.5MHz, 30k
12 Spectrum emission Mask
-35-1*(∆f-3.5)dBc@∆f=3.5~7.5MHz, 1M
-39-10*(∆f-7.5)dBc@∆f=7.5~8.5MHz, 1M
-49 dBc@∆f=8.5~12.5MHz, 1M
2. PERFORMANCE
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3)Receiver - GSM Mode
No Item Specification
13 Adjacent Channel Leakage Ratio(ACLR)
33dB@5MHz, ACP>-50dBm
43dB@10MHz, ACP>-50dBm
-36dBm@f=9~150KHz, 1k BW
-36dBm@f=150KHz~30MHz, 10k
-36dBm@f=30~1000MHz, 100k
14
Spurious Emissions -30dBm@f=1~12.75GHz, 1M
*: additional requirement -41dBm*@1893.5~1919.6MHz, 300k
-67dBm*@925~935MHz, 100k
-79dBm*@935~960MHz, 100k
-71dBm*@1805~1880MHz, 100k
15 Transmit Intermodulation
-31dBc@5MHz, Interferer -40dBc
-41dBc@10MHz, Interferer -40dBc
16 Error Vector Magnitude(EVM)
17.5% (>-20dBm)
(@12.2k, 1DPDCH+1DPCCH)
17 Transmit OFF Power
-15dB@SF=4, 768kbps, multi-code
transmission
No Item GSM DCS
1
Sensitivity (TCH/FS Class II) -105dBm -105dBm
2
Co-Channel Rejection
C/Ic=7dB C/Ic=7dB
(TCH/FS Class II, RBER, TUhigh/FH)
3 Adjacent Channel 200kHz C/Ia1=-12dB C/Ia1=-12dB
Rejection 400kHz C/Ia2=-44dB C/Ia2=-44dB
Wanted Signal: -98dBm Wanted Signal: -96dBm
4
Intermodulation Rejection 1’st interferer: -44dBm 1’st interferer: -44dBm
2’st interferer: -45dBm 2’st interferer: -44dBm
5
Blocking Response Wanted Signal: -101dBm Wanted Signal: -101dBm
(TCH/FS Class II, RBER) Unwanted Signal: Depend on freq. Unwanted Signal: Depend on freq.
2. PERFORMANCE
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4) Receiver - WCDMA Mode
No Item Specification
18 Reference Sensivitivity Level -106.7dBm(3.84M)
-25dBm(3.84MHz)
19 Maximum Input Level -44dBm/3.84MHz(DPCH_Ec)
UE@+20dBm output power(class3)
20 Adjacent Channel Selectivity(ACS)
33dB
UE@+20dBm output power(class3)
-56dBm/3.84MHz@10MHz
21 In-band Blocking UE@+20dBm output power(class3)
-44dBm/3.84MHz@15MHz
UE@+20dBm output power(class3)
-44dBm/3.84MHz@f=2050~2095 &
2185~2230MHz, band a)
UE@+20dBm output power(class3)
-30dBm/3.84MHz@f=2025~2050 &
22 Out-band Blocking 2230~2255MHz, band a)
UE@+20dBm output power(class3)
-15dBm/3.84MHz@f=1~2025 &
2255~12500MHz, band a)
UE@+20dBm output power(class3)
23 Spurious Response
-44dBm CW
UE@+20dBm output power(class3)
-46dBm CW@10MHz &
24 Intermodulation Characteristic -46dBm/3.84MHz@20MHz
UE@+20dBm output power(class3)
-57dBm@f=9KHz~1GHz, 100k BW
25 Spurious Emissions -47dBm@f=1~12.75GHz, 1M
-60dBm@f=1920~1980MHz, 3.84MHz
-60dBm@f=2110~2170MHz, 3.84MHz
2. PERFORMANCE
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2.4 Current Consumption
(VT test : Speaker off, LCD backlight On)
2.5 RSSI
TBD
2.6 Battery Bar
Stand by Voice Call VT
WCDMA 120Hours=10mA 140Min=514mA 100Min=720mA
(DRX=1.28) (Tx=12dBm) (Tx=12dBm)
GSM 150Hours=8mA 180Min=400mA
(paging=9period) (Tx=Max)
GSM WCDMA(TBD)
BAR 4 → 3 -91 ±2dBm
BAR 3 → 2 -96 ±2dBm
BAR 2 → 1 -101 ±2dBm
BAR 1 → 0 -106 ±2dBm
Indication Voltage
BAR 4 → 3 (68%) 3.87 ±0.03V
BAR 3 → 2 (47%) 3.77 ±0.03V
BAR 2 → 1 (26%) 3.72 ±0.03V
BAR 1 → Icon Blinking (5%) 3.50 ±0.03V
Low voltage, warning message
3.50 ±0.03V(Talk: 1min. interval) -5%
3.46 ±0.03V(Standby: 3min. Inverval) -3%
Power OFF
3.10 ±0.03V ↓ (WCDMA Talk)
3.20 ±0.03V ↓ (else)
2. PERFORMANCE
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2.7 Sound Pressure Level
No Test Item Specification
1 Sending Loudness Rating (SLR)
NOM
8±3dB
MAX
2 Receiving Loudness Rating (RLR)
NOM -1±3dB
MAX -13±1dB
3 Side Tone Masking Rating (STMR)
NOM
17dB over
MAX
4 Echo Loss (EL)
NOM
40dB over
MAX
5 Sending Distortion (SD) refer to TABLE 30.3
6 Receiving Distortion (RD) refer to TABLE 30.4
7 Idle Noise-Sending (INS)
NOM
-64dBm0p under
MAX
8 Idle Noise-Receiving (INR)
NOM -47dBPA under
MAX -36dBPA under
9 Sending Loudness Rating (SLR)
NOM
8±3dB
MAX
10 Receiving Loudness Rating (RLR)
NOM -1±3dB
MAX -12±3dB
11 Side Tone Masking Rating (STMR)
NOM
25dB over
MAX
12 Echo Loss (EL)
NOM
40dB over
MAX
13 Sending Distortion (SD) refer to TABLE 30.3
14 Receiving Distortion (RD) refer to TABLE 30.4
15 Idle Noise-Sending (INS)
NOM
-55dBm0p under
MAX
16 Idle Noise-Receiving (INR)
NOM -45dBPA under
MAX -40dBPA under
TDMA NOISE
GSM
SEND
–.GSM: Power Level: 5
MS
REV.
DCS: Power Level: 0
DCS
SEND
17
(Cell Power: -90 ~ -105dBm) REV.
-62dBm under
–.Acoustic(Max Vol.)
GSM
SEND
MS/HEADSET SLR: 8±3dB
Headset
REV.
MS/HEADSET RLR: -13±1dB/-15dB
DCS
SEND
(SLR/RLR: mid-Value Setting) REV.
A
C
O
U
S
T
I
C
MS
HEAD
SET
2. PERFORMANCE
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2.8 Charging
• Normal mode: Complete Voltage: 4.2V
Charging Current: 600mA
• Await mode: In case of During a Call, should be kept 3.9V
(GSM: It should be kept 3.9V in all power level
WCDMA: It will not be kept 3.9V in some power level)
Extend await mode: At Charging prohibited temperature(-20C under or 60C over)
(GSM: It should be kept 3.7V in all power level
WCDMA: It will not be kept 3.7V in some power level)
3. TECHNICAL BRIEF
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3.1 Digital Baseband(DBB) & Multimedia Processor
3.1.1 General Description
A. Features
• CPU ARM946 running at 104 MHz
- 32 kB Instruction Cache, 16 kB Data Cache, 128 kB Instruction TCM and 128 kB Data TCM
- 8 channel DMAC
• DSP C55x (LEAD3) Megastar (MGS3_2.0B) running at 170 MHz
- 144 kWord ROM, 32 kWord DARAM, 32 kWord SARAM
- 7 channel DMAC
- Dedicated API channel to DSP memory (not locked up to other DMA channels)
• UMTS Access
- Support for WCDMA/GSM Dual Mode
- GSM/GPRS network signaling (from Layer 1 to 3)
- WCDMA Ciphering and Integrity
- High Speed Serial Link (HSSL) to the WCDMA Modem (at Layer 1)
- GSM AMR
- Multislot Class 8
- HSCSD 14.4 kb/s
• MMI
- Keypad Interface
- Tone Generator Interface
- Camera Data and Programmable Display Interfaces
- Enhanced graphics support for QCIF display
• Operation and Services
- I2C™ Interface
- SIM Interfaces
- General Purpose I/O (GPIO) Interface
- External Memory Interface that supports FLASH, SRAM and PSRAM
- JTAG
- RTC
- ETM (in Prototype Package)
• Data Communication
- IrDA ® (SIR)
- UARTs (ACB, EDB (RS232))
- Slave USB
• Package
- 12 by 12 mm 289 pin FPBGA Production Package
3. Technical Brief
3. TECHNICAL BRIEF
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3.1.2 Hardware Architecture
The hardware structure is delivered as five separate hardware macros to the top-level design, also
depicted in Figure.
Figure. Simplified Block Diagram
3. TECHNICAL BRIEF
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A. Block Diagram
B. CPU Hardware Subsystem
The CPU subsystem incorporates:
• CPU Sub chip
• Backplane
• JTAG
• DMA Controller
• System Buffer RAM
• Boot ROM
• External Memory Interface (EMIF) for connection to external SRAM and Flash memories.
The bus architecture is built on the ARM AMBA standard with multi-layer AHB (Advanced High-speed
Bus) and APB (Advanced Peripheral Bus) for the peripheral buses.
There are two AHB busses, the CPU AHB and the DMA AHB.
Clocks to the CPU subsystem are distributed from the system control (SYSCON) backplane clocking.
The reset lines are all asynchronously asserted low and synchronously negated high.
The CPU subsystem has separate clocking and reset for the ARM946, AHB system, EMIF and DMAC.
Figure. Simplified Block Diagram
3. TECHNICAL BRIEF
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C. Peripheral Hardware Subsystem
There are 29 peripherals within the peripheral hardware subsystem. With the exception of the USB,
all hardware peripheral blocks are APB slave peripherals. From an architecture-hierarchy perspective,
the SYSCON block is an APB slave on the slow APB bridge, but resides at the top level of the ASIC.
The APB provides a simple interface to support low-performance peripherals.
Within the peripheral subsystem, there are four separate APB busses with AHB to APB (AHB2APB)
bridges to the multi-layer AHB.
D. DSP Hardware Subsystem
The DSP subsystem provides support for processor intensive activity, such as voice coding and
multimedia application support. The DSP subsystem includes the standard C55xTM Core (LEAD3)
from Texas Instruments with associated memory system and peripherals.
E. GAM Hardware Subsystem
The Graphics Accelerator Module (GAM) subsystem provides hardware support in the creation of
visual imagery and the transfer of this data to the display. GAM also provides support for the camera
module. The visual data could be graphics, still images or video.
The GAM subsystem consists of five modules:
• GRAM - graphics memory (160 kB).
• GAMCON . GAM controller.
• GRAPHCON . graphics controller.
• PDI/SSI - programmable display interface for parallel/serial displays.
• CDI - camera data interface.
F. GSM Hardware Subsystem
The GSM subsystem is a stand-alone sub-chip incorporating GSM modem and interface to GSM radio
together with memory control (MEMSYS) and internal RAM (IRAM).
The hardware peripheral blocks are RXIF, FCHDET, CRYPTO, EQU, NODI, 4 x CHD, GPRS
CRYPTO, GPRS CRC24, CHE, DIRMOD, CLKCON, SERCON, TIMGEN, MEMSYS and IRAM.
The peripherals are accessible to the AHB (CPU-only) by an asynchronous I/O bridge.
The dual port IRAM is accessible to the AHB (CPU and DMA) by a synchronous AHB slave interface.
3. TECHNICAL BRIEF
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G. System Control Subsystem
The system controller subsystem (SYSCON) is primarily responsible for generating clock signals and
distributing the clock and reset signals within the ASIC and certain external devices. The GSM core,
GAM and DSP subsystems include their own system controllers that are sourced from SYSCON.
SYSCON consists of analog and digital PLL clocks and a clock squarer. The block is a slave
peripheral on the slow APB bus under control of the CPU.
The programming of SYSCON controls the fundamental modes of operation within the ASIC.
Individual blocks can also be reset and their clocks held inactive by accessing the appropriate control
registers. SYSCON also controls the requesting protocol through which different sub-blocks in
Ericsson DB 20000 can request clocks derived from the system clock.
The system controller also stores the chip-ID number in a read only register.
3. TECHNICAL BRIEF
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3.1.3 External memory interface
There are four independent chip selects (CS0, CS1, CS2, CS3) provided for external memories and
each has an address range of 256 Mb.
RF calibration data, Audio parameters and battery calibration data etc are stored in flash memory
area.
A. U8100 & U8100
• 384Mb flash memory + 64Mb PSRAM
• 4-CS(Chip Select) are used
B. U8100
• 512Mb flash memory + 64Mb PSRAM
• 3-CS(Chip Select) are used
Interface Spec.
Read Access Time Write
Device Part Name Maker Access
Async Page Burst Time
MCP S71WS256HC0BAW00 AMD 56 ns –
13.5 ns
56 ns
at 54MHz
FLASH Am29BDS128HD9VKI AMD 56 ns –
13.5 ns
70 ns
at 54MHz
PSRAM S71WS256HC0BAW00 AMD 70 ns 20 ns – 70 ns
Table External memory interface for U8100 & U8100
Interface Spec.
Read Access Time Write
Device Part Name Maker Access
Async Page Burst Time
MCP RD38F4050L0YTQ0 Intel 85 ns 25 ns
14 ns
85 ns
at 54MHz
FLASH NZ48F4000L0YBQ0 Intel 85 ns 25 ns
14 ns
85 ns
at 54MHz
PSRAM RD38F4050L0YTQ0 Intel 85 ns 25 ns
10 ns
85 ns
at 66MHz
Table External memory interface for U8100
3. TECHNICAL BRIEF
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3.1.4 RF Interface
A. MARITA Interface
Marita controls GSM RF part using these signals through GSM RF chip-Ingela.
• RFCLK, RFDAT, RFSTR : Control signals for Ingela
• TXON, RXON : Control signals for TX and RX part of Ingela
• PCTL : Control signal for GSM TX PAM
• BANDSEL0 : Band selection signal for GSM or DCS
• ANTSW[0:3] : Control signals for antenna switch
• DCLK, IDATA, QDATA : GSM/DCS RX Data
• DIRMOD[A:D] : GSM/DCS TX Data
B. WANDA Interface
Wanda controls WCDMA RF part using these signals through W-CDMA RF chip-Wopy & Wivi.
Figure. Schematic of MARITA RF Interface
Figure. Schematic of WANDA RF Interface
3. TECHNICAL BRIEF
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• RADIO_CLK, RADIO_DAT, RADIO_STR : Control signals for Wivi & Wopy
• RXIA, RXIB, RXQA, RXQB : WCDMA RX Data
• TXIA, TXIB, TXQA, TXQB : WCDMA TX Data
• HSSLRX_D, HSSLRX_CLK : Marita & Wanda Communication Signal
• HSSLTX_D, HSSLTX_CLK : Marita & Wanda Communication Signal
Figure. Schematic of WANDA RF Interface
3. TECHNICAL BRIEF
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3.1.5 SIM Interface
SIMDAT0, SIMCLK0, SIMRST0 ports are used to communicate DBB(MARITA) with ABB(VINCENNE)
and filter.
3.1.6 UART Interface
UART signals are connected to MARITA GPIO through IO connector
SIM (Interface between DBB and ABB)
SIMDAT0 SIM card bidirectional data line
SIMCLK0 SIM card reference clock
SIMRST0 SIM card async/sync reset
Table. SIM Interface
Figure. SIM Interface
UART0
Resource Name Note
GPIO10 UARTRX0 Transmit Data
GPIO11 UARTTX0 Receive Data
UART1
GPIO14 UARTRX1 Transmit Data (UART1)
GPIO15 UARTTX1 Receive Data (UART1)
GPIO16 UARTRTS1 Request To Send
GPIO17 UARTCTS1 Clear To Send
Table. UART Interface
3. TECHNICAL BRIEF
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3.1.7 GPIO (General Purpose Input/Output) map
In total 40 allowable resources. This model is using 25 resources.
GPIO Map, describing application, I/O state, and enable level are shown in below table.
IO # Application IO Resource Inactive State Active State
GPIO00 Not used – – – –
GPIO01 BL_PWL O GPIO Low High
GPIO02 7C_LED_VDD_EN O GPIO Low High
GPIO03 PULSESKIP (Not used) I GPIO – –
GPIO04 CAMERA_DET I GPIO High Low
GPIO05 GPIO05 (Not used) O – – –
GPIO06 AMPCTR O GPIO Low High
GPIO07 TGBUZZ (Not used) O GPIO Low High
GPIO10 UARTRX0 I UART0 High Low
GPIO11 UARTTX0 O UART0 High Low
GPIO12 Not used – – – –
GPIO13 Not used – – – –
GPIO14 UARTRX1 I UART1 High Low
GPIO15 UARTTX1 O UART1 High Low
GPIO16 UARTRTS1 I UART1 High Low
GPIO17 UARTCTS1 O UART1 – –
GPIO20 CAM_REG_EN O GPIO Low High
GPIO21 CAM_FLASH_ON O GPIO Low High
GPIO22 TP2125 (Not used) – – – –
GPIO23 CAM_FLASH_SHOT O GPIO Low High
GPIO24 Not used – – – –
GPIO25 Not used – – – –
GPIO26 Not used – – – –
GPIO27 Not used – – – –
GPIO30 Not used – – – –
GPIO31 Not used – – – –
3. TECHNICAL BRIEF
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IO # Application IO Resource Inactive State Active State
GPIO32 KEY_LED_ONOFF O GPIO Low High
GPIO33 Not used – – – –
GPIO34 Not used – – – –
GPIO35 LCDVSYNCI (Not used) I GPIO Low High
GPIO36 SPKMUTE O GPIO LOW (Ear piece) HIGH (Speaker)
GPIO37 Not used – – – –
GPIO40 USBSENSE I GPIO Low High
GPIO41 Not used – – – –
GPIO42 BL_EN O GPIO Low High
GPIO43 FOLDER_DET I GPIO High Low
GPIO44 EN_LED_R O GPIO Low High
GPIO45 EN_LED_G O GPIO Low High
GPIO46 EN_LED_B O GPIO Low High
GPIO47 IRDA_REG_CTRL O GPIO Low High
Table. MARITA GPIO Map Table
3. TECHNICAL BRIEF
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3.1.8 USB
The USB block supports the implementation of a "full-speed" device fully compliant to USB 2.0
standard. It provides an interface between the CPU (embedded local host) and the USB wire, and
handles USB transactions with minimal CPU intervention.
The USB specification allows up to 15 pairs of endpoints. Data for each endpoint is buffered in RAM
within the USB block and is read/written from the endpoint FIFO using DMA transfers or FIFO register
access. High-speed (high throughput) endpoints can use DMA while slower endpoints can use FIFO
register access.
The USB block can request up to six DMA channels, three for IN endpoints and three for OUT
endpoints.
USB Function Note
USBDP USB differential (+) line
USBDM USB differential (-) line
USBSENSE (GPIO40) USB detection (input)
USBPUEN USB pull-up control
VDDUSB Power supply for MARITA USB block
Table. USB Signal Interface of MARITA
Figure. Schematic of MARITA USB block
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