LG TM13LNNAHK1 Users manual

Technical Specification

(TM13LNNAHK1)

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History

Written

by

Checked

by

Approved

by

1.0

2018.06.12

Ver. Date Contents

Note

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Contents

1. Product Introduction ...................................................................................................... 4

1.1 Block Diagram ...................................................................................................... 5

1.2 Environmental Specifications ............................................................................... 5

1.3 Electrical Specifications ....................................................................................... 5

1.3.1 Absolute Maximum and ESD Ratings ........................................................... 5

1.3.2 Current Consumption .................................................................................... 6

1.4 Mechanical Specifications .................................................................................. 6

1.4.1 Physical Dimensions and Connection Interface ............................................ 6

1.4.2 Mechanical Drawing ...................................................................................... 7

2. Pin Definitions ............................................................................................................... 8

3 RF Specification ............................................................................................................. 9

3.1. LTE B2,B4, B5, B13 Specification ....................................................................... 9

3.2. CDMA BC0, BC1 Specification..……………………………………………………
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1. Product Introuction

The TM13LNNAHK1 are designe d for the automotive in dustry. They suppor t LTE and CDMA
air Interface standards. The TM13LNNAHK1 are based on t he Qualcomm MDM9628 wireless
chipsets and support the following bands.

Table 1. Supported Band

Region US

LTE

Band

CDMA BC0/BC1

1.1 Block Diagram

B2/B4/B5/B13

Figure 1.1. TM13LNNAHK1 Block diagram

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1.2 Environmental Specifications

Parameter

Min

Max

Units

+4.0_VPWR

Power Supply Input

-

4.4V

V

VIN

Voltage on any digital input or output pin

-

VREG_MDME+0.5

V

ESD Ratings

ESD1)

Primary, Diversity antenna pads ­Contact

10

kV

The environmental specification for operating and storage of the TM13LNNAHK1 are defined
in the the table below.

Table 2. Environmental Specifications

Parameter Temperature Range

Operating Temperature

Storage Temperature -40℃ to +90℃

Humidity 95% or less

-40℃ to 85℃

1.3 Electrical Specifications
This section provides details for some of the key electrical specifications of the

TM13LNNAHK1 embedded modules.

1.3.1 Absolute Maximum Rating and ESD Ratings
This section defines the Absolute Maximum and Electrostatic Discharge (ESD) Ratings of

the TM13LNNAHK1 embedded modules.

Warning: If these parameters are exceeded, even momentarily, damage may occur to the
device.

Table 3. Absolute Maximum Ratings

1) The ESD Simulator configured with 330pF, 2000Ω.

Caution: The TM13LNNAHK1 embedded modules are sensitive to Electrostatic Discharge.
ESD countermeasures and handling methods must be used when handling the
TM03LNNAHK0 devices.

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1.3.2 Current Consumption

Mode

Parameter

Typical

Max

Units

Band2/4/13, Max TX Output /Full RB

600

650

Band5, Max TX Output /Full RB

550

600

800MHz

550

600

1900MHz

600

650

LTE

Idle, Registered

1.8

2.2

mA

CDMA

Idle, Registered

1.8

2.2

mA

LTE

Sleep Mode, Average Current

1.8

2.2

mA

CDMA

Sleep Mode, Average Current

1.8

2.2

mA

Parameter

Nominal

Max

Units

Overall Dimension

34 x 40

34.35 x 40.35

mm

Overall Module Height

3.5

3.85

mm

PCB Thickness

1.0

1.1

mm

Flatness Specification

0.1

mm

Weight

12

TBD

g

Table 4. TM13LNNAHK1 Current Consumption (TBD)

LTE

CDMA

mA

mA

1.4 Mechanical Specifications

1.4.1 Physical Dimensions and Connection Interfa ce
The TM13LNNAHK1 embedded modules are a Land Grid Array (LGA) form factor device.

The device does not have a System or RF connectors. All electrical and mechanical
connections are made via the 323 pad TM13LNNAHK1 on the underside of the PCB.

Table5. TM13LNNAHK1 Embedded Module Dimens i ons

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1.4.2 Mechanical Drawing

HMC_MDM9628

module_Pinmap.xls

40 mm

34

1.4.2.1 Module PCB

2. Pin Definitions

2.1 PIN Definitions

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Technology

Standards

LTE

• 3GPP Release 8

CDMA

• 3GPP2 Release IxEVDO, REV.H

Measure Max and Min and Min Transmit Power
of Low Channel (18650)

Max Power : 20.3~25.7dBm
Min Power : ≤ -39dBm

Measure Max and Min Transmit Power of M i d
Channel (18900)

Max Power : 20.3~25.7dBm
Min Power : ≤ -39dBm

Measure Max and Min Transmit Power of High
Channel (19150)

Max Power : 20.3~25.7dBm
Min Power : ≤ -39dBm

Measure Max and Min and Min Transmit P owe r
of Low Channel (20000)

Max Power : 20.3~25.7dBm
Min Power : ≤ -39dBm

Measure Max and Min Transmit Power of M i d
Channel (20175)

Max Power : 20.3~25.7dBm
Min Power : ≤ -39dBm

Measure Max and Min Transmit Power of High
Channel (20350)

Max Power : 20.3~25.7dBm
Min Power : ≤ -39dBm

Measure Max and Min and Min Transmit P owe r
of Low Channel (20450)

Max Power : 20.3~25.7dBm
Min Power : ≤ -39dBm

Measure Max and Min Transmit Power of M i d
Channel (20525)

Max Power : 20.3~25.7dBm
Min Power : ≤ -39dBm

Measure Max and Min Transmit Power of High
Channel (20600)

Max Power : 20.3~25.7dBm
Min Power : ≤ -39dBm

3. RF Specification

The specifications for the LTE and CDMA interfa ces are defined.
TM13LNNAHK1 is designed to be compliant with the standard shown in the table below.

Table20. Standards Compliance

3.1 LTE B2,B4, B5, B13 Specification

3.1.1 LTE TX Output Power

The Maximum / Minimum Transmitter Output Power of the TM13LNNAHK1 are specified in
the following table.

Table21. Conducted TX (Transmit) Max output Po wer Tolerances – LTE Bands

BAND Method (UL CH) Specification

BAND2
UE Maximum
Output Power

BAND4
UE Maximum
Output Power

BAND5
UE Maximum
Output Power

BAND13
UE Maximum
Output Power

Measure Max and Min Transmit Power of M i d
Channel (23230)

Max Power : 20.3~25.7dBm
Min Power : ≤ -39dBm

3.1.2 LTE RX Sensitivity

The Receiver Sensitivity of the TM13LNNAHK1 are specified in the following table.

Table22. Conducted RX (Receive) Sensitivity – LTE Bands

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BAND Method (DL CH) Specification

sensitivity : ≤-95
BLER : ≤ 5%

sensitivity : ≤-95
BLER : ≤ 5%

sensitivity : ≤-95
BLER : ≤ 5%

sensitivity : ≤-97
BLER : ≤ 5%

sensitivity : ≤-97
BLER : ≤ 5%

sensitivity : ≤-97
BLER : ≤ 5%

sensitivity : ≤-95
BLER : ≤ 5%

sensitivity : ≤-95
BLER : ≤ 5%

sensitivity : ≤-95
BLER : ≤ 5%

Measure Max Transmit Power of Low Channel
(CH=384) in CDMA Mode

Measure Max Transmit Power of Middle Channel
(CH=779) in CDMA Mode

Measure Max Transmit Power of High Channel
(CH=1013) in CDMA Mode

Measure Max Transmit Power of Low Channel
(CH=25) in DCS1900 Mode

Measure Max Transmit Power of Middle Channel
(CH=600) in DCS1900 Mode

Measure Max Transmit Power of High Ch annel
(CH=1175) in DCS1900 Mode

BAND2
Reference
sensitivity
level(DUAL)

BAND4
Reference
sensitivity
level(DUAL)

BAND5
Reference
sensitivity
level(DUAL)

BAND13
Reference
sensitivity
level(DUAL)

Measure BLER of Low Channel (18650)
Measure BLER of Mid Channel (18900)
Measure BLER of High Channel (19150)
Measure BLER of Low Channel (20000)
Measure BLER of Mid Channel (20175)
Measure BLER of High Channel (20350)
Measure BLER of Low Channel (20450)
Measure BLER of Mid Channel (20525)
Measure BLER of High Channel (20600)

Measure BLER of Low Channel (23230)

sensitivity : ≤-94

BLER : ≤ 5%

3.2 CDMA 800/1900 Specification

3.2.1 CDMA TX Output Power

The Maximum Transmitter Output Power of the TM13LNNAHK1 are specified in the
following table.

Table23. Conducted TX (Transm it) Max output Po wer Tolerances – CDMA Bands

Item Method (DL CH) Specification

Max Power : 23~30dBm

CDMA800
Power Level

PCS1900
Power Level

Max Power : 23~30dBm
Max Power : 23~30dBm
Max Power : 23~30dBm

Max Power : 23~30dBm

Max Power : 23~30dBm

CDMA RX Sensitivity

3.2.2

The Receiver Sensitivity of the TM13LNNAHK1 are specified in the following table.

Table24. Conducted RX (Receive) Sensitivity – CDMA Bands

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Item Method (DL CH) Specification

Measure BER of Low Channel (CH=384)
in EGSM Mode

Measure BER of Middle Channel (CH=7 79 )
in EGSM Mode

Measure BER of High Channel (CH=1013)
in EGSM Mode

Measure BER of Low Channel (CH=25)
in PCS1900 Mode

Measure BER of Middle Channel (CH=600)
in PCS1900 Mode

Measure BER of High Channel (CH=1175 )
in PCS1900 Mode

0.5% @≤-104dBm

CDMA800
BER(Bit Error
Rate)

PCS1900
BER(Bit Error
Rate)

0.5% @≤-104dBm

0.5% @≤-104dBm

0.5% @≤-104dBm

0.5% @≤-104dBm

0.5% @≤-104dBm

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FCC Warning Statement

FCC Part 15.19
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may
not cause harmful interference, and (2) this device must accept any interference received, including interference that may
cause undesired operation.
FCC Part 15.21
Any changes or modifications (including the antennas) to this device that are not expressly approved by the manufacturer
may void the user’s authority to operate the equipment.

Please notice that if the FCC identification number is not visible when the module is installed inside another device, then
the outside of the device into which the module is installed must also display a label referring to the enclosed module.
This exterior label can use wording such as the following: “Contains FCC ID : BEJTM13LNNAHK1” any similar wording
that expresses the same meaning may be used.

Manual Information to the End User
The module is limited to OEM installation ONLY.
The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or install module.
The module is limited to installation in mobile application;
A separate approval is required for all other operating configurations, including portable configurations with respect to Part

2.1093 and difference antenna configurations.
There is requirement that the grantee provide guidance to the host manufacturer for compliance with Part 15B
requirements.