1) The pick-up should always be left in its conductive bag until immediately prior to use.
2) The pick-up should never be subjected to external pressure or impact.
2. Repair notes
1) The pick-up incorporates a strong magnet, and so should never be brought close to magnetic materials.
2) The pick-up should always be handled correctly and carefully, taking care to avoid external pressure and
impact. If it is subjected to strong pressure or impact, the result may be an operational malfunction and/or
damage to the printed-circuit board.
3) Each and every pick-up is already individually adjusted to a high degree of precision, and for that reason
the adjustment point and installation screws should absolutely never be touched.
4) Laser beams may damage the eyes!
Absolutely never permit laser beams to enter the eyes!
Also NEVER switch ON the power to the laser output part (lens, etc.) of the pick-up if it is damaged.
5) Cleaning the lens surface
If there is dust on the lens surface, the dust should be cleaned away by using an air bush (such as used
for camera lens). The lens is held by a delicate spring. When cleaning the lens surface, therefore, a cotton
swab should be used, taking care not to distort lens.
6) Never attempt to disassemble the pick-up.
Spring has excess pressure. If the lens is extremely dirty, apply isopropyl alcohol to the cotton swab.
(Do not use any other liquid cleaners, because they will damage the lens.) Take care not to use too much
of this alcohol on the swab, and do not allow the alcohol to get inside the pick-up.
Storage in conductive bag
Drop impact
NEVER look directly at the laser beam, and don’t allow
contact with fingers or other exposed skin.
1) Compact disc players incorporate a great many ICs as well as the pick-up (laser diode). These components
are sensitive to, and easily affected by, static electricity. If such static electricity is high voltage, components
can be damaged, and for that reason components should be handled with care.
2) The pick-up is composed of many optical components and other high-precision components. Care must be
taken, therefore, to avoid repair or storage where the temperature or humidity is high, where strong magnetism is present, or where there is excessive dust.
2. Notes for repair
1) Before replacing a component part, first disconnect the power supply lead wire from the unit
2) All equipment, measuring instruments and tools must be grounded.
3) The workbench should be covered with a conductive sheet and grounded.
When removing the laser pick-up from its conductive bag, do not place the pick-up on the bag. (This is
because there is the possibility of damage by static electricity.)
4) To prevent AC leakage, the metal part of the soldering iron should be grounded.
5) Workers should be grounded by an armband (1M Ω)
6) Care should be taken not to permit the laser pick-up to come in contact with clothing, in order to prevent static electricity changes in the clothing to escape from the armband.
7) The laser beam from the pick-up should NEVER be directly facing the eyes or bare skin.
Resistor
(1 Mohm)
Conductive
Sheet
Resistor
(1 Mohm)
Armband
1-4
ESD PRECAUTIONS
Electrostatically Sensitive Devices (ESD)
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are integrated
circuits and some field-effect transistors and semiconductor chip components. The following techniques should
be used to help reduce the incidence of component damage caused by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off
any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device, which should be removed for potential shock reasons
prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive surface
such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ESD devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static" can
generate electrical charges sufficient to damage ESD devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESD
devices.
6. Do not remove a replacement ESD device from its protective package until immediately before you are
ready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable conductive materials).
7. Immediately before removing the protective material from the leads of a replacement ESD device, touch the
protective material to the chassis or circuit assembly into which the device will by installed.
CAUTION : BE SURE NO POWER IS APPLIED TO THE CHASSIS OR CIRCUIT, AND OBSERVE ALL OTHER
such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ESD device).
CAUTION. GRAPHIC SYMBOLS
THE LIGHTNING FLASH WITH APROWHEAD SYMBOL. WITHIN AN EQUILATERAL TRIANGLE, IS
INTENDED TO ALERT THE SERVICE PERSONNEL TO THE PRESENCE OF UNINSULATED
“DANGEROUS VOLTAGE” THAT MAY BE OF SUFFICIENT MAGNITUDE TO CONSTITUTE A RISK OF
ELECTRIC SHOCK.
THE EXCLAMATION POINT WITHIN AN EQUILATERAL TRIANGLE IS INTENDED TO ALERT THE
SERVICE PERSONNEL TO THE PRESENCE OF IMPORTANT SAFETY INFORMATION IN SERVICE
LITERATURE.
settings and the source, there may
be no sound output.)
GENERAL
Power supplyRefer to main label
Power consumptionRefer to main label
Net Weight2.5 kg
External dimensions (W x H x D)360 x 62 x 305 mm
Operating conditionsTemperature: 5°C to 35°C, Operation status: Horizontal
Operating humidity5% to 85%
125RFIPAnalog InputAC coupled DVD RF signal input RFIP
126RFINOPOUTAnalog InputAC coupled DVD RF signal input RFIN
127RFGOPINPAnalog InputMain beam, RF AC input path
128RFHOPINNAnalog InputMain beam, RF AC input path
1RFAAnalog InputRF main beam input A
2RFBAnalog InputRF main beam input B
3RFCAnalog InputRF main beam input C
4RFDAnalog InputRF main beam input D
5RFEAnalog InputRF sub beam input E
6RFFAnalog InputRF sub beam input E
7AVDD18_2Analog powerAnalog 1.8V power
8AVDD33_1Analog powerAnalog 3.3V power
9XTALIInput27MHz crystal input
10XTALOOutput27MHz crystal output
11AGND33Analog GroundAnalog Ground
12V20Analog outputReference voltage 2.0V
13V14Analog outputReference voltage 1.4V
14REXTAnalog Input
Current reference input. It generates reference current for
RF path. Connect an external 15K resistor to this pin and
AVSS
15MDI1Analog InputLaser power monitor input
16MDI2Analog InputLaser power monitor input
17LDO1Analog OutputLaser driver output
18LDO2Analog OutputLaser driver output
19AVDD33_2Analog PowerAnalog 3.3V power
20DMOAnalog OutputDisk motor control output. PWM output
21FMOAnalog OutputFeed motor control. PWM output
22TRAY_OPENAnalog OutputTray PWM output/Tray open output
23TRAY_CLOSEAnalog OutputTray PWM output/Tray close output
24TROAnalog Output
Tracking servo output. PDM output of tracking servo
compensator
25FOOAnalog Output
Focus servo output. PDM output of focus servo
compensator
26FGGPIO2Analog
1) Motor Hall sensor input
2) GPIO
27USB_DPAnalog InputUSB port DPLUS analog pin
28USB_DMAnalog InputUSB port DMINUS analog pin
29VDD33_USBUSB PowerUSB Power pin 3.3V
30VSS33_USBUSB GroundUSB ground pin
31PAD_VRTAnalog InoutUSB generating reference current
32VDD18_USBUSB PowerUSB Power pin 1.8V
95DACVDDCPowerPower
96VREFAnalogBandgap reference voltage
97FSAnalogFull scale adjustment (suggest to use 560 ohm)
98DACVSSCGroundGround pin for video DAC circuitry
99CVBSAnalogAnalog composite output
• Abbreviations:
SR: Slew Rate
PU: Pull Up
PD: Pull Down
SMT: Schmitt Trigger
4mA~16mA: Output buffer driving strength.
100DACVDDBPower3.3V power pin for video DAC circuitry
101DACVDDAPower3.3V power pin for video DAC circuitry
102Y/GAnalogGreen, Y, SY, or CVBS
103B/CB/PBAnalogBlue, CB/PB, or SC
104R/CR/PRAnalogRed, CR/PR, CVBS, or SY
105AADVSSGroundGround pin for 2ch audio ADC circuitry
`1) Audio ADC input 2
2) MS_CLK set B
3) MCDATA
106AKIN2Analog4) Audio Mute
5) HSYN/VSYN output
6) C5
7) GPIO
1) 2ch audio ADC reference voltageC
107ADVCMAnalog2) C6
3) GPIO
1) Audio ADC input 1
2) MS_D0 set B
3) Audio Mute
108AKIN1Analog
4) HSYN/VSYN output
5) C7
6) GPIO
109AADVDDPower3.3V power pin for 2ch audio ADC circuitry
110APLLVDD3Power3.3V Power pin for audio clock circuitry
111APLLCAPAnalog InOutAPLL external capacitance connection
112ADACVSS2GroundGround pin for audio DAC circuitry
113ADACVSS1GroundGround pin for audio DAC circuitry
114ARF / LFEGPIOAnalog Output
1) Audio DAC sub-woofer channel output
2) While internal audio DAC not used:
a. ACLK
b. GPIO
115ARSGPIOAnalog Output
1) Audio DAC right Surround channel output
2) While internal audio DAC not used:
a. ABCK
b. GPIO
1) Audio DAC right channel output
2) While internal audio DAC not used:
116ARAnalog Outputa. SDATA2
b. GPIO
c. RXD2
117AV CMAnalogAudio DAC reference voltage
118ALGPIOAnalog Output
1) Audio DAC left channel output
2) While internal audio DAC not used:
a. SDATA1
b. GPIO
c. RXD1
119ALSGPIOAnalog Output
1) Audio DAC left Surround channel output
2) While internal audio DAC not used:
a. ALRCK
b. GPIO
120ALF /CENTERGPIOAnalog Output
1) Audio DAC center channel output
2) While internal audio DAC not used:
a. ASDATA0
b. GPIO
121ADACVDD1Analog Power3.3V power pin for audio DAC circuitry
122ADACVDD2Analog Power3.3V power pin for audio DAC circuitry
123AVDD18_1Analog PowerAnalog 1.8V power
124AGND18Analog GroundAnalog Ground
General Power/ Ground (7)
54, 90DVDD18Power1.8V power pin for internal digital circuitry
Serial Control Data (Input/Output) - SDA is a data I/O in IC
®
Mode. CDOUT is the output data line for
the control port interface in SPI
TM
Mode.
SCL/CCLK2Serial Control Port Clock (Input) - Serial clock for the serial control port.
AD0/CS3
Address Bit 0 (IC) / Co ntrol Por t Chip Select (SPI) (Input) - AD0 is a chip address pin in IC Mode;
CS is the chip-select signal for SPI format.
AD1/CDIN4
Address Bit 1 (IC) / Ser i al Control Dat a Input (SPI) (Input) - AD1 is a chip address pin in IC Mode;
CDIN is the input data line for the control port interface in SPI Mode.
VLC5
Control Port Power (Input) - Determines the required signal level for the control port interface. Refer
to the Recommended Operating Conditions for appropriate voltages.
RESET6 Res et (Input) - The device enters a low-power mode when this pin is driven low.
AIN3A
AIN3B
78Stereo Analog Input 3 (Input) - The full-scale level is specified in the ADC Analog Characteristics
specification table.
AIN2A
AIN2B
910Stereo Analog Input 2 (Input) - The full-scale level is specified in the ADC Analog Characteristics
specification table.
• PIN DESCRIPTION
AIN1A
AIN1B
AGND13 Analog Ground (Input) - Ground reference for the internal analog section.
VA1 4 Analog Power (Input) - Positive power for the internal analog section.
AFILTA15 Antialias Filter Connection (Output) - Antialias filter connection for the channel A ADC input.
AFILTB16 Antialias Filter Connection (Output) - Antialias filter connection for the channel B ADC input.
VQ17 Quiescent Voltage (Output) - Filter connection for the internal quiescent reference voltage.
TSTO18 Test Pin (Output) - This pin must be left unconnected.
FILT+19 Positive Voltage Reference (Output) - Positive reference voltage for the internal sampling circuits.
TSTO20 Test Pin - This pin must be left unconnected.
AIN4A/MICIN1
AIN4B/MICIN22122
AIN5A
AIN5B
MICBIAS25
AIN6A
AIN6B
PGAOUTA
PGAOUTB
VA3 0 Analog Power (Input) - Positive power for the internal analog section.
AGND
NC
TSTO35 Test Pin (Output) - This pin must be left unconnected.
VLS36
TSTI37 Test Pin (Input) - This pin must be connected to ground.
NC
SDOUT41 Serial Audio Data Output (Output) - Output for two’s complement serial audio data.
SCLK42 Serial Clock (Input/Output)
LRCK43
MCLK44 Master Clock (Input/Output) - Clock source for the ADC’s delta-sigma modulators.
DGND45 Digital Ground (Input) - Ground reference for the internal digital section.
VD46 Digital Power (Input) - Positive power for the internal digital section.
INT47 Interrupt (Output) - Indicates an interrupt condition has occurred.
OVFL48 Overflow (Output) - I
1112Stereo Analog Input 1 (Input) - The full-scale level is specified in the ADC Analog Characteristics
specification table.
Stereo Analog Input 4 / Microphone Inp ut 1 & 2 (Input) - The full-scale level is specified in the ADC
Analog Characteristics specification table.
2324Stereo Analog Inpu t 5 (Input) - The full-scale level is specified in the ADC Analog Characteristics
specification table.
Microphone Bias Supply
teristics are specified in the DC Electrical Characteristics specification table.
2627Stereo Analog Input 6 (Input) - The full-scale level is specified in the ADC Analog Characteristics
specification table.
2829PGA Analog Audio Output (Output) - Either an analog output from the PGA block or high impedance.
31
Analog Ground (Input) - Ground reference for the internal analog section.
32
3334No Connect - These pins are not connected internally and should be tied to ground to minimize any
potential coupling effects.
Serial Audio Interface Power (Input) - Determines the required signal level for the serial audio interface. Refer to the Recommended Operating Conditions for appropriate voltages.
38,
No Connect - These pins are not connected internally and should be tied to ground to minimize any
39,
potential coupling effects.
40
Left Right Clock (Input/Output) - Determines which channel, Left or Right, is currently active on the
serial audio data line.
(Output) - Low-noise bias supply for external microphone. Electrical charac-
SLRCK 20 I/O PCM word clock (left-right clock) input/output of sub 8-channel
audio. User can select the master/slave mode of this signal.
Schmitt-Trigger i
nput.
SSDIN [3:0] 23, 24, 25, 26 I/O PCM serial data input of sub-channel audio.
User can set this sub-channel data input pins to PCM serial data
output pins. See the Control Register Description part.
Schmitt-Trigger i
nput
NamePin NO. Ty pe Description
PLL_AVDD 6 Analog
PLL_AVSS 8 Analog
PLL_DVDD 3 PLL
PLL_DVSS 2 PLL
DVDD 13, 34, 42,
DVSS 14, 35, 43,
IO_VDD 4,
IO_VSS 1, 5, 7, 9, 21,
/RESET 96 I H/W reset signal. Active Low Schmitt-Trigger input.
XIN 86 Analog Cryst
XOUT 87 Analog Cryst
MBCK 11 I/O PCM bit clock input/output of main 8-channel audio.
MLRCK 12 I/O PCM Word clock (left-right clock) input/output of main 8-channel
MSDIN [3:0] 15, 16, 17, 18 I PCM serial data input of main 8-channel audio.
SBCK 19 I/O PCM bit clock input/output of 8-channel audio.
66, 80, 91
63, 81, 92
10, 22, 29, 39, 47,
56, 65, 72, 94
28, 38, 44, 50,
53, 57, 60, 64,
69, 73, 85, 95
Power and Ground
Power
Ground
Power
Ground
Power Core power supply
GroundCore digit
Power I/O power supply. 3.3V Digital power supply.
GroundI/O digital ground.
PCM Audio Input/Output Interface
PLL analog power supply.
analog ground.
PLL
PLL digital power supply.
PLL digit
Reset and Clock
The Schmitt-Trigger input allows a slowly rising input to reset the
chip reliably. The RESET signal must be asserted ‘Low’ during
power up. De-assert ‘High’ for normal operation.
User can select the master/slave mode of this signal.
Schmitt-Trigger i
audio. User can select the master/slave mode of this signal.
Schmitt-Trigger i
Schmitt-Trigger i
User can select the master/slave mode of this signal.
NOTE) Parts that are shaded are critical
NOTE) With respect to risk of fire or
NOTE) electricial shock.
2-492-50
CIRCUIT DIAGRAMS
1. SMPS(POWER) CIRCUIT DIAGRAM
IMPORTANT SAFETY NOTICE
WHEN SERVICING THIS CHASSIS, UNDER NO CIRCUMSTANCES SHOULD THE ORIGINAL DESIGN BE
MODIFIED OR ALTERED WITHOUT PERMISSION
FROM THE LG CORPORATION. ALL COMPONENTS
SHOULD BE REPLACED ONLY WITH TYPES IDENTICAL TO THOSE IN THE ORIGINAL CIRCUIT. SPECIAL
COMPONENTS ARE SHADED ON THE SCHEMATIC
FOR EASY IDENTIFICATION.
THIS CIRCUIT DIAGRAM MAY OCCASIONALLY DIFFER FROM THE ACTUAL CIRCUIT USED. THIS WAY,
IMPLEMENTATION OF THE LATEST SAFETY AND
PERFORMANCE IMPROVEMENT CHANGES INTO
THE SET IS NOT DELAYED UNTIL THE NEW SERVICE
LITERATURE IS PRINTED.
NOTE :
1. Shaded( ) parts are critical for safety. Replace only
with specified part number.
2. Voltages are DC-measured with a digital voltmeter
during Play mode.
When reassembling, perform the procedure in
reverse order.
The “Bottom” on Disassembly column of above
Table indicates the part should be disassembled
at the Bottom side.
2) Lift up the Clamp Assembly Disc in direction of
arrow(A).
3) Separate the Clamp Assembly Disc from the
Holder Clamp.
1-1-1. Plate Clamp
1) Turn the Plate Clamp to counterclockwise
direction and then lift up the Plate Clamp.
1-1-2. Magnet Clamp
1-1-3. Clamp Upper
2. Tray Disc (Fig. 4-2)
1) Insert and push a Driver in the emergency eject
hole(A) at the right side, or put the Driver on the
Lever(B) of the Gear Emergency and pull the
Lever(B) in direction of arrow so that the Tray Disc
is ejected about 15~20mm.
2) Pull the Tray Disc until it is separated from the
Base Main completely.
2) Unlock the Locking Tab(L3) in direction of arrow
and then lift up the Frame Assembly Up/Down to
separate it from the Base Main.
Note
• When reassembling move the Guide Up/Down in
direction of arrow(C) until it is positioned as
Fig.(C).
• When reassembling insert (A) portion of the Frame
Assembly Up/Down in the (B) portion of the Guide
Up/Down as Fig.(B)
6. Belt Loading(Fig. 4-4)
Note
Put the Base Main on original position(Top Side)
7. Gear pulley (Fig. 4-4)
1) Unlock the Locking Tab(L4) in direction of arrow(B) and
then separate the Gear Pulley from the Base Main.
8. Gear Loading (Fig. 4-4)
9. Guide Up/Down (Fig. 4-4)
1) Move the Guide Up/Down in direction of arrow(A) as
Fig.(A)
2) Push the Locking Tab(L5) down and then lift up the
Guide Up/Down to separate it from the Base Main.
Note
When reassembling place the Guide Up/Down as Fig.(C)
and move it in direction arrow(B) until it is locked by the
Locking Tab(L5). And confirm the Guide Up/Down as Fig.(A)
10. PWB Assembly Loading (Fig. 4-4)
Note
Put the Base Main face down(Bottom Side)
1) Release 1 Screws(S5)
2) Unlock the Loading Motor (C2) from the Hook (H1) on
the Base Main.
3) Unlock 2 Locking Tabs(L6) and separate the PWB
Assembly Loading from the Base Main.