LG RE-21CC20MX, RE-21CC20RX User Manual

COLOR TV
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : MC-019A
MODEL : RE-21CC20MX/RX
e-mail:http://www.LGEservice.com/techsup.html
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CONTENTS
CONTENTS ............................................................................................................ 2
SAFETY PRECAUTIONS ..................................................................................3
SERVICING PRECAUTIONS .......................................................................... 4
SPECIFICATIONS ................................................................................................ 6
DESCRIPTION OF CONTROLS ..................................................................... 7
ADJUSTMENT......................................................................................................10
PURITY & CONVERGENCE ADJUSTMENT...........................................13
BLOCK DIAGRAM...............................................................................................16
EXPLODED VIEW .............................................................................................. 18
EXPLODED VIEW PARTS LIST.....................................................................19
REPLACEMENT PARTS LIST ...................................................................... 20
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SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Replacement Parts List. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.
It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Due to high vacuum and large surface area of picture tube, extreme care should be used in handling the Picture Tube. Do not lift the Picture tube by it's Neck.
X-RAY Radiation
Warning:
To determine the presence of high voltage, use an accurate high impedance HV meter.
Adjust brightness, color, contrast controls to minimum. Measure the high voltage. The meter reading should indicate
23.5
¡ 1.5KV: 14-19 inch, 26 ¡ 1.5KV: 19-21 inch,
29.0 ¡ 1.5KV: 25-29 inch, 30.0 ¡ 1.5KV: 32 inch If the meter indication is out of tolerance, immediate service and correction is required to prevent the possibility of premature component failure.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to 0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
Leakage Current Hot Check circuit
The source of X-RAY RADIATION in this TV receiver is the High Voltage Section and the Picture Tube. For continued X-RAY RADIATION protection, the replacement tube must be the same type tube as specified in the Replacement Parts List.
1.5 Kohm/10W
To Instrument's exposed METALLIC PARTS
Good Earth Ground such as WATER PIPE, CONDUIT etc.
AC Volt-meter
IMPORTANT SAFETY NOTICE
0.15uF
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CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS
on page 3 of this publication.
NOTE:
If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC
power source before; a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug
or other electrical connection.
c.
Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.
d. Discharging the picture tube anode.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".
3. Discharge the picture tube anode only by (a) first connecting
one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected, and then (b) touch the other end of the insulated clip lead to the picture tube anode button, using an insulating handle to avoid personal contact with high voltage.
4. Do not spray chemicals on or near this receiver or any of its
assemblies.
5. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable nonabrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.
6. Do not defeat any plug/socket B+ voltage interlocks with
which receivers covered by this service manual might be equipped.
7. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are correctly installed.
8. Always connect the test receiver ground lead to the
receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.
9.
Use with this receiver only the test fixtures specified in this service manual.
CAUTION: Do not connect the test fixture ground strap to any heatsink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices.
Examples of
typical ES devices are integrated circuits and some fieldeffect
transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the ieads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION:Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500¡£F to 600¡£F.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thorohly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.
(500¡£F to 600¡£F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static,
suction-type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil.
6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal
temperature (500¡£F to 600¡£F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
SERVICING PRECAUTIONS
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c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.
d. Closely inspect the solder area and remove any excess
or splashed solder with a small wire-bristle brush.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction­type solder removal device (or with solder braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and solder it.
3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.
Power Output, Transistor Device Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heatsink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heatsink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit board.
3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow stake.
2. Securely crimp the leads of replacement component around notch at stake top.
3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.
1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
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SPECIFICATIONS
Note : Specification and others are subject to change without notice for improvement.
O Video input system:
PAL-B/G, D/K, I/I SECAM-B/G, D/K,L/L’ NTSC M NTSC 4.43
O Intermediate Frequency (Unit : MHz)
VISION IF : 38.9MHz COLOR IF : 34.47MHz(4.43)
35.32MHz(3.58) : NTSC-M VIF-4.25000MHz VIF-4.40625MHz
SOUND IF : 33.4MHz (B/G)
32.9MHz (I/I)
32.4MHz (D/K)
34.4MHz (M)
O Power requirement : 110~240V, 50/60Hz
O Power consumption : 95
O STAND-BY : 3W
O Tuning system :
FVS 100 Programme memory 200 Programme memory(W/O TXT)
O
Antenna input impedance : VHF/UHF 75 ohm, unbalanced
O OSD (On Screen Display) : EASY-MENU
O Voice coil impedance : 8 ohm
O Sound output : 7W¡¿2(MAX)
Dual/Stereo : A2/NICAM(Option)
O External connection : Head Phone Jack
A/V in : 2 PERI Connector(Full Scart) : 1 DVD in
O External In/Output
Audio-In:0.5Vrms
!3dB,over 10Kohm
Audio-Out:0.5Vrms!3dBb,below 1Kohm Video-In/Out:1Vp-p!3dB,75ohm DVD In Y: 1Vp-p!3dB Pb,Pr : 0.7Vp-p!3dB
O Feature : Auto programme/Manual programme
CSM (Color Status Memory) Auto Sleep Turbo Picture & Sound Programme Editing PSM (Picture Status Memory) Teletext (TOP/FLOF/LIST) ACMS Auto Volume Level Game SSM(Sound Status Memory) Favorite Program
O Tuning range
Band
VHF-Low
VHF-High
Hyper UHF
S1'-S3', S1
S2-S10, S11-S20 S21-S41
For TV
For CATV
B/G
Ch2-4
Ch5-12
D/K
Ch1-5
Ch6-12
I/I
Ch4-13
NTSC
Ch2-13
Ch21-69 Ch14-69
(
): SECAM
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All the functions can be controlled with the remote control handset. Some functions can also be adjusted with the buttons on the front panel of the set.
Remote control handset
Before you use the remote control handset, please install the bat­teries. See the next page.
1. POWER
switches the set on from standby or off to standby.
2. NUMBER BUTTONS
switches the set on from standby or directly select a number.
3. MENU (or INDEX)
selects a menu. selects an index page in the teletext mode (only TELETEXT models).
4. EYE/*(option)
switches the eye function on or off.
5.
/
(Programme Up/Down)
selects a programme or a menu item. switches the set on from standby. scans programmes automatically.
F / G
(Volume Up/Down)
adjusts the volume. adjusts menu settings.
OK
accepts your selection or displays the current mode.
6. Q.VIEW
returns to the previously viewed programme. selects a favorite programme.
7. TELETEXT BUTTONS (option)
These buttons are used for teletext. For further details, see the ‘Teletext’ section.
8. PSM (Picture Status Memory)
recalls your preferred picture setting.
9. TURBO PICTURE / SOUND BUTTON (option)
selects Turbo picture and sound.
POWER MUTE
123
456
789
MENU/INDEX
TV/AV
TV
0
i
TEXT/MIX/ SIZE/ HOLD/
EYE/
Q.VIEW
LIST
I / II /
( )
PR
( )
PR
OK
VOLVOL
UPDATE/
PSM SSM/ SLEEP/ M
X
TIME/ REVEAL/
?
/
TURBO/
PICTURE SOUND
1
2
3 4
5
6
7
8 9
10
11 12
13
14 16
15
( )
( )
(With TELETEXT)
DESCRIPTION OF CONTROLS
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10. MUTE
switches the sound on or off.
11. TV/AV
selects TV or AV mode. clears the menu from the screen. switches the set on from standby.
12. I/II/*(option)
selects the language during dual language broadcast. (option) selects the sound output.
13. LIST
displays the programme table.
14. SLEEP
sets the sleep timer.
15. SSM/*(option) (Sound Status Memory)
recalls your preferred sound setting.
16. SURROUND (ºº/*) (option)
selects surround sound.
*
: No function
COLOURED BUTTONS : These buttons are used for teletext (only
TELETEXT models) or programme edit.
(Without TELETEXT)
POWER MUTE
1 2 3
4 5 6
7 8 9
MENU
TV/AV
0
EYE/
Q.VIEW
LIST
I / II /
( )
PR
( )
PR
OK
VOLVOL
PSM SSM/ SLEEP
PICTURE SOUND
/
TURBO/
1
2
3 4
5
6
8
9
10
11 12
13
14 16
15
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