LG RBHP-B213B User Manual

CUSTOMER : LGE

DATE : 2017.09.06.

SPECIFICATIONS FOR APPROVAL

PRODUCT NAME : BT(v4.2) + WLAN(802.11a/b/g/n/ac) 2.4G SISO/5G MIMO
MODEL NAME : RBHP-B213B

CUSTOMER P/N : EAT63433501

APPROVAL REMARK

APPENDIX

Designed Checked Approved

LG Innotek Co., Ltd.

DOCUMENT No.

PAGE 68

RBHP-B213B

(00)-0070

TITLE : Specifications for approval (RBHP-B213B)

REV 1.6 (5 / 68)

(CUSTOMER P/NO : EAT63433501 )

1. Application

v

This specification is applied to LGInnotek Bluetooth (v4.2)and 2.4GHz SISO/5GHz MIMO
WLAN(802.11a/b/g/n/ac) Module RBHP-B213B which includes BCM88359

2. Quality

Quality should meet each condition which mentioned on this specification. However, the
items which are not mentioned on this specification follow the inspection agreements and
standards which are agreed with both companies.

3. Appearance and Characteristics

1) Appearance
Appearance should not be contaminated by harmful materials and should not have cracks

etc. Mechanical dimensions should meet the contents of clause 8.

2) Characteristics
Electrical characteristics should meet the contents of clause 10.

4. Application of Bluetooth v4.2 and 2.4GHz/5GHz WLAN(IEEE 802.11.a/b/g/n/ac)

1) Automotive

5. Maximum Rating

NO ITEM Rating UNIT

1 Operating Temperature Range -40 ~ +85 ℃
2 Storage Temperature Range -40 ~ +105 ℃
3 VBAT Voltage Range -0.5 ~ 6.0 V
4 VIO Voltage Range -0.5 ~ 3.9 V

5 VBAT Max. Current 700(@3.3V) mA

6 VIO Max. Current 50(@1.8V) mA

w

■ RBHP-B213B Module assures operating normally at -40 ~ +85 ℃.

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6. Test

Electrical characteristics are tested for every products. However, if there are any
objection in judgments, it should be treated with agreements of companies.

7. Labeling Information

p

REV 1.6 (6 / 68)

GWANGGAETOH

①

RBHP-B213B

②

7 04 GJ 27 0059

③

④ ⑤

⑥

EAT63433501

⑧

⑨

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⑦

No. Index

① PRODUCT

② MODEL PART NO.

MANUFACTURED YEAR (0~9)

③

MANUFACTURED MONTH(1,2, …9, A,B,C)

④

⑤ GwangJu

⑥ MANUFACTURED DATE (1~31)
⑦ MANUFACTURED SERIAL NUMBER(0001~9999)

⑧ Customer P/N

QR CODE INFORMATION

⑨

: EAT63433501_704GJ270059

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8. Mechanical Dimension

1) Dimension without Antenna Ass’y

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8. Mechanical Dimension

2) Dimension with Antenna Ass’y

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9. General Features

9.1 BT(v4.2) + 2.4GHz/5GHz WLAN(IEEE 802.11a/b/g/n/ac) 2.4G SISO/5G MIMO

1) Features

• Operation Voltage is 3.3V/1.8V Dual Power Rail

• WiFi Single-stream up to 866 Mbps data rate

• Automotive Module

: All components are AEC-Q 100/200 qualified

• Support 2 Antenna port

: ANT0 : Bluetooth/5G WLAN, ANT1 : 2.4G/5G WLAN

• Integrated WLAN PA, RF Switch and LNA

• RoHS Compliant

• Size : 35.3 x 35.3 x 7.8 mm

3

• Support bandwidth : HT20 / HT40 / VHT80

• HOST Interface : PCIE/SDIO(WLAN), UART(BT), PCM(I2S)

• Package type : Connector type(B to B)

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9. General Features

9.2 Bluetooth(BT v4.2+EDR compliant)

1) Bluetooth Key Features

• Supports key features of upcoming Bluetooth standards

• Fully supports Bluetooth Core Specification version 4.2 + (Enhanced Data Rate)

EDR features:

-. Adaptive Frequency Hopping (AFH)

-. Quality of Service (QoS)

-. Extended Synchronous Connections (eSCO) – Voice Connections

-. Fast Connect (interlaced page and inquiry scans)

-. Secure simple Pairing (SSP)

-. Sniff Sub rating (SSR)

-. Encryption Pause Resume (EPR)

-. Extended Inquiry Response (EIR)

-. Link Supervision Timeout (LST)

• UART baud rates up to 4 Mbps

• Supports all Bluetooth 4.2 packet types

• Supports maximum Bluetooth data rates over HCI UART

• Multipoint operation with up to seven active slaves

-. Maximum of seven simultaneous active ACL links

-. Maximum of three simultaneous active SCO and eSCO connections with

scatternet support

• Narrowband and wideband packet loss concealment

• Scatternet operation with up to four active piconets with background scan and

support for scatter mode

• High-speed HCI UART transport support

• Channel quality driven data rate and packet type selection

• Standard Bluetooth test modes

• Extended radio and production test mode features

• Full support for power savings modes

-. Bluetooth clock request

-. Bluetooth standard sniff

-. Deep-sleep modes and software regulator shutdown

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9. General Features

9.3 WLAN

1) WLAN RF band & modulation Features

• Dual-band 2.4GHz and 5GHz 802.11 a/b/g/n/ac(802.11ac compliant)

• Up to 866Mbps data rate

• Supports 20, 40 and 80MHz channels with optional SGI(256 QAM modulation)

• Tx and Rx low-density parity check(LDPC)

• Supports IEEE 802.11ac/n beamforming

• Supports PCIe v3.0-compliant interface running at GEN1 speeds

• Supports two antennas with Bluetooth/5G WLAN and 2.4G/5G WLAN antenna

• Supports standard SDIO V3.0 (up to SDR104 mode at 208MHz, 4-bit and 1-bit)

• Backward compatibility with SDIO v2.0 host interface

• WPA and WPA2(Personal) support for powerful encryption and authentication

• AES and TKIP in hardware for faster data encryption and IEEE 802.11i

compatibility

• Reference WLAN subsystem provides Wi-Fi protected Setup(WPS)

2) WLAN MAC features

• Enhanced MAC for supporting IEEE 802.11ac features

• Transmission and reception of aggregated MPDUs(A-MPDU) for high

throughput(HT)

• Support for power management schemes, including WMM power-save multi-

poll(PSMP) and multiphase PSMP operation

• Support for immediate ACK and block-ACK policies

• Inter-frame space timing support, including RIFS

• Back-off counters in hardware for supporting multiple priorities as specified in the

WMM specification

• Timing synchronization function(TSF), network allocation vector(NAV)

maintenance, and target beacon transmission time(TBTT) generation in hardware

• Hardware offload for AES-CCMP, legacy WPA TKIP, legacy WEP ciphers, WAPI,
and support for key management

• Programmable independent basic service set(IBSS) or infrastructure basic service

set functionality

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9. General Features

9.3 WLAN

3) WLAN PHY features

• Programmable data rates from MCS0-9 in 20MHz, 40MHz, and 80MHz channels,

as specified in IEEE 802.11ac

• Improved performance with channel smoothing and spur canceller support

• Supports Optional short GI and Green field modes in Tx and Rx

• Tx and Rx LDPC for improved range and power efficiency

• Beamforming support

• Supports IEEE 802.11h/k for worldwide operation

• Advanced algorithms for low power, enhanced sensitivity, range, and reliability

• IEEE 802.11a, 11b, 11g, 11n, 11ac single stream PHY standards

• Designed to meet FCC and other worldwide regulatory requirements

9.4 JEDEC MSL (Moisture Sensitivity Level) Test

• MSL 3 Level (Floor Life Time : 168Hrs. / Condition : ≤30℃, 60% RH)

• Standard : IPC / JEDEC J-STD-020C

Bake

Soak

Reflow

24Hrs. / 125℃

40Hrs. / 60℃, 60% RH

3 times / 240℃

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10. Electrical Specification

10.3 I/O characteristics

1) SDIO Interface I/O pins and PCIe out of band signals(PERST_N/PME_L/CLKREQ_N)

*VIO_SD= 1.8V

Item Symbol Min Typ Max Unit

Input high voltage VIH 1.27 - - V
Input low voltage VIL - - 0.58 V
Output high voltage@2mA

Output low voltage@2mA

*VIO_SD = 3.3V

Item Symbol Min Typ Max Unit

Input high voltage VIH 0.625xVIO - - V
Input low voltage VIL - - 0.25xVIO V
Output high voltage@2mA

Output low voltage@2mA

VOH
VOL

VOH
VOL

1.40 - - V

- - 0.45 V

0.75xVIO - - V

- - 1.25xVIO V

2) Other Digital I/O Pins(UART/PCM/WAKE/REG_ON/STRAP and GPIOs)

*VIO = 1.8V

Item Symbol Min Typ Max Unit

Input high voltage VIH 0.625xVIO - VIO+0.1 V
Input low voltage VIL - - 0.35xVIO V

Output high voltage@2mA

VOH

0.45xVIO - - V

Output low voltage@2mA

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VOL

- - 0.45 V

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10. Electrical Specification

10.3 I/O characteristics

*VIO = 3.3V

Item Symbol Min Typ Max Unit

Input high voltage VIH 2.00 - VIO+0.1 V
Input low voltage VIL - - 0.8 V
Output high voltage@2mA

Output low voltage@2mA

VOH

VOL

VIO-0.4 - - V

- - 0.4 V

3) WLAN host interface strap selection

- PCIE_EN, SDIO_DIS, SDIO_PAD

PCIE_EN Mode

High PCIe

Low 1.8V SDIO Low

Low

SDIO_DIS

High

Low

SDIO_PAD

High
High

low

3.3V SDIO

4) Sequencing of reset and regulator control signals

- Description of control signals

*WL_REG_ON
: Used by the PMU to power up the WLAN section. It is also OR-gated with the BT_REG_ON input to
control the internal BCM88359 regulators. When this pin is high, the regulators are enabled and the
WLAN section is out of reset. When this pin is low, the WLAN section is in reset. If both the
BT_REG_ON and WL_REG_ON pins are low, the regulators are disabled

*BT_REG_ON
: Used by the PMU(OR-gated with the WL_REG_ON)to power up the internal BCM88359 regulators. If
both the BT_REG_ON and WL_REG_ON pins are low, the regulators are disabled. When this pin is low
and WL_REG_ON is high, the BT section is in reset

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10. Electrical Specification

10.3 I/O characteristics

- Control signal timing diagrams

*WLAN =ON, Bluetooth = ON

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*WLAN =OFF, Bluetooth = OFF

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10. Electrical Specification

10.3 I/O characteristics

- Control signal timing diagrams

*WLAN =ON, Bluetooth = OFF

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*WLAN =OFF, Bluetooth = ON

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10. Electrical Specification

10.3 I/O characteristics

- Boot-Up Sequence and Reset timing

REV 1.6 (34 / 68)

VBAT

VIO

WL_REG_ON

/BT_REG_ON

VDDC

(on-chip PMU)

Internal POR

(Power on Reset)

Internal

Reference

Clock

<0ms

<70us

<200ms

<200ms

< 950us

< 104ms

< 4ms

3.3V

After a fixed delay following internal POR

and REG_ON going high, Module

responds to host(address0x14) reads

27ns

8ms

Boot ROM execution starts and
firmware download begins
(UART and SDIO command start)

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10. Electrical Specification

10.3 I/O characteristics

r

- PCIe Power-on Timing

*Timing Parameter WL_REG_ON)Perst# Deassertion – First Config Access)

REV 1.6 (35 / 68)

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10. Electrical Specification

10.3 I/O characteristics

5) UART characteristics

-. UART physical interface is a standard, 4-wire interface(Rx, Tx, RTS, CTS) with

adjustable baud rates from 9600 bps to 4Mbps. Normally the UART baud rate is set
by a configuration record downloaded after reset or by automatic baud rate detection.
LGIT Module supports HCI 3-wire transport(UART H5)

-. UART bus timing specifications

Item Min Typ Max Unit

Delay time, UART_CTS_N low to UART_TXD valid - - 1.5 Bit periods

Setup time, UART_CTS_N high before midpoint of stop bit - - 0.5 Bit periods
Delay time, midpoint of stop bit to UART RTS_N high - - 0.5 Bit periods
Baud rates range(default rate : 115200bps) 9600 - 4M bps

-. UART bus timing

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10. Electrical Specification

10.3 I/O characteristics

6) PCM characteristics

-. LGIT Module PCM interface can connect to linear PCM codec devices in master or slave

mode. In master mode, the device generates the PCM_CLK and PCM_SYNC signals. In slave
mode, these signals are provided by another master on the PCM interfaces as inputs to the
devices

-. Short frame sync, master mode timing diagram

-. Short frame sync, master mode interface timing specifications

Item Min Typ Max Unit

PCM bit clock frequency - - 12 MHz
PCM bit clock LOW 41 - - ns

PCM bit clock HIGH 41 - - ns
PCM_SYNC delay 0 - 25 ns
PCM_OUT delay - - 25 ns
PCM_IN setup 8 - - ns
PCM_IN hold 8 - - ns
Delay from rising edge of PCM_BCLK during last bit period to

PCM_OUT becoming high impedance

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- - 25 ns

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10. Electrical Specification

10.3 I/O characteristics

6) PCM characteristics

-. Short frame sync, slave mode timing diagram

REV 1.6 (38 / 68)

-. Short frame sync, slave mode interface timing specifications

Item Min Typ Max Unit

PCM bit clock frequency - - 12 MHz
PCM bit clock LOW 41 - - ns
PCM bit clock HIGH 41 - - ns
PCM_SYNC setup 8 - - ns
PCM_SYNC hold 8 - - ns
PCM_OUT delay - - 25 ns
PCM_IN setup 8 - - ns
PCM_IN hold 8 - - ns
Delay from rising edge of PCM_CLK during last bit period to

PCM_OUT becoming high impedance

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0 - 25 ns

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10. Electrical Specification

10.3 I/O characteristics

6) PCM characteristics

-. Long frame sync, master mode timing diagram

REV 1.6 (39 / 68)

-. Long frame sync, master mode interface timing specifications

Item Min Typ Max Unit

PCM bit clock frequency - - 12 MHz
PCM bit clock LOW 41 - - ns
PCM bit clock HIGH 41 - - ns
PCM_SYNC delay 0 - 25 ns
PCM_OUT delay 0 - 25 ns
PCM_IN setup 8 - - ns
PCM_IN hold 8 - - ns
Delay from rising edge of PCM_BCLK during last bit period to

PCM_OUT becoming high impedance

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0 - 25 ns

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10. Electrical Specification

10.3 I/O characteristics

6) PCM characteristics

-. Long frame sync, slave mode timing diagram

REV 1.6 (40 / 68)

-. Long frame sync, slave mode interface timing specifications

Item Min Typ Max Unit

PCM bit clock frequency - - 12 MHz
PCM bit clock LOW 41 - - ns

PCM bit clock HIGH 41 - - ns
PCM_SYNC setup 8 - - ns
PCM_SYNC hold 8 - - ns
PCM_OUT Delay 0 - 25 ns
PCM_IN setup 8 - - ns
PCM_IN hold 8 - - ns
Delay from falling edge of PCM_BCLK or PCM_SYNC

during last bit period to PCM_OUT becoming high impedance

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0 - 25 ns

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10. Electrical Specification

10.3 I/O characteristics

7) SDIO characteristics

-. RBHP-B213B support up to SDIO 3.0 specification

· DS : Default speed(DS) up to 25MHz(3.3V signaling)

· SDR12 : SDR up to 25MHz(1.8V signaling)

· SDR25 : SDR up to 50MHz(1.8V signaling)

· SDR50 : SDR up to 100MHz(1.8V signaling)

· SDR104 : SDR up to 208MHz(1.8V signaling)

· DDR50 : DDR up to 50MHz(1.8V signaling)

REV 1.6 (41 / 68)

-. SDIO default mode timing(min.Vih = 0.7 X VIO, max.Vil = 0.2 x VIO)

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10. Electrical Specification

10.3 I/O characteristics

-. SDIO default mode bus timing parameters

Item Symbol Min Typ Max Unit

SDIO CLK
Freq.(data transfer mode) fPP 0 - 25 MHz
Freq.(identification mode) fOD 0 400 KHz
Clock low time

Clock high time
Clock rise time
Clock low time
Input : CMD, DAT(referenced to CLK)
Input setup time
Input hold time
Output : CMD, DAT(referenced to CLK)
Output delay time-data transfer mode
Output delay time-data identification

mode

tWL

tWH
tTLH
tTHL

tISU

tIH

tODLY
tODLY

10 - - ns
10 - - ns

- - 10 ns

- - 10 ns

5 - - ns
5 - - ns

0 - 14 ns

0 - 50 ns

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10. Electrical Specification

10.3 I/O characteristics

-. SDIO high speed mode bus timing(min.Vih = 0.7 X VIO, max.Vil = 0.2 x VIO)

-. SDIO high speed mode bus timing parameters

Item Symbol Min Typ Max Unit

SDIO CLK
Freq.(data transfer mode) fPP 0 - 50 MHz
Freq.(identification mode) fOD 0 - 400 KHz
Clock low time

Clock high time

Clock rise time

Clock low time

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tWL

tWH

tTLH

tTHL

7 - - ns
7 - - ns

- - 3 ns

- - 3 ns

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10. Electrical Specification

10.3 I/O characteristics

Item Symbol Min Typ Max Unit

Input : CMD, DAT(referenced to CLK)

REV 1.6 (44 / 68)

Input setup time
Input hold time
Output : CMD, DAT(referenced to CLK)
Output delay time-data transfer mode
Output delay time-data identification

mode
Total system capacitance(each line)

-. SDIO SDR mode clock timing

tISU

tIH

tODLY
tODLY

CL

6 - - ns
2 - - ns

- - 14 ns

2.5 - - ns

- - 40 pF

Item Symbol Min Max Unit Comments

- t

-

Clock duty

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CLK

tCR, t

CF

-

40 50 ns SDR12 mode
20 400 ns SDR25 mode
10 - ns SDR50 mode

4.8 - ns SDR104 mode
tCR, tCF < 2.0ns(max)@100MHz

-

30 70 % -

X t

0.2

CLK

ns

tCR, tCF < 0.96ns(max)@208MHz

C

C

CARD

CARD

= 10pF

= 10pF

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10. Electrical Specification

10.3 I/O characteristics

-. SDIO SDR mode Device input timing

REV 1.6 (45 / 68)

Item Symbol Min Max Unit Comments

SDR104

Mode

SDR50

Mode

t

IS

t

IH

t

IS

t

IH

1.4 - ns C

0.8 - ns C

3 - ns C

0.8 - ns C

= 10pF, VCT=0.975V

CARD

= 5pF, VCT=0.975V

CARD

= 10pF, VCT=0.975V

CARD

= 10pF, VCT=0.975V

CARD

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10. Electrical Specification

10.3 I/O characteristics

-. SDIO SDR mode Device output timing(SDR modes up to 100MHz)

REV 1.6 (46 / 68)

Symbol Min Max Unit Comments

t

ODLY

t

ODLY

t

OH

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- 7.5 ns t

- 14.0 ns t

> 10ns, CL = 30pF using driver type B for SDR50

CLK

> 20ns, CL = 40pF using for SDR12, SDR25

CLK

1.5 - ns Hold time at the t

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ODLY

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10. Electrical Specification

10.3 I/O characteristics

-. SDIO SDR mode Device output timing(SDR modes 100MHz to 208MHz)

REV 1.6 (47 / 68)

Symbol Min Max Unit Comments

t

OP

Δt

OP

Δt

ODW

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0 2 UI Card output phase

-350 +1550 Ps Delay variation due to temp. change after tuning

0.60 - UI Δt

= 2.88ns @208MHz

ODW

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10. Electrical Specification

10.3 I/O characteristics

-. SDIO DDR50 mode Clock timing

REV 1.6 (48 / 68)

Item Symbol Min Max Unit Comments

-

-

Clock duty

t

CLK

t

CR, tCK

-

20 - ns DDR50 mode

-

45 55 % -

0.2x

t

CLK

ns

tCR, tCF < 4.0ns(max)@50MHz

C

CARD

= 10pF

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10. Electrical Specification

10.3 I/O characteristics

-. SDIO DDR50 mode Data timing

REV 1.6 (49 / 68)

Item Symbol Min Max Unit Comments

Input

CMD

Output

CMD
Input

DAT

Output

DAT

Input Setup time

Input Hold time

Output delay time

Output hold time

Input Setup time

Input Hold time

Output delay time

Output holdtime

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t

ISU

t

IH

t

ODLY

t

OH

t

ISU2X

t

IH2X

t

ODLY2X

t

ODLY2X

6 - ns C

0.8 - ns C

- 13.7 ns C

1.5 - Ns C

3 - ns C

0.8 - ns C

7.5 ns C

1.5 - Ns C

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< 10pF(1CARD)

CARD

< 10pF(1CARD)

CARD

< 30pF(1CARD)

CARD

< 15pF(1CARD)

CARD

< 10pF(1CARD)

CARD

< 10pF(1CARD)

CARD

< 25pF(1CARD)

CARD

< 15pF(1CARD)

CARD

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10. Electrical Specification

10.3 I/O characteristics

8) PCI Express characteristics

-. PCI Express Reference CLK

s

Parameters Symbol Comments Min. Typ. Max Unit

Baud rate BPS - - 2.5 -

Reference clock

amplitude

Vref

LVPECL, AC coupled

1.0 - - V

Gbaud

-. PCI Express Receiver

Parameters Symbol Comments Min. Typ. Max Unit

Differential

termination

DC impedance ZRX-DC

Powered down

termination(POS)

Powered down

termination(NEG)

Input voltage VRX-DIFFp-p

Jitter tolerance TRX-EYE

Differential
return loss

ZRX-DIFF-DC Differential termination 80 100 120 Ω

DC common-mode

impedance

ZRX-HIGH-IMP-DC-

POS

ZRX-HIGH-IMP-DC-

NEG

RLRX-DIFF Differential return loss 10.0 - - dB

Power-down or RESET

high Impedance

Power-down or RESET

high Impedance

AC coupled, differential(p-p)

Minimum receiver eye

width

40 50 60 Ω

100k - - Ω

1k - - Ω

175 - - mV

0.4 - - UI

Common-mode

return loss

Unexpected

electrical idle

enter detect

threshold

integration time

Signal detect

threshold

RLRX-CM Common-mode return loss 6 - - dB

RX-IDEL-DET-

DIFFENTERTIME

VRX-IDLE-DET-

DIFFpp

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An unexpected electrical

idle must be recognized no

longer than this time to

signal an unexpected idle

condition.

Electrical idle detect

threshold

- - 10.0 ms

65.0 - 175 mV

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10. Electrical Specification

10.3 I/O characteristics

8) PCI Express characteristics

-. PCI Express Transmitter

Parameters Symbol Comments Min. Typ. Max Unit

Output voltage

Output voltage

rise time

Output voltage

fall time

RX detection voltage

swing

TX AC peak

common-mode

voltage(5 GT/s)

TX AC peak

commonmode

voltage(2.5 GT/s)

Absolute delta of DC

common-model

voltage

during L0 and

electrical idle

VTX-

DIFFp-p

VTX-RISE

VTX-FALL

VTX-RCV-

DETECT

VTX-CM-

AC-PP

VTX-CM-

AC-P

VTX-CM-

DC-

ACTIVE-

IDLE-

DELTA

Differential p-p, programmable

in 16 steps

20% to 80%

80% to 20%

The amount of voltage
change allowed during

receiver detection.

TX AC common mode

voltage (5 GT/s)

TX AC common mode

voltage (2.5 GT/s)

Absolute delta of DC

common-model voltage

during L0 and electrical idle.

0.8 - 1200 mV

0.125

(2.5 GT/s)

0.15

(5 GT/s)

0.125

(2.5 GT/s)

0.15

(5 GT/s)

- - 600 mV

- - UI

- - UI

- - 100 mV

- - 20.0 mV

0 - 100 mV

Absolute delta of DC

common-model

voltage

between D+ and D-

Electrical idle

differential

peak output voltage

CM-DC-

DELTA

DIFF-AC-

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VTX-

LINE-

VTX-

IDLE-

p

DC offset between

D+ and D-

Peak-to-peak voltage 0 - 20.0 mV

0 - 25.0 mV

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10. Electrical Specification

10.3 I/O characteristics

8) PCI Express characteristics

Parameters Symbol Comments Min. Typ. Max Unit

TX short circuit

current

DC differential TX

termination

Differential

return loss

Common-mode

return loss

ITX-

SHORT

ZTX-

DIFF-DC

RLTX-

DIFF

RLTX-CM Common-mode return loss 6.0 - - dB

TX eye width TTX-EYE

Current limit when TX output

is shorted to ground.

Low impedance defined

during signaling (parameter

is captured for 5.0 GHz by

RLTX-DIFF)

Differential
return loss

Minimum TX

eye width

- - 90.0 mA

80.0 - 120 Ω

10 (min)

for 0.05:

1.25 GHz

- - dB

0.75 - - UI

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10. Electrical Specification

10.4 Operating Conditions

1) Recommended operation conditions

REV 1.6 (53 / 68)

t

Operating Temperature Range ℃
Supply Voltage : VBATT (3.3V)

Supply Voltage : VIO (1.8V) 1.62 1.98 V

2)Current consumption

Stand-by (BT & WLAN) mA

WLAN Continuous Rx mA 180
WLAN Continuous Tx2) mA 420
Bluetooth Connection mA 20

3) ESD Precautions

l

RBHP-B213B is classified as a JESD22-A114(HBM) class 1C(1kV) product. Apply ESD static handling
precautions during manufacturing.

Parameter Unit

Parameter Unit

Min Max

-40 +85

1)

3.0

Average

10

3.6

V

4) External 32.768KHz low-power oscillator(LPO)
External 32.768KHz precision oscillator is required.

Parameter Unit

Nominal input frequency KHz
Frequency accuracy ppm ±200
Single input amplitude mV, p-p 200 ~ 1800
Signal type Square-wave or sine-wave

1)

The BCM88359 is functional across this range of voltages.
Optimal RF performance specified in the RBHP-B213B approval sheet, however , is guaranteed only for min. 3.2V

including VBAT ripple

2)

MIMO condition

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LPO clock

32.768

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11. Pin Configuration

REV 1.6 (54 / 68)

< Opposite (Host) Pin Map (Top View) >

*

*

21

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*

Position#1

Indicator

<FCI 61082-041 >

1 20

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12. Reliability Test Conditions

12.1 Items related with Non-Solderability(ES96100-02)

NO ITEM Condition Characteristics

Initial value measured at standard test condition.

9 Against flux

Temperature

10

and Humidity

Cycling

Test Conditions

-Soak 5 seconds in a I.P.A and let waiting condition for 35 seconds.

After then test.
Initial value measured at standard test condition.

Test Conditions: 3 cycle condition.

70±2

55±2

23±5

Temperature (℃)

-40±2

Humidity (%)

80

60±15

4 4.5

14.5

17 19

Time (hour)

20.5 22.5 24

- No electrical problem

- No electrical problem

In standard test condition, take measurements 2hr after.
Initial value measured at standard test condition.

11

12

13 Dust

Dew

Condensation

test

High humidity

and Temp.

load test

Test Conditions: 3 cycle condition.

-30℃ (1 Hr)

-30℃ → 25℃, 90%RH (within 1 min)
25℃, 90%RH (1 Hr) - On : 15 min / Off : 15 min
In standard test condition, take measurements 2hr after.

IInitial value measured at standard test condition.
Test Conditions: 60℃, 80%, 48hr
In standard test condition, take measurements within 3hr.

IInitial value measured at standard test condition.
Test Conditions: JIS Z 8901, 5kg

In standard test condition, take measurements within 3hr.

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4 4.5 14. 5 17 19

Time (hour)

22.5

20.5

24

- No electrical problem

- No electrical problem

- No electrical problem

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12. Reliability Test Conditions

12.1 Items related with Non-Solderability(ES96100-02)

NO ITEM Condition Characteristics

Initial value measured at standard test condition.
Test Conditions:

1 hour

70
65

55
45

Temperature

14

Drift Test

25

0

Temperature (℃)

-10

-20

- No electrical problem

15 Dust

16

17

18 ESD

Complex

Environment

Operation

Durability

Take measurements sustaining each temperature.

IInitial value measured at standard test condition.
Test Conditions: JIS Z 8901, 5kg
In standard test condition, take measurements within 3hr.

IInitial value measured at standard test condition.
Test Conditions: -20℃~60℃, 10~50Hz, 1G
In standard test condition, take measurements within 3hr.

IInitial value measured at standard test condition.
Test Conditions: 25±5℃ 60±20%, 1500Hrs
In standard test condition, take measurements within 3hr.

IInitial value measured at standard test condition.
Test Conditions: ±1KV 5time 150pF/330Ω
In standard test condition, take measurements within 3hr.

- No electrical problem

- No electrical problem

- No electrical problem

- No electrical problem

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12. Reliability Test Conditions

12.2 Items related with Solderability(ES90000-04)

NO ITEM Condition Characteristics

1

2

3

High
Temperature
and Humidity

Load Test

Thermal

Shock

Power and

Temperature

Cycling

Initial value measured at standard test condition.
Test Conditions: 85±3℃, 85±5%RH, 1000hr
In standard test condition, take measurements within 3hr.

Initial value measured at standard test condition.
Test Conditions:

-40℃ ( 10 min)

-40℃ → 85℃, (within 10 min)
85℃ ( 10 min)
85℃ → -40℃, (within 10 min)

- Test cycle : 1000 cycles

- Test Times : 667 Hr
In standard test condition, take measurements within 3Hr.

Initial value measured at standard test condition.
Test Conditions: 100 cycle condition

- Test Times : 100 Hr

Supply Voltage Condition: standard ± 5%
Power Condition:

-35℃ ( 10 min)

-35℃ → 75℃, (Temp. variation velocity : over 6℃/min)
75℃ ( 10 min)
75℃ → -35℃, (Temp. variation velocity : over 6℃/min)

- On: 300 sec , Off: 300 sec

- Whisker, No electrical
problem

- No Whisker, Bond
strength, section
inspection, electrical
problem

In standard test condition, take measurements within 3Hr

Initial value measured at standard test condition.
Test Conditions:

- Frequency : 10 ~ 1000Hz

- Power spectrum density : 0.0296 ~ 9.63 (m/s3)2/Hz

- Direction : X/Y/Z, 8hr/Axis
In standard test condition, take measurements 2hr after.

4

Random

Vibration test

With operation

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15. Reflow Profile

Temperature

250℃

217℃

3℃ per second

REV 1.6 (64 / 68)

6℃ per second maximum

200℃

150℃

Tsmax

60~150 sec

Tsmin

3℃ per second maximum

60~120 sec

Ramp up

Initial ramp-up rate 3℃ per second maximum
Preheat

Temperature minimum(Tsmin)
Temperature maximum(Tsmax)
Time(minimum to maximum)

Ramp-up rate Tsmax to TL 3℃ per second maximum
Liquidus Temperature(TL) 217℃
Time above TL 60-150s

Soak(flux activation)

Reflow

Profile Feature Pb-free Assembly

150℃
200℃
60-120s

Cool down

t [sec]

Peak temperature 250℃ maximum

Time within 5℃ of actual peak 10s
Ramp-down rate 6℃ per second maximum

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16. Recommended Land Pattern

1)Top view

c

REV 1.6 (65 / 68)

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<FCI 61082-041 >

<Unit : mm>

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of top on BOX.

(400X250X285)

(CUSTOMER P/NO : EAT63433501 )

17. Packing Information

REV 1.6 (66 / 68)

1.2 2017. 05.23. Rev1.2 Released

R

1.3 2017. 06.27. Rev1.3 Released

1.4 2017. 07.14. Rev1.4 Released

E

1.5 2017. 08.10. Rev1.5 Released

V

1.6 2017. 09.06. Rev1.6 Released

LG Innotek Co., Ltd

APPD CHKD DSGD

RBHP-B213B

DOCUMENT NO.

6-3

(30) - 4021

TITLE : Specifications for approval (RBHP-B213B)

(CUSTOMER P/NO : EAT63433501 )

17. Packing Information

q

① ② ③ ④

Item

LGE v1.0

REV 1.6 (67 / 68)

2016.05.30

⑤

EAT63433501 130

Spec

No. Index

RBHP-B213B

① POSITION (ITEM / OUTBOX)
② CUSTOMER
③ FIRMWARE VERSION (vX.X)
④ SHIPPING DATE (YYYY.MM.DD)

BARCODE (Customer P/N, Quantity)

⑤

Ex) EAT63433501 130

⑥ CUSTOMER P/N
⑦ QUANTITY
⑧ MODEL P/N
⑨ LOT NUMBER

BARCODE (Lot No.)

⑩

Ex) 6530-001
BARCODE (Model P/N, Lot No.1)

⑪

Ex) RBHP-B213B.6530-001.1

⑥ ⑦

⑧

LotNo

6530 - 001

⑩

⑨

⑪

1.2 2017. 05.23. Rev1.2 Released

R

1.3 2017. 06.27. Rev1.3 Released

1.4 2017. 07.14. Rev1.4 Released

E

1.5 2017. 08.10. Rev1.5 Released

V

1.6 2017. 09.06. Rev1.6 Released

LG Innotek Co., Ltd

APPD CHKD DSGD

RBHP-B213B

DOCUMENT NO.

6-3

(30) - 4021

TITLE : Specifications for approval (RBHP-B213B)

(CUSTOMER P/NO : EAT63433501 )

18. Ordering Information

Product

REV 1.6 (68 / 68)

R B H P - B 2 1 3 A

RB

H

P

B

213

A

Bluetooth

Module Type

BT(Class2)+WLAN

Host Interface

PCIe

Chipset Maker

Broadcom

Serial Number

Revision

A Version

213

1.2 2017. 05.23. Rev1.2 Released

R

1.3 2017. 06.27. Rev1.3 Released

1.4 2017. 07.14. Rev1.4 Released

E

1.5 2017. 08.10. Rev1.5 Released

V

1.6 2017. 09.06. Rev1.6 Released

LG Innotek Co., Ltd

APPD CHKD DSGD

RBHP-B213B

DOCUMENT NO.

6-3

(30) - 4021

FCC Information
This device complies with part 15 of the FCC Results. Operation is subject to the following two conditions :
(1) This Device may not cause harmful interface, and
(2) This device must accept any interference received, including interference that may cause undesired
operation.

Note: This equipment has been tested and found to comply with the limits for CLASS B digital device,
pursuant to Part 15 of FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment This equipment generates, uses
and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may
cause harmful interference to radio communications. However, there is no guarantee that interference will not
occur in a particular installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encouraged to try correct
the interference by one or more of the following measures:

1.1. Reorient or relocate the receiving antenna.

1.2. Increase the separation between the equipment and receiver.

1.3. Connect the equipment into an outlet on a circuit different from that to which receiver is connected.

1.4. Consult the dealer or experienced radio/TV technician for help.

WARNING

Changes or modifications not expressly approved by the manufacturer could void the user’s authority to

operate the equipment.

“CAUTION : Exposure to Radio Frequency Radiation.
Antenna shall be mounted in such a manner to minimize the potential for human contact during normal
operation. The antenna should not be contacted during operation to avoid the possibility of exceeding the
FCC radio frequency exposure limit.

IC Information
This device complies with Industry Canada license-exempt RSS standard(s). Operation in subject to The
following two conditions: (1) this device may not cause interference, and (2) this device must accept any
interference, including interference that may cause undesired operation of the device.

Cet appareil est conforme avec Industrie Canada RSS standard exempts de licence(s), Son utilisation est
soumise à Les deux conditions suivantes: (1) cet appareil ne peut pas provoquer d’interférences et (2) cet
appareil doit accepter Toute interférence, y compris les interférences qui peuvent causer un mauvais
fonctionnement du dispositif.

Information for OEM Integrator
This

device is intended only for OEM integrators under the following conditions:

1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and

2) The transmitter module may not be co-located with any other transmitter or antenna.

End product labelling
The label for end product must include

“Contains FCC ID: BEJRBHP-B213B, Contains IC: 2703H-RBHPB213B”.

“ CAUTION: Exposure to Radio Frequency Radiation.

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with minimum distance of 20cm between the radiator and your
body. This transmitter module is authorized only for use in device where the antenna may be installed such
that 20 cm may be maintained between the antenna and users.”

Copyrightⓒ. 2019. All Rights Reserved.

2.2 List of applicable FCC rules
List the FCC rules that are applicable to the modular transmitter. These are the rules that specifically establish
the bands of operation, the power, spurious emissions, and operating fundamental frequencies. DO NOT list
compliance to unintentional-radiator rules (Part 15 Subpart B) since that is not a condition of a module grant
that is extended to a host manufacturer. See also Section 2.10 below concerning the need to notify host
manufacturers that further testing is required.3
Explanation: This module meets the requirements of FCC part 15C(15.247).

2.3 Summarize the specific operational use conditions
Describe use conditions that are applicable to the modular transmitter, including for example any limits on
antennas, etc. For example, if point-to-point antennas are used that require reduction in power or
compensation for cable loss, then this information must be in the instructions. If the use condition limitations
extend to professional users, then instructions must state that this information also extends to the host
manufacturer’s instruction manual. In addition, certain information may also be needed, such as peak gain per
frequency band and minimum gain, specifically for master devices in
5 GHz

DFS bands.
Explanation: The EUT has a PCB Antenna, , and the antenna use a permanently attached antenna
which is not replaceable.

2.4 Limited module procedures
If a modular transmitter is approved as a “limited module,” then the module manufacturer is responsible for
approving the host environment that the limited module is used with. The manufacturer of a limited module
must describe, both in the filing and in the installation instructions, the alternative means that the limited
module manufacturer uses to verify that the host meets the necessary requirements to satisfy the module
limiting conditions.
A limited module manufacturer has the flexibility to define its alternative method to address the conditions that
limit the initial approval, such as: shielding, minimum signaling amplitude, buffered modulation/data inputs, or
power supply regulation. The alternative method could include that the limited module manufacturer reviews
detailed test data or host designs prior to giving the host manufacturer approval.
This limited module procedure is also applicable for RF exposure evaluation when it is necessary to
demonstrate compliance in a specific host. The module manufacturer must state how control of the product
into which the modular transmitter will be installed will be maintained such that full compliance of the product
is always ensured. For additional hosts other than the specific host originally granted with a limited module, a
Class II permissive change is required on the module grant to register the additional host as a specific host
also approved with the module.
Explanation: The module is not a limited module.

2.5 Trace antenna designs
For a modular transmitter with trace antenna designs, see the guidance in Question 11 of KDB Publication
996369 D02 FAQ – Modules for Micro-Strip Antennas and traces. The integration information shall include for
the TCB review the integration instructions for the following aspects:
layout of trace design, parts list (BOM), antenna, connectors, and isolation requirements.

a) Information that includes permitted variances (e.g., trace boundary limits, thickness, length, width, shape(s),
dielectric constant, and impedance as applicable for each type of antenna);
b) Each design shall be considered a different type (e.g., antenna length in multiple(s) of frequency,
the wavelength, and antenna shape (traces in phase) can affect antenna gain and must be considered);
c) The parameters shall be provided in a manner permitting host manufacturers to design the printed circuit
(PC) board layout;
d) Appropriate parts by manufacturer and specifications;
e) Test procedures for design verification; and
f) Production test procedures for ensuring compliance.
The module grantee shall provide a notice that any deviation(s) from the defined parameters of the antenna
trace, as described by the instructions, require that the host product manufacturer must notify the module
grantee that they wish to change the antenna trace design. In this case, a Class II permissive change
application is required to be filed by the grantee, or the host manufacturer can take responsibility through the
change in FCC ID (new application) procedure followed by a Class II permissive change application.
Explanation: Yes, The module with trace antenna designs, and This manual has been shown the layout
of trace design,, antenna, connectors, and isolation requirements.

Copyrightⓒ. 2019. All Rights Reserved.

2.6 RF exposure considerations
It is essential for module grantees to clearly and explicitly state the RF exposure conditions that permit a host
product manufacturer to use the module. Two types of instructions are required for RF exposure information:
(1) to the host product manufacturer, to define the application conditions (mobile, portable – xx cm from a
person’s body); and (2) additional text needed for the host product manufacturer to provide to end users in
their end-product manuals. If RF exposure statements and use conditions are not provided, then the host
product manufacturer is required to take responsibility of the module through a change in FCC ID (new
application).

Explanation: This module complies with FCC RF radiation exposure limits set forth for an uncontrolled
environment, This equipment should be installed and operated with a minimum distance of 20
centimeters between the radiator and your body." This module is designed to comply with the FCC statement,
FCC ID is: BEJRBHP-B213B.

2.7 Antennas
A list of antennas included in the application for certification must be provided in the instructions. For modular
transmitters approved as limited modules, all applicable professional installer instructions must be included as
part of the information to the host product manufacturer. The antenna list shall also identify the antenna types
(monopole, PIFA, dipole, etc. (note that for example an “omni-directional antenna” is not considered to be a
specific “antenna type”)).
For situations where the host product manufacturer is responsible for an external connector, for example with
an RF pin and antenna trace design, the integration instructions shall inform the installer that unique antenna
connector must be used on the Part 15 authorized transmitters used in the host product. The module
manufacturers shall provide a list of acceptable unique connectors.

Explanation: The EUT has a PCB Antenna, , and the antenna use a permanently attached antenna

which is unique.

2.8 Label and compliance information
Grantees are responsible for the continued compliance of their modules to the FCC rules. This includes
advising host product manufacturers that they need to provide a physical or e-label stating “Contains FCC ID”
with their finished product. See Guidelines for Labeling and User Information for RF Devices –
P

ication 784748.

ubl
Explanation:The host system using this module, should have label in a visible area indicated the
following texts: "Contains FCC ID: BEJRBHP-B213B

2.9 Information on test modes and additional testing requirements5
Additional guidance for testing host products is given in KDB Publication 996369 D04 Module Integration
Guide. Test modes should take into consideration different operational conditions for a stand-alone modular
transmitter in a host, as well as for multiple simultaneously transmitting modules or other transmitters in a host
product.
The grantee should provide information on how to configure test modes for host product evaluation for
different operational conditions for a stand-alone modular transmitter in a host, versus with multiple,
simultaneously transmitting modules or other transmitters in a host.
Grantees can increase the utility of their modular transmitters by providing special means, modes, or
instructions that simulates or characterizes a connection by enabling a transmitter. This can greatly simplify a
host manufacturer’s determination that a module as installed in a host complies with FCC requirements.

Explanation: Topband can increase the utility of our modular transmitters by providing instructions

that simulates or characterizes a connection by enabling a transmitter.

2.10 Additional testing, Part 15 Subpart B disclaimer
The grantee should include a statement that the modular transmitter is only FCC authorized for the specific
rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is
responsible for compliance to any other FCC rules that apply to the host not covered by the modular
transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant
(when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that
the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

Explanation: The module without unintentional-radiator digital circuity, so the module does not

require an evaluation by FCC Part 15 Subpart B. The host shoule be evaluated by the FCC Subpart B.

KDB

Copyrightⓒ. 2019. All Rights Reserved.