LG MCD102, MCS102F Schematic

MINI Hi-Fi SYSTEM
SERVICE MANUAL
MODEL : MCD102 (MCS102F)
CAUTION
BEFORE SERVICING THE UNIT, READ THE “SAFETY PRECAUTIONS” IN THIS MANUAL
.
SERVICE MANUAL
http://biz.lgservice.com
P/NO : AFN32840849 FEBRUARY, 2007
1-1
CONTENTS
SECTION 1 GENERAL
SERVICING PRECAUTIONS......................................1-2
• NOTES REGARDING HANDLING OF THE PICK-UP
NOTES REGARDING COMPACTDISC PLAYER REPAIRS
ESD PRECAUTIONS...................................................1-4
LOCATION OF USERS CONTROLS.........................1-5
SPECIFICA TIONS........................................................1-7
SECTION 2 EXPLODED VIEWS
CABINET EXPLODED VIEW......................................2-1
TAPE DECK MECHANISM EXPLODED VIEW........2-3
1. TAPE DECK MECHANISM
(A/S & A/S : RIGHTA/S DECK)........................2-3
2. TAPE DECK MECHANISM
(A/S & A/S : LEFTA/S DECK) ..........................2-5
CD MECHANISM EXPLODED VIEW.........................2-7
SPEAKER EXPLODED VIEW ....................................2-9
MODEL : MCS102F ...............................................2-9
PACKING ACCESSORY VIEW.................................2-13
SECTION 3 AUDIO PART ELECTRICAL
AUDIO ELECTRICAL
TROUBLESHOOTING GUIDE....................................3-1
1. POWER (SMPS)................................................3-1
2. P-SENS...............................................................3-2
3. VKK CHECK.......................................................3-2
4. MICOM PART CHECK I ....................................3-2
5. MICOM PART CHECK II ...................................3-3
6. IC103(KS4CD21CS) CHECK............................3-4
7. FLD DISPLAY CHECK ......................................3-5
8. PWM MODULATION PART CHECK................3-6
9. POWER AMPPART CHECK............................3-7
10. AUX FUNCTION CHECK..................................3-8
11. TUNER FUNCTION CHECK.............................3-9
12. TAPE FUNCTION CHECK..............................3-10
13. T APE PLAY PAR TCHECK..............................3-11
14. TAPE REC PART CHECK...............................3-12
INTERNAL BLOCK DIAGRAM OF ICs...................3-13
1. ES6838 ..............................................................3-13
2. HA12237F..........................................................3-14
3. PS9829B............................................................3-15
4. PT6324...............................................................3-15
5. STR-S6757IF1905 ............................................3-16
6. T AS5142.............................................................3-17
7. U1739EJ2V1UD00/KF2_E...............................3-18
WIRING DIAGRAM....................................................3-20
BLOCK DIAGRAM.....................................................3-22
1. SMPS BLOCK DIAGRAM...............................3-22
2. MAIN & FRONT BLOCK DIAGRAM ..............3-24
SCHEMATIC DIAGRAMS .........................................3-26
1. SMPS SCHEMATIC DIAGRAM.......................3-26
2. MAIN SCHEMATIC DIAGRAM........................3-28
3. AMP SCHEMATIC DIAGRAM..........................3-30
4. DECK SCHEMATIC DIAGRAM.......................3-32
5. FRONT SCHEMATIC DIAGRAM.....................3-34
PRINTED CIRCUIT DIAGRAMS...............................3-36
1. MAIN P.C.BOARD............................................3-36
2. SMPS P.C.BOARD ..........................................3-40
3. FRONT P.C.BOARD........................................3-42
SECTION 4 CD PART ELECTRICAL
CD ELECTRICAL TROUBLESHOOTING GUIDE....4-1
1. CD PART TROUBLESHOOTING.....................4-1
2. USB PART TROUBLESHOOTING...................4-9
WAVEFORMS OF MAJOR CHECK POINT............4-10
SCHEMATIC DIAGRAMS .........................................4-13
1. CD SCHEMATIC DIAGRAM...........................4-13
2. USB SCHEMATIC DIAGRAM.........................4-15
PRINTED CIRCUIT DIAGRAM.................................4-17
CD P.C.BOARD....................................................4-17
SECTION 5 REPLACEMENT PARTS LIST
........5-1
1-2
NOTES REGARDING HANDLING OF THE PICK-UP
1.Notes for transport and storage
1) The pick-up should always be left in its conductive bag until immediately prior to use.
2) The pick-up should never be subjected to external pressure or impact.
2.Repair notes
1) The pick-up incorporates a strong magnet, and so should never be brought close to magnetic materials.
2) The pick-up should always be handled correctly and carefully, taking care to avoid external pressure and impact. If it is subjected to strong pressure or impact, the result may be an operational malfunction and/or damage to the printed-circuit board.
3) Each and every pick-up is already individually adjusted to a high degree of precision, and for that reason the adjustment point and installation screws should absolutely never be touched.
4) Laser beams may damage the eyes! Absolutely never permit laser beams to enter the eyes! Also NEVER switch ON the power to the laser output part (lens, etc.) of the pick-up if it is damaged.
5) Cleaning the lens surface If there is dust on the lens surface, the dust should be cleaned away by using an air bush (such as used for camera lens). The lens is held by a delicate spring. When cleaning the lens surface, therefore, a cotton swab should be used, taking care not to distort this.
6) Never attempt to disassemble the pick-up. Spring by excess pressure. If the lens is extremely dirty, apply isopropyl alcohol to the cotton swab. (Do not use any other liquid cleaners, because they will damage the lens.) Take care not to use too much of this alcohol on the swab, and do not allow the alcohol to get inside the pick-up.
SERVICING PRECAUTIONS
SECTION 1 GENERAL
1-3
NOTES REGARDING COMPACT DISC PLAYER REPAIRS
1.Preparations
1) Compact disc players incorporate a great many ICs as well as the pick-up (laser diode). These components are sensitive to, and easily affected by, static electricity . If such static electricity is high voltage, components can be damaged, and for that reason components should be handled with care.
2) The pick-up is composed of many optical components and other high-precision components. Care must be taken, therefore, to avoid repair or storage where the temperature of humidity is high, where strong magnetism is present, or where there is excessive dust.
2.Notes for repair
1) Before replacing a component part, first disconnect the power supply lead wire from the unit
2) All equipment, measuring instruments and tools must be grounded.
3) The workbench should be covered with a conductive sheet and grounded.
When removing the laser pick-up from its conductive bag, do not place the pick-up on the bag. (This is because there is the possibility of damage by static electricity.)
4) To prevent AC leakage, the metal part of the soldering iron should be grounded.
5) Workers should be grounded by an armband (1MΩ)
6) Care should be taken not to permit the laser pick-up to come in contact with clothing, in order to prevent
static electricity changes in the clothing to escape from the armband.
7) The laser beam from the pick-up should NEVER be directly facing the eyes or bare skin.
CLEARING MALFUNCTION
You can reset your unit to initial status if malfunction occur(button malfunction, display, etc.). Using a pointed good conductor(such as driver), simply short the RESET jump wire on the inside of the volume knob for more than 3 seconds. If you reset your unit, you must reenter all its settings(stations, clock, timer)
NOTE: 1. To operate the RESET jump wire, pull the volume rotary knob and release it.
2. If you wish to operate the RESET jump wire, it is necessary to unplug the power cord.
1-4
ESD PRECAUTIONS
Electrostatically Sensitive Devices (ESD)
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called electrostatically sensitive devices (ESD). Examples of typical ESD devices are integrated circuits and some field-effect transistors and semiconductor chip components. The following techniques should be used to help reduce the incidence of component damage caused by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a know earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ESD devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ESD devices.
5. Do not use freon-propelled chemicals These can generate electrical charges sufficient to damage ESD devices.
6. Do not remove a replacement ESD device from its protective package until immediately before you are ready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive materials).
7. Immediately before removing the protective material from the leads of a replacement ESD device, touch the protective material to the chassis or circuit assembly into which the device will by installed.
CAUTION : BE SURE NO POWER IS APPLIED TO THE CHASSIS OR CIRCUIT, AND OBSERVE ALL
OTHER SAFETY PRECAUTIONS.
8. Minimize bodily motions when handing unpackaged replacement ESD devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ESD device).
[CAUTION. GRAPHIC SYMBOLS]
THE LIGHTNING FLASH WITH ARROWHEAD SYMBOL. WITHIN AN EQUILATERAL TRIANGLE, IS INTENDED TO ALERT THE SERVICE PERSONNEL TO THE PRESENCE OF UNINSULATED "DANGEROUS VOLTAGE" THAT MAY BE OF SUFFICIENT MAGNITUDE TO CONSTITUTE A RISK OF ELECTRIC SHOCK.
THE EXCLAMATION POINT WITHIN AN EQUILATERAL TRIANGLE IS INTENED TO ALERT THE SERVICE PERSONNEL TO THE PRESENCE OF IMPORTANT SAFETY INFORMATION IN SERVICE LITERATURE.
1-5
LOCATION OF USERS CONTROLS
FRONT / BACK PANEL
1. DISPLAY WINDOW
2. • (POWER) button
OPEN/ CLOSE button
3. • XDSS/ MP3 OPT. button
• XTS - PRO button
4. • USB (OPTIONAL) / DEMO button
• USB connector (OPTIONAL)
• PHONES (HEADPHONE JACK) : ø3.5mm
5. • TUNER button
• AUX button
6. • PUSH EJECT position - TAPE 1
7. • PUSH EJECT position - TAPE 2
8. • TUNING (-/+) button
(REWIND / FAST FORWARD) button
(CD SKIP / SEARCH) buttons
• PRESET (-/+) button FORWARD PLAY ( ) button
•STOP button
9. • CD button
• TAPE button
10.•CLOCK button
• TIMER button
• RDS(OPTIONAL) / SET / CD button
• EQ. button
• CD SYNC. / DUBB / ST./MONO button
• REC/
• VOLUME CONTROL KNOB
11.DISC SELECT buttons (DISC1, DISC2, DISC3)
12.DISC TRAY
13.AM/ FM ANTENNATERMINAL
14.AUX IN (AUXILIARY INPUT) connector
15.POWER CORD
16.SPEAKER TERMINAL
1 2
3 4
5 6
12
11 10
9
13
8 7
14 15
16
1-6
REMOTE CONTROL
POWER button
PRESET/FOLDER( ) buttons
SLEEP button
CD FUNCTION buttons
PLAY/PAUSE ( ) button •
CD STOP( ) button •
CD SKIP/ SEARCH •
() buttons
TUN.(-/+) buttons •
REPEAT button •
D.SKIP button
EQ (EQUALIZER PATTERN) button •
XTS Pro button •
XDSS plus button •
NUMERIC buttons
MUTE button
• USB (OPTIONAL) button
• FUNCTION button VOLUME ( ) buttons
DIMMER button PROGRAM/ MEMO button TAPE FUNCTION buttons
• FORWARD PLAY ( ) button
• FAST REWIND PLAY ( ) button
• FAST FORWARD PLAY ( ) button
• TAPE-1/ 2 SELECT buttons
• RECORD/ RECORD PAUSE ( ) button
• TAPE STOP ( ) button
RANDOM button INFO (MP3/ WMA file information display) button
1-7
SPECIFICATIONS
• GENERAL
Power supply Refer to the back panel of the unit. Power consumption Refer to the back panel of the unit. Net Weight 5.57kg (MCD202 Model)
5.36kg (MCD102 Model)
External dimensions (WxHxD) 273 x 371 x 326mm
• TUNER
FM Tuning Range 87.5 ~ 108.0MHz or 65 ~ 74MHz, 87.5 ~ 108.0MHz Intermediate Frequency 10.7MHz Signal to Noise Ratio 60/55dB Frequency Response 50 ~ 10000Hz AM Tuning Range 522 ~ 1620kHz or 520 ~ 1720kHz Intermediate Frequency 450kHz Signal to Noise Ratio 30dB Frequency Response 140 ~ 1800Hz
• AMPLIFIER
Output Power 100W + 100W (MCD202 Model)
50W + 50W (MCD102 Model) T.H.D 0.5% Frequency Response 40 ~ 20000Hz Signal-to-noise ratio 75dB
• CD
Frequency response 40 ~ 20000Hz Signal-to-noise ratio 75dB Dynamic range 75dB
• CASSETTE TAPE PLAYER
Tape Speed 3000 ± 3% (MTT-111. NORMAL-SPEED) Wow Flutter 0.25% (MTT-111, JIS-WTD) F.F/REW Time 120sec (C-60) Frequency Response 250 ~ 8000Hz Signal to Noise Ratio 43dB Channel Separation 50dB (P/B) / 45dB (R/P) Erase Ratio 55dB (MTT-5511)
• SPEAKERS Speaker Name MCS202F MCS102F
Type Bass Reflex 2Way 2Speaker Bass Reflex 2Way 2Speaker Impedance 4 4Ω Frequency Response 60 ~ 20000Hz 60 ~ 20000Hz Sound Pressure Level 84dB/W (1m) 85dB/W (1m) Rated Input Power 100W 50W Max. Input Power 200W 100W Net Dimensions (WxHxD) 220 x 342 x 270mm 200 x 337 x 228mm Net Weight (1EA) 3.46kg 2.92kg
I
J
D
H
A
B
E
B
M
N
N
C
F
G
A
J
K
H
L
L
K
M
I
C
G
E
F
D
A26
A41
A44
A40
A47
A46
266
263
305
A43
451
450
267
289
456
450
264
458
450
450
450
290
290
454
450
450
A00
257
255
255
256
259
253
282
253
254
450
CABLE2
CABLE4
CABLE3
CABLE1
CABLE5
CN201
CN806
P9701
P9702
260
CD
MAIN
SMPS
FRONT
291
2-1 2-2
SECTION 2 EXPLODED VIEWS
CABINET EXPLODED VIEW
2-3 2-4
TAPE DECK MECHANISM EXPLODED VIEW
1. TAPE DECK MECHANISM (A/S & A/S : RIGHT A/S DECK)
BRASS MOTOR PULLEY MAYBE CHANGED FOR WOW FLUTTER WHEN NECESSARY
009
003
A00
001
002
007
008
022
006
016
015
017
023
018
019
025
020
A01
RING FW MAYBE ADDED FOR WOW FLUTTER WHEN NECESSARY
011
009
A02
013
2-5 2-6
2. TAPE DECK MECHANISM (A/S & A/S : LEFT A/S DECK)
019
A00
003
009
007
008
016
017
022
018
023
015
020
RING FW MAYBE ADDED FOR WOW FLUTTER WHEN NECESSARY
024
011
009
A03
013
2-7 2-8
416
151
159
165
164
417
166
417
167
416
177
175
172
170
419
417
418
418
190
189
188
A30
A32
A26
181
187
186
184
421
421
185
156
155
153
173
168
163
162
441
440
422
A35
417
CD MECHANISM EXPLODED VIEW
2-9 2-10
SPEAKER EXPLODED VIEW
MODEL : MCS102F
A80
A80A
A80B
855
853
850
854
852
851
856
WIRE80
2-13
PACKING ACCESSORY VIEW
3-1
AUDIO ELECTRICAL TROUBLESHOOTING GUIDE
SECTION 3 AUDIO PART ELECTRICAL
1. POWER (SMPS)
POWER (SMPS)
OK
YES
YES
YES
Replace IC 901,902
Check IC901, 902
Check the fuse
F901
NONO
NO
YES
Check short of
P9701, P9702 line
Replace the fuse
Check
the DC V of C905.
If DC V is over
400V
NO
Check BD901, LF901, 902
Check the
DC V of C981, C945.
If DC V is 6.1V
NO
Check short of P9702 line
YES
YES
Chcek the
DC V of C950, C951
If DC V is in
31.5V
NO
Check short of P9701 line
Chcek the
DC V of C909, C903,
C921 If DC V is in 14~19V
and it is steady.
YES
3-2
2. P-SENS
P-SENS
YES
YES
Check
the PIN6 of P9702
If DC V is over 5.6V
Check power circuit Trouble shooting
NO
OK
3. VKK CHECK
VKK check
YES
YES
Check
the PIN3 of P9702
If DC V is over -28V ±2
Check power circuit Trouble shooting
NO
OK
4. MICOM PART CHECK I
MICOM part check I
OK OK
YES
YES
Check P-SENS
(P7904)_PIN6.
NO
Refer to
SMPS troubleshooting.
YES
YES
YES
Check both
end voltage of IC101
(KIA7042).
Check
if input voltage of
IC101(KIA7042) is
over 5V.
YES
NO
Check the
periphery of IC101
(KIA7042).
NO
YES
Check if IC101(KIA7042) of output voltage is over 4.3V.
Check voltage of IC100
78KO/KF2_PIN1.
NO
Replace IC101
(KIA7042).
3-3
5. MICOM PART CHECK II
MICOM part check II
X101 : 32.768kHz
X100 : 9.8304MHz
Check the operation.
Check
Q101_ emitter/collector
5V.
Check Q102_base
0.6V HIGH.
Check if IC103_PIN8 and
IC100_PIN19, 20, 59 are 5V.
NO NO
YES
YES
Check if
voltage of P7904_PIN5
is 5.6V.
NO
Refer to
SMPS troubleshooting.
YES
YES
YES
OK
YES
Check
both end voltage of
D101
YES
YES
Check D101.
NO
Check if output of
D101(1SR35) is 5V.
YES
YES
YES
YES
Check IC101.
Q102_collector 0.6V LOW.
OK
Check if output of IC101
(KIA7042) is over 4.3V.
OK
NO
Replace IC101.
NO
Replace D101.
YES
Check Q102.
OK
NO
Replace Q102.
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