LG LHS-55-SBC, LHS-55-SBS, LHS-55-SBW, LHT-522-SB, LHT-552-SB Service manual

DVD/CD RECEIVER

SERVICE MANUAL

MODEL : LH-T552SB

LHS-55SBC, LHS-55SBS, LHS-55SBW

MODEL : LH-T552SB LHS-55SBC, LHS-55SBS, LHS-55SBW

SERVICE MANUAL

1-1

[CONTENTS]

SECTION 1. GENERAL

• SERVICING PRECAUTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2

• ESD PRECAUTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4

• SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-5

SECTION 2. AUDIO PART

• AUDIO TROUBLESHOOTING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

• WIRING DIAGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4

• BLOCK DIAGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6

• SCHEMATIC DIAGRAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-8

• PRINTED CIRCUIT DIARGAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-22

SECTION 3. DVD & AMP PART

• ELECTRICAL TROUBLESHOOTING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-1

• DVD PART SCHEMATIC DIAGRAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-22

SECTION 4. EXPLODED VIEWS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-1

SECTION 5. SPEAKER PART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-1

SECTION 6. REPLACEMENT PARTS LIST . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-1

1-2

SERVICING PRECAUTIONS

NOTES REGARDING HANDLING OF THE PICK-UP

1. Notes for transport and storage

1) The pick-up should always be left in its conductive bag until immediately prior to use.

2) The pick-up should never be subjected to external pressure or impact.

2. Repair notes

1) The pick-up incorporates a strong magnet, and so should never be brought close to magnetic materials.

2) The pick-up should always be handled correctly and carefully, taking care to avoid external pressure and impact. If it is subjected to strong pressure or impact, the result may be an operational malfunction and/or damage to the printed-circuit board.

3) Each and every pick-up is already individually adjusted to a high degree of precision, and for that reason the adjustment point and installation screws should absolutely never be touched.

4) Laser beams may damage the eyes! Absolutely never permit laser beams to enter the eyes! Also NEVER switch ON the power to the laser output part (lens, etc.) of the pick-up if it is damaged.

5) Cleaning the lens surface If there is dust on the lens surface, the dust should be cleaned away by using an air bush (such as used for camera lens). The lens is held by a delicate spring. When cleaning the lens surface, therefore, a cotton swab should be used, taking care not to distort this.

6) Never attempt to disassemble the pick-up. Spring by excess pressure. If the lens is extremely dirty, apply isopropyl alcohol to the cotton swab. (Do not use any other liquid cleaners, because they will damage the lens.) Take care not to use too much of this alcohol on the swab, and do not allow the alcohol to get inside the pick-up.

Storage in conductive bag

Drop impact

NEVER look directly at the laser beam, and don’t let contact fingers or other exposed skin.

Magnet

How to hold the pick-up

Conductive Sheet

Cotton swab

Pressure

SECTION 1. GENERAL

1-3

NOTES REGARDING COMPACT DISC PLAYER REPAIRS

1. Preparations

1) Compact disc players incorporate a great many ICs as well as the pick-up (laser diode). These components are sensitive to, and easily affected by, static electricity. If such static electricity is high voltage, components can be damaged, and for that reason components should be handled with care.

2) The pick-up is composed of many optical components and other high-precision components. Care must be taken, therefore, to avoid repair or storage where the temperature of humidity is high, where strong magnetism is present, or where there is excessive dust.

2. Notes for repair

1) Before replacing a component part, first disconnect the power supply lead wire from the unit

2) All equipment, measuring instruments and tools must be grounded.

3) The workbench should be covered with a conductive sheet and grounded. When removing the laser pick-up from its conductive bag, do not place the pick-up on the bag. (This is because there is the possibility of damage by static electricity.)

4) To prevent AC leakage, the metal part of the soldering iron should be grounded.

5) Workers should be grounded by an armband (1M Ω)

6) Care should be taken not to permit the laser pick-up to come in contact with clothing, in order to prevent static electricity changes in the clothing to escape from the armband.

7) The laser beam from the pick-up should NEVER be directly facing the eyes or bare skin.

Resistor (1 Mohm)

Conductive Sheet

Resistor (1 Mohm)

Armband

1-4

ESD PRECAUTIONS

Electrostatically Sensitive Devices (ESD)

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are integrated circuits and some field-effect transistors and semiconductor chip components. The following techniques should be used to help reduce the incidence of component damage caused by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off

any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive surface

such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ESD devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static" can

generate electrical charges sufficient to damage ESD devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESD

devices.

6. Do not remove a replacement ESD device from its protective package until immediately before you are

ready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive materials).

7. Immediately before removing the protective material from the leads of a replacement ESD device, touch the

protective material to the chassis or circuit assembly into which the device will by installed.

CAUTION : BE SURE NO POWER IS APPLIED TO THE CHASSIS OR CIRCUIT, AND OBSERVE ALL OTHER

SAFETY PRECAUTIONS.

8. Minimize bodily motions when handing unpackaged replacement ESD devices. (Otherwise harmless motion

such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ESD device).

CAUTION. GRAPHIC SYMBOLS

THE LIGHTNING FLASH WITH APROWHEAD SYMBOL. WITHIN AN EQUILATERAL TRIANGLE, IS INTENDED TO ALERT THE SERVICE PERSONNEL TO THE PRESENCE OF UNINSULATED “DANGEROUS VOLTAGE” THAT MAY BE OF SUFFICIENT MAGNITUDE TO CONSTITUTE ARISK OF ELECTRIC SHOCK.

THE EXCLAMATION POINTWITHIN AN EQUILATERAL TRIANGLE IS INTENDED TO ALERT THE SERVICE PERSONNEL TO THE PRESENCE OF IMPORTANT SAFETY INFORMATION IN SERVICE LITERATURE.

1-5

GENERAL

Power supply Refer to main label Power consumption Refer to main label Weight 3.9 kg External dimensions (W x H x D) 430 x 54 x 350 mm Operating conditions Temperature: 5°C to 35°C, Operation status: Horizontal Operating humidity 5% to 85%

CD/DVD

Laser Semiconductor laser, wavelength 650 nm Signal system PAL 625/50, NTSC 525/60 Frequency response (audio) 200 Hz to 20 kHz Signal-to-noise ratio (audio) More than 75 dB (1 kHz, NOP, 20 kHz LPF/A-Filter) Dynamic range (audio) More than 70 dB Harmonic distortion (audio) 0.5 % (1 kHz, at 12W position) (20 kHz LPF/A-Filter)

VIDEO

Video input 1.0 V (p-p), 75 Ω, negative sync., RCA jack x 1 Video output 1.0 V (p-p), 75 Ω, negative sync., RCA jack x 1 S-video output (Y) 1.0 V (p-p), 75 Ω, negative sync., Mini DIN 4-pin x 1

Component Video output (Y) 1.0 V (p-p), 75 Ω, negative sync., RCA jack x 1

(Pb)/(Pr) 0.7 V (p-p), 75 Ω, RCA jack x 1

TUNER FM

Tuning Range 87.5 - 108.0 MHz or 65.0 - 74.0 MHz, 87.5 - 108.0 MHz Intermediate Frequency 10.7 MHz Signal-to Noise Ratio 60 dB (Mono) Frequency Response 140 - 10,000 Hz

AM [MW]

Tuning Range 522 - 1,620 kHz or 520 - 1,720 kHz Intermediate Frequency 450 kHz

AMPLIFIER

Stereo mode 70W + 70W (8Ω at 1 kHz, THD 10 %) Surround mode Front: 70W + 70W (THD 10 %)

Center*: 70W Surround*: 70W + 70W (8Ω at 1 kHz, THD 10 %)

Subwoofer*: 150W (4Ω at 30 Hz, THD 10 %) Input AV IN Outputs S-VIDEO, MONITOR, PHONES: (32 Ω, 10.V)

SPEAKERS

Front Speaker Center Speaker Subwoofer Type 1 Way 1 Speaker 1 Way 1 Speaker 1 Way 1 Speaker Impedance 8 Ω 8 Ω 4 Ω Frequency Response

110 - 20,000 Hz 110 - 20,000 Hz 40 - 1,500 Hz Sound Pressure Level

82 dB/W (1m) 82 dB/W (1m) 82 dB/W (1m) Rated Input Power 70W 70W 150W Max. Input Power 140W 140W 300W Net Dimensions 140x222x153 mm 300x116x91 mm 195x402x360 mm Net Weight 0.95 kg 1.0 kg 5.6 kg

(* Depending on the sound mode

settings and the source, there may be no sound output.)

SPECIFICATIONS

2-1

SECTION 2. AUDIO PART

AUDIO TROUBLESHOOTING GUIDE

1. POWER SUPPLY CIRCUIT

2-2

2. FRONT CIRCUIT (1/2)

PIN3 PIN4 PIN9

CN902 CN902

: -32.4 VKK : -27.5 FL: -23.7 FL+

: +5.0

2-3

3. FRONT CIRCUIT (2/2)

2-4 2-5

WIRING DIAGRAM

WIRELESS

PN801

CN350

OPTICALINSCART

JACK

MAIN PCB

PDM01 PDM03

23PIN 11PIN 24PIN 23PIN

OPTION

AV1,2

COMPONENT

MONITOR OUT

S-VIDEO OUT

PN103

TUNER

PN104

SPEAKER TERMINAL

30PIN

PN302

AMP PCB

PN105

PN902 PN303

14PIN 14PIN

5PIN

6PIN

MIC

JACK

MIC

JACK

CN001

NOTES) Warning

NOTES) Parts that are shaded are critical NOTES) With respect to risk of fire or NOTES) electricial shock.

MIC&USB PCB

USB JACK

PN005

PN002

PN001

SMPS PCB

VFD

FRONT

PCB

H/P JACK

2-6 2-7

BLOCK DIAGRAM

Optical

Tuner

AV1

AV2

(option)

Monitor Out

S-AV

Component

L R V

G B R

Tuner-L/R

AV1-L/R AV2-L/R

SCART-L/R

(A)(T_CE,T_DO,T_DI,T_CLK,T_RDS_DATA,T_RDS,CLK)

Audio s/w

Bu 4052

CTL-A/B AV1-CVBS AV2-CVBS Monitor out SCART-CVBS out

C Y

(B)

Video S/W NJM 2279 out (CVBS-S/W)

ADC

CS 5340

Fs = 48kHz

DVD-CVBS

AD-DATA AD-BCK AD-LRCK

/RST-AD

(A)

SW1, SW2,MUTE1

(A)

SPDIF 12.288MHz

DIT

CS 8406

(slave)

ADAT 0,1,2,3 (FL/R,RL/R,

C/SW)

8406_SDI,8406_SDO 8406_CLK,8406_CE 8406_RST,8406_INT

(A)

SPDIF

LRCK BCK

AUDIO MICOM

LC876B48

(PIN MAP)

PS 9818

(PWM)

(A) HP_DET

STA510A

AMP IC

H/P

PDN TH_W

Scart

(option)

USB Port

MIC

Wireless

L R L R G B R 8 16 V

MIC1 MIC2

SCART-ID SCART-FB

ALC

BA 3308

MIC1_DET(A) MIC2_DET(A)

Slide

S/W

VIDEO-SW

Mixing

(R) ,Pr(R)

(A)

Y Y(G)

USB Controller

CS 5340

ADC

/RST-AD

Video

S/W

NJM2279

(Y-S/W)

ALRCK,ABCK MCLK,AMDAT

(A)

DVD BLOCK

CVBS

(ES 6698)

MUTE

TR Mute

Mic Volume : OSD CTL

OPTION

FRONT

(A)

FAN1

FAN2

FAN1_CTL FAN2_CTL

OPTION

2-8 2-9

SCHEMATIC DIAGRAMS

1. POWER SCHEMATIC DIAGRAM_1

NOTES) Symbol denotes AC ground.

NOTES) Symbol denotes DC chassis ground.

NOTE) Warning

NOTE) Parts that are shaded are critical NOTE) With respect to risk of fire or NOTE) electricial shock.