LG LG-C320 User Manual

Service Manual Model : LG-C320

Internal Use Only

Service Manual

LG-C320

Date: October, 2010 / Issue 1.0

Table Of Contents

1. INTRODUCTION ..................................................................5

1.1 Purpose ............................................................................................... 5

1.2 Regulatory Information ............................................................... 5

1.3 Abbreviations ................................................................................... 7

2. PERFORMANCE ...................................................................9

2.1 Product Name .................................................................................. 9

2.2 Supporting Standard .................................................................... 9

2.3 Main Parts : GSM Solution ........................................................... 9

2.4 HW Features ....................................................................................10

2.5 SW Features ....................................................................................12

2.6 HW SPEC. .........................................................................................14

2.7 C320 Figures ...................................................................................15

3. TECHNICAL BRIEF .............................................................16

3.1 General Description .....................................................................16

3.2 Power management ....................................................................28

3.3 SUB SYSTEM ....................................................................................32

3.4 General Description (RF Part) ..................................................40

4.12 Speaker/Speaker Phone path ...............................................73

4.13 Main microphone ......................................................................78

4.14 Headset microphone ................................................................80

4.15 RF Component ............................................................................82

4.16 RF Path ............................................................................................83

4.17 Trouble Shooting of GSM Part ..............................................84

4.18 Checking Bluetooth Block ......................................................91

4.19 Checking FM Radio Block .......................................................96

5. DOWNLOAD ......................................................................99

6. BLOCK DIAGRAM ........................................................... 112

7. CIRCUIT DIAGRAM ........................................................ 123

8. BGA Pin Map .................................................................. 137

9. PCB LAYOUT ................................................................... 143

10. RF CALIBRATION ......................................................... 149

10.1 Usage of Tachyon for RF Calibration and Test ............. 149

3.5 GSM MODE ......................................................................................41

3.6 OFF-CHIP RF COMPONENTS ....................................................44

3.7 OFF-CHIP COMPONENTS ..........................................................46

4. TROUBLE SHOOTING .......................................................50

4.1 Power ON Troubleshooting ......................................................50

4.2 Charger Troubleshooting ..........................................................52

4.3 USB Troubleshooting ..................................................................54

4.4 USIM Detect Troubleshooting .................................................56

4.5 Camera Troubleshooting ...........................................................58

4.6 Main side view LED Troubleshooting ...................................60

4.7 Slide Key side view LED Troubleshooting ...........................61

4.8 LCD Troubleshooting ..................................................................63

4.9 Vibrator Troubleshooting ..........................................................65

4.10 Receiver Path ...............................................................................67

4.11 Headset path ...............................................................................70

11. TEST ALONE ................................................................. 152

11.1 Phone Test Mode.....................................................................152

12. EXPLODED VIEW & REPLACEMENT PART LIST ......... 157

11.1 EXPLODED VIEW ......................................................................157

11.2 Replacement Parts..................................................................159

11.3 Accessory ...................................................................................175

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LGE Internal Use Only

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Only for training and service purposes

1. INTRODUCTION

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the features

of this model.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,

persons other than your company’s employees, agents, subcontractors, or person working on your

company’s behalf) can result in substantial additional charges for your telecommunications services. System

users are responsible for the security of own system.

There are may be risks of toll fraud associated with your telecommunications system. System users are

responsible for programming and configuring the equipment to prevent unauthorized use. The

manufacturer does not warrant that this product is immune from the above case but will prevent

unauthorized use of common carrier telecommunication service of facilities accessed through or connected

to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing

harm or interruption in service to the telephone network, it should disconnect telephone service until repair

can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these

changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the

telephone company is required to give advanced written notice to the user, allowing the user to take

appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent.

The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore,

note that unauthorized alternations or repair may affect the regulatory status of the system and may void

any remaining warranty.

1. INTRODUCTION

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LGE Internal Use Only

1. INTRODUCTION

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local

regulatory agencies. In accordance with these agencies, you may be required to provide information such as

the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from

unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following

information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat which is also

grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as described.

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Only for training and service purposes

1.3 Abbreviations

For the purposes of this manual, following abbreviations apply:

Offset Phase Locked LoopOPLL

Light Emitting DiodeLED

Low Drop OutputLDO

Liquid Crystal DisplayLCD

Intermediate FrequencyIF

International Portable User IdentityIPUI

Global System for Mobile CommunicationsGSM

General Purpose Interface BusGPIB

Gaussian Minimum Shift KeyingGMSK

Flexible Printed Circuit BoardFPCB

Electrostatic DischargeESD

Electrical Erasable Programmable Read-Only MemoryEEPROM

Digital Signal ProcessingDSP

dB relative to 1 milli wattdBm

Digital Communication SystemDCS

Digital to Analog ConverterDAC

Constant Current – Constant VoltageCC-CV

Bit Error RatioBER

BasebandBB

Automatic Power ControlAPC

1. INTRODUCTION

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LGE Internal Use Only

1. INTRODUCTION

Wireless Application Protocol

WAP

Voltage Control Temperature Compensated Crystal OscillatorVCTCXO

Voltage Controlled OscillatorVCO

Universal Asynchronous Receiver/TransmitterUART

Time Division Multiple AccessTDMA

Time Division DuplexTDD

Travel AdapterTA

Side Tone Masking RatingSTMR

Pseudo SRAMPSRAM

Static Random Access MemorySRAM

Sending Loudness RatingSLR

Subscriber Identity ModuleSIM

Surface Acoustic WaveSAW

Real Time ClockRTC

Root Mean SquareRMS

Receiving Loudness RatingRLR

Radio FrequencyRF

Public Switched Telephone NetworkPSTN

Phase Locked LoopPLL

Programmable Gain AmplifierPGA

Printed Circuit BoardPCB

Power Amplifier ModulePAM

1. INTRODUCTION

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Only for training and service purposes

2. PERFORMANCE

2.1 Product Name

C320 : EGSM/GSM850/DCS/PCS

(GPRS Class 12 / EDGE Class 12)

2.2 Supporting Standard

Item Feature Comment

Supporting Standard EGSM/GSM850/DCS1800/PCS1900

with seamless handover

Phase 2+(include AMR) SIM Toolkit : Class 1, 2, 3, C-E

Frequency Range EGSM TX : 880 – 915 MHz

EGSM RX : 925 – 960 MHz GSM850 TX : 824 – 849 MHz GSM850 RX : 869 – 894 MHz DCS1800 TX : 1710 – 1785 MHz DCS1800 RX : 1805 – 1880 MHz PCS1900 TX : 1850 – 1910 MHz PCS1900 RX : 1930 – 1990 MHz

Application Standard WAP 2.0, JAVA 2.0

2.3 Main Parts : GSM Solution

Item Part Name Comment

Digital Baseband ESC6270 : Qualcomm Analog Baseband ESC6270 : Qualcomm RF Chip ESC6270 : Qualcomm

2. PERFORMANCE

Phase 2+(include AMR) SIM Toolkit : Class 1, 2, 3, C-E

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2. PERFORMANCE

2.4 HW Features

Item Feature Comment

Form Factor Slide type

1) Capacity Standard : Li-Ion, 900 mAh

Battery

2) Packing Type : Soft Pack

Size Standard : 91 x 63 x 15.9 mm

Weight 115.6g With Battery Volume TBD PCB Stag type, 10 Layers , 0.8t Stand by time Up to 300 hrs @ Paging Period 5 Charging time Up to 3 hrs @ Talk time 2G Up to 3.4hr @ Tx=Max(2G) RX sensitivity EGSM : -105 dBm

GSM850 : -105 dBm DCS 1800 : -105 dBm

PCS 1900 : -105 dBm GSM/ GPRS

EGSM : 33dBm

GSM850 : 33 dBm

DCS 1800 : 30 dBm

PCS 1900 : 30 dBm

Class4 (EGSM) Class4 (GSM850) Class1 (PCS) Class1 (DCS)

TX output power

EDGE GSM 900 : 27 dBm

GSM 850 : 27 dBm

DCS 1800 : 26 dBm

PCS 1900 : 26 dBm

E2 (GSM900) E2 (GSM850) E2 (PCS)

E2 (DCS) GPRS compatibility GPRS Class 12 EDGE compatibility EDGE Class 12 SIM card type Plug-In SIM

3V /1.8V

Display 2.4” TFT QVGA landscape

Built-in Camera 2M FF SOC Camera Status Indicator Yes

Keypad

ANT Main : Internal Fixed Type System connector 5 Pin

Ear Phone Jack 3.5Phi, 4 Pole, Stereo PC synchronization Yes Memory NAND Flash : 2Gbit

SDRAM : 1Gbit Speech coding FR, EFR, HR,AMR Data & Fax Built in Data & Fax support Vibrator Built in Vibrator BlueTooth V2.1 + EDR MIDI(for Buzzer

Function)

SW Decoded 64Poly

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Only for training and service purposes

2. PERFORMANCE

Music Player MP3/AAC/AAC+/WMA

Video Player PEG4, H.263,H.264 30fps@QVGA

WMV 15fps@QCIF

Camcorder MPEG4, 15fps@QVGA

Voice Recording Yes Speaker Phone mode Support

Yes

Travel Adapter Yes CDROM No Stereo Headset Yes Data Cable Yes T-Flash (External Memory)

Yes

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2. PERFORMANCE

2.5 SW Features

Item Feature Comment

RSSI 0 ~ 7 Levels Battery Charging 0 ~ 3 Levels Key Volume 0 ~ 7 Level

Audio Volume 1 ~ 20 Level Time / Date Display Yes Multi-Language Yes English / Chinese Trad. / Chinese Simp.

/ Thai / Korean / Malay / Indonesian / Vietnamese

Quick Access Mode Dialing / Contact / Menu /

Message / Camera PC Sync Yes PC suite 4 Speed Dial Yes Voice mail center -> 1 key Profile Yes not same with feature phone setting CLIP / CLIR Yes

Phone Book Name + 5 Numbers + 1 Memo + 2

e-mail + 3 Group Select + Picture +

Ringtone + Anniversary day

1000 + SIM

Last Dial Number Yes Total Call DB Max 100

LDN (SIM) N/A Last Received Number

Yes Total Call DB Max 100

LDN (SIM) N/A Last Missed Number Yes Total Call DB Max 100

LDN (SIM) N/A Search by Number / Name

Name and Number

Group Yes 30 Fixed Dial Number Yes Service Dial Number No Own Number Yes Read only

(add/edit/delete are not supported) Voice Memo Yes Support voice recorder Call Reminder Yes Network Selection Automatic

Mute Yes Call Divert Yes Call Barring Yes Call Charge (AoC) Yes Call Duration Yes SMS (EMS) Yes (1000+SIM) EMS : Release4

(Except Text align) SMS Over GPRS Yes EMS Melody / Picture Send / Receive / Save

Yes

(Receive only) MMS MPEG4 Send / Receive / Save

Yes

Long Message MAX 1000 Characters SMS 7pages

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Only for training and service purposes

Cell Broadcast Yes Download Over the WAP Game Yes

Calendar Yes

Memo Yes 100

World Clock Yes

Unit Convert Yes Stop Watch Yes Wall Paper Yes WAP Browser Over WAP 2.0 Obigo Download Melody / Wallpaper

Yes Over WAP

SIM Lock Yes Operator Dependent SIM Toolkit Yes R99 MMS Yes Obigo +LG MMS Client EONS No CPHS Yes V4.2 ENS No Camera Yes 2M FF JAVA Yes CLDC V1.1 / MIDP V2.1

Download Over WAP Voice Dial No IrDa No Bluetooth Yes BT 2.1+EDR

HFP/HSP/A2DP&AVRCP

/OPP/BPP/PBAP/SPP/ FM radio Yes

GPRS Yes Class 12 EDGE Yes Class 12 Hold / Retrieve Yes Conference Call Yes Max. 6 DTMF Yes Memo pad Yes TTY No AMR Yes SyncML No IM Yes JAVA midlet (neustar)

Email Yes

2. PERFORMANCE

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2. PERFORMANCE

2.6 HW SPEC.

1) GSM transceiver specification

Item Specification

Phase Error

Rms : 5° Peak : 20 °

Frequency Error

GSM : 0.1 ppm DCS/PCS : 0.1 ppm

EMC(Radiated Spurious Emission Disturbance)

GSM/DCS : < -28dBm

Transmitter Output power and Burst Timing

GSM : 5dBm – 33dBm ± 3dB

DCS/PCS : 0dBm – 30dBm ± 3dB Burst Timing <3.69us Spectrum due to modulation out to less

than 1800kHz offset

200kHz : -36dBm

600kHz : -51dBm/-56dBm

Spectrum due to modulation out to larger than 1800kHz offset to the edge of the transmit band

GSM :

1800-3000kHz :< -63dBc(-46dBm)

3000kHz-6000kHz : <-65dBc(-46dBm)

6000kHz < : < -71dBc(-46dBm)

DCS :

1800-3000kHz :< -65dBc(-51dBm)

6000kHz < : < -73dBc(-51dBm)

Spectrum due to switching transient

400kHz : -19dBm/-22dBm(5/0), -23dBm

600kHz : -21dBm/-24dBm(5/0), -26dBm Reference Sensitivity – TCH/FS Class II(RBER) : -105dBm(2.439%) Usable receiver input level range 0.012(-15 - -40dBm) Intermodulation rejection – Speech

channels

± 800kHz, ± 1600kHz

: -98dBm/-96dBm (2.439%)

AM Suppression

T GSM : -31dBm

- DCS : -29dBm

-98dBm/-96dBm (2.439%)

Timing Advance ± 0.5T

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Only for training and service purposes

2.7 C320 Figures

2. PERFORMANCE

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LGE Internal Use Only

3. TECHNICAL BRIEF

2. Base Band Technical Description

3.1 General Description

QSC6270 (3G disable)has all eight major functional blocks as like Figure 3.1

Figure 3.1 QSC6270(3G disable) Base band block

3. TECHNICAL BRIEF

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Only for training and service purposes

3. TECHNICAL BRIEF

3.1.1 Processor

The QSC6270(3Gdisable) device integrates multiple processors on-chip: one ARM microprocessor and two

DSP processors. Each processor is part of a functional subsystem:

 The micro subsystem includes the ARM926EJ-S microprocessor.  The modem subsystem includes the QDSP4u8 digital signal processor (mDSP).  The application subsystem includes the QDSP4u8 application digital signal processor(aDSP).

Figure 3.1.1 Processors and bus architecture

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3. TECHNICAL BRIEF

3.1.2 Memory support (and LCD interface)

The QSC62x0 device has two external bus interface (EBI) ports: EBI1 and EBI2.

EBI1 supports high-speed synchronous dynamic devices. Its memory controller supports the new mobile

DDR SDRAM memories with its higher bandwidth and ability to run at high clock frequencies. This interface supports the high-bandwidth, high-density, and low-latency requirements of the QSC’s advanced on-chip capabilities such as the ARM9 processor, highperformance graphics, and video applications.

EBI2 is the slower speed interface intended to support memory devices such as NAND flash and

asynchronous SRAM, peripheral devices such as LCDs, and the UBM receiver for multicast or broadcast reception (QSC6270 only). In addition, EBI2 is required to support a synchronous-burst AAD NOR flash to enable a NOR/DDR SDRAM memory configuration because the simultaneous mode (NOR, SDRAM) is not supported on the EBI1 bus.

The ARM926EJ-S microprocessor is a cached processor and all its accesses to external memory use burst

techniques of four or eight 32-bit words when the memory region is declared to be cacheable/bufferable. To take advantage of this QSC higher performance feature, data from memories must satisfy the requirements for these burst accesses.

Figure 3.1.2.1 The memory control blocks of C320

QSC6270

NAND Flash

(1Gbit)

SDRAM

512Mbit)

NAND_DATA[ 0: 15]

NAND__CS__N

NAND_ LB_N

NAND_UB_N

NAND_OE_N

NAND_WE_N

NAND_BSY_N

NAND_WP_N

_CE

ALE

CLE

_RE

_WE

RY_BY

_WP

IO[1: 16]

DDR_ A[0:13]

DDR_M_CLK_N

DDR_CKE[0]_

DDR_CS[0]_N_

DDR_RAS_N

DDR_CAS_N

DDR_WE_N_ _

DDR_DQM[0:1]_

DDR_ D[0:15]

CLK

CKE

_CS

_RAS

_CAS

_WE D

DQM

ADDR

EBI1

EBI2

(3G disable)

USIM (SIM PLUS)

SIM_CLK

_ _

SIM_DATA

MUSIM_DM MUSIM_DP

SIM_RST_N

External

Memory

( MICRO SD)

MSD_D[0:3]

MSD_CMD

MSD_CLK

3.1.2 Memory support (and LCD interface)

The QSC62x0 device has two external bus interface (EBI) ports: EBI1 and EBI2.

EBI1 supports high-speed synchronous dynamic devices. Its memory controller supports the new mobile DDR SDRAM memories with its higher bandwidth and ability to run at high clock frequencies. This interface supports the high-bandwidth, high-density, and low-latency requirements of the QSC’s advanced on-chip capabilities such as the ARM9 processor, highperformance graphics, and video applications.

EBI2 is the slower speed interface intended to support memory devices such as NAND ﬂash and asynchronous SRAM, peripheral devices such as LCDs, and the UBM receiver for multicast or broadcast reception (QSC6270 only). In addition, EBI2 is required to support a synchronous-burst AAD NOR ﬂash to enable a NOR/DDR SDRAM memory conﬁguration because the simultaneous mode (NOR, SDRAM) is not supported on the EBI1 bus.

The ARM926EJ-S microprocessor is a cached processor and all its accesses to external memory use burst techniques of four or eight 32-bit words when the memory region is declared to be cacheable/buﬀerable. To take advantage of this QSC higher performance feature, data from memories must satisfy the requirements for these burst accesses.

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Only for training and service purposes

QSC6270

(3G disable)

QVGA Main

LCD

(2.4", 320x240)

EBI2_DATA[15:0]

LCD_ADS

LCD_CS_N

EBI2_WE_N

LCD_RST

LDO_LCD_2.8V

WLED_PWR

LCD_IF(2:1)

LDO_LCD_1.8V

Figure 3.1.2.2 The LCD interfaces of C320

3. TECHNICAL BRIEF

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3. TECHNICAL BRIEF

3.1.3 Connectivity

QSC6270 has connectivity features as below

– USB-OTG; USB LS, FS, and HS (2.0 compliant) – I2C compatible for peripheral controls (1.8 V) – UART: up to 4 Mbps – Bluetooth 2.0 support via external SoC – WLAN via external device (SDIO) – NFC via external module (I2C) – FM radio via external module (I2C) – USIM, SIM, and USB-UICC support; 1.8 and 3 V – Keypad interface – SPI (master only) for peripheral support – Two secure digital controllers — WLAN and secure digital (SD) cards

Figure 3.1.3 The connectivity of BL20

QSC6270

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Only for training and service purposes

Figure 3.1.4 GPIOs of C320

3.1.4 GPIOs

QSC6270 (3G disable has 78 configurable I/O pins

UART_BT_SEL

MUIC_INT_N

CHG_EN_N

BT_WAKEUP_HOST

CHG_STS_N

HALL_SENS_DET

MUIC_AUD_FM_I2C_SCL

MUIC_AUD_FM_I2C_SDA

BL_LCD_CAM_LDO_I2C_SCL

HS_JACK_DET

WLAN_BT_REG_ON

WLAN_CLK

LCD_IF_MODE[0]

BL_LCD_CAM_LDO_I2C_SDA

WLAN_RST_N

BL_LCD_CAM_LDO_EN

BT_RST_N

WLAN_CMD

LCD_RST_N

WLAN_SDIO[3]

WLAN_SDIO[0]

WLAN_SDIO[1]

WLAN_SDIO[2]

BT_PWR_ON

MUSIM_DM

MUSIM_DP

Low : UART Comm

High : BT UART

3. TECHNICAL BRIEF

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3. TECHNICAL BRIEF

3.1.5 Air interfaces

The supported air-interface standards and features include: (See the RF technical description)

 GSM/GPRS/EDGE Specification Release 4 (3GPP R4)  Enhanced GPS position location using gpsOne (with RGR6240 IC)  Integrated gpsOne functionality, featuring enhancements by SnapTrack®, Inc., to enable a wide variety of

location-based services and applications, including points of interest, personal navigation, and friend finder

 Simultaneous-GPS (processes GPS using dedicated circuitry while voice and/or data signals continue to be

processed separately)

 1024x searcher, direct facility termination (DFT) accelerator, off-chip RAM for measured data storage

3.1.6 Internal base band functions

Several baseband circuits within the QSC6270(3G disable)device provide functions that are necessary only to make the device operate properly — these functions are not generally used directly by other handset circuits and functions.

 PLLs and clock generation  Modes and resets  Security  Qfuse  JTAG/ETM

The clock block includes two PLLs, all phase-locked to the TCXO signal. These PLLs generate several different stable, low-jitter clock signals that are distributed throughout the QSC device and to external c omponents as needed. All the required WCDMA, GSM, GPS(only QSC6270), ARM, QDSP, and most peripheral clocks are derived in some way from the TCXO (or XO) source for their operating modes, plus the 32.768 kHz oscillator for their sleep modes

Figure 3.1.6 Clock block basic architecture of QSC6270(3G disable)

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Only for training and service purposes

3. TECHNICAL BRIEF

3.1.7 Multimedia

Multimedia topics are as below in QSC6270, including:

 Camera interface and video front-end  Mobile display processor  Additional multimedia support: video, audio, graphics, and messaging

3.1.7.1 Camera interface and video front-end

The camera interface (CAMIF) connects the QSC62x0 device directly to a camera sensor. Typical applications include Qcamera, Qcamcorder, and QvideophoneThe CAMIF delivers the raw 10-bit Bayer pattern data (preferred) to the video front-end (VFE) that performs the required image processing (RGB-triplet generation, color-space conversion, auto-white balance, auto exposure, gamma correction, etc.) and prepares the image for capture or transmission. The QSC device also supports a YUV 4:2:2 input from the sensor (8-bit, 2:1 MUX YUV or CCIR656 YUV).

The video capabilities of the two QSC devices varies slightly, with the QSC6270 providing higher performance than the QSC6270 device — greater resolution, higher capture and streaming rates, etc.

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3. TECHNICAL BRIEF

3.1.7.2 Mobile display processor

The MDP is a hardware accelerator primarily responsible for transferring an updated image from the QSC memory subsystem to the LCD module. The transferring of an updated image is an operation that is shared between software, video processing, and graphics processing, so a common block helps to reduce redundant circuitry. The MDP is designed with the assumption that the LCD panel has an embedded LCD controller and a frame buffer. The image transfer is then the copying of the image from the QSC memory system to the frame buffer within the LCD module.

While the MDP is transferring an image to the LCD module, it can perform a final set of operations to the image. The set of operations that the MDP can perform has been chosen to maximize the efficiency of the QSC memory subsystems, typically removing two or more copy operations of the image to and from memory.

The MDP reduces redundant circuitry and offloads the ARM and aDSP from memory-transfer operations and a certain set of graphics and video operations

Figure 3.1.7.2.1 MDP-to-LCD interface functional block diagram

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Only for training and service purposes

3. TECHNICAL BRIEF

Figure 3.1.7.2.2 The LCD interface of C320

C102

0.1u0.1u

C101

CN102

101R

201R 1

VLDO_LCD_1V8 VLDO_LCD_2V8

LCD_MAKER_ID

LCD_RD

WLED3 WLED2 WLED1

LCD_VSYNC_OUT

LCD_RS

LCD_DATA[7]

LCD_DATA[6]

LCD_DATA[5]

LCD_DATA[4]

LCD_DATA[3]

LCD_DATA[2]

LCD_DATA[1]

LCD_DATA[0]

LCD_WR_N

LCD_CS_N

LCD_RST_N

LCD_DATA[15]

LCD_DATA[14]

LCD_DATA[13]

LCD_DATA[12]

LCD_DATA[11]

LCD_DATA[10]

LCD_DATA[9]

LCD_DATA[8]

LCD_IF_MODE[0]

WLED4

WLED5

LCD_IF_MODE[1]

WLED_VOUT

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3. TECHNICAL BRIEF

3.1.8 UART

 One universal asynchronous receiver transmitter (UART) port that supports low-speed, full-speed,

and high-speed modes

 Serial data port communications that conform to the RS-232 interface protocol  Used for data transport during Bluetooth operation (BTS402x™ SoC required)  Other possible uses:

– Test and debug – External keypad – Ringer – Load/upgrade system software

 Separate FIFOs for Rx and Tx  Supporting circuits include:

– Interrupt control – Clock source – Bit-rate generator (BRG) – Microprocessor interface  Flow control is not available on UART2 (behind USIM)

3.1.9 USB

 Each USB link has a host and a peripheral; the host is responsible for initiating and controlling bus traffic  The USB specification requires PCs to act as hosts, and other devices such as printers, keyboards, mice, etc.,

to act as peripherals

 USB 2.0 implementation defines three modes

- Low-speed (LS): 1.5 Mbps

- Full-speed (FS): 12 Mbps

- High-speed (HS): 480 Mbps  The QSC62x0 is compliant with the USB 2.0 specification

- All three modes are supported when acting as a host

- FS and HS are supported when acting as a peripheral  The QSC62x0 has two USB controllers

- Primary USB controller

- Secondary USB controller  The primary USB controller is supplemented by an integrated physical layer (PHY)

3.1.10 HKADC

The HKADC includes an analog multiplexer that selects an input for the sample and hold circuit. One of three inputs can be selected: HKAIN1, pin R22 – an external connection that is available as a general-purpose input, though it is often used to monitor the power amplifier(s) temperature. An on-chip connection to the power management circuit’s analog multiplexer output. This allows monitoring of:

-. Key power supply nodes such as VBAT, VCHG, etc.

-. Multipurpose pins (when configured as analog inputs)

-. A few on-chip parameters such as the die temperature or VREF

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Only for training and service purposes

3. TECHNICAL BRIEF

QSC6270HKADC Block diagram

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LGE Internal Use Only

3. TECHNICAL BRIEF

3.2 Power management

3.2.1 Input power management

 Valid external supply attachment and removal detection  Unregulated (closed-loop) external charger supply as input power source  Integrated PFET charging pass transistor; eliminated sense resistor  Support for lithium-ion and lithium-ion polymer main batteries; nickel-based batteries are not supported  Trickle, constant current, constant voltage, and pulse charging of the main battery  Autonomous charging option – driven by an on-chip state machine without software intervention  Software-controlled charging option – backwards-compatible with previous QSC and PM products  Coin-cell battery (including charging)  Battery-voltage detectors with programmable thresholds  VDD collapse protection  Charger-current regulation and real-time monitoring for overcurrent protection  Charger-transistor protection by thermal control  Control drivers for the internal charging PFET and external battery PFET  Voltage, current, and thermal control loops  Automated recovery from sudden momentary power loss (requires external32.768 kHz crystal)

Figure 3.2.1 Input circuits schematic diagram

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Only for training and service purposes

3. TECHNICAL BRIEF

3.2.2 Output voltage regulation

The QSC62x0 device includes all the regulated voltages needed for most low-cost wireless handset applications (and many other applications). Independent regulated power sources are required for various electronic functions to avoid signal corruption between diverse circuits, support power-management sequencing, and meet different voltage-level requirements. Sixteen voltage regulators are provided — all programmable, all derived from a common bandgap reference circuit.

Three major types of voltage regulator circuits are on-chip:

 Three positive voltage switched-mode power supply (SMPS) circuits

- One boost converter (rated for 600 mA)

- Three buck converters (rated for 500 mA each)

 Thirteen positive voltage linear regulators

- Four rated for 300 mA

- Six rated for 150 mA

- Three rated for 50 mA

 One negative voltage charge pump rated for 200 mA, referred to as a negative charge pump(NCP)

Each regulator has two logic-OR input bits; a logic high at either input enables that regulator:

 A master bit that enables all regulators according to their default condition  A dedicated bit that enables only that regulator

The master enable reduces the number of write cycles needed when switching between the phone’s sleep and active modes.

Additional comments that apply to regulator functions:

 If a regulator’s default condition is on, that regulator will power on automatically at QSC startup.  The MSMP regulator must be on to allow internal communications between major functional blocks.  Each regulator and SMPS can provide more than its rated output current, though some

performance characteristics might be degraded.

 All regulated output voltages are programmable.  All regulators can be set to a low-power mode except the VREG_USB_3P3 and VREG_NCP circuits

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LGE Internal Use Only

3. TECHNICAL BRIEF

Table 3.2.2 Voltage regulator summary

1. All regulator names are based on their intended use, though some may be used to power alternate functions. For example, the USIM regulator is intended to power an external SIM card but may be used to power other circuits (or not used at all).

2. Each current listed in this table is its regulator's rated value – the current at which the regulator meets all its performance specifications. Higher currents are allowed, but higher input voltages may be required and some performance characteristics may become degraded. See the appropriate regulator sections for details.

3. VREG_MSMP powers key internal circuits and should be kept on at its default voltage setting.

4. All regulators have default output voltage settings, even if they default to an off condition.

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Only for training and service purposes

3. TECHNICAL BRIEF

3.2.3 Charging control

C320 use single Charger.

- Single charger has five mode like “ OFF / TRICKLE / ISET / USB500 / FACTORY mode”.

- Single Charger is working as ISET mode in case of CC(Constant Current), CV(Constant Voltage) mode, as USB 500mode in case of USB Charging.

- FACTORY mode is working only for Factory use.

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LGE Internal Use Only

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