LG L852i Service Manual

Date: May, 2008 / Issue 1.0

Service Manual

Model : L852i

Service Manual

L852i

Internal Use Only

- 3 -

1. INTRODUCTION .............................. 5

1.1 Purpose................................................... 5

1.2 Regulatory Information............................ 5

2. PERFORMANCE...............................7

2.1 System Overview .....................................7

2.2 Usable environment .................................8

2.3 Radio Performance ..................................9

2.4 Current Consumption.............................12

2.5 Antenna BAR .........................................12

2.6. Battery Bar ............................................12

2.7 Sound Pressure Level............................13

2.8 Charging ................................................14

3. TECHNICAL BRIEF ........................15

3.1 Digital Baseband(DBB/MSM6280).........15

3.2. Subsystem(MSM6280) .........................18

3.3 Power Block ...........................................25

3.4 External memory interface .....................30

3.5 H/W Sub System....................................31

4. TROUBLE SHOOTING ...................48

4.1 Power ON Troubleshooting....................48

4.2 Charger Troubleshooting .......................52

4.3 USB Troubleshooting.............................55

4.4 SIM Detect Troubleshooting ..................57

4.5 LCD Troubleshooting .............................63

4.6 Receiver Path ........................................64

4.7 Headset path..........................................66

4.8 Speaker phone path...............................68

4.9 Main microphone ...................................70

4.10 Headset microphone............................72

4.11 Touch Screen Trouble .........................74

4.12 Checking TCXO Block .........................76

4.13 Checking UMTS Block .........................78

5. DOWNLOAD ...................................88

5.1 Introduction ............................................88

5.2 Downloading Procedure.........................88

5.3 Troubleshooting download errors ........102

5.4 Caution.................................................109

6. BLOCK DIAGRAM ........................110

7. Circuit Diagram.............................111

8. BGM Pin Map ................................119

9. PCB LAYOUT................................121

10. Calibration & RF Auto Test

Program (Hot Kimchi)................129

10.1 Configuration of directory...................129

10.2 How to use HOT KIMCHI...................130

11. EXPLODED VIEW &

REPLACEMENT PART LIST ..... 134

11.1 EXPLODED VIEW ............................ 134

11.2 Replacement Parts

<Mechanic component>.................... 137

<Main component> ........................... 141

11.3 Accessory ......................................... 162

Table Of Contents

LGE Internal Use Only

- 4 -

LGE Internal Use Only

Only for training and service purposes

LGE Internal Use Only

- 5 -

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the features of this model.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of commoncarrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.

1. INTRODUCTION

LGE Internal Use Only

Only for training and service purposes

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as described.

1. INTRODUCTION

- 6 -

LGE Internal Use Only

2. PERFORMANCE

- 7 -

2.1 System Overview

2. PERFORMANCE

Item Specification

Dimension 101x54x12.7

Weight About 92g

Power 900mA Li-ion

Talk time 140min

Stand-by time Over 350hours(WCDMA DRX2.56s)

Antenna Internal antenna

LCD 3.0” WQVGA(240x400 Dot), 262K TFT Color LCD

Back light Yes

Back light color White

Camera 2Mega pixel(CMOS)

Vibrator Yes

Speaker Yes

C-MIC Yes

Earphone jack Yes(RC-5240)

SIM socket Yes(3.0V & 1.8V)

Volume key Push type(+,-)

Camera key Push type

I/O connect 10pin(RC-5238)

LGE Internal Use Only

Only for training and service purposes

2.2 Usable environment

1) Environment

2) Environment(Accessory)

* CLA : 12~24V(DC).

2. PERFORMANCE

- 8 -

Item Specification

Voltage 3.7V (Typ) ( Shut Down: 3.26)

Operation Temp 20 ~ + 60°C

Storage Temp 30 ~ + 85°C

Humidity 40 ~ 85%

Reference Spec. Min Typ. Max Unit

TA power Available power 100 220 240 Vac

LGE Internal Use Only

2. PERFORMANCE

- 9 -

2.3 Radio Performance

1) Transmitter -WCDMA Mode

* In case of DCS : [A] -> 1710, [B] -> 1785* In case of PCS : [A] -> 1850, [B] -> 1910

No Item Specification

1 Maximum Output Power

Class3: +24 dBm (+1/-3dB)

Class4: +21dBm(°æ2dB)

2 Frequency Error ±0.1ppm↓

3 Open Loop Power control in uplink ±9dB↓ @normal, ±12dB @extreme

Adjust output(TPC command)

cmd 1dB 2dB 3dB

+1 +0.5/1.5 +1/3 +1.5/4

4 Inner Loop Power control in uplink 0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5

-1 -0.5/-1.5 -1/-3 -1.5/-4

group(10equal command group)

+1 +8/+12 +16/+24

5 Minimum Output Power -50 dBm↓ (3.84MHz)

Qin/Qout:DPCCH quality levels

6 Out-of-synchronization handling of output power Toff@ DPCCH/Ior:-22->-28dB

Ton@ DPCCH/Ior:-24->-18dB

7 Transmit OFF Power -56 dBm↓ (3.84M)

8 Transmit ON/OFF Time Mask

±25us

PRACH,CPCH, uplink compressed mode

±25us

9 Change of TFC

power varies according to the data rate

DTX: DPCH off

(minise interference between UE)

10 Power setting in uplink compressed ±3dB↓ (after14slots transmission gap)

11 Occupied Bandwidth(OBW) 5 MHz↓ (99% )

LGE Internal Use Only

Only for training and service purposes

* In case of DCS : [A] -> 1710, [B] -> 1785* In case of PCS : [A] -> 1850, [B] -> 1910

2. PERFORMANCE

- 10 -

No Item Specification

-35-15*(∆f-2.5) dBc @∆f=2.5~3.5MHz, 30k

12 Spectrum emission Mask

-35-1*(∆f-3.5) dBc @∆f=3.5~7.5MHz,1M

-39 10*(∆f-7.5) dBc @∆f=7.5~8.5MHz,1M

-49 dBc @∆f=8.5~12.5MHz,1M

13 Adjacent Channel Leakage Ratio(ACLR)

33dB↑ @5MHz, ACP>-50dBm

43dB↑ @10MHz, ACP>-50dBm

-36 dBm @f=9~150KHz, 1k BW

-36 dBm @f=150KHz~30MHz, 10k

-36 dBm @f=30~1000MHz, 100k

-30 dBm @f=1~12.75GHz, 1M

-41 dBm* @1893.5~1919.6MHz, 300k

14

Spurious Emission

-67 dBm* @925~935MHz, 100k

(*: additional requirement)

-79 dBm* @935~960MHz, 100k

-71 dBm* @1805~1880MHz, 100k

-60 dBm* @869~894MHz, 3.84M

-60 dBm* @1930~1990MHz, 3.84M

-60 dBm* @2110~2155MHz, 3.84M

15 Transmit Intermodulation

-31 dBc @5MHz,Interferer -40dBc

-41 dBc @10MHz,Interferer -40dBc

16 Error Vector Magnitude(EVM)

17.5 %↓ (>-20dBm)

(@12.2k, 1DPDCH+1DPCCH)

17 Peak code domain error

-15 dB↓ @SF=4, 768kbps, multi-code

transmission

LGE Internal Use Only

2. PERFORMANCE

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No Item Specification

18 Reference Sensivitivity Level -106.7dBm↓(3.84M)

-25 dBm↑(3.84 MHz)

19 Maximum Input Level -44dBm/3.84MHz(DPCH_Ec)

UE@ +20dBm output power(class3)

20 Adjacent Channel Selectivity(ACS) 33 dB↑

UE@ +20dBm output power(class3)

-56 dBm/3.84MHz @10MHz

21 In-band Blocking

UE@ +20dBm output power(class3)

-44 dBm/3.84MHz @15MHz

UE@ +20dBm output power(class3)

-44 dBm/3.84MHz @f=2050~2095 &

2185~2230 MHz , band a)

UE@ =20dBm output power(class3)

-30 dBm/3.84MHz @f=2025~2050 &

22 Out-band Blocking 2230~2255 MHz, band a)

UE@ +20dBm output power(class3)

-15 dBm/3.84MHz @f=1~2025 &

2255~12500 MHz, band a)

UE@ +20dBm output power(class3)

23 Spurious Response

-44 dBm CW

UE@ +20dBm output power(class3)

-46 dBm CW@10MHz &

24 Intermodulation Characteristic -46dBm/3.84MHz @20MHz

UE@ +20dBm output power(class3)

-57 dBm @f=9KHz~1GHz, 100k BW

-47 dBm @f=1~12.75GHz, 1M

25

-60 dBm @f=1920~1980MHz, 3.84MHz

-60 dBm @f=2110~2170MHz, 3.84MHz

-60 dBm @f=824~849MHz, 3.84MHz

-60 dBm @f=869~894MHz, 3.84MHz

2)Receiver- WCDMA Mode

LGE Internal Use Only

Only for training and service purposes

2. PERFORMANCE

- 12 -

2.4 Current Consumption

(Stand by and Voice Call Test Condition: LCD backlight Off) (VT Test Condition: Speaker off, LCD backlight On)

2.5 Antenna BAR

2.6. Battery Bar

Static Stand-by Voice Call VT

WCDMA

350 Hours (2.4mA) 140 Mins (350mA) 90 Mins (550mA)

(DRX=2.56) (Tx=10dBm) (Tx=10dBm)

Antenna Bar WCDMA

BAR 3 ->2 -104 ± 2 dBm

BAR 2 ->1 -109 ± 2 dBm

BAR 1 ->0 -112 ± 2 dBm

-114 ± 2 dBm

Indication Voltage

During Idle state During Call state

BAR 3 -> 2

3.720 ± 0.05V 3.660 ± 0.05V

(call maintenance over 40min)

BAR 2 -> 1

3.610 ± 0.05V 3.560 ± 0.05V

(call maintenance over 10min)

BAR 1 -> 0

3.260V ± 0.05V 3.260V ± 0.05V

(Icon Blinking)

Low battery message BAR 1 -> 0

Low battery pop-up BAR 2 -> 1, display one time

Power OFF during call - 80s after Low battery message

Power OFF at stand-by 60s after Low battery message -

LGE Internal Use Only

2.7 Sound Pressure Level

2. PERFORMANCE

- 13 -

No Test Item Specification

1 Sending Loudness Rating (SLR)

NOM

8±3dB

MAX

2 Sending Frequency Response (SFR) MAX MASK IN

3 Receiving Loudness Rating (RLR)

NOM -2±3dB

MAX -10±3dB

4 Receiving Frequency Response (RFR) MAX MASK IN

5 Side Tone Masking Rating (STMR)

NOM

17dB ↑

MAX

6 Echo Loss (EL)

NOM

46dB ↑

MAX

7 Idle Noise-Sending (INS)

NOM

-64dBm0p

MAX

8 Idle Noise-Receiving (INR)

NOM Under -57dBPA

MAX Under -54dBPA

9 Sending Loudness Rating (SLR)

NOM

8±3dB

MAX

10 Receiving Loudness Rating (RLR)

NOM -1±3dB

MAX -12±3dB

11 Side Tone Masking Rating (STMR)

NOM

25dB ↑

MAX

12 Echo Loss (EL)

NOM

40dB ↑

MAX

13 Idle Noise-Sending (INS)

NOM

Under -55dBm0p

MAX

14 Idle Noise-Receiving (INR)

NOM Under -45dBPA

MAX Under -40dBPA

MS

Headset

A C O U S T

I

C

A

I

R

- 14 -

2. PERFORMANCE

2.8 Charging

• Charging Method : CC & CV (Constant Current and Constant Voltage)

• Maximum Charging Voltage : 4.2 V

• Maximum Charging Current : 600mA

• Normal Battery Capacity : 900mA

• Charging Time : Max 3 hours ( except for trickle charging time )

• Full charging indication Current (charging icon stop current) : 140mA

• Low battery message : 3.26 ± 0.05V

• Cut-off : [Idle] 60s after Low battery message

[Call] 80s after Low battery message

LGE Internal Use Only

Only for training and service purposes

LGE Internal Use Only

3. TECHNICAL BRIEF

- 15 -

3.1 Digital Baseband(DBB/MSM6280)

3.1.1 General Description

A. Features(MSM6280)

■ Support for multimode operation - HSDPA, tri-band WCDMA (UMTS), quad GSM/GPRS

■ Support for HSDPA downlink up to 3.6Mbps (initial commercial release will support 3.6Mbps

■ HSDPA. Later releases will have support for 7.2 Mbps HSDPA)

■ Support for WCDMA (UMTS) uplink data rate up to 384 kbps

■ High-performance ARM926EJ-S running at up to 225 MHz (later at 270 MHz for 7.2 Mbps

HSDPA)

■ ARM Jazelle Java hardware acceleration for faster Java-based games and other applets

■ QDSP4000 high-performance DSP cores

■ Integrated gpsOne position location technology functionality

■ Integrated Bluetooth 1.2 baseband processor for wireless connectivity to peripherals

■ Qcamera™ with 15 fps QVGA viewfinder resolution, and support for 4 MP camera sensors

■ Direct interface to digital camera module with video front end (VFE) image processing

■ True 3D graphics for advanced wireless gaming

■ SecureMSM v2.0 includes support for Open Mobile Alliance (OMA) DRM v2.0, SIM-lock and IMEI

integrity. Support for Q-fuse.

■ Audio on par with portable music players

■ Vocoder support (AMR, FR, EFR, HR)

■ Advanced 14 x 14 mm, 0.5 mm pitch, 409-pin lead-free CSP packaging technology

■ SD/SDIO hardware support

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 16 -

Prada Block Diagram

PM6650

MSM6280

Connectivity

CAM I/F

H.264

MPEG

KEYPAD I/F

I2C I/F

AUDIO

PLL

QDSP 4000

ARM926ejs

With Jazelle

Modem QDSP 4000

Dual Memory

Bus

EBI2

EBI1

IRDA/UART

USIM

USB

SSBI

GRAPICS

LDO

Camera 2M A/F

Camera VGA

CAM LED

LED

Driver

TX_SAW

RTR6275

RFR6275

W-VCO1

LNA1

W-VCO2

LNA2

TX_SAW

WCDMA

PAM

WCDMA

PAM

Coupler Coupler

Duplexer

RX_SAW

Diplexer

SPDT

RX_SAW

TCXO

19.2MHz

XTAL

48MHz

XTAL

32.768KHz

Key pad

Touch

Screen

Audio

Processor

LCD

(3.0î WQVGA)

NAND 2Gbits

SDRAM 1Gbits

RUIM Level

Translator

USB

Tranciever

Charge &

Battery Control

RC Formattor

IrDA(RC)

USIM

Micro SD

LCD

B/L Driver

DAC/AMP

ARIB A ConnectorEar Jack

Sensor IC

LDO

Battery

MIC

Speaker

&

Receiver

USB

+5V

SSBI

TX IQ

RX IQ

TX IQ

RX

IQ

RF

Connector

WCDMA 800MHz

WCDMA 2100MHz

New parts

Changed parts

Figure. Simplified Block Diagram

LGE Internal Use Only

3. TECHNICAL BRIEF

- 17 -

3.1.2 Block Diagram(MSM6280)

Figure. Simplified Block Diagram of MSM6280

Camera 2M

Camera 0.3M

CAMERA

PROCESSING

(Default 8bit

Interface)

GRAPHICS

Open GL ES

3D, 2D

VIDEO

MPEG-4

AUDIO

AAC,

EVRC, QCELP

AMR, CMX

SDRAM

1G

EBI 1 EBI 2

DUAL MEMORY BUS

MSM6280

Modem QDSP 4000

PLL

QDSP 4000

CONNECTIVITY

F/ I

d ap

y eK

GATJ

NAND Flash

2G

ARM 926ejs With Jazelle

1TRAU

BSU

LCD

(3.0î )

GSM/GPRS

processor

UMTS, WCDMA,

HSDPA processor

IBSS

1 M

I UR

C IM

/ 2

P

T R AU

RF SSBI

Rx ADC

Tx DAC

GPIO

ediS

yeK

nnoC O/I

PM6650

BSU

USIM

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 18 -

3.2. Subsystem(MSM6280)

3.2.1 ARM Microprocessor Subsystem

The MSM6280 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM, including control of the external peripherals such as the keypad, LCD, SDRAM, and NAND-Flash devices. Through a QUALCOMM proprietary serial bus interface (SBI) the ARM926EJ-S configures and controls the functionality of the RTR6275, RFR6275 and PM6650 devices.

3.2.2 WCDMA R99 features

The MSM6280 device supports release 99 June 2004 of the W-CDMA FDD standard, including the following features:

■ All modes and data rates for W-CDMA frequency division duplex (FDD), with the following

restrictions:

❏ The downlink supports the following specifications:

- Up to four physical channels, including the broadcast channel (BCH), if present

- Up to three dedicated physical channels (DPCHs)

- Spreading factor (SF) range support from 4 to 256

- The following transmit diversity modes are supported: Space time transmit diversity (STTD) Time-switched transmit diversity (TSTD) Closed-loop feedback transmit diversity (CLTD)

■ The uplink supports the following specifications:

❏ The uplink provides the following UE support:

- One physical channel, eight TrCH, and 16 TrBks starting at any frame boundary

- A maximum data rate of 384 kbps

❏ Full SF range support from 4 to 256

■ SMS (CS and PS)

■ PS data rate - 384 kbps DL / 384 kbps UL

■ CS data rate - 64 kbps DL / 64 kbps UL

■ AMR (all rates)

3.2.3 GSM features

The following GSM modes and data rates are supported by the MSM6280 device hardware. Support modes conform to release '99 specifications of the sub-feature.

■ Voice features

❏ FR

❏ EFR

LGE Internal Use Only

3. TECHNICAL BRIEF

- 19 -

❏ AMR

❏ HR

❏ A5/1, A5/2, and A5/3 ciphering

■ Circuit-switched data features

❏ 9.6k

❏ 14.4k

❏ Fax

❏ Transparent and non-transparent modes for CS data and fax

❏ No sub-rates are supported.

3.2.4 GPRS features

■ Packet switched data (GPRS)

❏ DTM (Simple Class A) operation

❏ Multi-slot class 12 data services

❏ CS schemes: CS1, CS2, CS3, and CS4

❏ GEA1, GEA2, and GEA3 ciphering

■ Maximum of four Rx timeslots per frame

3.2.5 MSM6280 device audio processing features

■ Integrated wideband stereo CODEC

❏ 16-bit DAC with typical 88 dB dynamic range

❏ Supports sampling rates up to 48 kHz on the speaker path and 16 kHz on the microphone path

■ VR- Voice mail + voice memo

■ Acoustic echo cancellation

■ Audio AGC

■ Audio Codecs: AMR-NB, AAC, AAC Plus, Enhanced AAC Plus, Windows Audio v9, Real Audio 8

(G2)

■ Internal vocoder supporting AMR, FR, EFR, and HR

3.2.6 MSM6280 microprocessor subsystem

■ Industry standard ARM926EJ-S embedded microprocessor subsystem

❏ 16 kB instruction and 16 kB data cache

❏ Instruction set compatible with ARM7TDMI®

❏ ARM version 5TEJ instructions

❏ Higher performance 5 stage pipeline, Harvard cached architecture

❏ Higher internal CPU clock rate with on-chip cache

■ Java hardware acceleration

■ Enhanced memory support

Please note that NOR/PSRAM will not be supported on MSM6280.

❏ 75 MHz and 90 MHz bus clock for SDRAM

❏ 32-bit SDRAM

❏ Dual memory buses separating the high-speed memory subsystem (EBI1) from low-speed

peripherals (EBI2) such as LCD panels

❏ 1.8 V or 2.6 V memory interface support (excluding EBI1)

❏ NAND FLASH memory interface

- 8/16-bit data I/O width NAND flash support

- 1- or 4-bit ECC

- 512-byte/2KB page-size support

- 2 chip selects supported for NAND Flash

❏ Boot from NAND

❏ Low-power SDRAM (LP-SDRAM) interface

■ Internal watchdog and sleep timers

3.2.7 Supported interface features

■ USB On-the-Go core supports both slave and host functionality

■ Three universal asynchronous receiver transmitter (UART) serial ports

■ USIM controller (via UART)

■ Integrated 4-bit secure digital (SD) controller for SD and Mini SD cards

■ Parallel LCD interface

■ General-purpose I/O pins

■ External keypad interface

3.2.8 Supported multimedia features

■ Provide additional general purpose MIPS by using:

❏ Two QDSP4000s

❏ Dedicated hardware accelerators and compression engines

■ Improve Java, BREW, and game performance

❏ Integrated Java and 2D/3D graphics accelerator with Sprite engine

■ Enable various accessories via USB host connectivity.

❏ Integrated USB host controller functionality

■ Enable compelling visual and audio applications.

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 20 -

LGE Internal Use Only

3. TECHNICAL BRIEF

- 21 -

Qcamera

■ High-quality digital camera processing, supporting CCD or CMOS image sensors up to 4-megapixel with 15 fps capture rate

■ 15 fps QVGA viewfinder

Qtv

■ Audio and video decoder that supports VOD, MOD and Broadcast multimedia services.

■ Audio Codecs supported: AMR-NB, AAC, AAC Plus, Enhanced AAC Plus, Windows® Audio v9,

RealAudio® v8

■ Integrated stereo wideband Codec for music/digital clips

■ CMX

■ Video Codecs supported: MPEG-4, H.263, H.264, Windows Media® v9 and RealNetworks® v10

Video telephony services: Qvideophone

■ A two-way mobile video conferencing solution that delivers 15 fps @ QCIF

■ Video Codecs supported: MPEG-4 and H.263

■ Audio Codecs supported: AMR-NB.

Qcamcorder

■ Real time mobile video encoder

■ Video Codecs supported: MPEG-4, H.263.H.264

■ Audio Codecs supported: AMR-NB, AAC

■ Recording performance: 15 fps @ QVGA, 384 kbps

CMX (MIDI and still image, animation, text, LED/vibrate support)

■ 72 simultaneous polyphonic tones

■ 44 kHz sampling rate

■ 512 kB wave table

■ Support of universal file formats

❏ Standard MIDI Format (SMF)

❏ SP-MIDI

❏ SMAF Audio playback (MA-2, MA-3, MA-5)

❏ XMF/OLS

❏ MFil (requires Docomo license)

■ PNG decoder

■ Pitch bend range support

■ LED/vibrate support

■ Scalable Vector Graphics (SVG- Tiny 1.1 + SVG Tiny 1.2)

■ MLZ decoder

■ Integrated PNG/SAF A.T.

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 22 -

Table. 3.2 Summary of MSM6280 device features

LGE Internal Use Only

3. TECHNICAL BRIEF

- 23 -

3.2.9 Serial Bus Interface(SBI)

The MSM6280 device’s SSBI is designed specifically to be a quick, low pin count control protocol for QUALCOMM’s RTR6275, RFR6275 and PM6650 ASICs. Using the SSBI, the RTR6275, RFR6275, and PM6650 devices can be configured for different operating modes and for minimum power consumption, extending battery life in Standby mode. The SSBI also controls DC baseband offset errors.

3.2.10 Wideband CODEC

The MSM6280 device integrates a wideband voice/audio CODEC into the mobile station modem (MSM). The CODEC supports two differential microphone inputs, one differential earphone output, one single-ended earphone output, and a differential analog auxiliary interface.

The CODEC integrates the microphone and earphone amplifiers into the MSM6280 device, reducing the external component count to just a few passive components. The microphone (Tx) audio path consists of a two-stage amplifier with the gain of the second stage set interally. The Rx/Tx paths are designed to meet the ITU-G.712 requirements for digital transmission systems.

3.2.11 Vocoder Subsystem

The MSM6280 device’s QDSP4000 supports AMR,FR,EFR and HR. In addition, the QDSP4000 has modules to support the following audio functions: DTMF tone generation, DTMF tone detection, Tx/Rx volume controls, Tx/Rx automatic gain control (AGC), Rx Automatic Volume Control (AVC), EarSeal Echo Canceller (ESEC), Acoustic Echo Canceller (AEC), Noise Suppression (NS), and programmable, 13-tap, Type-I, FIR, Tx/Rx compensation filters. The MSM6280 device’s integrated ARM9TDMI processor downloads the firmware into the QDSP4000 and configures QDSP4000 to support the desired functionality.

3.2.12 ARM Microprocessor subsystem

The MSM6280 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM device, including control of the external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices. Through a generic single serial bus interface (SSBI) the ARM926EJ-S configures and controls the functionality of the RFR6275, RTR6275, and PM6650 devices.

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 24 -

3.2.13 Mode Select and JTAG Interfaces

The mode pins to the MSM6280 device determine the overall operating mode of the ASIC. The options under the control of the mode inputs are Native mode, which is the normal subscriber unit operation, ETM mode, which enables the built-in trace mode, and test mode for factory testing. The MSM6280 device meets the intent of the ANSI/IEEE 1149.1A-1993 feature list. The JTAG interface can be used to test digital interconnects between devices within the mobile station during manufacture.

3.2.14 General-Purpose Input/Output Interface

The MSM6280 device has general-purpose bidirectional input/output pins. Some of the GPIO pins have alternate functions supported on them. The alternate functions include USB interface, additional RAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART interface. The function of these pins is documented in the various software releases.

3.2.15 UART

The MSM6280 device employs three UARTs. UART1 has dedicated pins while UART2 and UART3 share multiplexed pins.

■ UART1 for data

■ UART2 (can be used for USIM interface)

■ UART3 for data

3.2.16 USB

The MSM6280 device integrates a universal serial bus (USB) controller that supports both unidirectional and bidirectional transceiver interfaces. The USB controller acts as a USB peripheral communicating with the USB host.

LGE Internal Use Only

3. TECHNICAL BRIEF

- 25 -

3.3 Power Block

3.3.1 General

MSM6280, included RF, is fully covered by PM6650(Qualcomm PMIC). PM6650 cover the power of MSM6280, MSM memory, RF block, Bluetooth, Micro SD, USIM and TCXO.

Major power components are :

PM6650-3P (U400, Main PCB) : Phone power supply

MAX8645Y (U601, Slide PCB) : LCD Backlight charge pump

3.3.2 PM6650

The PM6650 device (Figure 1-1) integrates all wireless handset power management. The power management portion accepts power from all the most common sources - battery, external charger, adapter, coin cell back-up - and generates all the regulated voltages needed to power the appropriate handset electronics. It monitors and controls the power sources, detecting which sources are applied, verifying that they are within acceptable operational limits, and coordinates battery and coin cell recharging while maintaining the handset electronics supply voltages. Eight programmable output voltages are generated using low dropout voltage regulators, all derived from a common trimmed voltage reference.

A dedicated controller manages the TCXO warm-up and signal buffering, and key parameters (undervoltage lockout and crystal oscillator signal presence) are monitored to protect against detrimental conditions.

MSM device controls and statuses the PM6650 IC using Single Serial Bus Interface (SSBI) supplemented by an Interrupt Manager for time-critical information. Another dedicated IC Interface circuit monitors multiple trigger events and controls the power-on sequence.

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 26 -

Figure. PM6650 Functional Block Diagram

LGE Internal Use Only

3. TECHNICAL BRIEF

- 27 -

3.3.3. Charging control

A programmable charging block in PM6650 is used for battery charging. It is possible to set limits for the charging current. The external supply typically connects directly to pin (VCHG). The voltage on this pin (VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied or not. For additional accuracy or to capture variations over time, this voltage is routed internally to the housekeeping ADC via the analog multiplexer. PM6650 circuits monitor voltages at VCHARGER and ICHARGE pins to determine which supply should be used and when to switch between the two supplies. These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the pass transistor respectively.

L852i Battery Bar Display

[Call]3.66V ± 0.05V [Idle]3.72V ± 0.05V

[Call]3.56V ± 0.05V [Idle]3.61V ± 0.05V

[Call & Idle]3.26 ± 0.05V

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3. TECHNICAL BRIEF

Trickle Charging

Trickle Charging of the main battery, enabled through SBI control and powered from VDD, is provided by the PM6650 IC, The trickle charger is on-chip programmable current source that supplies current from VDD to pin (VBAT). Trickle charging can be used for lithium-ion and nickelbased batteries, with its performance specified below (3.2V). The charging current is set to 80mA.

LGE Internal Use Only

Only for training and service purposes

Parameter Min Typ Max Unit

Trickle Current 60 80 100 mA

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3. TECHNICAL BRIEF

Constant Current Charging

The PM6650 IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V.

Constant Voltage Charging

Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V. The end of constant voltage charging is commonly detected 10% of the full charging current (140mA)

• Charging Method : CC & CV (Constant Current & Constant Voltage)

• Maximum Charging Voltage : 4.2V

• Maximum Charging Current : 600mA

• Nominal Battery Capacity : 900 mAh

• Charger Voltage : 5.4V

• Charging time : Max 160min (Except time trickle charging)

• Full charge indication current (icon stop current) : 140mA

• Low battery message : 3.26 ± 0.05V

• Cut-off : [Idle] 60s after Low battery message [Call] 80s after Low battery message

LGE Internal Use Only

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3. TECHNICAL BRIEF

3.4 External memory interface

A. MSM6280

The MSM6280 device was designed to provide two distinct memory interfaces. EBI1 was targeted for supporting high speed synchronous memory devices. EBI2 was targeted towards supporting slower asynchronous devices such as LCD, NAND flash, SRAM, etc.

• EBI1 Features

- 16 bit static and dynamic memory interface

- 32 bit dynamic memory interface

- 24 bits of address for static memory devices which can support up to 32MBytes on each chip select

- Synchronous burst memories supported (burst NOR, burst PSRAM)

- Synchronous DRAM memories supported

- Byte addressable memory supporting 8 bit, 16 bit and 32 bit accesses

- Pseudo SRAM (PSRAM) memory support

• EBI2 Features

- Support for asynchronous FLASH and SRAM(16bit & 8bit).

- Interface support for byte addressable 16bit devices(UB_N & LB_N signals).

- 2Mbytes of memory per chip select.

- Support for 8 bit/16bit wide NAND flash.

- Support for parallel LCD interfaces, port mapped of memory mapped(18 or 16 bit)

• 2Gb NAND(16bit) flash memory + 1Gb SDRAM (32bit)

• 1-CS(Chip Select) is used

LGE Internal Use Only

Only for training and service purposes

Interface Spec

Device Part Name Maker Read Access Time Write Access Time

FLASH TYA000B800COGG Toshiba 50 ns 50 ns

SDRAM TYA000B800COGG Toshiba 15 ns 15 ns

Table#1. External memory interface for L852i

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3. TECHNICAL BRIEF

3.5 H/W Sub System

3.5.1 RF Interface

A. RTR6275(WCDMA_Tx)

MSM6280 controls RF part(RTR6275) using these signals.

• SSBDT_RTR : SSBI I/F signals for control Sub-chipset

• RX_I/Q_M/P,TX_I/Q_M/P : I/Q for T/Rx of RF

• TX_AGC_ADJ : control the gain of the Tx signal prior to the power amplifier

B. RFR6275(WCDMA_Rx)

• SSBDT_RFR : SSBI I/F signals for control Sub-chipset

• RX_I/Q_M/P : I/Q for Rx of RF

C. the others

• TRK_LO_ADJ : TCXO(19.2M) Control

• PA_ON0 : WCDMA(800), WCDMA(2100) TX Power Amp Enable

• PA_ON1 : WCDMA(2100) TX Power Amp Enable

LGE Internal Use Only

Figure. Schematic of RF Interface of MSM6280

Near to MSM

(WCMDA 2100PAM Enable)

TP201

33nF

C239

2KR210

SYNTH0_GP_PDM0_GPIO92

TCXO_EN_GPIO94

F19

TRK_LO_ADJ

L13

H13

TX_AGC_ADJ

Q_OUT_N

SBST1_GPIO93

H18

PA_ON0

F17

AA25

Q_IM_CH0

Q_IM_CH1

W23

Y25

Q_IP_CH0

Q_IP_CH1

V23

B12

Q_OUT

A12

A13

AB25

I_IM_CH0

V25

I_IM_CH1

AC25

I_IP_CH0

W25

I_IP_CH1

I_OUT

B13

I_OUT_N

F12

DAC_REF

AP_1.2V_EN

PA_ON0

TRK_LO_ADJ

TCXO_EN

DAC_REF

TX_QM TX_QP TX_IM TX_IP

RX_QM RX_QP RX_IM RX_IP

TX_AGC_ADJ

LG L852i Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual