LG L3200A Schematic

Website:http://biz.LGservice.com

E-mail:http://www.LGEservice.com/techsup.html

COLOR MONIT OR

SER VICE MANUAL

CHASSIS NO. : CL-70

MODEL: L3200A (L3200AC.AL**A)

L3200A (L3200ATC.AL**A) L3200A (L3200AFC.AL**A) L3200A (L3200AKC.AL**A)

( ) **Same model for Service

CAUTION

BEFORE SERVICING THE UNIT, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CONTENTS

SPECIFICATIONS ................................................... 2

PRECAUTIONS ....................................................... 3

TIMING CHART ........................................................7

BLOCK DIAGRAM ....................................................9

DESCRIPTION OF BLOCK DIAGRAM....................10

ADJUSTMENT ........................................................11

SPECIFICATIONS

1. LCD CHARACTERISTICS

Type : TFT Color LCD Module Active Display Area : 31.51inches(800.4mm)diagonal Pixel Pitch : 170.25um x 510.75um x RGB Color Depth : 8-bit, 16,777,216 colors Electrical Interface : LVDS Size : 760mm (H) x 450 (D)x48 (D)mm Surface Treatment : Anti-Glare, Hard Coating(3H) Operating Mode : Normally Black Backlight Unit : 20-EEFL

2. OPTICAL CHARACTERISTICS

2-1. Viewing Angle by Contrast Ratio ≥ 10 Left : -85° min., -88°(Typ) Right : +85° min., +88°(Typ) Top : +85° min., +88°(Typ) Bottom : -85° min., -88°(Typ)

2-2. Luminance : 400(min), 500(Typ) 2-3. Contrast Ratio : 400(min), 600(Typ)

3. SIGNAL (Refer to the Timing Chart)

3-1. PC & Video Input

1)Input Form : AV, SVIDEO, Component1, Component2, RGB PC, DVI PC

2)Resolution(max) : Analog -1600 x 1200@60Hz

Digital -1280 x 1024@60Hz

3-2. Sync Input

Horizontal : 30 ~ 83kHz(Digital: 30~72kHz) Vertical : 56 ~ 85Hz Input Form : Separate, TTL,

Positive/Negative Digital

4. SPECIAL FUNCTION

4-1. Audio

1)Output Rating : 10W + 10W(Rated Output ± 10%)

2)Freq. Character : 100Hz~10KHz Range(-3dB)

3)T. H. D : Within 10%

4)Input Sensitivity : 0.700Vrms

SERVICE OSD ...................................................... 13

TROUBLESHOOTING GUIDE .............................. 14

WIRING DIAGRAM ............................................... 21

EXPLODED VIEW...................................................22

REPLACEMENT PARTS LIST ...............................24

SCHEMATIC DIAGRAM......................................... 34

5. POWER SUPPLY

5-1. Power Adaptor

Input : AC 100~240V, 50/60Hz , 2.8A

5-2. Power Consumption

MODE

POWER ON (NORMAL)

STAND-BY

SUSPEND

DPM OFF

POWER OFF

H/V SYNC

ON/ON OFF/ON ON/OFF

OFF/OFF

6. ENVIRONMENT

6-1. Operating Temperature: 10°C~35°C 6-2. Operating Humidity : 10%~80% 6-3. MTBF :

Lamp Life : 50,000 Hours(Min.)

7. DIMENSIONS L3200AC/L3200AKC

Width : 803 mm (31.61'') Depth : 99.9 mm (3.93'') Height : 493 mm (19.41'')

L3200ATC(with Stand)

Width : 803 mm (31.61'') Depth : 180 mm (7.09'') Height : 540 mm (21.26'')

L3200AFC(with Speaker/Stand)

Width : 964 mm (37.96'') Depth : 180 mm (7.09'') Height : 540 mm (21.26'')

POWER CONSUMPTION

VIDEO

less than 160 W

less than 4 W less than 4 W

less than 4 W less than 2 W

ACTIVE

OFF OFF OFF

LED COLOR

GREEN AMBER AMBER AMBER

OFF

50,000 HRS with 90% Confidence level

4-2. Speaker

1)TYPE : Detachable

2)Impedance : 8Ϊ

3)Input : Max : 15W, Normal : 10W

4-2. AV

1)Video Level : Input : 0.7V

2)Sync Level : Input : 0.286V

3)Color Burst : Input : 0.214V

4)Audio Level : NTSC Input : 0.40V PAL Input : 0.5V PC Input : 0.7V

5)Video Cross Talk : 43dB

8. WEIGHT L3200AC/L3200AKC

Net. Weight : 16 kg (35.28 lbs) Gross Weight : 20.9 kg (46.08 lbs)

L3200ATC/L3200AFC(with Speaker/Stand)

Net. Weight : 21.1 kg (46.52 lbs) Gross Weight : 26 kg (57.33 lbs)

- 2 -

PRECAUTION

1.5 Kohm/10W

To Instrument's exposed METALLIC PARTS

Good Earth Ground such as WATER PIPE, CONDUIT etc.

AC Volt-meter

WARNING FOR THE SAFETY-RELATED COMPONENT.

• There are some special components used in LCD monitor that are important for safety. These parts are

marked on the schematic diagram and the replacement parts list. It is essential that these critical

parts should be replaced with the manufacturer’s specified parts to prevent electric shock, fire or other hazard.

• Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee.

TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT.

• Must mount the module using mounting holes arranged in four corners.

• Do not press on the panel, edge of the frame strongly or electric shock as this will result in damage to the screen.

• Do not scratch or press on the panel with any sharp objects, such as pencil or pen as this may result in damage to the panel.

WARNING

BE CAREFUL ELECTRIC SHOCK !

• If you want to replace with the new backlight (CCFL) or inverter circuit, must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms.

• Handle with care wires or connectors of the inverter circuit. If the wires are pressed cause short and may burn or take fire.

Leakage Current Hot Check Circuit

• Protect the module from the ESD as it may damage the electronic circuit (C-MOS).

• Make certain that treatment person’s body are grounded through wrist band.

• Do not leave the module in high temperature and in areas of high humidity for a long time.

• The module not be exposed to the direct sunlight.

• Avoid contact with water as it may a short circuit within the module.

• If the surface of panel become dirty, please wipe it off with a softmaterial. (Cleaning with a dirty or rough cloth may damage the panel.)

CAUTION

Please use only a plastic screwdriver to protect yourself from shock hazard during service operation.

- 3 -

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this

service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit

board module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical

plug or other electrical connection.

c. Connecting a test substitute in parallel with an

electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

d. Discharging the picture tube anode.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Discharge the picture tube anode only by (a) first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected, and then (b) touch the other end of the insulated clip lead to the picture tube anode button, using an insulating handle to avoid personal contact with high voltage.

4. Do not spray chemicals on or near this receiver or any of its assemblies.

5. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cottontipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

6. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

7. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

8. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

9. Use with this receiver only the test fixtures specified in

this service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "antistatic" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

- 4 -

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip

temperature within the range or 500

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire-bristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal

temperature.

F to 600 F)

(500 b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static,

suction-type solder removal device or with solder

braid.

CAUTION: Work quickly to avoid overheating the

circuitboard printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal

temperature (500

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of

the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any

excess or splashed solder with a small wire-bristle brush.

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

F to 600 F)

F to 600 F.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

- 5 -

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

- 6 -

TIMING CHART

VIDEO

SYNC

<< Dot Clock (MHz), Horizontal Frequency (kHz), Vertical Frequency (Hz), Horizontal etc... (µs), Vertical etc... (ms) >>

1) PC Mode

MODE

1 H(Pixels) + 25.175 31.469 800 640 16 96 48 640 x 350

2 H(Pixels) - 28.321 31.468 900 720 18 108 54 720 X 400

3 H(Pixels) - 25.175 31.469 800 640 16 96 48 640 x 480

4 H(Pixels) - 31.5 37.5 840 640 16 64 120 640 x 480

5 H(Pixels) - 36.0 43.269 832 640 56 56 80 640 x 480

6 H(Pixels) + 40.0 37.879 1056 800 40 128 88 800 x 600

7 H(Pixels) + 49.5 46.875 1056 800 16 80 160 800 x 600

8 H(Pixels) + 56.25 53.674 1048 800 32 64 152 800 x 600

9 H(Pixels) +/- 57.283 49.725 1152 832 32 64 224 832 x 624

10 H(Pixels) - 65.0 48.363 1344 1024 24 136 160 1024 x 768

11 H(Pixels) - 78.75 60.123 1312 1024 16 96 176 1024 x 768

12 H(Pixels) + 94.5 68.68 1376 1024 48 96 208 1024 x 768

13 H(Pixels) + 74.5 44.772 1664 1280 64 128 192 1280 x 720

14 H(Pixels) + 84.75 47.72 1776 1360 72 136 208 1360 x 768

15 H(Pixels) + 108.0 63.981 1688 1280 48 112 248 1280 x 1024

16 H(Pixels) + 135.00 79.98 1688 1280 16 144 248 1280 x 1024

17 H(Pixels) + 162.00 75.00 2160 1600 90 30 88 1600 x 1200

H / V

V(Lines) - 70.8 449 350 37 2 60

V(Lines) + 70.8 449 400 12 2 35

V(Lines) - 59.94 525 480 10 2 33

V(Lines) - 75 500 480 1 3 16

V(Lines) - 85.0 509 480 1 3 25

V(Lines) + 60.317 628 600 1 4 23

V(Lines) + 75.0 625 600 1 3 21

V(Lines) + 85.061 631 600 1 3 27

V(Lines) +/- 74.55 667 624 1 3 39

V(Lines) - 60.0 806 768 3 6 29

V(Lines) - 75.029 800 768 1 3 28

V(Lines) + 85.00 808 768 1 3 36

V(Lines) + 59.855 748 720 3 5 20

V(Lines) + 59.799 798 768 3 5 22

V(Lines) + 60.02 1066 1024 1 3 38

V(Lines) + 75.02 1066 1024 1 3 38

V(Lines) + 60 1250 1200 1 3 46

Sync

Polarity

Dot

Clock

Frequency

Total

Period

( E )

Video

Active

Time ( A )

Front

Porch

( C )

Sync

Duration

( D )

Back

Porch

( F )

Resolution

※1~17 : D-SUB, 1~17 : DVI-D : 1~15

- 7 -

2) Component Video Mode(Y/Pb/Pr)

MODE

1 H(Pixels) - 25.175 31.469 800 640 16 96 48 SDTV

2 H(Pixels) - 27.027 31.5 858 720 16 62 60 HDTV

3 H(Pixels) - 74.176 44.955 1650 1280 70 40 260 HDTV

4 H(Pixels) - 74.250 33.750 2200 1920 44 44 192 HDTV

5 H(Pixels) - 74.176 33.716 2200 1920 44 44 192 HTDV

H / V

V(Lines) - 59.94 525 480 10 2 33 480P

V(Lines) - 60 525 480 10 2 33 720P(HDCP)

V(Lines) - 59.94 750 720 5 5 60 720P(HDCP)

V(Lines) - 60.053 562 540 2 5 15 1080I(HDCP)

V(Lines) - 59.994 562 540 2 5 15 1080I(HDCP)

Sync

Polarity

Dot

Clock

Frequency

Total

Period

( E )

Video

Active

Time ( A )

Front

Porch

( C )

Sync

Duration

( D )

Back

Porch

( F )

Resolution

- 8 -

BLOCK DIAGRAM(uPD64011+gm1501H)

LCD

Module

1 Ch

R,G,B

VCHIP-SCL/VCHIP-SDA

CC / V chip

uPD-HS/VS

(M37272M6)

LVDS Tx

(THC63LVDM83R)

Even

R,G,B

Enhance

Back-end

Even

R,G,B

Memory

(M29W800AT)

8Mb Flash

ITUR 601 (16Bit)

HS/VS/CLK_OUT(13.5MHz)

ITUR 601 (16Bit)

RGB

(EX256)

MIX IC

SP (R)

SP (L)

(TPA3004)

Audio-Amp

AMP_IN_Right

AMP_IN_Left

Audio

(MSP3420G)

Decoder

CVBS-TTX

SCL/SDA

SIF from Tuner 1

uPD-HS/VS/CLK2(27MHz)

Tuner2 Audio

CVBS Audio

PC Audio

DVD Audio

DTV Audio

gm1501H

DDR

128Mb

(MT46V2M32)

LVDS

Processor

Video Signal

ADC

TMDS

DDC_SCLA

DDC_SDAA

DDC_SCLB

RGB/SOG

Dsub-H/V

D-SUB

DDC_SDAB

TMDS

DVI-D

(16Bit)

ITUR601

CLK (13.5MHz)

ITUR601

(16Bit)

H/V/CLK OUT

SCL/SDA

SCL2/SDA2

SDRAM

(MT46V2M32)

(MDIN150)

De-interlace 1

RGB 24 bit

ADC 1

SCL2/SDA2

HS/VS-ADC

(MST9883C)

VCHIP-SCL/VCHIP-SDA

SCL/SDA

HD-YPbPr

Component 1(YPbPr,480i/480p/720p/1080i)

Video

UPD64011

HD-YCbCr

Component 2 (YCbCr,480i)

Decoder

CVBS-OUT 1

SDRAM

(M56V16160F)

LPF

Y OUT

C OUT

S/W

SCL/SDA

CVBS

LPF

CVBS-TTX

(CXA2040AQ)

CVBS-OUT 1

Y/C-in

- 9 -

DESCRIPTION OF BLOCK DIAGRAM

1. Input Selection Circuit

1) PC Input Selection This block is composed of GM1501(U402) and peripheral devices.

2) Video Input Selection This block is composed of video S/W IC (CXA2040Q, U201) and peripheral devices. There are two inputs in CXA2040Q IC(Video input CVBS, S-video signal). One selected video signal is transmitted a video decoder IC (UPD64011, U904)

2. DDC controller

This block is composed of GM1501(U402) and peripheral EEPROM IC(U114,U115). GM1501(U402) controls peripheral devices through IIC line. Major functions are (1) to control Flash memory through DDC-SCLA, DDC-SDAA of D-sub and (2) to store EDID data in the EEPROM (U114,U115).

3. Video Decoder

This block is composed of UPD64011 (U904) and peripheral devices. GM 1501 controls this IC through IIC Line. This IC analyzes input signal of CVBS, Y/C and output analyzed signal (16bit interlace signal) to De-interlace block. Analyzed signal has video control signals like Contrast, Brightness, Sharpness, Color, tint signals Including Adaptive Comb Filter.

4. Audio Decoder

This block is composed of MSP3420G (U501) and peripheral devices. GM 1501 controls this IC through IIC Line. This IC analyzes audio input signal through A/V Jack and PC audio. The analyzed signals transmitted to audio amplifier (TPA3004, U502).

6. De-interlacer

This block is composed of MDIN150(U901) and peripheral devices. GM1501 (U402) controls this IC through IIC Line. And this IC converts 16 Bit Interlaced Y/UV signal to De-interlaced signal. It output converted signal to Format Converter IC(GM 1501, U402).

7. Format Converter

This block is composed of GM 1501(U402) and peripheral devices. GM 1501(Scaler,U402) contains MICOM.

1) This IC contain A/D converter, Pre-amp and PLL circuit that converting analog video signal(0.7Vp-p) through D-sub(J101) Pin to digital signal.

2) This IC Decode TMDS signals of 8 line from DVI-D Pin (J102) and transmit to LVDS Transmitter. GM 1501 is Format Converter IC that receives Digital signal and outputs proper frame signal to LCD Module Timing(1366x768,WXGA).

8. DC/DC Converter block

DC/DC Converter convert the input 12V, 24V to proper

2.5V, 3.3V, 5V, 1.8V for main control system. For shooting heat trouble, we use the DC/DC converting IC.

9. Caption/V-CHIP block -Only U.S.A

This block is composed of M37272(U1001) and peripheral devices. M37272 IC is useful for channel selection system for TV with a closed caption decoder.

10. Power Supply Block

This Block generates DC Voltages(12V, 24V) to Main Control system from AC Power(100-240 V, 50/60 Hz,

2.8 A). This Circuit contains PFC(Power Factor correction) circuit. The Minimum of Power efficiency is about 75%.

5. Audio Amplifier

This block is composed of TPA3004 (U502) and peripheral devices. The function of the audio amplifier is that to amplify audio L/R signal transmitted from audio decoder. The audio signal is amplified according to pre-defined DC volume control curve.

- 10 -

ADJUSTMENT

RS-232C

EXT.

220

IBM Compatible PC

Parallel Port

Power inlet (required)

Power LED

ST Switch

Power Select Switch (110V/220V)

Control Line

Not used

RS232C

PARALLEL

V-SYNC

POWER

VGS

MONITOR

V-Sync On/Off Switch (Switch must be ON.)

4.7K

74LS06

OFF ON

OFF

All adjustment are thoroughly checked and corrected when the monitor leaves the factory, but sometimes several minor adjustment may be required. Adjustment should be following procedure and after warming up for a minimum of 30 minutes.

• Alignment appliances and tools.

- IBM compatible PC

- Programmable Signal Generator. (eg. VG-819 made by Astrodesign Co.)

- Oscilloscope.

- White Balance Meter. (CA-110)

1. DDC Data Write Procedure-Analog

1) Use this procedure only when there is some

problem on Analog EDID data.

2) Run alignment program for L3200TC on the IBM

compatible PC.

3) Select EEPROM → Analog EDID write command

and Enter.

4) This will write the Analog EDID data to EEPROM.

2. DDC Data Write Procedure-Digital

1) Use this procedure only when there is some problem on Digital EDID data.

2) Run alignment program for L3200TC on the IBM compatible PC.

3) Select EEPROM → Digital EDID write command and Enter.

4) This will write the Digital EDID data to EEPROM.

Figure 1. Cable Connection

- 11 -

Windows EDID V1.0 User Manual

Operating System: MS Windows 98, 2000, XP Port Setup: Windows 98 => Don’t need setup

Windows 2000, XP => Need to Port Setup.

This program is available to LCD Monitor only.

1. Port Setup a) Copy “UserPort.sys” file to

“c:\WINNT\system32\drivers” folder

b) Run Userport.exe

c) Remove all default number d) Add 300-3FF

2. EDID Read & Write

1) Run WinEDID.exe

2) Edit Week of Manufacture, Year of Manufacture, Serial Number a) Input User Info Data b) Click “Update” button c) Click “ Write” button

e) Click Start button. f) Click Exit button.

- 12 -

SERVICE OSD

SEREVICE MENU

Model : L3200T V1.0 Elapsed Time : 0H NVram Inatial OFF

WB Adjust Aging Mode OFF

Model Select L3200 TV <-> AV AV

Country Option

SEREVICE MENU

CNN Resolution

AI OFF Hotel Mode SET SVC Display SET Video H Positoin 0 Video V Positoin 0 RS232 Select Nomal

USA

OFF Auto

■ Service Menu

- Model : Model or Micom Version

- Elapsed time : Time used for panel

- Nvram Initial : EEPROM reset and use Default Data

- WB Adjust : Adjusts the white balance

- Aging Mode : Sets the aging mode (User : OFF)

- Model Select : Use the sizes Model change

- TV <-> AV : TV Model, AV Model change

- Contry Option : Chooses a country

- CNN : Use the CNN Option (only CNN version ON)

- Resolution : Adjusts the picture resolution

- AI : Function built in panel

- Hotel Mode : Enters with the menu which sets a hotel mode

- SVC Display : Color of video input at regulation hour use

- Video H Position :

Horizontality position of video input at the change

- Video V Position : Verticality position of video input at the change

- RS232 Select : Change RS232 Protocol

- 13 -

NO POWER

(POWER INDICATOR OFF)

TROUBLESHOOTING GUIDE

1. NO POWER

CHECK J601 VOLTAGE

2 3

4 5

(18V, 12V, 5V)?

J602 VOLTAGE

(24V, 33V) ?

(14.318MHz) ?

(SUB POWER) ?

YES

CHECK

YES

CHECK

X401

YES

CHECK

J601

CHECK POWER BOARD

CHECK X401

CHECK MICOM(U402)

SUB POWER PORT(R634)

YES

CHECK KEY

CONTROL BOARD

Waveforms

1 3

J601-18V J601-12V J601-5V

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