LG L170 Schematic

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Page 1

COLOR MONITOR

SERVICE MANUAL

CAUTION

BEFORE SERVICING THE UNIT, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

MODEL: L170 (6734 - AB9)

Chassis No. : CL-61

Page 2

CONTENTS

SPECIFICATIONS

- 2 -

1. LCD CHARACTERISTICS

Type : TFT XGA LCD Module Size : 358.5(H) x 296.5(V) x 17.0(D) Pixel Pitch : 0.264mm x 0.264mm Color Depth :

16.2M colors Active Video Area : 17.0inch (432.7mm) Surface Treatment : Anti-Glare, Hard Coating (3H) Backlight Unit : 4CCFL Opraating Mode : Transmissive mode, Normally white Electrical Interface : LVDS interface

2. OPTICAL CHARACTERISTICS

2-1. Viewing Angle by Contrast Ratio

≥

LPL Module

Left : -60° min. -70° typ. Right: +60° min. +70° typ. Top : +45° min. +60° typ. Bottom: -45° min. -60° typ.

AUO Module

Left : -60° min. -70° typ. Right: +60° min. +70° typ. Top : +60° min. +70° typ.Right: -60° min. -70° typ.

2-2. Luminance :

250(min.), 300(typ.) - LPL

300(typ) - AUO

2-3. Contrast Ratio : 300(min.), 450(typ.) - LPL

450(typ) -

AUO

3. SIGNAL (Refer to the Timing Chart)

3-1. Sync Signal

1) Type : Separate Sync. (Horizontal & Vertical)

2) Input Voltage Level: Low=0~0.8V, High=2.1~5.5V

3) Sync Polarity : Positive or Negative

3-2. Video Input Signal

1) Type : R, G, B Analog

2) Voltage Level : 0~0.7 V a) Color 0, 0 : 0 Vp-p b) Color 7, 0 : 0.35 Vp-p c) Color 15, 0 : 0.7 Vp-p

3) Input Impedance : 75 Ω

3-3. Operating Frequency

Horizontal : 31 ~ 81kHz Vertical : 55 ~ 75Hz

3-4. Resolution

Max. : 1280 x 1024@75Hz Recommend : 1280 x 1024@60Hz

4. POWER SUPPLY

4-1. Power

90-264V~, 50/60Hz 0.6A

4-2. Power Consumption

5. ENVIRONMENT

5-1. Operating Temperature: 10°C~35°C 5-2. Operating Humidity : 10%~80% 5-3. MTBF : 50,000 HRS (Min.)

Lamp Life : 25,000 Hours (Min.)

6. DIMENSIONS (with TILT / with Base)

Width : 398.9mm (15.70'') Depth : 222mm (8.74'') Height : 412.9mm (16.25'')

7. WEIGHT (with TILT)

Net. Weight : 5.3kg (11.69 lbs) Gross Weight : 7.3kg (16.07lbs)

SPECIFICATIONS ................................................... 2

PRECAUTIONS ....................................................... 3

SERVICE PRECAUTIONS ...................................... 4

TIMING CHART ....................................................... 6

DISASSEMBLY .........................................................8

WIRING DIAGRAM ............................................... 10

BLOCK DIAGRAM ................................................. 11

DESCRIPTION OF BLOCK DIAGRAM ................. 12

ADJUSTMENT ...................................................... 14

TROUBLESHOOTING GUIDE .............................. 16

EXPLODED VIEW...................................................20

REPLACEMENT PARTS LIST ...............................22

SCHEMATIC DIAGRAM......................................... 24

MODE

POWER ON (NORMAL)

POWER S/W ON

POWER S/W OFF

H/V SYNC

ON/ON

POWER CONSUMPTION

less than 40 W

less than 2 W

LED COLOR

GREEN AMBER

OFF

VIDEO

ACTIVE

OFF

Page 3

- 3 -

WARNING FOR THE SAFETY-RELATED COMPONENT.

• There are some special components used in LCD monitor that are important for safety. These parts are

marked on the schematic diagram and the replacement parts list. It is essential that these critical

parts should be replaced with the manufacturer’s specified parts to prevent electric shock, fire or other hazard.

• Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee.

TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT.

• Must mount the module using mounting holes arranged in four corners.

• Do not press on the panel, edge of the frame strongly or electric shock as this will result in damage to the screen.

• Do not scratch or press on the panel with any sharp objects, such as pencil or pen as this may result in damage to the panel.

• Protect the module from the ESD as it may damage the electronic circuit (C-MOS).

• Make certain that treatment person’s body are grounded through wrist band.

• Do not leave the module in high temperature and in areas of high humidity for a long time.

• The module not be exposed to the direct sunlight.

• Avoid contact with water as it may a short circuit within the module.

• If the surface of panel become dirty, please wipe it off with a softmaterial. (Cleaning with a dirty or rough cloth may damage the panel.)

WARNING

BE CAREFUL ELECTRIC SHOCK !

• If you want to replace with the new backlight (CCFL) or inverter circuit, must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms.

• Handle with care wires or connectors of the inverter circuit. If the wires are pressed cause short and may burn or take fire.

Leakage Current Hot Check Circuit

PRECAUTION

CAUTION

Please use only a plastic screwdriver to protect yourself from shock hazard during service operation.

1.5 Kohm/10W

To Instrument's exposed METALLIC PARTS

Good Earth Ground such as WATER PIPE, CONDUIT etc.

AC Volt-meter

Page 4

SERVICING PRECAUTIONS

- 4 -

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit

board module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical

plug or other electrical connection.

c. Connecting a test substitute in parallel with an

electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

d. Discharging the picture tube anode.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Discharge the picture tube anode only by (a) first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected, and then (b) touch the other end of the insulated clip lead to the picture tube anode button, using an insulating handle to avoid personal contact with high voltage.

4. Do not spray chemicals on or near this receiver or any of its assemblies.

5. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cottontipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

6. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

7. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

8. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

9. Use with this receiver only the test fixtures specified in

this service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "antistatic" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

Page 5

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General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip

temperature within the range or 500

F to 600 F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire-bristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal

temperature. (500

F to 600 F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static,

suction-type solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuitboard printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal

temperature (500

F to 600 F)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of

the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any

excess or splashed solder with a small wire-bristle brush.

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Page 6

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Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

TIMING CHART

VIDEO

SYNC

Page 7

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Mode

H/V

Sort

Sync

Porarity

DOT

Clock

Frequency

Total

Period (E)

Video Active

Time

(A)

Front

Porch (D)

Sync

Duration(C)

Back

Porch (B)

Resolution

H(Pixels)

25.175

31.469 800 640 16 96 48 640 x 350

V(Lines)

- 70.8 449 350 37 2 60

H(Pixels)

25.175

31.469 800 640 16 96 48 640 x 480

V(Lines)

- 59.94 525 480 10 2 33

H(Pixels)

30.240

35.00 KHz 864 640 64 64 96 640 x 480

V(Lines)

- 66.667 Hz 525 480 3 3 39

H(Pixels)

31.5

37.861 832 640 24 40 128

640 x 480

V(Lines)

- 72.809 520 480 9 3 28

H(Pixels)

31.5

37.5 840 640 16 64 120

640 x 480

V(Lines)

- 75 500 480 1 3 16

H(Pixels)

28.350

31.50 KHz 900 720 18 108 54

720 x 400

V(Lines)

+ 70.156 Hz 449 400 12 3 34

H(Pixels)

40.0

37.879 1056 800 40 128 88

800 x 600

V(Lines)

+ 60.317 628 600 1 4 23

H(Pixels)

48.077 1040 800 56 120 64

800 x 600

V(Lines)

+ 72.188 666 600 37 6 23

H(Pixels)

49.5

46.875 1056 800 16 80 160

800 x 600

V(Lines)

+ 75.0 625 600 1 3 21

H(Pixels)

+/-

57.283

49.725 1152 832 32 64 224

832 x 624

V(Lines)

+/- 74.55 667 624 1 3 39

H(Pixels)

65.0

48.363 1344 1024 24 136 160

1024 x 768

V(Lines)

- 60.0 806 768 3 6 29

H(Pixels)

56.476 1328 1024 24 136 144

1024 x 768

V(Lines)

- 70.069 806 768 3 6 29

H(Pixels)

78.75

60.123 1312 1024 16 96 176

1024 x 768

V(Lines)

- 75.029 800 768 1 3 28

H(Pixels)

80.00

60.241 1328 1024 32 96 176

1024 x 768

V(Lines)

- 74.927 804 768 3 3 30

H(Pixels)

108

67.5 1600 1152 64 128 256

1152 x 864

V(Lines)

+ 75 900 864 1 3 32

H(Pixels)

+/-

100.0

68.681 1456 1152 32 128 144

1152 x 870

V(Lines)

+/- 75.062 915 870 3 3 39

H(Pixels)

+/-

92.978

61.805 1504 1152 18 134 200

1152 x 900

V(Lines)

+/- 65.96 937 900 2 4 31

H(Pixels)

108.00

60.000 1800 1280 96 112 312

1280 x 960

V(Lines)

+ 60.000 1000 960 1 3 36

H(Pixels)

108.0

63.981 1688 1280 48 112 248

1280 x 1024

V(Lines)

+ 60.02 1066 1024 1 3 38

H(Pixels)

135

78.125 1728 1280 64 192 192

1280 x 1024

V(Lines)

- 72.005 1085 1024 3 3 55

H(Pixels)

135.0

79.976 1688 1280 16 144 248

1280 x 1024

V(Lines)

+ 75.035 1066 1024 1 3 38

Page 8

DISASSEMBLY

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Disassembly Hinge Cover.

Pull the rear cover assy out from stand.

Remove the screws.

Disassemble the four screw cover by using something sharp.

# 1

Pull the Hinge Cover out From the Stand.

Put a soft cushion on the floor and lay the stand on it.

1. Remove the screw for the signal cable.

2. Pull out the signal cable.

Remove the four screws from the Back cover.

# 2

# 3 # 4

# 5 # 6

# 7 # 8

Page 9

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1. Pull the front cover upward.

2. Then, let the all latches are separated.

3. Put the from face down.

Remove te two screws for control pcb fix.

Disassemble inverter shield something thin.

Pull out the lamp cables

# 9

Disassemble back cover

Detach Al-tape from panel.

Remove the 4 screws from each side of metal frame

1. Lift downside of metal frame

2. Detach the insulation tage

3. Pull out the link cable

# 10

# 11 # 12

# 13 # 14

# 15 # 16

Page 10

- 10 -

WIRING DIAGRAM

Connector Ass’y P/N:

6631T11012W

Connector Ass’y P/N:

6631T20022G

Connector Ass’y P/N:

6631T20023J

Page 11

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BLOCK DIAGRAM

Micom

MTV312

))

nn gg

ii SS

((

LCD Module

differential

R,G,B

3.3V

Diode

KDS184

3.3V

Reg.

including

MST9111B

(ADC/LVDS/SCALER )

2.5V

3.3V

R,G,B, H/V Sync

LIPS

12V

3.3V

D-SUB

AC Input

Page 12

DESCRIPTION OF BLOCK DIAGRAM

- 12 -

1. Video Controller Part.

This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the digital video signal using a pixel clock. The pixel clock for each mode is generated by the PLL. The range of the pixel clock is from 25MHz to 135MHz. This part consists of the Scaler, ADC, LVDS transmitter. The Scaler gets the video signal converted analog to digital, interpolates input to 1280 X 1024 resolution signal and outputs 8-bit R, G, B signal to transmitter.

2. Power Part.

This part consists of the one 3.3V regulator, and two 2.5V drop diodes to convert power which is provided 12V, 5V in Power board. 5V is provided for LCD panel and Micom. Also, 5V is converted 3.3V by regulator and 3.3V is converted 2.5V by drop diode. Converted power is provided for IC in the main board.

3. MICOM Part.

This part consists of EEPROM IC which stores control data, Reset IC and the Micom. The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable. The controlled data of each modes is stored in EEPROM.

Page 13

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Operation description_LIPS

LIPS Board Block Diagram

1. EMI components.

This part contains of EMI components to comply with global marketing EMI standards like FCC, VCCI CISPR, the circuit included a line-filter, across line capacitor and of course the primary protection fuse.

2. Input rectifier and filter.

This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor.

3. Energy Transfer.

This part function is transfer the primary energy to secondary through a power transformer.

4. Output rectifier and filter.

This part function is to make a pulse width modulation control and to provide the driver signal to power switch, to adjust the duty cycle during different AC input and output loading condition to achive the dc output stablize, and also the over power protection is also monitor by this part.

5. Photo-Coupler isolation.

This part function is to feed back the dc output changing status through a photo transistor to primary controller to achieve the stabilized dc output voltage.

6. Signal collection.

This part function is to collect the any change from the dc output and feed back to the primary through photo transistor.

50 ~ 60Hz

LINE

100 ~ 240V

EMI

COMPONENTS

PRIMARY SECONDARY

INPUT RECTIFIER

AND FILTER

PWM

CONTROL

CIRCUIT

HVDC

ENERGY

TRANSFER

PHOTO-

COUPLER

ISOLATION

100KHz

OUTPUT RECTIFIER

AND FILTER

SIGNAL

COLLECTI

12V

GND

Page 14

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ADJUSTMENT

Windows EDID V1.0 User Manual

Operating System: MS Windows 98, 2000, XP Port Setup: Windows 98 => Don’t need setup

Windows 2000, XP => Need to Port Setup.

This program is available to LCD Monitor only.

1. Port Setup a) Copy “UserPort.sys” file to

“c:\WINNT\system32\drivers” folder

b) Run Userport.exe

c) Remove all default number d) Add 300-3FF

e) Click Start button. f) Click Exit button.

2. EDID Read & Write

1) Run WinEDID.exe

2) Edit Week of Manufacture, Year of Manufacture, Serial Number a) Input User Info Data b) Click “Update” button c) Click “ Write” button

Page 15

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Figure 1. Cable Connection

SERVICE OSD

1) Turn off the power switch at the front side of the display.

2) Wait for about 3 seconds and press Exit POWER switch with 1 second interval.

3) The SVC OSD menu contains additional menus that the User OSD menu as described below.

a) MODULE SELECT b) NVRAM INIT : EEPROM initialize(24C08) c) ADC OFFSET : The lowest value of input leves sets to digitally 0(zero). d) ADC GAIN : The highest value of input levels sets to digitally 255. e) ADC CAL : W/B balance sets the gain and offset value. f) ELAPSED CLEAR : To initialize using time. g) AGING : To select factory aging mode. h) ELAPSED TIME : ## Hr => Display the monitor's elapsed time.

Video Signal Generator

Control Line

IBM Compatible PC

PARALLEL PORT

Not used

RS232C

PARALLEL

Power inlet (required)

220

VGS

MONITOR

POWER

V-SYNC

Power Select Switch (110V/220V)

Power LED

ST Switch

V-Sync On/Off Switch (Switch must be ON.)

OFF ON

OFF

4.7K

74LS06

4.7K

Page 16

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TROUBLESHOOTING GUIDE

1. NO POWER

NO POWER

(POWER INDICATOR OFF)

CHECK KEY CONTROL

CONNECTOR ROUTINE

CHECK U201

CHECK POWER BOARD, AND FIND OUT A SHORT POINT AS OPENING EACH POWER LINE

CHECK 5VS LINE

(OPEN CHECK)

CHECK 3.3V LINE

CHECK X-TAL

YES

CHECK J705 VOLTAGE

PIN5, PIN6 (5V)?

CHECK

U501 PIN 8 Voltage

(5V) ?

IS U201

PIN114 (3.3V)

VOLTAGE ?

CHECK U201 PIN 122

PULSE

NO PROBLEM

Page 17

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2. NO RASTER (OSD IS NOT DISPLAYED) – LIPS

NO RASTER

(OSD IS NOT DISPLAYED)

REPLACE CCFL LAMP

IN THE LCD MODULE

CHECK LIPS

CHECK MICOM INV ON/OFF PORT.

1. CONFIRM BRIGHTNESS OSD CONTRL STATE.

2. CHECK MICOM DIM-ADJ PORT

LIPS

YES

J705

PIN5, PIN6

5V?

J705 PIN9

5V?

J705 PIN10

5V?

CHECK

PULSE AS

CONTACTING SCOPE

PROBE TO CAUTION LABEL.

(CONTACT PROBE TO

CAUTION LABEL.

CAN YOU SEE PULSE

AT YOUR

SCOPE?

Page 18

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3. NO RASTER (OSD IS NOT DISPLAYED) – MST9111B

NO RASTER

(OSD IS NOT DISPLAYED)

TROUBLE IN CABLE

OR LCD MODULE

CHECK U801

1. CHECK PIN122, 123 SOLDERING CONDITION

2. CHECK X501

3. TROUBLE IN U201

CHECK CONNECTION LINE FROM D-SUB TO U501

YES

U201

POWER PIN8, 114

3.3V

U201

PIN122, 123

OSCILLATE AS

12MHZ?

U501

PIN43 IS 48KHz H-SYNC?

PIN44 IS 60Hz V-SYNC?

IS PULSE APPEARED

AT SIGNAL PINS?

AT MODE 12?

Page 19

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4. TROUBLE IN DPM

TROUBLE IN DPM

TROUBLE IN U501

CHECK PC PC IS NOT GOING INTO DPM OFF MODE

CHECK H/V SYNC LINE

YES

CHECK

R773, R775 (SYNC) ?

CHECK

U501 PIN 43.44

SYNC PULSE ?

Page 20

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EXPLODED VIEW

Page 21

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EXPLODED VIEW PARTS LIST

3 4 5 6

9 10 11 12

3091TKL107B CABINET ASSEMBLY, LL170M IBM L096A STEALTH BK LGEWA 6304FLP107A

LCD(LIQUID CRYSTAL DISPLAY), LM170E01-B5K1 LG PHILPS TFT COLOR (LOX73L),300NITS SXGA LVDS

6304FAU012C

LCD(LIQUID CRYSTAL DISPLAY), M170EG01-V0 AUO TFT COLOR SXGA LVDS 300NITS PSWG TCO-03

3809TKL077B BACK COVER ASSEMBLY, LL170M L080A STEALTH BK LGEWA 3043TKK160B TILT SWIVEL ASSEMBLY, LL170M . STEALTH BK LGEWA 3550TKK521A COVER, LL170M HINGE IBM17" 3551TKK524A COVER ASSEMBLY, LL170M STAND . REAR COVER

6871TPT272A PWB(PCB) ASSEMBLY,POWER, LL170M(IBM) POWER TOTAL POWERNET LIPS FOR LPL

6871TPT272B PWB(PCB) ASSEMBLY,POWER, LL170M(IBM) POWER TOTAL POWERNET LIPS FOR AUO

3313TL2018B MAIN TOTAL ASSEMBLY, LL170M IBM CL-61 - LPL

3313TL2018C MAIN TOTAL ASSEMBLY, LL170M IBM CL-61- AUO 4951TKS149B METAL ASSEMBLY, FRAME MAIN LL170M LGEWA SKD 4814TKK269B SHIELD, INVERTER LL170M LGEWA CKD

6871TST547A PWB(PCB) ASSEMBLY,SUB, LL170M CONTROL TOTAL IBM CL-61 5040TKM072A RUBBER, COVER MOLDING SCREW(LL170M)SANTOPRENE S/BLACK

Description

Part No.Ref. No.

Page 22

- 22 -

DATE: 2004. 06. 04.

*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION

C204 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C205 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C206 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C207 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C208 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C209 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C210 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C211 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C214 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C215 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C216 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C217 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C218 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C219 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C220 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C221 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C222 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C223 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C225 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C226 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C227 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C230 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C231 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C232 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C233 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C240 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C251 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C501 0CC101CK41A 100PF 1608 50V 5% R/TP NP0 C502 0CC101CK41A 100PF 1608 50V 5% R/TP NP0 C503 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C504 0CH8106F611 10UF 16V M 85STD(CYL) R/TP C506 0CC030CK01A 3PF 1608 50V 0.25 PF R/TP NP C507 0CC180CK41A 18PF 1608 50V 5% R/TP NP0 C508 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C701 0CK105CD56A 1UF 1608 10V 10% R/TP X7R C703 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C708 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C709 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C710 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C711 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C717 0CC101CK41A 100PF 1608 50V 5% R/TP NP0 C718 0CC101CK41A 100PF 1608 50V 5% R/TP NP0 C719 0CC680CK41A 68PF 1608 50V 5% R/TP NP0 C720 0CC101CK41A 100PF 1608 50V 5% R/TP NP0 C721 0CC680CK41A 68PF 1608 50V 5% R/TP NP0 C727 0CK105CD56A 1UF 1608 10V 10% R/TP X7R C732 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C733 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C734 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C735 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C760 0CE107EF610 "100UF KMG,RD 16V 20% FL BULK" C801 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y

DATE: 2004. 06. 04.

*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION

C803 0CE107EF610 "100UF KMG,RD 16V 20% FL BULK" C804 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C805 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C806 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C807 0CE107EF610 "100UF KMG,RD 16V 20% FL BULK" C808 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C809 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y C810 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C812 0CE107EF610 "100UF KMG,RD 16V 20% FL BULK" C814 0CE107EF610 "100UF KMG,RD 16V 20% FL BULK" C815 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7R C816 0CK103CK51A 0.01UF 1608 50V 10% R/TP B(Y

D701 0DS226009AA KDS226 TP KEC SOT-23 80V 30 D702 0DS226009AA KDS226 TP KEC SOT-23 80V 30 D706 0DS226009AA KDS226 TP KEC SOT-23 80V 30 D804 0DSDI00068A BAV70 DIODES R/TP SOT23 100V D805 0DSDI00068A BAV70 DIODES R/TP SOT23 100V ZD701 0DZ560009GB BZT52C5V6S DIODES R/TP SOD32 ZD702 0DZ560009GB BZT52C5V6S DIODES R/TP SOD32 ZD703 0DZ560009GB BZT52C5V6S DIODES R/TP SOD32 ZD704 0DZ560009GB BZT52C5V6S DIODES R/TP SOD32 ZD705 0DZ560009GB BZT52C5V6S DIODES R/TP SOD32 ZD711 0DZ560009GB BZT52C5V6S DIODES R/TP SOD32

U201 0IPRPM3008B "MST9111B(ANALOG) MSTAR 128P," U501 0IZZTSZ458A MYSON MTV312 LL170M U502 0ISG240860B M24C08W6 SGS-THOMSON 8SOP R/ U801 0IPMGKE011A KIA78D33F KEC DPAK R/TP 3.3V

Q502 0IKE704200H KIA7042AP TO-92 TP 4.2 VOLT Q503 0TR390409AE FAIRCHILD KST3904(LGEMTF) TP Q504 0TR390409AE FAIRCHILD KST3904(LGEMTF) TP Q505 0TR390409AE FAIRCHILD KST3904(LGEMTF) TP Q703 0TR390609FA KST3906-MTF TP SAMSUNG SOT2 Q704 0TR390609FA KST3906-MTF TP SAMSUNG SOT2 Q706 0TR390409AE FAIRCHILD KST3904(LGEMTF) TP Q707 0TR390409AE FAIRCHILD KST3904(LGEMTF) TP Q801 0TR127309AA KTA1273-Y(KTA966A) TP KEC TO Q802 0TR390409AE FAIRCHILD KST3904(LGEMTF) TP

R201 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP R202 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP R203 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP R207 0RJ3900D677 390 OHM 1/10 W 5% 1608 R/TP R208 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP

REPLACEMENT PARTS LIST

CAUTION: BEFORE REPLACING ANY OF THESE COMPONENTS,

READ CAREFULLY THE SAFETY PRECAUTIONS IN THIS MANUAL.

* NOTE : S SAFETY Mark

AL ALTERNATIVE PARTS

MAIN BOARD

CAPACITORS

DIODEs

ICs

TRANSISTOR

RESISTORs

Page 23

DATE: 2004. 06. 04.

*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION

R209 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP R210 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP R213 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R214 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R220 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R240 0RJ1001D677 1K OHM 1/10 W 5% 1608 R/TP R506 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R508 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R512 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP R513 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP R514 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R515 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R516 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R518 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R519 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R520 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R521 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R522 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R523 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R524 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R525 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R526 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R527 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R528 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R529 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R531 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R532 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R534 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R535 0RJ3301D677 3.3K OHM 1/10 W 5% 1608 R/TP R537 0RJ3301D677 3.3K OHM 1/10 W 5% 1608 R/TP R541 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R542 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R543 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R544 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R545 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP R546 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R547 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP R548 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP R549 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP R555 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R556 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP R557 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R560 0RJ1501D677 1.5K OHM 1/10 W 5% 1608 R/TP R561 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R563 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R564 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R565 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R566 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R701 0RJ0752D677 75 OHM 1/10 W 5% 1608 R/TP R703 0RJ0752D677 75 OHM 1/10 W 5% 1608 R/TP R706 0RJ0752D677 75 OHM 1/10 W 5% 1608 R/TP R708 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP R709 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/TP R716 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R717 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R720 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R722 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R723 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP R724 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP R726 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R727 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R737 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP

DATE: 2004. 06. 04.

*S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION

R744 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R745 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R747 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R748 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R769 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R772 0RJ1001D677 1K OHM 1/10 W 5% 1608 R/TP R773 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R774 0RJ1001D677 1K OHM 1/10 W 5% 1608 R/TP R775 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/TP R779 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP R780 0RJ2001D677 2K OHM 1/10 W 5% 1608 R/TP R781 0RJ2001D677 2K OHM 1/10 W 5% 1608 R/TP R782 0RJ0102D677 10 OHM 1/10 W 5% 1608 R/TP R783 0RJ0102D677 10 OHM 1/10 W 5% 1608 R/TP R803 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R804 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/TP R805 0RJ3900D677 390 OHM 1/10 W 5% 1608 R/TP R806 0RJ3900D677 390 OHM 1/10 W 5% 1608 R/TP R807 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/TP R808 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R810 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R818 0RJ3900D677 390 OHM 1/10 W 5% 1608 R/TP R819 0RJ3900D677 390 OHM 1/10 W 5% 1608 R/TP R821 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R822 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R824 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP

X501 6212AA2004A HC-49U TXC 12.0MHZ +/- 30 PP

LED1 0DLLT0089AA LITEON LTL-1BEDJ-0C2 TP GREE R1 0RD4701Q609 4.70K 1/4W(3 5% TA52 R2 0RD4701Q609 4.70K 1/4W(3 5% TA52 R3 0RD8200Q609 820 1/4W(3 5% TA52 R4 0RD8200Q609 820 1/4W(3 5% TA52 R5 0RD1501Q609 1.50K 1/4W(3 5% TA52 SW1 140-058E SKHV10910B LGEC NON 12V 20A SW2 140-058E SKHV10910B LGEC NON 12V 20A SW3 140-058E SKHV10910B LGEC NON 12V 20A SW4 140-058E SKHV10910B LGEC NON 12V 20A SW5 140-058E SKHV10910B LGEC NON 12V 20A ZD1 0DZ560009AG GDZJ5.6B TP GRANDE DO-34 500 ZD2 0DZ560009AG GDZJ5.6B TP GRANDE DO-34 500

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OTHERs

CONTROL BOARD

Page 24