LG KU580 Service Manual

Date: August, 2007 / Issue 1.0

Service Manual

Model : KU580

Service Manual

KU580

Internal Use Only

- 3 -

LGE Internal Use Only

1. INTRODUCTION .............................. 5

1.1 Purpose................................................... 5

1.2 Regulatory Information............................ 5

2. PERFORMANCE.............................. 7

2.1 System Overview .................................... 7

2.2 Usable environment ................................ 8

2.3 Radio Performance ................................. 8

2.4 Current Consumption............................ 16

2.5 RSSI BAR ............................................. 16

2.6 Battery Bar ............................................ 17

2.7 Sound Pressure Level........................... 18

2.8 Charging ............................................... 19

3. Technical Brief .............................. 20

3.1 Digital Baseband(DBB) & Multimedia

Processor.............................................. 20

3.2 GAM Hardware Subsystem ...................41

3.3 Audio Part ..............................................51

3.4 GPADC(General Purpose ADC) and

AUTOADC2 ...........................................59

3.5 Charger control ......................................60

3.6 Voltage Regulation.................................66

3.7 RF Technical Description.......................67

4. TROUBLE SHOOTING ...................78

4.1 Power ON Trouble .................................78

4.2 USB Trouble ..........................................79

4.3 SIM Detect Trouble ................................80

4.4 MicroSD card Trouble ............................81

4.5 Keypad And Touch key Trouble.............82

4.6 Camera Trouble .....................................85

4.7 Main LCD Trouble..................................89

4.8 Keypad Backlight Trouble......................91

4.9 Folder ON/OFF Trouble .........................93

4.10 Audio Trouble Shooting .......................95

4.11 Charger Trouble Shooting..................110

4.12 Checking Bluetooth Block..................113

4.13 RF Component...................................117

4.14 Procedure to check............................118

4.15 Checking Common Power Source

Block ..................................................119

4.16 Checking VCXO Block .......................124

4.17 Checking Front End Module Block.....129

4.18 Checking Front End Module Block

input logic...........................................130

4.19 Checking WCDMA Block ...................133

4.20 Checking GSM Block .........................145

5. KU580 Download Setup Manual 157

6. BLOCK DIAGRAM ....................... 164

6.1 GSM & WCDMA RF Block...................164

7. CIRCUIT DIAGRAM ..................... 167

8. PCB LAYOUT................................175

9. CALIBRATION ..............................181

9.1 General Description .............................181

10. EXPLODED VIEW &

REPLACEMENT PART LIST ......187

10.1 EXPLODED VIEW .............................187

10.2 Replacement Parts ............................189

<Mechanic component> .................... 189

<Main component> ............................ 193

10.3 Accessory ......................................... 208

Table of Contents

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LGE Internal Use Only

Only for training and service purposes

Table Of Contents

- 5 -

LGE Internal Use Only

Table Of Contents

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the features of this model.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of commoncarrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.

1. INTRODUCTION

- 6 -

LGE Internal Use Only

Only for training and service purposes

1. INTRODUCTION

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as described.

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LGE Internal Use Only

2. PERFORMANCE

2.1 System Overview

2. PERFORMANCE

Item Specification

Shape GSM900/1800/1900 & WCDMA Slide type - Dual Mode Handset

Size 93.9X52.9X16.45 mm

Weight 100g (with standard battery)

Power 860mAh Li-Polymer

Talk Time Over 170 Min (WCDMA, Tx=12 dBm, Voice)

Over 200 Min (GSM, Tx=Max, Voice)

Standby Time Over 280 hrs (WCDMA, DRX=2.56)

Over 280 hrs (GSM, Paging period=5)

Antenna Intenna type

Main LCD 2.0"(320x240), 260K TFT Color LCD

Main LCD BL White LED Backlight

Vibrator Yes (Coin Type)

MIC Yes (SMD Type)

Receiver Yes

Earphone Jack Yes

SIM Socket Yes(SIM Block Type) : 3.0V & 1.8V

Volume Key Push Type ( + , - )

Voice Key Push Type

External Memory T - Flash Socket

I/O Connect 18 Pin

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LGE Internal Use Only

Only for training and service purposes

2. PERFORMANCE

2.2 Usable environment

1) Environment

2) Environment(Accessory)

* CLA : 12~24V (DC)

2.3 Radio Performance

1) Transmitter - GSM Mode

Item Spec. Unit

Voltage 3.7 (Typ), 3.4 (Min), (Shut Down: 3.23) V

Operating Temp. -20 ~ +60 °C

Storage Temp. -30 ~ +85 °C

Humidity max. 85 %

Item Spec. Min Typ. Max Unit

Power Available power 100 220 240 Vac

No Item GSM DCS & PCS

100k~1GHz -39dBm

9k ~ 1GHz -39dBm

MS allocated 1G ~ 1710MHz -33dBm

Channel

1G~12.75GHz -33dBm

1710M ~ 1785MHz -39dBm

Conducted 1785M ~ 12.75GHz -33dBm

1 Spurious 100k~880MHz -60dBm 100k ~ 880MHz -60dBm

Emission 880M~915MHz -62dBm 880M ~ 915MHz -62dBm

Idle Mode

915M ~ 1000Mz -60dBm 915M ~ 1000MHz -60dBm

1G ~ 1.71GHz -50dBm 1G ~ 1.71GHz -50dBm

1.71G ~ 1.785GHz -56dBm 1.71G ~ 1.785GHz -56dBm

1.785G ~ 12.75GHz -50dBm 1.785G ~ 12.75GHz -50dBm

- 9 -

LGE Internal Use Only

2. PERFORMANCE

No Item GSM DCS & PCS

30M ~ 1GHz -36dBm

30M~1GHz -36dBm

MS allocated 1G ~ 1710MHz -30dBm

Channel

1G ~ 4GHz -30dBm

1710M ~ 1785MHz -36dBm

Radiated 1785M ~ 4GHz -30dBm

2Spurious 30M ~ 880MHz -57dBm 30M ~ 880MHz -57dBm

Emission 880M ~ 915MHz -59dBm 880M ~ 915MHz -59dBm

Idle Mode

915M ~ 1000Mz -57dBm 915M ~ 1000MHz -57dBm

1G ~ 1.71GHz -47dBm 1G ~ 1.71GHz -47dBm

1.71G ~ 1.785GHz -53dBm 1.71G ~ 1.785GHz -53dBm

1.785G ~ 4GHz -47dBm 1.785G ~ 4GHz -47dBm

3 Frequency Error ±0.1ppm ±0.1ppm

4 Phase Error

±5(RMS) ±5(RMS)

±20(PEAK) ±20(PEAK)

3dB below reference sensitivity 3dB below reference sensitivity

Frequency Error RA250 : ±200Hz RA250: ±250Hz

5 Under Multipath and HT100 : ±100Hz HT100: ±250Hz

Interference Condition TU50 : ±100Hz TU50: ±150Hz

TU3 : ±150Hz TU1.5: ±200Hz

0 ~ 100kHz +0.5dB 0 ~ 100kHz +0.5dB

200kHz -30dB 200kHz -30dB

250kHz -33dB 250kHz -31dB

Due to 400kHz -60dB 400kHz -33dB

Output RF

modulation 600 ~ 1800kHz -66dB 600 ~ 1800kHz -60dB

6 1800 ~ 3000kHz -69dB 1800 ~ 6000kHz -60dB

Spectrum

3000 ~ 6000kHz -71dB ≥6000kHz -73dB

≥6000kHz -77dB

Due to

400kHz -19dB 400kHz -22dB

Switching

600kHz -21dB 600kHz -24dB

transient

1200kHz -21dB 1200kHz -24dB

1800kHz -24dB 1800kHz -27dB

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LGE Internal Use Only

Only for training and service purposes

2. PERFORMANCE

No Item GSM DCS & PCS

Frequency offset 800kHz

7 Intermodulation attenuation –

Intermodulation product should

be Less than 55dB below the

level of Wanted signal

Power control

Power Tolerance

Power control

Power Tolerance

Level (dBm) (dB) Level (dBm) (dB)

533±3 030±3

631±3 128±3

729±3 226±3

827±3 324±3

925±3 422±3

10 23 ±3 5 20 ±3

8 Transmitter Output Power 11 21 ±3 6 18 ±3

12 19 ±3 7 16 ±3

13 17 ±3 8 14 ±3

14 15 ±3 9 12 ±4

15 13 ±3 10 10 ±4

16 11 ±5 11 8 ±4

17 9 ±5 12 6 ±4

18 7 ±5 13 4 ±4

19 5 ±5 14 2 ±5

15 0 ±5

9 Burst timing Mask IN Mask IN

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LGE Internal Use Only

2. PERFORMANCE

2) Transmitter - WCDMA Mode

No Item Specification

1 Maximum Output Power Class 3 : +24dBm(+1/-3dB)

Class 4 : +21dBm(±2dB)

2 Frequency Error ±0.1ppm

3 Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme

Adjust output(TPC command)

cmd 1dB 2dB 3dB

+1 +0.5/1.5 +1/3 +1.5/4.5

4 Inner Loop Power control in uplink 0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5

-1 -0.5/-1.5 -1/-3 -1.5/-4.5

Group (10 equel command group)

+1 +8/+12 +16/+24

5 Minimum Output Power -50dBm(3.84MHz)

Qin/Qout : PCCH quality levels

6 Out-of-synchronization handling of output power Toff@DPCCH/Ior : -22 -> -28dB

Ton@DPCCH/Ior : -24 -> -18dB

7 Transmit OFF Power -56dBm(3.84MHz)

8 Transmit ON/OFF Time Mask

±25us

PRACH,CPCH,uplinlk compressed mode

±25us

9 Change of TFC

Power varies according to the data rate

DTX : DPCH off

(minimize interference between UE)

10 Power setting in uplink compressed ±3dB(after 14slots transmission gap)

11 Occupied Bandwidth(OBW) 5MHz(99%)

-35-15*(∆f-2.5)dBc@∆f=2.5~3.5MHz,30k

12 Spectrum emission Mask

-35-1*(∆f-3.5)dBc@∆f=3.5~7.5MHz,1M

-39-10*(∆f-7.5)dBc@∆f=7.5~8.5MHz,1M

-49dBc@∆f=8.5~12.5MHz,1M

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LGE Internal Use Only

Only for training and service purposes

2. PERFORMANCE

3)Receiver - GSM Mode

No Item Specification

13 Adjacent Channel Leakage Ratio(ACLR)

33dB@5MHz, ACP>-50dBm

43dB@10MHz, ACP>-50dBm

-36dBm@f=9~150KHz, 1K BW

-36dBm@f=50KHz~30MHz, 10K BW

-36dBm@f=30MHz~1000MHz, 100K BW

14

Spurious Emissions -30dBm@f=1~12.5GHz, 1M BW

(*: additional requirement) -41dBm*@1893.5~1919.6MHz, 300k

-67dBm*@925~935MHz, 100k

-79dBm*@935~960MHz, 100k

-71dBm*@1805~1880MHz, 100k

15 Transmit Intermodulation

-31dBc@5MHz,Interferer -40dBc

-41dBc@10MHz, Interferer -40dBc

16 Error Vector Magnitude (EVM)

17.5%(>-20dBm)

(@12.2K, 1DPDCH+1DPCCH)

17 Transmit OFF Power

-15dB@SF=4.768Kbps, Multi-code

transmission

No Item GSM DCS & PCS

1

Sensitivity (TCH/FS Class II) -105dBm -105dBm

2

Co-Channel Rejection

C/Ic=7dB Storage -30 ~ +85

(TCH/FS Class II, RBER, TU high/FH)

3 Adjacent Channel 200kHz C/Ia1=-12dB C/Ia1=-12dB

Rejection 400kHz C/Ia2=-44dB C/Ia2=-44dB

Wanted Signal :-98dBm Wanted Signal :-96dBm

4

Intermodulation Rejection 1st interferer:-44dBm 1st interferer:-44dBm

2nd interferer:-45dBm 2nd interferer:-44dBm

5

Blocking Response Wanted Signal :-101dBm Wanted Signal :-101dBm

(TCH/FS Class II, RBER)

Unwanted Signal: Depend on freq. Unwanted Signal: Depend on freq.

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LGE Internal Use Only

2. PERFORMANCE

4) Receiver - WCDMA Mode

No Item Specification

1 Reference Sensitivity Level -106.7 dBm(3.84 MHz)

-25dBm(3.84MHz)

2 Maximum Input Level -44dBm/3.84MHz(DPCH_Ec)

UE@+20dBm output power(Class3)

3 Adjacent Channel Selectivity (ACS)

33dB

UE@+20dBm output power(Class3)

-56dBm/3.84MHz@10MHz

4In-band Blocking UE@+20dBm output power(Class3)

-44dBm/3.84MHz@15MHz

UE@+20dBm output power(Class3)

-44dBm/3.84MHz@f=2050~2095 and

2185~2230MHz, band a)

UE@+20dBm output power(class3)

-30dBm/3.84MHz@f=2025~2050 &

5 Out-band Blocking 2230~2255MHz, band a)

UE@+20dBm output power(class3)

-15dBm/3.84MHz@f=1~2025 &

2255~12500MHz, band a)

UE@+20dBm output power(class3)

6 Spurious Response

-44dBm CW

UE@+20dBm output power(class3)

-46dBm CW@10MHz &

7 Intermodulation Characteristic -46dBm/3.84MHz@20MHz

UE@+20dBm output power(class3)

-57dBm@f=9KHz~1GHz, 100k BW

8 Spurious Emissions -47dBm@f=1~12.75GHz, 1M

-60dBm@f=1920~1980MHz, 3.84MHz

-60dBm@f=2110~2170MHz, 3.84MHz

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LGE Internal Use Only

Only for training and service purposes

2. PERFORMANCE

5) Bluetooth Mode

5.1) Transmitter

No Item Specification

1 Out Power Class 2 : -6~4dBm

2 Power Density Power density < 20dBm per 100kHz EIRP

3 Power Control Option 2dB ≤ step size ≤ 8dB

4 TX Output Spectrum -Frequency range

fmax & fmin @ below the level of -30dBm

(100khz BW) within 2.4GHz~2.4835GHz

5 TX Output Spectrum -20dB Bandwidth ≤ 1MHz

6 Tx Output Spectrum -Adjacent channel Po

≤ -20dBm @ C/I = 2MHz

≤ -40dBm @ C/I ≥ 3MHz

140kHz ≤ delta f1 avg ≥ 175kHz

7 Modulation Characteristics delta f2max ≥ 115kHz at least 99.9% of all

deltaf2max delta f2avg/deata f1avg0.8

8 Init. Carrier Freq. Tolerance ≤ ± 75KHz

1 slot : ≤ ± 25kHz

9 Carrier Frequency Drift

3 slot : ≤ ± 40kHz

5 slot : ≤ ± 40kHz

Maximum drift rate ≤ 20KHz/50usec

Freq.Range Operating Standby

30MHz~1GHz -36dBm -57dBm

10 Out of Band Spurious Emissions Above 1GHz~12.75GHz -30dBm -47dBm

1.8~1.9GHz -47dBm -47dBm

5.15~5.3GHz -47dBm -47dBm

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LGE Internal Use Only

2. PERFORMANCE

5.2) Receiver

No Item Specification

1 Sensitivity single slot packets BER ≤ 0.1%@-70dBm

2 Sensitivity multi slot packets BER ≤ 0.1%@-70dBm

3 C/I performance BER ≤ 0.1%@ (Low,Mid,High Frequency)

2405MHz, 2441MHz, 2477MHz

Interference Ratio

Co-Channel interference, C/I co-channel 11dB

Adjacent(1MHz)interference, C/I 1MHz 0dB

Adjacent(2MHz)interference, C/I 2MHz -30dB

Adjacent(3MHz)interference, C/I ≥ 3MHz -40dB

Adjacent(3MHz)interference to in band -9dB

mirror frequency, C/I image ±1MHz -20dB

4Blocking Characteristic BER ≤ 0.1%@wanted signal -67dBm

interfering Signal Frequency Power Level

30MHz~2000MHz -10dBm

2000MHz~2400MHz -27dBm

2500MHz~3000MHz -27dBm

3000MHz~12.75GHz -10dBm

5 Intermodluation Performance BER ≤ 0.1%@wanted signal -64dBm

static sinwave signal at f1=-39dBm

a BT modulated signal f2=-39dBm(payload PRBS15)

6 Maximum Input Level BER ≤ 0.1%@-20dBm

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LGE Internal Use Only

Only for training and service purposes

2. PERFORMANCE

2.4 Current Consumption

(VT test : Speaker off, LCD backlight On)

2.5 RSSI BAR

Stand by Voice Call VT

WCDMA

280 Hours = 3.0 mA 170 Min = 300 mA 110 Min= 450 mA

(DRX=2.56) (Tx=12dBm) (Tx=12dBm)

280 Hours = 3.0 mA 200 Min = 250 mA

GSM

(paging=5period) (Tx=Max)

GSM WCDMA

BAR 4 → 3 -91 ± 2 dBm -87 ± 2 dBm

BAR 3 → 2 -96 ± 2 dBm -97 ± 2 dBm

BAR 2 → 1 -101 ± 2 dBm -107 ± 2 dBm

BAR 1 → 0 -106 ± 2 dBm -112 ± 2 dBm

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LGE Internal Use Only

2. PERFORMANCE

2.6 Battery Bar

Indication Standby

BAR 4 → 3 (72%) 3.89 ± 0.05V

BAR 3 → 2 (53%) 3.79 ± 0.05V

BAR 2 → 1 (28%) 3.71 ± 0.05V

BAR 1 → Icon Blinking (7%) 3.61 ± 0.05V

Low voltage, 3.54 ±0.05V(Talk: 1min. interval) -3%

warning message 3.54 ±0.05V(Standby: 3min. Inverval) -3%

Power OFF 3.10 ±0.05V ↓ (WCDMA Talk)

3.20 ±0.05V ↓ (else)

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LGE Internal Use Only

Only for training and service purposes

2. PERFORMANCE

2.7 Sound Pressure Level

No Test Item Specification

1 Sending Loudness Rating (SLR)

NOM

8±3dB

MAX

2 Receiving Loudness Rating (RLR)

NOM -1±3dB

MAX -15±3dB

3 Side Tone Masking Rating (STMR)

NOM

17dB over

MAX

4 Echo Loss (EL)

NOM

40dB over

MAX 5 Sending Distortion (SD) refer to TABLE 30.3 6 Receiving Distortion (RD) refer to TABLE 30.4

7 Idle Noise-Sending (INS)

NOM

-64dBm0p under

MAX

8 Idle Noise-Receiving (INR)

NOM -47dBPA under

MAX -36dBPA under

9 Sending Loudness Rating (SLR)

NOM

8±3dB

MAX

10 Receiving Loudness Rating (RLR)

NOM -1±3dB

MAX -12±3dB

11 Side Tone Masking Rating (STMR)

NOM

25dB over

MAX

12 Echo Loss (EL)

NOM

40dB over

MAX

13 Sending Distortion (SD) refer to TABLE 30.3 14 Receiving Distortion (RD) refer to TABLE 30.4

15 Idle Noise-Sending (INS)

NOM

-55dBm0p under

MAX

16 Idle Noise-Receiving (INR)

NOM -45dBPA under

MAX -40dBPA under

TDMA NOISE

GSM

SEND

–.GSM: Power Level: 5

MS

REV.

DCS: Power Level: 0

DCS

SEND

17

(Cell Power: -90 ~ -105dBm) REV.

-62dBm under

–.Acoustic(Max Vol.)

GSM

SEND

MS/HEADSET SLR: 8±3dB

Headset

REV.

MS/HEADSET RLR: -13±1dB/-15dB

DCS

SEND

(SLR/RLR: mid-Value Setting) REV.

A C O U S

T

I

C

MS

HEAD

SET

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LGE Internal Use Only

2. PERFORMANCE

2.8 Charging

• Normal mode: Complete Voltage: 4.2V Charging Current: 500mA

• Await mode: In case of During a Call, should be kept 3.9V

(GSM: It should be kept 3.9V in all power level WCDMA: It will not be kept 3.9V in some power level)

• Extend await mode: At Charging prohibited temperature(0˚C under or 45˚C over)

(GSM: It should be kept 3.7V in all power level WCDMA: It will not be kept 3.7V in some power level)

- 20 -

3. Technical Brief

LGE Internal Use Only

Only for training and service purposes

3. BB Technical Description

3.1 Digital Baseband(DBB) & Multimedia Processor

3.1.1 General Description

• Access subsystem

- Access Central Processing Unit (CPU) subsystem - ARM926, Joint Test Action Group (JTAG), Embedded Trace Module (ETM), Instruction and Data (I&D)-cache, and I&DTCM

- Access peripheral subsystems - Subscriber Identity Module (SIM) interface, IrDA®, Universal Serial Bus (USB), Universal Asynchronous Receiver/Transmitter (UART), and so on

- Digital Signal Processor (DSP) subsystem - CEVA-X1620, JTAG, Static Random Access Memory (SRAM), and Program Data Read Only Memory (PDROM)

- EDGE/GSM/GPRS (EGG) subsystem - EGG hardware accelerators

- WCDMA subsystem - WCDMA hardware accelerators

• Application subsystem

- Application CPU subsystem - containing ARM926, JTAG, ETM, I&D-cache, and I&D-TCM

- Application peripheral subsystems - I2C™, keypad, UART, and so on

- Graphics subsystem - XGAM subsystem

- Audio Processing Execution (APEX) and video encoder subsystems In addition to the two subsystems above, there is also a test block, chip control block, and a pad multiplexing block residing at the top level

• DSP

- The Digital Signal Processor Subsystem (DSPSUB) includes a DSP megacell, which contains the DSP CPU together with a tightly coupled memory. The DSP is the Ceva-X 1620 core with a 64 kB instruction RAM and a 64 kB data RAM. It also contains debug logic and interfaces. In addition to the megacell, the DSPSUB includes external memories, peripheral units, and interfaces. The DSP megacell is clocked at 208 MHz.

- The DSPSUB includes an AHB master and an AHB slave interface. The AHB master provides a direct access to the Internal Random Access Memory (IRAM) in the EGG core through the AHB. The AHB slave interface allows the CPU and the DMA to access in the program and data RAM residing in the DSPSUB.

• WCDMA subsystem

- The digital baseband controller WCDMA subsystem incorporate a WCDMA modem

- An interface to the WCMDA together with memory control and an internal single port RAM. The WCDMA subsystem has three AHB slave interfaces.

- The Ericsson DB 3150 also includes HSDPA class 6 functionality.

- The WCDMA subsystem is handled and provided by Ericsson.

- 21 -

3. Technical Brief

LGE Internal Use Only

• XGAM subsystem

- The XGAM subsystem is a graphics acceleration module that provides hardware support in the creation of visual imagery and the transfer of this data to a display. The XGAM also provides support for connecting a Camera module. The visual data could be graphics, still images, or video.

- The XGAM subsystem is handled and provided by Ericsson.

• Operation and Services

- I

2

C™ Interface

- SIM Interfaces

- General Purpose I/O (GPIO) Interface

- External Memory Interface that supports NAND, NOR, PSRAM, SDRAM,

- JTAG

- RTC

- ETM (in Prototype Package)

Figure 3-1-1 KU580 Block Diagram

- 22 -

LGE Internal Use Only

Only for training and service purposes

3.1.2 External memory interface

RF calibration data, Audio parameters and battery calibration data etc are stored in flash memory area.

A. KU580

• 1Gb NAND flash memory + 512Mb SDRAM

• Data Communication

- IrDA ® (SIR)

- UARTs (ACB, EDB (RS232))

- Slave USB

• Package

- 12 by 12 mm 344 balls, 0.5mm pitch FPBGA Production Package

3. Technical Brief

Device Part Name Maker Item Time Size Speed

NAND flash K5D1G12ACB-D075 Samsung

Program speed 200µs 1 page = 528 Byte 2.64MByte/s

Erase speed 2ms 1 Block = 16K Byte 8MByte/s

Table 3- 1- 1. External Memory Interface Spec. of KU580

Figure 3- 1- 2. External Memory Configuration of KU580

- 23 -

3. Technical Brief

LGE Internal Use Only

3.1.3 Hardware Architecture

A. Block Diagram

Figure 3-1-3. Access system of Ericsson DB3100

Figure 3-1-4. Application system of Ericsson DB3100

- 24 -

3. Technical Brief

LGE Internal Use Only

Only for training and service purposes

B. CPU Subsystem

• Access CPU subsystem The digital baseband controller includes an access CPU subsystem, which includes the submodules described below.

− 32 KiB I-cache

− 16 KiB D-cache

− Page table

− Memory Management Unit (MMU)

− JTAG

− ETM9

− 26 KiB I-TCM

− 8 KiB D-TCM

• Application CPU subsystem

The digital baseband controller includes an Application CPU subsystem, which includes the submodules described below.

− 32 KiB I-cache

− 16 KiB D-cache

− Page table

− MMU

− JTAG

− ETM9

− 8 KiB I-TCM

− 8 KiB D-TCM

C. Peripheral Hardware Subsystem

The digital baseband controller includes hardware that supports mobile terminal peripherals such as a MMC, SD, UART, I2C, USB, keypad, and infrared. Collectively, this hardware comprises the Peripheral subsystem. The functional blocks of the Peripheral subsystem connect to the peripheral bus through four separate bridges, which provide a simple interface to support different timing and memory access arrangements.

D. DSP Hardware Subsystem

The Digital Signal Processor Subsystem (DSPSUB) includes a DSP megacell, which contains the DSP CPU together with a tightly coupled memory. The DSP is the Ceva-X 1620 core with a 64 kB instruction RAM and a 64 kB data RAM. It also contains debug logic and interfaces. In addition to the megacell, the DSPSUB includes external memories, peripheral units, and interfaces. The DSP megacell is clocked at 208 MHz. The DSPSUB includes an AHB master and an AHB slave interface. The AHB master provides a direct access to the Internal Random Access Memory (IRAM) in the EGG core through the AHB. The AHB slave interface allows the CPU and the DMA to access in the program and data RAM residing in the DSPSUB.

- 25 -

3. Technical Brief

LGE Internal Use Only

E. XGAM Subsystem

The XGAM subsystem is a graphics acceleration module that provides hardware support in the creation of visual imagery and the transfer of this data to a display. The XGAM also provides support for connecting a Camera module. The visual data could be graphics, still images, or video. The XGAM subsystem is handled and provided by Ericsson.

F. System Control Subsystem

The SYSCON resides at the top level of the circuit architecture and is responsible for clock generation and clock and reset distribution within the digital baseband controller, as well as to external devices. The block is a slave peripheral under control of the ARM processor. The programming of the SYSCON controls the fundamental modes of operation within the digital baseband controller. Individual blocks can also be reset and their clocks held inactive by accessing the appropriate control registers.

3.1.4 RF Interface

A. Asta Interface

Asta controls GSM RF part using these signals through GSM RF chip-Gimli.

• RF_DATA_A

• RF_DATA_B

• RF_DATA_C

• RF_DATA_STRB

B. WCDMA Radio Link Interface

• RF_WCDMA_PA_0_EN

• RF_WCDMA_PA_1_EN

• RF_WCDMA_DCDC_EN

• RF_WCDMA_PWRDET_EN

Figure 3-1- 5. Schematic of Asta RF Interface

Figure 3-1-6. Schematic of WCDMA RF Interface

Y4

RF_DATA_A

RF_DATA_B

AA2

Y3

RF_DATA_C

Y2

RF_DATA_STRB

QDATA_AMP_MSB

IDATA_FREQ_MSB

AMP_LSB_FREQ_LSB

DCLK_DATSTR

TX_POW

AB7

AB5

RF_WCDMA_DCDC_EN

AB8

RF_WCDMA_PA_0_EN

RF_WCDMA_PA_1_EN

V7

RF_WCDMA_PWRDET_EN

AB6

Y8

DAC_I_NEG

DAC_I_POS

W8

W7

DAC_Q_NEG

DAC_Q_POS

Y7

Y10

ADC_I_NEG

ADC_I_POS

W10

W9

ADC_Q_NEG

ADC_Q_POS

Y9

TP300

WPOW_DET

WDCDC_EN

WPA0_EN

WPOW_DET_EN

WTX_I_N

WTX_I_P

WTX_Q_N

WTX_Q_P

WRX_I_N

WRX_I_P

WRX_Q_N

WRX_Q_P

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3. Technical Brief

LGE Internal Use Only

Only for training and service purposes

3.1.5 SIM Interface

SIM interface scheme is shown in Figure3-1-6. SIMDAT0, SIMCLK0, SIMRST0 ports are used to communicate DBB(Asta) with ABB(Veronica) and filter.

SIM (Interface between DBB and ABB)

SIMDAT0 SIM card bidirectional data line

SIMCLK0 SIM card reference clock

SIMRST0 SIM card async/sync reset

Table 3-1-2. SIM Interface

VDD

DAT

CLK CARD RST

SIMVCC

Veronica

SDAT SIMDAT

SCLK SIMCLK

SRST SIMRST

Asta

SIMDAT0

SIMCLK0

SIMRST0

VDD E

10K

Figure 3-1-7. SIM Interface

- 27 -

3. Technical Brief

LGE Internal Use Only

3.1.6 UART Interface

UART signals are connected to Asta GPIO through IO connector

UART0

Resource Name Note

ACC_GPIO_2 ACC_UART_RX ACC Receive Data

ACC_GPIO_3 ACC_UART_TX ACC Transmit Data

UART1

APP_GPIO_0 APP_UART_RX APP Receive Data

APP_GPIO_1 APP_UART_TX APP Transmit Data

Table 3- 1- 3. UART Interface

3.1.7 GPIO (General Purpose Input/Output) map

In total 39 allowable resources. This model is using 39 resources. GPIO Map, describing application, I/O state, and enable level are shown in below table.

- 28 -

3. Technical Brief

LGE Internal Use Only

Only for training and service purposes

Table 3-1-4. Asta ACC GPIO Map Table

- 29 -

LGE Internal Use Only

3. Technical Brief

3.1.8 GPIO (General Purpose Input/Output) map

The USB block supports the implementation of a "full-speed" device fully compliant to USB 2.0

Access GPIO

GPIO Assigned Name Init Status

APP_GPIO_0 APP_GP00_UART_RX Input

APP_GPIO_1 APP_GP01_UART_TX Output

APP_GPIO_2 APP_GP02_FLIPSENSE Input

APP_GPIO_3 APP_GP03_HEAD_AMP_EN Output low

APP_GPIO_4 APP_GP04_FM_GPI02 Input

APP_GPIO_5 APP_GP05_TOUCH_ACK Input

APP_GPIO_6 APP_GP06_VC_IO_OFF Output Low(Hi-Z: low)

APP_GPIO_7 APP_GP07_VC_IO_OFF Output Low(Hi-Z: low)

APP_GPIO_8 APP_GP10_BL_CTRL output Low

APP_GPIO_9 APP_GP11_REMOTE_INT Input

APP_GPIO_10 APP_GP12_PHFSENSE Input

APP_GPIO_11 APP_GP13_MC_CLKRET Input

APP_GPIO_12 APP_GP14_MC_DETECT Input

APP_GPIO_13 APP_GP15_TOUCH_CLK Input/output

APP_GPIO_14 APP_GP16_TOUCH_DAT Input/output

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3. Technical Brief

LGE Internal Use Only

Only for training and service purposes

3.1.9 USB

The USB block supports the implementation of a “High-speed" device fully compliant to USB 2.0 standard. It provides an interface between the CPU (embedded local host) and the USB wire, and handles USB transactions with minimal CPU intervention.

The USB specification allows up to 15 pairs of endpoints. Data for each endpoint is buffered in RAM within the USB block and is read/written from the endpoint FIFO using DMA transfers or FIFO register access. High-speed (high throughput) endpoints can use DMA while slower endpoints can use FIFO register access.

The USB block can request up to six DMA channels, three for IN endpoints and three for OUT endpoints.

USB Function Note

USB_STP ULPI stop signal

USB_DIR ULPI direction signal

USB_CLK USB clock

USB_NXT ULPI next signal

USB_DAT0 USB data0

USB_DAT1 USB data1

USB_DAT2 USB data2

USB_DAT3 USB data3

USB_DAT4 USB data4

USB_DAT5 USB data5

USB_DAT6 USB data6

USB_DAT7 USB data7

USB_CS_PD USB chip select

VBUS Power supply for Asta USB block

Table 3-1-6. USB Signal Interface of Asta

- 31 -

3. Technical Brief

LGE Internal Use Only

Figure 3-1-8. Schematic of Asta USB block

Figure 3-1-9. Schematic of USB Transceiver

ACC_GPIO_6

P3

ACC_GPIO_7

P4 R4

ACC_GPIO_8 ACC_GPIO_9

R3

P2

ACC_GPIO_2 ACC_GPIO_3

N9

M9

ACC_GPIO_4 ACC_GPIO_5

N4

J9

ACC_GPIO_0 ACC_GPIO_1

K9

R2

ACC_GP07_USB_DAT5

ACC_GP06_USB_DAT4

ACC_GP10_USB_DAT6 ACC_GP11_USB_DAT7

ACC_GP00_USB_STP

ACC_GP01_USB_DIR

ACC_GP02_UART0_RX

ACC_GP03_UART0_TX

ACC_GP04_USB_CLK ACC_GP05_USB_NXT

10V

1%

R438 12K

C429 0.1u

R435 51K

C433 2.2u

R436 1K

0.1uC431

4.7u

R437 0

4.7u

C424

C432

VBUS

VCC

F3

B5

VCC_IO1 VCC_IO2

B2

F5

XTAL1 XTAL2

F6

VDDE_1V8

C430 0.1u

C1 D1

DP

FAULT

E2

GND1

C5

D2

GND2

GND3

E4

D3

ID

NC1

F1

F2

NC2

D5

NXT PSW_N

D4

E6

REF1V8

REG3V3

E3

C2

RREF

STP

D6

TEST

C4

F4

CFG0

E1

B4

CFG1

CFG2

B3

CHIP_SEL

C3 A4

CLOCK DATA0

B1 A1

DATA1 DATA2

A2 A3

DATA3 DATA4

A5 A6

DATA5 DATA6

B6

DATA7

C6

E5

DIR

DM

U402

ISP1508AET

0.1u

C423

VBAT

C428 4.7u

0

R430

ACC_GP20_USB_CS_PD

ACC_GP04_USB_CLK

USB_DAT0 USB_DAT1

USB_DAT2 ACC_GP22_USB_DAT3 ACC_GP06_USB_DAT4 ACC_GP07_USB_DAT5 ACC_GP10_USB_DAT6 ACC_GP11_USB_DAT7

ACC_GP01_USB_DIR

ACC_GP05_USB_NXT ACC_GP00_USB_STP

USB_XTAL1

USB_DM

VBUS_USB_TRX

USB_DP

USB_DAT_VP

L4

USB_OE

M4

L3

USB_SE0_VM

USB_DAT1

USB_DAT2 USB_DAT0

LG KU580 Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual